CN218352976U - Heat recovery system - Google Patents

Heat recovery system Download PDF

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Publication number
CN218352976U
CN218352976U CN202221901344.6U CN202221901344U CN218352976U CN 218352976 U CN218352976 U CN 218352976U CN 202221901344 U CN202221901344 U CN 202221901344U CN 218352976 U CN218352976 U CN 218352976U
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heat
heat recovery
recovery system
temperature
power
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杨琪
南建福
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Beijing Dajia Internet Information Technology Co Ltd
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Beijing Dajia Internet Information Technology Co Ltd
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Abstract

The present disclosure provides a heat recovery system, which relates to the technical field of heat treatment, the heat recovery system comprises: the heat absorption device is arranged in the heat dissipation area; the heat dissipation device is arranged in the area needing heat, and the first end of the heat dissipation device is connected with the first end of the heat absorption device; and the power equipment comprises first power equipment, the first end of the first power equipment is connected with the second end of the heat dissipation equipment, and the second end of the first power equipment is connected with the second end of the heat absorption equipment. The present disclosure provides a heat recovery system, which is decoupled from an original air conditioner, and can directly collect heat in a heat dissipation area, thereby reducing the influence of heat recovery on the original air conditioner, and improving the stability of heat collection.

Description

Heat recovery system
Technical Field
The present disclosure relates to the field of heat treatment technology, and more particularly, to a heat recovery system.
Background
The electromechanical device needs to dissipate heat in the operation process, so that the temperature of a room where the electromechanical device is placed is increased, and when the temperature of the room is too high, the normal operation of the electromechanical device can be affected. Under the normal condition, an air conditioner can be installed in a room to cool, and meanwhile, the heat of the room can be collected and reused.
In the related technology, the existing room for placing the electromechanical equipment can be transformed to recover the waste heat in the operation process of the electromechanical equipment, but the existing waste heat recovery scheme needs to transform the room for placing the electromechanical equipment, has large dependence on the original air conditioner in an equipment room, influences the normal work of the original air conditioner and influences the safe operation of the electromechanical equipment in the room.
Disclosure of Invention
The utility model provides a heat recovery system to at least, improve the problem that influences equipment safe operation to the original computer lab of equipment computer lab among the correlation technique. The technical scheme of the disclosure is as follows:
according to a first aspect of embodiments of the present disclosure, there is provided a heat recovery system comprising:
the heat absorption device is arranged in the heat dissipation area;
the heat sink comprises heat dissipation equipment and heat absorption equipment, wherein the heat dissipation equipment is arranged in a heat-requiring area, and the first end of the heat dissipation equipment is connected with the first end of the heat absorption equipment;
the power equipment comprises first power equipment, the first end of the first power equipment is connected with the second end of the heat dissipation equipment, and the second end of the first power equipment is connected with the second end of the heat absorption equipment.
Optionally, the heat recovery system further comprises:
the first end of the heat exchange device is connected with the first end of the heat absorption device, the second end of the heat exchange device is connected with the first end of the first power device, the third end of the heat exchange device is connected with the first end of the heat dissipation device, and the fourth end of the heat exchange device is connected with the second end of the heat dissipation device.
Optionally, the heat recovery system further comprises:
and the first end of the second power equipment is connected with the first end of the heat sink, and the second end of the second power equipment is connected with the first end of the heat sink.
Optionally, the heat recovery system further comprises:
the first end of the heat exchange device is connected with the second end of the second power device, the second end of the heat exchange device is connected with the second end of the heat absorbing device, the third end of the heat exchange device is connected with the first end of the heat radiating device, and the fourth end of the heat exchange device is connected with the second end of the heat radiating device.
Optionally, the heat recovery system further comprises an expansion device, a first end of the expansion device is connected with the second end of the heat dissipation device, and a second end of the expansion device is connected with the first end of the first power device.
Optionally, the heat sink comprises an evaporation device.
Optionally, the heat sink further comprises a first air blowing device.
Optionally, the heat sink apparatus comprises a condensing device.
Optionally, the heat dissipation apparatus further includes a second air supply device.
Optionally, the number of heat sinks includes a plurality, the number of first power devices includes a plurality, the first end of each heat sink is connected to the second end of an adjacent heat sink, and the second end of each heat sink is connected to the second end of another adjacent heat sink.
The technical scheme provided by the embodiment of the disclosure at least brings the following beneficial effects:
in the heat recovery system provided by the embodiment of the disclosure, a heat sink is arranged in a heat dissipation area, a heat dissipation device is arranged in a heat demand area, and a first end of the heat dissipation device is connected with a first end of the heat sink; and the power equipment comprises first power equipment, the first end of the first power equipment is connected with the second end of the heat dissipation equipment, and the second end of the first power equipment is connected with the second end of the heat absorption equipment. On one hand, the heat absorption device is placed in the heat dissipation area, so that heat can be directly collected in the heat dissipation area, the original air conditioner does not need to participate in heat recovery, and the normal work of the original air conditioner is not influenced; on the other hand, the heat absorption device is arranged in the heat dissipation area, so that heat can be uniformly heated and collected, and the stability of the collected heat and the stability of the heat provided for the heat-requiring area are improved.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the disclosure and are not to be construed as limiting the disclosure.
FIG. 1 is a schematic diagram illustrating the construction of a heat recovery system according to an exemplary embodiment;
FIG. 2 is a schematic block diagram illustrating another heat recovery system in accordance with an exemplary embodiment;
FIG. 3 is a schematic diagram illustrating the construction of yet another heat recovery system in accordance with an exemplary embodiment;
FIG. 4 is a schematic diagram of a heat recovery system including a plurality of heat sinks, according to an exemplary embodiment;
FIG. 5 is a schematic diagram illustrating a heat recovery system including a plurality of heat sinks in accordance with an exemplary embodiment;
FIG. 6 is a schematic diagram illustrating an application scenario including multiple heat recovery systems, according to an exemplary embodiment;
FIG. 7 is a schematic diagram illustrating an application scenario of a heat recovery system in accordance with an exemplary embodiment;
FIG. 8 is a schematic diagram illustrating a further heat recovery system in accordance with an exemplary embodiment;
FIG. 9 is a schematic diagram illustrating an application scenario of another heat recovery system in accordance with an exemplary embodiment;
FIG. 10 is a schematic diagram illustrating a thermal cycle of a thermal data room according to an exemplary embodiment;
FIG. 11 is a schematic diagram illustrating an application scenario of yet another heat recovery system in accordance with an exemplary embodiment;
FIG. 12 is a schematic diagram illustrating another heat recovery system in accordance with an exemplary embodiment;
fig. 13 is a schematic diagram illustrating an application scenario of a heat recovery system according to an exemplary embodiment.
Detailed Description
In order to make the technical solutions of the present disclosure better understood by those of ordinary skill in the art, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings.
It should be noted that the terms "first," "second," and the like in the description and claims of the present disclosure and in the foregoing drawings are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the disclosure described herein are capable of operation in sequences other than those illustrated or otherwise described herein. The implementations described in the exemplary embodiments below are not intended to represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.
In the equipment room of placing electromechanical device, can set up the air conditioner room usually for place the air conditioner and cool down the room, simultaneously, in order to realize the energy and recycle, can retrieve the waste heat in electromechanical device place room, carry the heat recovery to the region that needs heat with the heat energy of retrieving, carry out heat recovery and utilize.
In the related art, heat pipes are usually arranged on the wall surface of an air-conditioning room and used for recovering the heat energy of the room, but the placement mode of the heat pipes changes the original air flow mode in the air-conditioning room, which may cause the problems of insufficient residual pressure outside the air-conditioning fan, reduced air-conditioning refrigerating capacity and the like, and influence the safe operation of electromechanical equipment in the room; and the heat pipe is arranged at different positions, so that the heat quantity at different positions is different, and the recovered heat quantity is unstable.
In view of the above, exemplary embodiments of the present disclosure provide a heat recovery system that may be applied to a heat recovery environment including a heat dissipation area and a heat demand area of an equipment room, wherein the equipment room may be a data room and the heat absorption area may be a living area. The heat recovery system can comprise a heat absorption device, a heat dissipation device and a first power device, wherein the heat absorption device is used for absorbing heat of a heat dissipation area of an equipment machine room, the heat dissipation device is used for releasing the heat to a heat-requiring area, and the first power device is used for providing power for heat circulation between the heat absorption device and the heat dissipation device. The heat of the data machine room can be conveyed to the living area, and the heat of the data machine room is utilized to heat the living area.
Fig. 1 is a schematic diagram illustrating a heat recovery system that may be applied in a heat recovery environment that includes a heat dissipation area and a heat demand area, according to an exemplary embodiment. The heat recovery system 100 includes:
and a heat sink 101 disposed in the heat dissipation area a, wherein the heat sink collects heat from the heat dissipation area.
The heat dissipation device 102 is arranged in the area B needing heat, a first end of the heat dissipation device 102 is connected with a first end of the heat absorption device 101, and the heat dissipation device is used for acquiring heat collected by the heat absorption device and releasing the heat to the area needing heat;
and the power device comprises a first power device 103, a first end of the first power device 103 is connected with a second end of the heat sink 102, a second end of the first power device 103 is connected with a second end of the heat sink 101, and the first power device is used for providing power for heat transfer between the heat sink and the heat sink.
In summary, in the heat recovery system provided in the embodiments of the present disclosure, the heat sink is disposed in the heat dissipation area, the heat sink is disposed in the heat requiring area, and the first end of the heat sink is connected to the first end of the heat sink; and the power equipment comprises first power equipment, the first end of the first power equipment is connected with the second end of the heat dissipation equipment, and the second end of the first power equipment is connected with the second end of the heat absorption equipment. On one hand, the heat absorption device is placed in the heat dissipation area, so that heat can be directly collected in the heat dissipation area, the original air conditioner does not need to participate in heat circulation, and the normal work of the original air conditioner is not influenced; on the other hand, the heat absorption device is arranged in the heat dissipation area, so that heat can be uniformly heated and collected, and the stability of the collected heat and the stability of the heat provided for the heat-requiring area are improved.
The heat absorbing device, the heat dissipating device and the first power device can be connected through a pipeline, a heat recovery agent is filled in the pipeline, when the heat recovery system is in a working state, the first power device can provide power for the heat recovery agent, the heat recovery agent flows through the pipeline, and enters the heat absorbing device through the second end of the heat absorbing device, the heat absorbing device can absorb heat in a heat dissipation area, the heat recovery agent in the heat absorbing device can be heated and gasified into high-temperature gas, the high-temperature gas enters the pipeline through the first end of the heat absorbing device and enters the heat dissipating device through the first end of the heat dissipating device, the heat dissipating device can transfer heat in the high-temperature gas to a heat requiring area, the high-temperature high-pressure gas becomes the liquid heat recovery agent due to heat release, the liquid heat recovery agent can enter the pipeline through the second end of the heat dissipating device and flows back to the first power device through the first end of the first power device, the first power device can provide power for the liquid heat recovery agent, and the liquid heat recovery agent enters the pipeline through the second end of the pipeline, and the liquid heat recovery agent enters the heat absorbing device through the second end of the pipeline, and the next heat recovery device. The heat recovery agent may be a refrigerant, for example, the refrigerant may be freon, ethylene glycol, alcohol, methanol, etc., which is not limited in this disclosure; the material of the pipe can be determined based on actual needs, and the pipe can be made of copper as an example.
In an optional implementation manner, a part of the pipeline between the first power device and the heat sink is located in the heat dissipation area, and in the process that the first power device receives the liquid heat recovery agent and then conveys the liquid heat recovery agent to the heat sink, the liquid heat recovery agent in the part of the pipeline between the first power device and the heat sink can absorb heat in the heat dissipation area to achieve the purpose of cooling the heat dissipation area.
In an alternative embodiment, as shown in fig. 2, the heat recovery system further comprises a second power device 104, a first end of the second power device 104 is connected to a first end of the heat sink 101, and a second end of the second power device 104 is connected to a first end of the heat sink 102. The second power equipment 104 is used for rapidly collecting high-temperature and high-pressure gas in the pipeline, further increasing the pressure of the high-temperature and high-pressure gas, and conveying the boosted high-temperature and high-pressure gas to the heat dissipation equipment, so as to increase the heat acquired by the heat dissipation equipment. The second power equipment may be a compressor, and the type of the compressor may be determined based on actual needs, which is not limited in the embodiment of the present disclosure.
It should be noted that, in the embodiment of the present disclosure, an equipment room (for example, a data room) generally needs to ensure a certain humidity, and a humidification device may be configured in the data room to humidify the equipment room. In order to reduce the interference of the heat recovery system arranged in the equipment room on the humidity of the equipment room, the evaporating temperature of the second power equipment can be set to be the target temperature, sensible heat exchange of the heat absorption equipment can be guaranteed, dehumidification processing is not carried out on the equipment room, and the humidity stability of the equipment room is guaranteed. Wherein the target temperature may be higher than the dew point temperature, for example, 17 degrees or 18 degrees, etc.
If the heat recovery system is as shown in fig. 2, when the heat recovery system is in an operating state, the first power device may provide power for the heat recovery agent, so that the heat recovery agent flows through the pipeline and enters the heat sink through the second end of the heat sink, the heat sink may absorb heat in the heat dissipation area, the heat recovery agent in the heat sink may be heated and gasified into high-temperature gas, the high-temperature gas enters the pipeline through the first end of the heat sink and enters the second power device through the first end of the second power device, the second power device may perform temperature and pressure raising processing on the high-temperature gas to obtain high-temperature and high-pressure gas, and the high-temperature and high-pressure gas is conveyed to the pipeline through the second end of the second power device, the high-temperature and high-pressure gas in the pipeline enters the heat dissipation device through the first end of the heat sink, the heat in the high-temperature and high-pressure gas may be changed into a liquid heat recovery agent due to release heat, the liquid heat recovery agent may enter the pipeline through the second end of the heat sink, and the liquid heat recovery agent enters the first power device through the second end of the pipeline.
It should be noted that, in the embodiment of the present disclosure, when the heat recovery system is the heat recovery system shown in fig. 2, the heat recovery system may have two operation modes, in the first operation mode, the second power device in the heat recovery system is in a closed state, and the high-temperature gas conveyed from the heat absorbing device may be allowed to reach the heat dissipating device through the second power device, at this time, the power consumption of the heat recovery system may be reduced, and the electric energy may be saved; in the second working mode, all equipment in the heat recovery system is in a working state, so that sufficient high-temperature gas can be provided for the heat dissipation equipment, and the temperature of a heat-requiring area is increased. It can be understood that what operation mode the heat recovery system is in may be determined based on actual needs, which is not limited by the embodiments of the present disclosure. For example, when the heat demand of the heat demand area is low (such as spring and autumn), the first working mode can be operated, when the heat demand of the heat demand area is high (such as winter), the second working mode can be operated, the mode switching can judge which mode is started according to the outlet air temperature of the heat demand area, and when the outlet air temperature is less than the preset temperature value, the heat recovery system can be controlled to operate in the second working mode; when the outlet air temperature is greater than or equal to the preset temperature value, the heat recovery system can be controlled to operate in the first working mode, wherein the preset temperature value can be determined based on actual needs, which is not limited in the embodiment of the disclosure; for example, the preset temperature value may be 25 degrees; if the outlet air temperature is less than 25 ℃, the heat recovery system can be controlled to operate in a second working mode; when the outlet air temperature is greater than or equal to 25 degrees, the heat recovery system can be controlled to operate in the first working mode.
In an alternative embodiment, as shown in fig. 3, the heat recovery system further comprises an expansion device 105, wherein a first end of the expansion device 105 is connected to the second end of the first power plant 103 and a second end of the expansion device 105 is connected to the second end of the heat sink 101. The expansion device is used for performing expansion treatment on low-temperature and low-pressure liquid conveyed in the first power equipment to obtain low-temperature and low-pressure wet steam, and the low-temperature and low-pressure wet steam is transmitted to the heat absorption equipment through a pipeline. The expansion device may be an expansion valve, and the type of the expansion valve may be determined based on actual needs, which is not limited in the embodiment of the disclosure. For example, the expansion valve may be a thermostatic expansion valve, the low-temperature and low-pressure liquid may be processed to obtain low-temperature and low-pressure wet vapor of a constant temperature, and the first power plant may be a refrigerant booster pump or a refrigerant recovery pump.
Wherein, if the heat recovery system is shown in fig. 3, when the heat recovery system is in a working state, the first power device can provide power for the heat recovery agent, so that the heat recovery agent flows through the pipeline and enters the heat sink through the second end of the heat sink, the heat sink can absorb heat in the heat dissipation area, the heat recovery agent in the heat sink can be heated and gasified into high-temperature gas, the high-temperature gas enters the pipeline through the first end of the heat sink and enters the second power device through the first end of the second power device, the second power device can perform temperature and pressure raising treatment on the high-temperature gas to obtain high-temperature and high-pressure gas, and deliver the high-temperature and high-pressure gas to the pipeline through the second end of the second power device, the high-temperature and high-pressure gas in the pipeline enters the heat dissipation device through the first end of the heat dissipation device, and the heat dissipation device can transfer the heat in the high-temperature gas to the area needing heat, high temperature high pressure gas becomes high temperature high pressure liquid because the release heat, high temperature high pressure liquid can get into the pipeline through the second end of heat abstractor, and get into first power equipment through the first end of first power equipment, carry low temperature low pressure liquid to first power equipment, first power equipment can provide power for the heat recovery agent, make the heat recovery agent get into the pipeline through the second end of first power equipment, the first end that the recovery agent passes through expansion device through the pipeline gets into expansion device, expansion device can carry out expansion process to low temperature low pressure liquid and obtain low temperature low pressure wet steam, furthermore, low temperature low pressure wet steam can get into the pipeline through expansion device's second end, low temperature low pressure wet steam in the pipeline gets into the heat absorption equipment through the second end of heat absorption equipment, begin next heat recovery.
In an alternative embodiment, the heat sink may include an evaporation device for rapidly acquiring heat from the heat dissipation area, the evaporation device may be an evaporator, and the evaporator may be a coil evaporator, so as to increase a heating area of the heat sink and improve heat acquisition efficiency.
In an optional embodiment, the heat sink may further include a first air supply device, and the first air supply device may be an electronic fan, and during operation of the first air supply device, the first air supply device may concentrate hot air in the heat dissipation area to the evaporation device, so as to improve heat collection efficiency of the heat sink. Optionally, the evaporator and the first air supply device can be movably connected, so that the installation efficiency of the heat absorption device in a heat dissipation area is improved, and the operation time is shortened. For example, the evaporator and the first air supply device may be connected by a clip or a screw, which is not limited in the embodiments of the present disclosure.
The number of the first air supply devices may be determined based on actual needs, which is not limited in the embodiments of the present disclosure. Optionally, when the heat recovery system is in a working state, the working frequency of each first air supply device in the heat sink device can be controlled to be the same or similar, so that the heating uniformity of the evaporation device can be further improved, and the stability of the collected heat can be improved.
In an optional embodiment, the heat dissipation device includes a condensing device, which may be a condenser, for rapidly transferring heat to a heat-requiring area, and the condenser may be a coil condenser, which may increase a heat dissipation area of the heat dissipation device, thereby improving heat dissipation efficiency. Optionally, the heat dissipation device may further include a second air supply device, the second air supply device may be an electronic fan, and the second air supply device may enable heat of the condensing device to be quickly transferred to the air in the operation process, so as to improve the heat dissipation efficiency of the heat dissipation device.
The number of the second air supply devices may be determined based on actual needs, which is not limited in the embodiments of the present disclosure. Optionally, when the heat recovery system is in a working state, the working frequency of each second air supply device in the heat dissipation apparatus can be controlled to be the same or similar, so that the heat dissipation uniformity of the heat dissipation apparatus can be further improved, and the heat dissipation stability is improved.
In an alternative embodiment, the heat sink can be fixedly or movably connected to the line. Optionally, the heat sink may be movably connected to the pipeline through a quick coupling, which may further reduce the operation time in the heat dissipation area; meanwhile, the heat absorption device is convenient to overhaul, and the operation difficulty is reduced.
In an alternative embodiment, the heat sink may be fixedly or movably connected to the pipe. Optionally, the heat dissipation device may be fixedly connected to the pipeline, for example, the heat dissipation device may be welded to the pipeline, which may reduce the system cost.
In an alternative embodiment, as shown in fig. 4, in the heat recovery system, the number of the heat sinks 101 may include a plurality of heat sinks 101, and the plurality of heat sinks 101 are connected in sequence, wherein the first end of each heat sink is connected to the second end of an adjacent one of the heat sinks, and the second end of each heat sink is connected to the second end of another adjacent heat sink. The heat in the heat dissipation area can be collected through a plurality of heat sinks, and the heat collection efficiency of the heat sinks is improved.
In an alternative embodiment, the number of the heat dissipation devices may include a plurality of heat dissipation devices, and the plurality of heat dissipation devices may be disposed in the heat demand area according to different connection forms, for example, may be disposed in the heat demand area according to a wall hanging form, a wind disk form, a multiple connection form, or the like. As shown in fig. 5, fig. 5 shows a schematic view of a heat recovery system. The plurality of heat dissipation devices 102 are arranged in the area a requiring heat in a multi-connected manner, so that the heat supply amount of the area requiring heat can be further increased.
In an optional embodiment, the heat recovery environment may include a plurality of heat recovery systems, and when any heat recovery system fails, the normal operation of other heat recovery systems may not be affected, so as to improve the heat recovery stability in the heat recovery environment. As shown in fig. 6, a heat recovery environment may include a plurality of heat recovery systems as shown in fig. 5, and the number of heat sinks in each heat recovery system may be determined based on actual needs, which is not limited by the embodiments of the present disclosure.
It is to be understood that, in the embodiments of the present disclosure, in the above-mentioned fig. 4 to 5, when the heat recovery system is in the operating state, the actual operating principles of the first power plant 103, the second power plant 104 and the expansion device 104 in the non-heat dissipation region and the non-heat-demand region may refer to the description of the operating principles of the first power plant 103, the second power plant 104 and the expansion device 104 in the heat recovery system as shown in fig. 3, and the embodiments of the present disclosure will not be described in detail here.
For example, as shown in fig. 7, fig. 7 shows an application scenario diagram of a heat recovery system, the heat recovery system is applied to a data room 701 and a living area 702, the data room includes an original cooling air conditioner 7011 in an air conditioning room, a heat dissipation area 7012, a cabinet placement area 7013, an aisle 7014, and an air outlet area 7015, where the heat dissipation area 7012 is composed of a hot channel a1 and a hot ceiling a2, a heat dissipation cabinet is placed in the cabinet placement area 7013, during the operation of the cabinet, the dissipated heat may form hot air, which moves to the hot ceiling a2 through the hot channel a1, the hot air in the hot ceiling a2 may enter the original cooling air conditioner 7011 in a direction shown by an arrow in fig. 7, the original cooling air conditioner 7011 may cool the hot air into a cold air aisle, and transport the cold air to the air outlet area 7015, and enter the cabinet placement area 7013 through the cold air conditioner 7014 to cool the cabinet.
With continued reference to fig. 7, the heat recovery system includes a coil evaporator 1011 and a first fan 1012, a second power plant 104, a coil condenser 1021 and a second fan 1022, a first power plant 103, and an expansion device 105, wherein the coil evaporator 1011 and the first fan 1012 are disposed in the hot drop ceiling a2, the coil condenser 1021 and the second fan 1022 are disposed in the living area 702, and the first power plant 103, the expansion device 105, and the second power plant 104 are disposed in an area outside the data room 701 and the living area 702. Wherein the first power plant 103, the expansion device 105 and the second power plant 104 may be integrated into the same plant 10, placed outside the data room 701 and the living area 702 for easy access.
In the operation process of the heat recovery system, the refrigerant booster pump 103 may provide power for a heat recovery agent in the heat recovery system, so that the heat recovery agent flows to the coil evaporator 1011 through a pipeline, the coil evaporator 1011 may rapidly absorb heat in the heat ceiling a2 of the data room 701 under the action of the first fan 1012, the heat recovery agent in the coil evaporator 1011 may be heated and gasified into a high-temperature gas, the high-temperature gas moves to the second power equipment 104 through the pipeline, the second power equipment 104 may rapidly collect the high-temperature high-pressure gas in the pipeline, further increase the pressure of the high-temperature high-pressure gas, and convey the boosted high-temperature high-pressure gas to the coil condenser 1021, and transfer the heat in the high-temperature gas to the living area 702 under the action of the second fan 1022, the high-temperature high-pressure gas becomes a liquid heat recovery agent due to heat release, the liquid heat recovery agent may flow back to the first power equipment 103 through the pipeline, the first power equipment 103 provides power for the low-temperature low-pressure heat recovery agent, so that the low-temperature low-pressure heat recovery agent flows to the expansion device through the pipeline, the expansion device may perform low-temperature steam expansion treatment, and further perform low-temperature steam evaporation to enter the low-temperature steam-recovery pipeline. Wherein the first power plant may be a refrigerant booster pump or a refrigerant recovery pump and the second power plant may be a compressor.
In an alternative embodiment, when the power device in the heat recovery system includes a second power device, as shown in fig. 8, the heat recovery system further includes a heat exchange device 108, a first end of the heat exchange device 108 is connected to the second end of the second power device 104, a second end of the heat exchange device 108 is connected to the second end of the heat sink 101, a third end of the heat exchange device 108 is connected to the first end of the heat sink 102, and a fourth end of the heat exchange device 108 is connected to the second end of the heat sink 102. The second power equipment can provide a power source for the heat recovery system, and meanwhile, the heat which can be acquired by the heat dissipation equipment is improved. The second power equipment 104 and the heat exchange equipment 108 are arranged in the equipment room C, so that the equipment is convenient to overhaul; the first end and the second end of the heat exchange device are connected with the first pipeline; the third end and the fourth end of the heat exchange device are connected with a second pipeline, and the high-temperature gaseous heat recovery agent in the first pipeline can transfer heat to the heat recovery agent in the second pipeline.
Optionally, with continued reference to fig. 8, the heat recovery system may further include an expansion device 105, a first end of the expansion device 105 is connected to a second end of the heat exchange device 108, and a second end of the expansion device is connected to a second end of the heat sink 101, so as to further cool the low-temperature and low-pressure heat recovery agent conveyed from the first pipeline of the heat exchange device, so that the heat recovery agent returns to the heat sink to absorb heat in the heat dissipation area, and start a next heat cycle.
In an alternative embodiment, when the power device in the heat recovery system includes a first power heat device, as shown in fig. 9, the heat recovery system further includes a heat exchange device 108, a first end of the heat exchange device 108 is connected to the first end of the heat sink 101, a second end of the heat exchange device 108 is connected to the first end of the first power device 103, a third end of the heat exchange device 108 is connected to the first end of the heat sink 102, and a fourth end of the heat exchange device 108 is connected to the second end of the heat sink 102. Wherein, heat exchange equipment 108 and first power equipment 103 set up in equipment room C or the corridor furred ceiling, are convenient for the maintenance of equipment. The first end and the second end of the heat exchange device are connected with the first pipeline; the third end and the fourth end of the heat exchange device are connected with a second pipeline, and the high-temperature gaseous heat recovery agent in the first pipeline can transfer heat to the heat recovery agent in the second pipeline. Illustratively, the heat exchange device may be a heat exchanger. It should be noted that, since the second power equipment belongs to a fault-prone equipment, the heat recovery system shown in fig. 9 does not include the second power equipment, and by reducing the use of the second power equipment in the heat recovery system, the fault rate of the heat recovery system can be reduced, and the operation stability of the heat recovery system can be improved.
Optionally, as shown in fig. 9, the heat recovery system further includes an expansion device 105, where the expansion device is configured to perform an expansion process on the low-temperature and low-pressure liquid delivered in the first power plant to obtain low-temperature and low-pressure wet steam, and to enable the low-temperature and low-pressure wet steam to be transmitted to the heat sink through a pipeline.
Optionally, in order to further improve the heat dissipation efficiency of the heat dissipation apparatus, in the heat recovery system shown in fig. 9, a temperature rising device may be connected between the heat exchange apparatus and the heat dissipation apparatus, the temperature rising device may raise the temperature of the heat recovery agent conveyed by the heat exchange apparatus 108, and convey the heat recovery agent after the temperature rise to the heat dissipation apparatus, so as to supply heat to a region requiring heat, and the heat recovery agent after the heat dissipation may enter the heat exchange apparatus through the temperature rising device to continue to absorb heat in the first pipeline for the next heat cycle. Wherein, the temperature raising device can be a centrifugal heat pump, a screw heat pump or a magnetic suspension heat pump.
In an alternative embodiment, as shown in fig. 10, fig. 10 is a schematic view of an application scenario of the heat recovery system shown in fig. 9, and the heat recovery system is applied to a data room 701 and a living area 702. As shown in fig. 10, the scenario further includes an inter-device 703.
With continued reference to fig. 10, the heat recovery system includes a plurality of sets of coil evaporators 1011 and first fans 1012, a plurality of coil condensers 1021, a plurality of first power devices 103, a plurality of expansion devices 105, a plurality of heat exchange devices 108, and a warming device 109, wherein the coil evaporators 1011 and the first fans 1012 are disposed in a hot ceiling a2, the coil condensers 1021 are disposed in a living area 702, the first power devices 103 and the heat exchange devices 108 are integrated into a heat energy module, the heat energy module can be disposed in a corridor ceiling, the plurality of heat energy modules can correspond to one warming device 109, the warming device 109 is disposed in an equipment room 703, and the plurality of sets of coil evaporators and the first fans can absorb more heat, so as to increase the heat provided to the heat exchange devices; a plurality of heat transfer equipment can provide more heats for the rising temperature device, is convenient for provide the heat recovery agent of higher temperature for the rising temperature device, reduces the consumption of rising temperature device.
During operation of the heat recovery system, each refrigerant booster pump 103 may power a heat recovery agent in the heat recovery system to flow through a line to the expansion device 105; the expansion device 105 can perform expansion treatment on the low-temperature low-pressure liquid to obtain low-temperature low-pressure wet steam, and further, the low-temperature low-pressure wet steam can enter the coil evaporator 1011 through a pipeline; the coil evaporator 1011 can absorb heat in the hot ceiling a2 of the data computer room 701 quickly under the action of the first fan 1012, the heat recovery agent in the coil evaporator 1011 can be heated and gasified into high-temperature gas, the high-temperature gas moves into a first pipeline of the heat exchange equipment 108 through a pipeline, the first pipeline transfers heat to the heat recovery agent in a second pipeline, so that the heat recovery agent in the second pipeline can be heated up, for example, the heat recovery agent in the second pipeline can be water, and the heated heat recovery agent can flow to the heating device 109 through a plurality of heat exchange equipment; the temperature increasing device 109 may further increase the temperature of the heat recovery agent to obtain a high temperature heat recovery agent, such as 55 ℃ hot water, which is delivered to the coil condenser 1021 in the heat requiring area 702 by a third power device, such as a water pump (not shown); the coil condenser 1021 can release heat carried by the high-temperature heat recovery agent to supply heat for the living area 702, and the high-temperature heat recovery agent in the coil condenser 1021 becomes the low-temperature heat recovery agent due to the release of heat, and flows back to the second pipeline in the heat exchange device 108, continues to absorb heat transferred by the first pipeline of the heat exchange device, and starts next thermal cycle.
After transferring heat to the heat recovery agent in the second pipeline, the first pipeline in the heat exchange device 108 becomes a low-temperature low-pressure liquid heat recovery agent, the low-temperature low-pressure liquid heat recovery agent can enter the first power device 103, the first power device 103 provides power for the liquid heat recovery agent, so that the low-temperature low-pressure heat recovery agent flows to the coil evaporator 1011 through the pipeline, and next heat recovery is started.
In the embodiment of the present disclosure, in a data room, as shown in fig. 11, in the operation process of a cabinet, heat released by the cabinet may move to a hot ceiling a2 through a hot channel a1, and move from the hot ceiling a2 to an original refrigeration air conditioner 7011 in an air conditioning room, and the original refrigeration air conditioner 7011 may obtain cold air by using heat in the hot air, and deliver the cold air to an air outlet area 7015, and enter a cabinet placement area 7013 through a passageway 7014 to cool the cabinet. In an optional embodiment, when the heat recovery system is disposed, in order to prevent the heat recovery system disposed in the hot ceiling a2 of the area where the cabinet is located from possibly affecting the cabinet, the heat recovery system may be disposed in a heat flow area in the air conditioning room, so as to further reduce the effect of the equipment in the data room disposed with the heat recovery system on the cabinet, and facilitate installation and maintenance of the heat recovery system. As shown in fig. 12, fig. 12 is a schematic view illustrating an application scenario in which the heat recovery system shown in fig. 9 is disposed in a data room and a heat flow area of an air-conditioning room is provided, wherein a coiled evaporator 1011 and a first fan 1012 in the heat recovery system are disposed in the heat flow area of the air-conditioning room. Heat may be absorbed as it flows through.
In the operation process of the heat recovery system, the refrigerant booster pump 103 may provide power for a heat recovery agent in the heat recovery system, so that the heat recovery agent flows to the expansion device 105 through a pipeline, the expansion device 105 may perform expansion processing on low-temperature and low-pressure liquid to obtain low-temperature and low-pressure wet steam, further, the low-temperature and low-pressure wet steam may enter the coil evaporator 1011 through a pipeline, the coil evaporator 1011 may rapidly absorb heat in the hot ceiling a2 of the data room 701 under the action of the first fan 1012, the heat recovery agent in the coil evaporator 1011 may be heated and gasified to be high-temperature gas, the high-temperature gas moves to a first pipeline of the heat exchange device 108 through a pipeline, the temperature of the first pipeline may be 30 degrees, and the first pipeline transfers heat to the heat recovery agent in a second pipeline, the heat recovery agent in the second pipeline may be heated to 28 degrees, for example, the heat recovery agent in the second pipeline may be water, the heated heat recovery agent may flow to the heating device 109, the heating device 109 may further heat the heat recovery agent to obtain high-temperature heat recovery agent, for example, 60 degrees or 50 degrees or 70 degrees hot water, the high-temperature heat recovery agent is conveyed to the coil condenser 1021 in the area 702 requiring heat by a third power device (not shown in the figure), for example, a water pump, the coil condenser 1021 may release heat carried by the high-temperature heat recovery agent to heat the living area 702, the high-temperature heat recovery agent in the coil condenser 1021 becomes low-temperature heat recovery agent due to the released heat, and flows back to the second pipeline in the heat exchange device 108, and continues to absorb heat transferred by the first pipeline of the heat exchange device, and starts a next heat cycle.
In an alternative implementation, as shown in fig. 13, fig. 13 is a schematic view of an application scenario of the heat recovery system shown in fig. 8, the heat recovery system is applied to a data room 701 and a living area 702, and specific structures of the data room and the living area may refer to fig. 7, which is not described in detail in this disclosure. As shown in fig. 13, the scene further includes an inter-device 703.
With continued reference to fig. 13, the heat recovery system includes a coil evaporator 1011 and a first fan 1012, a coil condenser 1021, a second power plant 104, a heat exchange plant 108, and an expansion device 105, wherein the coil evaporator 1011 and the first fan 1012 are disposed in the hot ceiling a2, the coil condenser 1021 is disposed in the living area 702, and the second power plant 104 and the heat exchange plant 108 are disposed in the plant room 703.
In the operation process of the heat recovery system, the coil evaporator 1011 can rapidly absorb heat in the hot ceiling a2 of the data room 701 under the action of the first fan 1012, the heat recovery agent in the coil evaporator 1011 can be heated and gasified into high-temperature gas, the high-temperature gas moves to the second power device 104 through a pipeline, the second power device 104 can provide power for the heat recovery agent in the heat recovery system, so that the heat recovery agent flows into the first pipeline of the heat exchange device 108 through the pipeline, the first pipeline transfers heat to the heat recovery agent in the second pipeline, so that the heat recovery agent in the second pipeline can be heated up, for example, the heat recovery agent in the second pipeline can be water, the heated heat recovery agent can flow to the coil condenser 1021 in the area to be heated 702, the coil condenser can release heat carried by the high-temperature heat recovery agent to heat the living area 702, the high-temperature heat recovery agent in the coil condenser 1021 releases heat to become the low-temperature heat recovery agent and flows back to the second pipeline in the area to be heated, the heat exchange device continues to absorb heat of the first pipeline, and the heat transfer of the next heat exchange device begins to circulate.
Wherein, first pipeline among the indirect heating equipment 108 becomes low temperature low pressure heat recovery agent to the heat recovery agent heat transfer back in the second pipeline, and low temperature low pressure heat recovery agent can get into expansion device 105, and expansion device 105 can be handled low temperature low pressure heat recovery agent and obtain low temperature low pressure wet steam, and low temperature low pressure wet steam can flow back to coil evaporator 1011 through the pipeline, begins heat recovery next time.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice in the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
It will be understood that the present disclosure is not limited to the precise arrangements that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims (10)

1. A heat recovery system, characterized in that the heat recovery system comprises:
the heat absorption device is arranged in the heat dissipation area;
the heat dissipation device is arranged in a heat-requiring area, and the first end of the heat dissipation device is connected with the first end of the heat absorption device;
the power equipment comprises first power equipment, the first end of the first power equipment is connected with the second end of the heat dissipation equipment, and the second end of the first power equipment is connected with the second end of the heat absorption equipment.
2. The heat recovery system of claim 1, further comprising:
the first end of the heat exchange device is connected with the first end of the heat absorbing device, the second end of the heat exchange device is connected with the first end of the first power device, the third end of the heat exchange device is connected with the first end of the heat dissipation device, and the fourth end of the heat exchange device is connected with the second end of the heat dissipation device.
3. A heat recovery system in accordance with claim 1, wherein said power plant comprises a second power plant, a first end of said second power plant connected to a first end of said heat sink, a second end of said second power plant connected to a first end of said heat sink.
4. A heat recovery system in accordance with claim 3, further comprising:
the first end of the heat exchange device is connected with the second end of the second power device, the second end of the heat exchange device is connected with the second end of the heat absorption device, the third end of the heat exchange device is connected with the first end of the heat dissipation device, and the fourth end of the heat exchange device is connected with the second end of the heat dissipation device.
5. The heat recovery system of claim 1 further comprising an expansion device, a first end of the expansion device being connected to the second end of the first power plant, a second end of the expansion device being connected to the second end of the heat sink.
6. A heat recovery system in accordance with claim 1, wherein said heat sink comprises an evaporation apparatus.
7. The heat recovery system of claim 6, wherein the heat sink further comprises a first air-moving device.
8. A heat recovery system in accordance with claim 1, wherein said heat sink apparatus comprises a condensing device.
9. The heat recovery system of claim 8, wherein the heat sink apparatus further comprises a second air-moving device.
10. The heat recovery system of claim 1 wherein the number of heat sinks comprises a plurality of heat sinks, the plurality of heat sinks being connected in series, a first end of each heat sink being connected to a second end of an adjacent heat sink, and a second end of each heat sink being connected to a second end of another adjacent heat sink.
CN202221901344.6U 2022-07-22 2022-07-22 Heat recovery system Active CN218352976U (en)

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Application Number Priority Date Filing Date Title
CN202221901344.6U CN218352976U (en) 2022-07-22 2022-07-22 Heat recovery system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202221901344.6U CN218352976U (en) 2022-07-22 2022-07-22 Heat recovery system

Publications (1)

Publication Number Publication Date
CN218352976U true CN218352976U (en) 2023-01-20

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Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
CN (1) CN218352976U (en)

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