CN218336952U - Double-effect cooling semiconductor refrigerating device - Google Patents
Double-effect cooling semiconductor refrigerating device Download PDFInfo
- Publication number
- CN218336952U CN218336952U CN202222413112.2U CN202222413112U CN218336952U CN 218336952 U CN218336952 U CN 218336952U CN 202222413112 U CN202222413112 U CN 202222413112U CN 218336952 U CN218336952 U CN 218336952U
- Authority
- CN
- China
- Prior art keywords
- cavity
- air
- cold
- hot
- air suction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a semiconductor refrigerating device with double-effect cooling, which comprises a box body; a cold air cavity and a hot air cavity are arranged inside the box body; an air inlet cavity is arranged between the cold air cavity and the hot air cavity; a hot side air suction cavity and a cold side air suction cavity are arranged in the air inlet cavity; the hot side air suction cavity is communicated with the hot air cavity; the cold side air suction cavity is communicated with the cold air cavity; a hot side cooling fin group is arranged in the hot side air suction cavity, a cold side cooling fin group is arranged in the cold side air suction cavity, and a semiconductor refrigerating fin is arranged between the hot side cooling fin group and the cold side cooling fin group; a first clapboard is arranged between the hot side air suction cavity and the cold side air suction cavity, and an opening is arranged on the first clapboard; a hot side axial flow fan is arranged in the hot side air suction cavity; a cold side axial flow fan is arranged in the cold air cavity; a cold side air outlet is arranged in the cold air cavity; a hot side air outlet is arranged in the hot air cavity. The device is simple to install, low in noise, energy-saving and environment-friendly, and very practical in small application places with mute requirements.
Description
Technical Field
The utility model relates to a refrigeration plant technical field, concretely relates to economic benefits and social benefits refrigerated semiconductor refrigerating plant.
Background
The server belongs to one kind of computer, is usually used for processing operation data, responding to service request, and is widely applied in various industries, because the server works almost uninterruptedly, and the inside of the server is provided with more electronic components, larger heat can be generated naturally, in order to avoid the influence of heat accumulation on the work of the server, refrigeration equipment is usually needed to be arranged for heat dissipation and temperature reduction; in the existing stage, two types of refrigeration equipment, namely chilled water type refrigeration equipment and direct expansion type refrigeration equipment, are common, and although both the two types of equipment can play a role in refrigeration to a certain extent, the two types of refrigeration equipment still have some defects in small data centers (libraries, laboratories and the like) with mute requirements; for the direct expansion type refrigeration equipment, an external machine needs to be installed, time and labor are wasted during installation, meanwhile, the noise of the compressor is high in the operation process of the equipment, and the applicable environment has certain limitation.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a economic benefits and social benefits refrigerated semiconductor refrigerating plant to solve traditional refrigerated water refrigeration plant, the drawback that formula refrigeration plant that directly expands exists when dealing with some small-size data centers that just have the silence demand.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a double-effect cooling semiconductor refrigerating device comprises a box body;
a cold air cavity and a hot air cavity are arranged in the box body at a left-right interval; an air inlet cavity is arranged between the cold air cavity and the hot air cavity; a hot side air suction cavity and a cold side air suction cavity are arranged in the air inlet cavity at an upper-lower interval; the hot side air suction cavity is communicated with the hot air cavity; the cold side air suction cavity is communicated with the cold air cavity;
a hot side cooling fin group is arranged in the hot side air suction cavity, a cold side cooling fin group is arranged in the cold side air suction cavity, and a semiconductor refrigerating fin is arranged between the hot side cooling fin group and the cold side cooling fin group; a first partition plate is arranged between the hot side air suction cavity and the cold side air suction cavity, and an opening for abdicating the semiconductor refrigerating sheet is formed in the first partition plate;
a hot side axial flow fan for sucking air from the outside of the box body to the hot side air suction cavity is arranged in the hot side air suction cavity; a cold side axial flow fan used for sucking air from the cold side air suction cavity to the cold air cavity is arranged in the cold air cavity;
a cold air outlet is arranged in the cold air cavity; and a hot air outlet is arranged in the hot air cavity.
Further, the cold air cavity is located on the left side of the box body, and the hot air cavity is located on the right side of the box body; the hot side air suction cavity is positioned on the upper side of the cold side air suction cavity.
Furthermore, a second partition plate is arranged between the cold air cavity and the air inlet cavity, and a first communication port for communicating the cold air cavity with the cold side air suction cavity is formed in the second partition plate;
and a third partition plate is arranged between the hot air cavity and the air inlet cavity, and a second communication port for communicating the hot air cavity with the hot side air suction cavity is formed in the third partition plate.
Further, the hot side heat dissipation plate set is fixed on the upper side face of the first partition plate, and the cold side heat dissipation plate set is fixed on the lower side face of the first partition plate.
Furthermore, two cold side air outlets are arranged and are respectively arranged at the top and the bottom of the cold air cavity;
and two hot side air outlets are arranged and are respectively arranged at the top and the bottom of the hot air cavity.
Furthermore, silicone grease is arranged between the cold-side cooling fin group and the semiconductor refrigerating fin.
The utility model has the advantages that:
in the device, when in an external circulation working mode, the device is arranged in an up-down forward direction, the axial flow fan at the hot side sucks air from the inside of the cabinet to the inside of the box body, and airflow passes through the air suction cavity at the hot side, the second communication hole and the hot air cavity in sequence and is finally discharged out of the inside of the cabinet from the opening at the bottom of the hot air cavity; and the hot-side axial flow fan sucks air from the inside of the cabinet to the inside of the box body, and airflow sequentially passes through the hot-side air suction cavity, the second communication hole and the hot air cavity and is finally discharged out of the inside of the cabinet from an opening at the bottom of the hot air cavity. In the internal circulation mode, the device is arranged in the up-down direction, the axial flow fan at the hot side works, air is sucked from the outside of the machine cabinet, and air flow sequentially passes through the air suction cavity at the hot side, the second communication port and the hot air cavity and is finally discharged from an opening at the top of the hot air cavity; the cold side axial flow fan works, air is sucked from the inside of the machine cabinet, air flow passes through the cold side air suction cavity, the first communication port and the cold air cavity in sequence, and finally is discharged into the inside of the machine cabinet from an opening in the bottom of the cold air cavity; thereby realize the heat dissipation cooling to the inside server of rack, compare traditional frozen water type, directly expand formula refrigeration plant, the device installation is simple, the noise is little, and energy-concerving and environment-protective relatively more, and is very practical in some small-size application places that just have the silence requirement.
Furthermore, the device can flexibly select the positive position or the negative position according to the actual situation of the environment, provides two different refrigeration modes and effects, and meets the use requirement.
Drawings
FIG. 1 is a schematic view of the overall structure of the utility model;
FIG. 2 is an enlarged view of a portion of FIG. 1 at A;
FIG. 3 is a schematic view of the air flow direction in the external circulation mode of the present invention;
fig. 4 is a schematic view of the flow direction of the air flow in the internal circulation mode of the present invention.
Names corresponding to the marks in the figure:
1. the cooling air cooling device comprises a cold air cavity, 10 cold side axial flow fans, 2 hot air cavity, 3 hot side air suction cavity, 30 hot side cooling fin group, 4 cold side air suction cavity, 40 cold side cooling fin group, 5 hot side axial flow fans, 6 first partition plate, 60 gap, 7 second partition plate, 8 third partition plate, 9 semiconductor refrigerating fin.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art all belong to the protection scope of the present invention.
The embodiment of the utility model provides a:
as shown in fig. 1-2, the double-effect cooling semiconductor refrigerating device comprises a box body.
A cold air cavity 1 and a hot air cavity 2 are arranged in the box body at the left and right intervals, wherein the cold air cavity 1 is positioned at the left end of the box body, and the hot air cavity 2 is positioned at the right end of the box body; an air inlet cavity is arranged between the cold air cavity 1 and the hot air cavity 2; a hot side air suction cavity 3 is arranged above the inner part of the air inlet cavity, and a cold side air suction cavity is arranged below the inner part of the air inlet cavity; a hot side cooling fin group 30 is arranged in the hot side air suction cavity 3, a cold side cooling fin group 40 is arranged in the cold side air suction cavity 4, and a semiconductor refrigerating fin 9 is arranged between the hot side cooling fin group 30 and the cold side cooling fin group 40; the hot side air suction cavity 3 and the cold side air suction cavity 4 are provided with a first partition plate 6 therebetween, the first partition plate 6 is provided with an opening for yielding the semiconductor refrigerating sheet 9, the semiconductor refrigerating sheet 9 is located in the opening, the refrigerating side of the semiconductor refrigerating sheet 9 is arranged downwards and is in mutual contact with the cold side cooling sheet set 40, the heating side of the semiconductor refrigerating sheet 9 is arranged upwards and is in mutual contact with the hot side cooling sheet set 30, and the semiconductor refrigerating sheet 9 is respectively clamped and arranged by the hot side cooling sheet set 30 and the cold side cooling sheet set.
The hot side air suction cavity 3 is communicated with the hot air cavity 2, specifically, a second partition plate 7 is arranged between the cold air cavity 1 and the air inlet cavity, and a first communication port for communicating the cold air cavity 1 with the cold side air suction cavity 4 is arranged on the second partition plate 7; the cold side air suction cavity 4 is communicated with the cold air cavity 1, specifically, a third partition plate 8 is arranged between the hot air cavity 2 and the air inlet cavity, and a second communication port for communicating the hot air cavity 2 with the hot side air suction cavity 3 is arranged on the third partition plate 8.
A hot side axial flow fan 5 for sucking air from the box body to the hot side air suction cavity 3 is arranged in the hot side air suction cavity 3, and in the embodiment, the hot side axial flow fan 5 is fixed on the wall of the box body; a cold side axial flow fan 10 used for sucking air from the cold side air suction cavity 4 to the cold air cavity 1 is arranged in the cold air cavity 1, and the cold side axial flow fan 10 is fixed on the second partition plate 7.
A cold air outlet is arranged in the cold air cavity 1; a hot air outlet is arranged in the hot air cavity 2.
In this embodiment, the hot side heat sink plate group is fixed to the upper side of the first separator 6, and the cold side heat sink plate group is fixed to the lower side of the first separator 6.
The cold side air outlets are two and are respectively arranged at the top and the bottom of the cold air cavity 1; the hot side air outlets are arranged at the top and the bottom of the hot air cavity 2 respectively, when attention needs to be paid, only one hot side air outlet and one cold side air outlet are arranged in the using process, the other hot side air outlet and the other cold side air outlet are in a blocking state, and the arrangement of the device in the cabinet is based on the arrangement mode of the device at the top or the bottom.
Silicone grease is arranged between the cold-side cooling fin group 40 and the semiconductor chilling plate 9, so that a certain buffering effect can be achieved under the condition that heat conduction is not affected, and the semiconductor chilling plate 9 is prevented from being broken due to overlarge stress.
In this embodiment, the box is provided with silencing cotton at the place where the air flow circulates.
In this embodiment, when the thickness of the semiconductor chilling plate 9 is not consistent with that of the first partition plate 6, a gap 60 is formed between the cold-side heat sink sheet group 40 and the first partition plate 6 and between the hot-side heat sink sheet group 30 and the first partition plate 6, and a rubber and plastic heat insulation plate is disposed in the gap 60 to ensure independence of heat and cold transfer.
The working principle is as follows:
external circulation mode of operation
As shown in fig. 3, when the external ambient temperature is relatively high (the temperature inside the cabinet is higher than the ambient temperature due to the heat dissipation inside the cabinet), the semiconductor cooling fins 9 are in an operating state. The whole device is arranged at the bottom side of the interior of the cabinet in the forward direction, the hot-side axial flow fan 5 sucks air from the interior of the cabinet into the box body, airflow passes through the hot-side air suction cavity 3, the second communicating hole and the hot air cavity 2 in sequence and is finally discharged out of the interior of the cabinet from an opening at the bottom of the hot air cavity 2 (the opening at the top of the hot air cavity 2 is in a blocking state), and at the moment, the opening at the bottom of the hot air cavity 2 is connected with an air outlet used for air exhaust on the cabinet; meanwhile, the cold-side axial flow fan 10 sucks air from the outside of the cabinet inwards, the air flow passes through the cold-side air suction cavity 4, the first communicating hole and the cold air cavity 1 in sequence, and is finally discharged into the cabinet from the opening at the top of the cold air cavity 1 (the opening at the bottom of the cold air cavity 1 is in a blocking state), and at the moment, the cold-side air suction cavity 4 is connected with an air inlet for air inlet at the bottom of the cabinet; in the whole process, the heat in the cabinet is discharged out of the cabinet under the action of the hot-side axial flow fan 5, and meanwhile, the heat on the hot-side cooling fin group 30 is taken away when the airflow passes through the hot air suction cavity, so that the normal work of the semiconductor refrigerating fins 9 is ensured, and the heat dissipation and cooling in the cabinet are better realized; and when the cold side axial flow fan sends external air flow into the cabinet, the air flow passes through the cold side cooling fin group 40 in the cold side air suction cavity, and the air flow brings cooling capacity generated by the semiconductor refrigerating fins 9 on the cold side cooling fin group into the cabinet, so that the cooling and heat dissipation inside the cabinet are realized, and the continuous heat dissipation and cooling of the cabinet are realized under the continuous circulation of two paths of air flows. It should be noted that the semiconductor refrigeration sheet 9 may also be in a non-working state according to a specific environment temperature condition, and the requirement of heat dissipation and cooling may also be met only by circulation of the air flow, so as to save more energy.
Internal circulation mode of operation
As shown in fig. 4, when the external environment is relatively low (the temperature of the cabinet is lower than the ambient temperature), the whole device is reversely arranged at the bottom side of the interior of the cabinet at this time, the semiconductor refrigeration sheet 9 is in a working state, the hot-side axial flow fan 5 works, air is sucked from the exterior of the cabinet, airflow sequentially passes through the hot-side air suction cavity 3, the second communication port and the hot air cavity 2, and is finally discharged from the opening at the top of the hot air cavity 2 (at this time, the opening at the bottom of the hot air cavity 2 is in a blocking state), the hot-side axial flow fan 5 is connected with an air inlet for air intake at the bottom of the cabinet, and the opening at the top of the hot air cavity 2 is connected with an air outlet for air exhaust at the bottom of the cabinet; meanwhile, the cold-side axial flow fan 10 works, air is sucked from the inside of the cabinet, air flow passes through the cold-side air suction cavity, the first communication port and the cold air cavity 1 in sequence, and is finally discharged into the inside of the cabinet from an opening at the bottom of the cold air cavity 1 (at the moment, the opening at the top is in a blocking state), in the whole process, heat on the hot-side cooling fin group 30 is discharged through the air flow of the second channel, and cold on the cold-side cooling fin group 40 is continuously sent to the inside of the cabinet through the air flow of the first channel, so that heat dissipation and temperature reduction of the cabinet are realized. It should be noted that the semiconductor refrigeration sheet 9 may also be in a non-working state according to a specific environment temperature condition, and the requirement of heat dissipation and cooling may also be met only by circulation of the air flow, so as to save more energy.
It should be noted that, since the outer circulation mode and the inner circulation mode correspond to two states of the device being placed in the right and the reverse directions, in order to avoid confusion between the two modes, the descriptions about "top" and "bottom" in the inner circulation operation mode are still based on the "top" and "bottom" defined in the outer circulation operation mode; the "opening at the top of the hot blast chamber 2" as in the inner circulation mode of operation refers to the lower located opening in the hot blast chamber 2 in fig. 4.
Claims (6)
1. A semiconductor refrigerating device with double-effect cooling is characterized in that: comprises a box body;
a cold air cavity and a hot air cavity are arranged in the box body at left and right intervals; an air inlet cavity is arranged between the cold air cavity and the hot air cavity; a hot side air suction cavity and a cold side air suction cavity are arranged in the air inlet cavity at intervals up and down; the hot side air suction cavity is communicated with the hot air cavity; the cold side air suction cavity is communicated with the cold air cavity;
a hot side cooling fin group is arranged in the hot side air suction cavity, a cold side cooling fin group is arranged in the cold side air suction cavity, and a semiconductor refrigerating fin is arranged between the hot side cooling fin group and the cold side cooling fin group; a first partition plate is arranged between the hot side air suction cavity and the cold side air suction cavity, and an opening for abdicating the semiconductor refrigerating sheet is formed in the first partition plate;
a hot side axial flow fan for sucking air from the outside of the box body to the hot side air suction cavity is arranged in the hot side air suction cavity; a cold side axial flow fan used for sucking air from the cold side air suction cavity to the cold air cavity is arranged in the cold air cavity;
a cold side air outlet is arranged in the cold air cavity; and a hot side air outlet is arranged in the hot air cavity.
2. The dual effect cooling semiconductor chilling device of claim 1, wherein: the cold air cavity is positioned on the left side of the box body, and the hot air cavity is positioned on the right side of the box body; the hot side air suction cavity is positioned on the upper side of the cold side air suction cavity.
3. The dual effect cooling semiconductor chilling device of claim 1, wherein: a second partition plate is arranged between the cold air cavity and the air inlet cavity, and a first communication port for communicating the cold air cavity with the cold side air suction cavity is formed in the second partition plate;
and a third partition plate is arranged between the hot air cavity and the air inlet cavity, and a second communication port for communicating the hot air cavity with the hot side air suction cavity is formed in the third partition plate.
4. The double-effect cooled semiconductor refrigeration device according to claim 1, wherein: the hot side heat dissipation plate set is fixed on the upper side face of the first partition plate, and the cold side heat dissipation plate set is fixed on the lower side face of the first partition plate.
5. The dual effect cooling semiconductor chilling device of claim 1, wherein: the cold side air outlets are two and are respectively arranged at the top and the bottom of the cold air cavity;
and two hot side air outlets are arranged and are respectively arranged at the top and the bottom of the hot air cavity.
6. The dual effect cooling semiconductor chilling device of claim 1, wherein: and silicone grease is arranged between the cold-side radiating fin group and the semiconductor refrigerating fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222413112.2U CN218336952U (en) | 2022-09-09 | 2022-09-09 | Double-effect cooling semiconductor refrigerating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222413112.2U CN218336952U (en) | 2022-09-09 | 2022-09-09 | Double-effect cooling semiconductor refrigerating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218336952U true CN218336952U (en) | 2023-01-17 |
Family
ID=84834898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222413112.2U Active CN218336952U (en) | 2022-09-09 | 2022-09-09 | Double-effect cooling semiconductor refrigerating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218336952U (en) |
-
2022
- 2022-09-09 CN CN202222413112.2U patent/CN218336952U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103759448B (en) | The two cooling system of a kind of X-ray machine | |
| CN109189184B (en) | Big data mainframe box | |
| WO2018149032A1 (en) | Heat dissipation assembly and refrigeration device | |
| WO2011006314A1 (en) | Intelligent energy-saving air conditioner | |
| CN104613556A (en) | Heat dissipation device of electrical element and air conditioner with same | |
| CN218336952U (en) | Double-effect cooling semiconductor refrigerating device | |
| CN201233076Y (en) | Cooling machine cabinet of energy-conserving server | |
| CN208751104U (en) | A kind of water-cooling semiconductor refrigeration air duct refrigerates rice bin | |
| WO2009043221A1 (en) | A portable refrigerator | |
| CN216134765U (en) | Electric cabinet cooling system | |
| CN213399405U (en) | Temperature-controllable radiator | |
| CN212116063U (en) | Heat dissipation device applied to electronic equipment | |
| CN210781826U (en) | Computer lab cooling system | |
| CN212132777U (en) | Portable air conditioner | |
| CN111757646A (en) | Heat dissipation device applied to electronic equipment | |
| CN216204455U (en) | Air energy condensing device | |
| CN219063802U (en) | Screw type water chiller | |
| CN218376801U (en) | Circulating cooling structure of vacuum pump unit | |
| CN218296280U (en) | Refrigerating system | |
| CN212992804U (en) | Novel electromechanical device's heat dissipation protection device | |
| CN218723356U (en) | Auxiliary cooling device for cooling water of refrigerator | |
| CN214148402U (en) | One-way refrigerator for air conditioner | |
| CN210035948U (en) | Condenser with bottle | |
| CN208540361U (en) | Cabinet air conditioner cooling system | |
| CN220828912U (en) | Semiconductor refrigeration dehumidifier capable of self-utilizing cold energy |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |