CN218336899U

CN218336899U - Passive heat dissipation device and electronic equipment

Info

Publication number: CN218336899U
Application number: CN202221923093.1U
Authority: CN
Inventors: 傅志杰; 林海涛
Original assignee: Hongqisheng Precision Electronics Qinhuangdao Co Ltd; Avary Holding Shenzhen Co Ltd
Current assignee: Hongqisheng Precision Electronics Qinhuangdao Co Ltd; Avary Holding Shenzhen Co Ltd
Priority date: 2022-07-25
Filing date: 2022-07-25
Publication date: 2023-01-17
Anticipated expiration: 2032-07-25

Abstract

The application provides a passive heat abstractor, passive heat abstractor includes a plurality of radiating element, radiating element includes first pipeline, second pipeline and third pipeline, the second pipeline communicate in first pipeline with between the third pipeline, the aperture of first pipeline with the aperture of third pipeline all is greater than the aperture of second pipeline, the lateral wall of second pipeline is equipped with the through-hole, through-hole intercommunication external environment. The heat dissipation device can realize high-efficiency automatic circulation of air according to the Bernoulli effect, achieves the heat dissipation effect, and is superior to the conventional heat dissipation fins. The application also provides electronic equipment comprising the passive heat dissipation device.

Description

Passive heat dissipation device and electronic equipment

Technical Field

The present application relates to a passive heat dissipating device and an electronic apparatus including the same.

Background

The conventional heat dissipation method is generally heat dissipation by a heat sink, and the heat energy in a heat source is conducted or radiated onto the heat sink, so that the heat energy can be radiated to the air by the heat sink by utilizing the characteristics of quick heat conduction and large heat dissipation area of the heat sink, and then the heat energy is taken away by the air circulation, thereby achieving the heat dissipation effect. Therefore, the heat dissipation effect depends heavily on the heat dissipation area of the heat dissipation fins and the air circulation rate, which results in low air circulation rate and poor heat dissipation effect of the heat dissipation fins. In order to obtain a better heat dissipation effect, the surface area of the heat sink needs to be increased continuously, so that the overall volume of the electronic device is increased.

SUMMERY OF THE UTILITY MODEL

In view of the above, there is a need to provide a passive heat sink that can solve the above problems.

In addition, the present application also needs to provide an electronic device including the passive heat dissipation device.

An embodiment of the present application provides a passive heat dissipation device, passive heat dissipation device includes a plurality of heat dissipation units, heat dissipation unit includes first pipeline, second pipeline and third pipeline, the second pipeline communicate in first pipeline with between the third pipeline, the aperture of first pipeline with the aperture of third pipeline all is greater than the aperture of second pipeline, the lateral wall of second pipeline is equipped with the through-hole, through-hole intercommunication external environment.

In some embodiments, the first conduit has a decreasing pore size in a direction in which the first conduit connects to the second conduit.

In some embodiments, the second conduit has a constant pore size along the direction in which the first conduit connects to the second conduit.

In some embodiments, the third conduit has a gradually larger pore size in a direction in which the second conduit connects the third conduit.

In some embodiments, the third conduit has a maximum pore size that is less than the maximum pore size of the first conduit.

In some embodiments, the heat sink further includes a connecting portion, the plurality of heat dissipating units are arranged in a matrix to form a heat dissipating body, and the connecting portion is connected to an outer side of the heat dissipating body.

The application still provides an electronic equipment including above-mentioned passive heat abstractor, electronic equipment includes circuit board, heating element and passive heat abstractor, heating element locates the circuit board with between the passive heat abstractor, heating element electric connection the circuit board, first pipeline orientation heating element sets up.

In some embodiments, the passive heat sink and the heat generating element have a gap therebetween, the gap communicating with each of the first conduits.

In some embodiments, the passive heat dissipation device further includes a fastening element and a fixing post, one end of the fixing post is disposed on the circuit board, the passive heat dissipation device further includes a connecting portion disposed outside the heat dissipation unit, and the fastening element connects the fixing post and the connecting portion.

In some embodiments, the heat-generating component is a chip.

The application provides a passive heat abstractor is through setting up the minimum second pipeline in aperture between first pipeline and third pipeline, according to the Bernoulli effect for the air current by first pipeline passes through circulation passageway reduces during the second pipeline, the velocity of flow increases, forms the low-pressure area passive heat abstractor is inside and outside formation pressure difference, realizes the high-efficient automatic cycle of air, reaches the radiating effect, and the radiating effect is superior to conventional fin. In addition, the through hole is formed in the side wall of the second pipeline, so that low-speed airflow in an external high-pressure area can flow from the through hole to the low-pressure area in an accelerated mode, the exchange amount of the airflow in the external high-pressure area and the airflow in the internal low-pressure area can be increased, and the heat dissipation efficiency is improved. The passive heat dissipation device has the advantages of better heat dissipation effect than the conventional heat dissipation fins, no need of an external device, energy saving, lighter weight, smaller volume and contribution to miniaturization of electronic equipment.

Drawings

Fig. 1 is a schematic cross-sectional view of an electronic device according to an embodiment of the present disclosure.

Fig. 2 is a top view of the electronic device shown in fig. 1.

Fig. 3 is a schematic diagram illustrating an operation principle of the passive heat dissipation device shown in fig. 1.

Description of the main elements

Passive heat sink 100

Heat dissipation body 10

Heat radiation unit 11

First pipe 111

Second pipe 112

Third pipe 113

Through hole 114

Connecting part 12

First gap 13

Circuit board 20

Heating element 30

Second gap 32

Fastener 40

Fixing post 42

Electronic device 200

The following detailed description will further illustrate the present application in conjunction with the above-described figures.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments.

In the description of the present application, it is to be understood that the terms "upper", "lower", "vertical", "horizontal", "inclined", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing the present application and simplifying the description, and do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first" and "second" may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In the description of the present application, it should be noted that, unless explicitly stated or limited otherwise, the terms "connected" and "connected" are to be interpreted broadly, e.g., as being fixed or detachable or integrally connected; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

Referring to fig. 1 and fig. 2, an embodiment of the present invention provides an electronic device 200, which includes a passive heat sink 100, a circuit board 20, and a heat generating element 30 stacked in sequence, and a fastening member 40 and a fixing post 42 for fixing the passive heat sink 100 to the circuit board 20.

The passive heat dissipation device 100 includes a heat dissipation body 10 and a connection portion 12 connected to the heat dissipation body 10, the heat dissipation body 10 includes a plurality of heat dissipation units 11, the plurality of heat dissipation units 11 are arranged in a matrix to form the heat dissipation body 10, and the connection portion 12 is connected to the outside of the heat dissipation body 10.

The heat dissipation unit 11 has a height direction a, and along the height direction a, the heat dissipation unit 11 includes a first pipeline 111, a second pipeline 112 and a third pipeline 113, the second pipeline 112 is communicated between the first pipeline 111 and the third pipeline 113, and the first pipeline 111 is disposed toward the heat generating element 30. In the height direction a, the aperture of the first duct 111 becomes gradually smaller, the aperture of the second duct 112 remains unchanged, and the aperture of the third duct 113 becomes gradually larger. A through hole 114 is formed in the side wall of the second pipeline 112, and the through hole 114 is communicated with the external environment.

Wherein the bottoms of the adjacent first pipes 111 are connected to each other to form the heat dissipation body 10. The maximum aperture D1 of the third pipe 113 is smaller than the maximum aperture D2 of the first pipe 111, so as to form a first gap 13 between adjacent heat dissipation units 11, and the first gap 13 is communicated with the through hole 114 and the external environment. Accordingly, air in the external environment can enter the second duct 112 through the first gap 13 and the through hole 114.

The fixing posts 42 are disposed on the surface of the circuit board 20, and the connecting portion 12 of the passive heat sink 100 is fixed to the fixing posts 42 by the fasteners 40. The height of the fixing post 42 is higher than the thickness of the heat generating element 30, so that the heat dissipating body 10 forms a second gap 32 with the surface of the heat generating element 30, and air in a high pressure area at the bottom of the electronic device 200 can enter the passive heat dissipating device 100 through the second gap 32.

In this embodiment, the number of the connecting portions 12 and the number of the corresponding fastening members 40 and the corresponding fixing posts 42 are two, and the two connecting portions 12 are diagonally connected to the outer side of the heat dissipating body 10. The fasteners 40 are bolts. The heating element 30 is a chip.

Referring to fig. 3, the working principle of the passive heat dissipation device 100 is as follows:

first, the heat generating element 30 generates a heat source, air is affected by the heat source, an upward fast flowing air flow is generated in the first duct 111, and in the process of flowing the air flow from the first duct 111 to the third duct 113, because the space of the second duct 112 is small, the flow passage of the air is rapidly reduced, so that the flow speed is rapidly increased when the air flow passes through the space, and a high-speed air flow is formed. According to Bernoulli's principle, the greater the air flow rate, the lower the pressure, thereby creating a low pressure region in the second conduit 112. Due to the pressure difference, the low-speed air flow of the external relatively high-pressure region is accelerated to flow to the low-pressure region by the second gap 32 between the heat dissipating body 10 and the heat generating element 30 and the through hole 114, so that the external air is automatically sucked into the passive heat dissipating device 100. Then, the high-speed airflow in the low-pressure area drives the low-speed airflow to flow out of the passive heat dissipation device 100 by means of gas viscosity, so that air circulation is formed, and a heat dissipation effect is achieved.

The passive heat sink 100 provided in the present application forms the second gap 32 between the heat generating element 30 and the passive heat sink 100, and provides the second pipe 112 with a smaller space between the third pipe 113 and the first pipe 111, so that the passive heat sink 100 can perform its own heat dissipation cycle according to the bernoulli effect, and the heat dissipation effect is superior to that of a conventional heat sink. In addition, the through holes 114 are formed in the side wall of the second duct 112, and the first gap 13 is controlled to be formed between two adjacent heat dissipation units 11, so that the exchange amount of the air flow in the external high pressure region and the air flow in the internal low pressure region can be increased, and the heat dissipation efficiency can be improved.

In addition, the passive heat dissipation device 100 does not need an external device, thereby saving energy, and being lighter in weight, smaller in volume, and beneficial to miniaturization of electronic equipment.

While the foregoing has been described in terms of what is presently considered to be a practical and preferred embodiment, the invention is not limited to the disclosed embodiment.

Claims

1. The utility model provides a passive heat abstractor, its characterized in that includes a plurality of radiating element, radiating element includes first pipeline, second pipeline and third pipeline, the second pipeline communicate in first pipeline with between the third pipeline, the aperture of first pipeline with the aperture of third pipeline all is greater than the aperture of second pipeline, the lateral wall of second pipeline is equipped with the through-hole, the through-hole communicates external environment.

2. The passive heat sink of claim 1, wherein the first conduit has a decreasing pore size in a direction in which the first conduit joins the second conduit.

3. The passive heat sink of claim 1, wherein the aperture of the second conduit is constant along the direction in which the first conduit connects to the second conduit.

4. The passive heat sink of claim 2, wherein the aperture of the third conduit becomes progressively larger in a direction in which the second conduit connects to the third conduit.

5. The passive heat sink of claim 4, wherein the third conduit has a maximum aperture that is smaller than a maximum aperture of the first conduit.

6. The passive heat dissipating device of claim 1, further comprising a connecting portion, wherein the plurality of heat dissipating units are arranged in a matrix to form a heat dissipating body, and the connecting portion is connected to an outer side of the heat dissipating body.

7. An electronic device, comprising a circuit board, a heat generating element and the passive heat dissipating device of any one of claims 1 to 6, wherein the heat generating element is disposed between the circuit board and the passive heat dissipating device, the heat generating element is electrically connected to the circuit board, and the first conduit is disposed toward the heat generating element.

8. The electronic device of claim 7, wherein a gap is provided between the passive heat sink and the heat generating element, the gap communicating with each of the first conduits.

9. The electronic device of claim 7, further comprising a fastener and a fixing post, one end of the fixing post being disposed on the circuit board, the passive heat dissipation device further comprising a connecting portion disposed outside the heat dissipation unit, the fastener connecting the fixing post and the connecting portion.

10. The electronic device of claim 7, wherein the heat generating component is a chip.