CN216204455U

CN216204455U - Air energy condensing device

Info

Publication number: CN216204455U
Application number: CN202122588433.1U
Authority: CN
Inventors: 冯敏
Original assignee: Aokeli Environmental Technology Co ltd
Current assignee: Aokeli Environmental Technology Co ltd
Priority date: 2021-10-26
Filing date: 2021-10-26
Publication date: 2022-04-05
Anticipated expiration: 2031-10-26

Abstract

The utility model discloses an air energy condensing device, which comprises a main body component and a condensing mechanism, wherein the main body component comprises an air energy casing, a control cabinet, heat dissipation holes, a box body and heat dissipation fins; the condensation mechanism comprises an exhaust pipe, a temperature sensor, a relay, a PLC (programmable logic controller), a semiconductor refrigeration piece and a heat conduction pipe; according to the utility model, the temperature sensor is used for detecting the temperature data in the control cabinet, when the data detected by the temperature sensor reaches a first threshold value, the PLC and the relay are used for starting the first heat dissipation fan to work, when the data detected by the temperature sensor reaches a second threshold value, the water pump, the second heat dissipation fan and the semiconductor refrigeration sheet are started to work, and then the working semiconductor refrigeration sheet is used for refrigerating and cooling the water used in the water storage tank, so that the water temperature in the water storage tank is prevented from rising, the cooling effect on the cooling fin is increased, the normal work of the cooling fin is ensured, and the air energy condensation effect is improved.

Description

Air energy condensing device

Technical Field

The utility model relates to the technical field of air energy, in particular to an air energy condensing device.

Background

The air energy refers to low-grade heat energy contained in the air, but according to the second law of thermodynamics, the heat cannot be transferred from a low-temperature heat source to a high-temperature heat source without causing other changes, so that the air cannot be utilized on the basis of not consuming external energy, and the heat pump can realize the functions of absorbing the heat from the air and transferring the heat to a high-temperature object or environment, and the technology is called as an air source heat pump;

traditional air can condensing equipment when using, utilizes fan and endless water to cool down the heat dissipation work to the fin usually, because endless water when using, rises along with live time's increase temperature gradually to influenced the cooling work to the fin, and then lead to the air can the condensation effect to reduce, for this reason, propose air can condensing equipment.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to an air energy condensing device to solve the above problems of the related art.

In order to achieve the purpose, the utility model provides the following technical scheme: the air energy condensing device comprises a main body component and a condensing mechanism, wherein the main body component comprises an air energy casing, a control cabinet, heat dissipation holes, a box body and heat dissipation fins;

the condensation mechanism comprises an exhaust pipe, a temperature sensor, a relay, a PLC (programmable logic controller), a semiconductor refrigeration piece and a heat conduction pipe;

the utility model discloses a refrigerator, including air can casing, top fixedly connected with switch board, air can casing, the inside roof fixedly connected with fin of air can casing, the inside of fin is equipped with the heat pipe, inside wall one side of switch board is equipped with temperature sensor, the top fixedly connected with box of switch board, the inside diapire fixedly connected with storage water tank of box, the one end of heat pipe runs through the inside wall of fin and communicates in the bottom of storage water tank, the inside wall fixedly connected with of storage water tank leads cold block, the top of leading cold block bonds in the cold junction of semiconductor refrigeration piece, the inside of box is equipped with the PLC controller, the relay is installed to the inside diapire of box.

Preferably, the bottom wall of the interior of the box body is fixedly connected with a storage plate, the bottom of the PLC is installed on the inner side wall of the storage plate, a groove is formed in the inner side wall of the control cabinet, and one side of the temperature sensor is installed on the inner side wall of the groove; and temperature data in the control cabinet is detected through the temperature sensor.

Preferably, the top of the water storage tank is fixedly connected with an exhaust pipe, one end of the exhaust pipe penetrates through the inner side wall of the tank body, and the top of the inner side wall of the exhaust pipe is fixedly connected with a first dust screen; and intercepting dust in the air through the first dust screen.

Preferably, the bottom of the cold guide block is symmetrically and fixedly connected with two heat conduction rings, and the hot end of the semiconductor refrigeration sheet is bonded with the heat conduction block; the heat at the hot end of the semiconductor refrigerating sheet is absorbed by the heat conducting block.

Preferably, a second heat dissipation fan is installed in the middle of the inner side wall of the exhaust pipe, and a water pumping pipe is communicated with one side of the water storage tank; the water pump pumps out water in the water storage tank through the water pumping pipe.

Preferably, the bottom wall of the interior of the box body is provided with a water pump, one end of the water pumping pipe is communicated with a water inlet of the water pump, and one end of the heat conducting pipe, which is far away from the water storage tank, is communicated with a water outlet of the water pump; the water is discharged into the heat conduction pipe through the water outlet of the water pump.

Preferably, the outer side wall of the control cabinet is uniformly provided with heat dissipation holes, one side of the outer side wall of the control cabinet is communicated with an exhaust pipe, and the inner side wall of the exhaust pipe is provided with a first heat dissipation fan; carry out quick ventilation cooling work in to the switch board through first heat dissipation fan.

Preferably, the signal output end of the temperature sensor is electrically connected to the signal input end of the PLC controller through a wire, the electrical output end of the PLC controller is electrically connected to the electrical input end of the relay through a wire, and the electrical output end of the relay is electrically connected to the electrical input ends of the first heat dissipation fan, the water pump, the second heat dissipation fan and the semiconductor refrigeration sheet through wires; and receiving data of the temperature sensor through the PLC.

Compared with the prior art, the utility model has the beneficial effects that: according to the utility model, the temperature sensor is used for detecting the temperature data in the control cabinet, when the data detected by the temperature sensor reaches a first threshold value, the PLC and the relay are used for starting the first heat dissipation fan to work, when the data detected by the temperature sensor reaches a second threshold value, the water pump, the second heat dissipation fan and the semiconductor refrigeration sheet are started to work, and then the working semiconductor refrigeration sheet is used for refrigerating and cooling the water used in the water storage tank, so that the water temperature in the water storage tank is prevented from rising, the cooling effect on the cooling fin is increased, the normal work of the cooling fin is ensured, and the air energy condensation effect is improved.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic cross-sectional view of the present invention;

FIG. 3 is a schematic longitudinal sectional view of the present invention;

FIG. 4 is a schematic sectional view of an exhaust duct according to the present invention.

In the figure: 1. a body assembly; 2. a condensing mechanism; 101. an air energy housing; 102. a control cabinet; 103. heat dissipation holes; 104. a box body; 105. a heat sink; 201. an exhaust duct; 202. a temperature sensor; 203. a relay; 204. a PLC controller; 205. a semiconductor refrigeration sheet; 206. a heat conducting pipe; 41. a first dust screen; 42. a groove; 43. a water storage tank; 44. a storage plate; 45. an exhaust pipe; 46. a first heat dissipation fan; 47. a water pump; 48. a water pumping pipe; 49. a second heat dissipation fan; 50. a heat conducting block; 51. a cold conducting block; 52. a thermally conductive ring.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Examples

Referring to fig. 1-4, the present invention provides a technical solution: the air energy condensing device comprises a main body component 1 and a condensing mechanism 2, wherein the main body component 1 comprises an air energy casing 101, a control cabinet 102, a heat dissipation hole 103, a box body 104 and a heat dissipation fin 105;

the condensing mechanism 2 comprises an exhaust duct 201, a temperature sensor 202, a relay 203, a PLC (programmable logic controller) 204, a semiconductor chilling plate 205 and a heat pipe 206;

air can casing 101's top fixedly connected with switch board 102, air can casing 101's inside roof fixedly connected with fin 105, the inside of fin 105 is equipped with heat pipe 206, inside wall one side of switch board 102 is equipped with temperature sensor 202, the top fixedly connected with box 104 of switch board 102, the inside diapire fixedly connected with storage water tank 43 of box 104, the one end of heat pipe 206 runs through the inside wall of fin 105 and communicates in the bottom of storage water tank 43, the inside wall fixedly connected with of storage water tank 43 leads cold block 51, lead the top of cold block 51 and bond in the cold junction of semiconductor refrigeration piece 205, the inside of box 104 is equipped with PLC controller 204, relay 203 is installed to the inside diapire of box 104.

In this embodiment, specifically: the bottom wall of the interior of the box 104 is fixedly connected with a storage plate 44, the bottom of the PLC 204 is mounted on the inner side wall of the storage plate 44, the inner side wall of the control cabinet 102 is provided with a groove 42, and one side of the temperature sensor 202 is mounted on the inner side wall of the groove 42; temperature data within the control cabinet 102 is sensed by the temperature sensor 202.

In this embodiment, specifically: the top of the water storage tank 43 is fixedly connected with an exhaust pipe 201, one end of the exhaust pipe 201 penetrates through the inner side wall of the tank body 104, and the top of the inner side wall of the exhaust pipe 201 is fixedly connected with a first dust screen 41; the dust in the air is intercepted by the first dust screen 41, and the dust is prevented from entering the inside of the exhaust duct 201.

In this embodiment, specifically: the bottom of the cold-conducting block 51 is symmetrically and fixedly connected with two heat-conducting rings 52, and the hot end of the semiconductor refrigerating sheet 205 is bonded with the heat-conducting block 50; the heat at the hot end of the semiconductor chilling plate 205 is absorbed by the heat conduction block 50, and then the heat dissipation work is performed on the heat conduction block 50 by the second heat dissipation fan 49 working.

In this embodiment, specifically: a second heat dissipation fan 49 is arranged in the middle of the inner side wall of the exhaust pipe 201, and one side of the water storage tank 43 is communicated with a water pumping pipe 48; the water pump 47 pumps water out of the water storage tank 43 through the water pumping pipe 48.

In this embodiment, specifically: a water pump 47 is arranged on the bottom wall in the box body 104, one end of a water pumping pipe 48 is communicated with a water inlet of the water pump 47, and one end of a heat conducting pipe 206 far away from the water storage tank 43 is communicated with a water outlet of the water pump 47; the water is discharged into the heat pipe 206 through the water discharge port of the water pump 47, and then the heat transfer operation is performed with the heat sink 105 through the heat pipe 206, and the water cooling operation is performed with respect to the heat sink 105.

In this embodiment, specifically: the outer side wall of the control cabinet 102 is uniformly provided with heat dissipation holes 103, one side of the outer side wall of the control cabinet 102 is communicated with an exhaust pipe 45, and the inner side wall of the exhaust pipe 45 is provided with a first heat dissipation fan 46; the first cooling fan 46 is used for conducting rapid ventilation and cooling work on the inside of the control cabinet 102, so that the cooling fins 105 are preliminarily cooled.

In this embodiment, specifically: the signal output end of the temperature sensor 202 is electrically connected to the signal input end of the PLC controller 204 through a wire, the electrical output end of the PLC controller 204 is electrically connected to the electrical input end of the relay 203 through a wire, and the electrical output end of the relay 203 is electrically connected to the electrical input ends of the first heat dissipation fan 46, the water pump 47, the second heat dissipation fan 49 and the semiconductor refrigeration sheet 205 through wires; the data of the temperature sensor 202 is received by the PLC controller 204, and the opening and closing of the relay 203 is controlled by the PLC controller 204.

In this embodiment, specifically: a switch group for turning on and off the temperature sensor 202 and the PLC controller 204 is installed on one side of the control cabinet 102, and the switch group is connected with an external commercial power to supply power to the temperature sensor 202 and the PLC controller 204.

In this embodiment, specifically: the model number of the temperature sensor 202 is D6T-1A-01; the PLC controller 204 is DF-96D in model number; the water pump 47 is of the type HLS-550; the model of the semiconductor refrigerating plate 205 is TEC1-12703 AC.

The utility model is in operation: the temperature sensor 202 and the PLC 204 are started to work through the switch group, the working temperature sensor 202 detects temperature data in the control cabinet 102, when the temperature data detected by the temperature sensor 202 reaches a first threshold value, the relay 203 is started to work through the PLC 204, the working relay 203 starts the first heat dissipation fan 46 to work, the working first heat dissipation fan 46 performs rapid ventilation and heat dissipation work on the control cabinet 102, so as to perform primary cooling on the heat dissipation fins 105, when the data detected by the temperature sensor 202 reaches a second threshold value, the PLC 204 and the relay 203 start the water pump 47, the second heat dissipation fan 49 and the semiconductor refrigeration fins 205 to work, the working water pump 47 pumps water in the water storage tank 43 through the water pumping pipe 48, then the water is discharged into the heat conduction pipe 206 through a water discharge port of the water pump 47, and then the heat conduction work is performed on the heat dissipation fins 105 through the heat conduction pipe 206, then the water-cooling heat dissipation work is carried out on the heat dissipation fin 105, the used water is guided into the heat dissipation hole 103 through the heat conduction pipe 206 for recycling, then the temperature of the cold end of the semiconductor refrigeration sheet 205 is guided out through the cold conduction block 51, the refrigeration and temperature reduction work is carried out in the heat dissipation hole 103, then the contact area between the semiconductor refrigeration sheet 205 and the water in the heat dissipation hole 103 is increased through the arranged heat conduction ring 52, the refrigeration effect is improved, then the heat of the hot end of the semiconductor refrigeration sheet 205 is absorbed through the heat conduction block 50, then the heat dissipation work is carried out on the heat conduction block 50 through the working second heat dissipation fan 49, then the dust in the air is intercepted through the first dustproof net 41, the dust is prevented from entering the interior of the exhaust pipe 201, the device not only prevents the water temperature from rising, but also increases the temperature reduction effect on the heat dissipation fin 105, and ensures the normal work of the heat dissipation fin 105, the air energy condensation effect is improved.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. Air can condensing equipment, including main part subassembly (1) and condensation mechanism (2), its characterized in that: the main body component (1) comprises an air energy casing (101), a control cabinet (102), heat dissipation holes (103), a box body (104) and heat dissipation fins (105);

the condensation mechanism (2) comprises an exhaust pipe (201), a temperature sensor (202), a relay (203), a PLC (programmable logic controller) controller (204), a semiconductor refrigeration sheet (205) and a heat conduction pipe (206);

the top of the air energy casing (101) is fixedly connected with a control cabinet (102), the top wall of the interior of the air energy casing (101) is fixedly connected with a radiating fin (105), a heat conducting pipe (206) is arranged in the radiating fin (105), a temperature sensor (202) is arranged on one side of the inner side wall of the control cabinet (102), the top of the control cabinet (102) is fixedly connected with a box body (104), the bottom wall inside the box body (104) is fixedly connected with a water storage tank (43), one end of the heat conduction pipe (206) penetrates through the inner side wall of the radiating fin (105) and is communicated with the bottom of the water storage tank (43), the inner side wall of the water storage tank (43) is fixedly connected with a cold guide block (51), the top of the cold guide block (51) is bonded with the cold end of the semiconductor refrigeration sheet (205), the inside of box (104) is equipped with PLC controller (204), relay (203) is installed to the inside diapire of box (104).

2. An air energy condensing device according to claim 1, characterized by: the inside diapire fixedly connected with of box (104) puts thing board (44), the bottom of PLC controller (204) is installed in the inside wall of putting thing board (44), the inside wall of switch board (102) is seted up flutedly (42), one side of temperature sensor (202) is installed in the inside wall of flutedly (42).

3. An air energy condensing device according to claim 1, characterized by: the top fixedly connected with exhaust pipe (201) of storage water tank (43), the inside wall of box (104) is run through to the one end of exhaust pipe (201), the first dust screen (41) of inside wall top fixedly connected with of exhaust pipe (201).

4. An air energy condensing device according to claim 1, characterized by: the bottom of the cold guide block (51) is symmetrically and fixedly connected with two heat conduction rings (52), and the hot end of the semiconductor refrigeration sheet (205) is bonded with the heat conduction block (50).

5. An air energy condensing device according to claim 1, characterized by: the inside wall mid-mounting of exhaust pipe (201) has second heat dissipation fan (49), one side intercommunication of storage water tank (43) has drinking-water pipe (48).

6. An air energy condensing device according to claim 5 characterized by: water pump (47) are installed to the inside diapire of box (104), the one end of drinking-water pipe (48) communicates in the water inlet of water pump (47), the one end that storage water tank (43) were kept away from in heat pipe (206) communicates in the outlet of water pump (47).

7. An air energy condensing device according to claim 6 wherein: the radiating holes (103) are uniformly formed in the outer side wall of the control cabinet (102), an exhaust pipe (45) is communicated with one side of the outer side wall of the control cabinet (102), and a first radiating fan (46) is installed on the inner side wall of the exhaust pipe (45).

8. An air energy condensing device according to claim 7 characterized by: the signal output end of the temperature sensor (202) is electrically connected to the signal input end of the PLC controller (204) through a wire, the electrical output end of the PLC controller (204) is electrically connected to the electrical input end of the relay (203) through a wire, and the electrical output end of the relay (203) is electrically connected to the electrical input ends of the first heat dissipation fan (46), the water pump (47), the second heat dissipation fan (49) and the semiconductor refrigeration piece (205) through wires.