CN218333838U

CN218333838U - Good-sealing light emitting device diode lamp packaging structure

Info

Publication number: CN218333838U
Application number: CN202222524496.5U
Authority: CN
Inventors: 陈晓昌; 黄志燕
Original assignee: Shenzhen Baijiang Technology Co ltd
Current assignee: Shenzhen Baijiang Technology Co ltd
Priority date: 2022-09-23
Filing date: 2022-09-23
Publication date: 2023-01-17
Anticipated expiration: 2032-09-23

Abstract

The utility model discloses a light emitting diode lamps and lanterns packaging structure that leakproofness is good belongs to light emitting diode lamps and lanterns encapsulation technical field, including the molding compound, it has the metal sheet to peg graft in the bottom of molding compound, the top of metal sheet is provided with luminous chip, luminous chip passes through the surface that the metal sheet is connected to the solder, it has the shrouding to peg graft at the top of molding compound, it has the lead frame to peg graft in the both sides slip of molding compound, it has the gold thread to peg graft in luminous chip's inside, electric connection between gold thread and the lead frame, therefore, can fix a position metal sheet and the shrouding board through the molding compound, rethread metal sheet internal weld luminous chip, and the gold thread is connected through the lead frame at luminous chip and both ends, thereby guide external power source to inside luminous chip, the material of shrouding is epoxy, increase the moisture resistance of shrouding, it is insulating, increase its mechanical strength.

Description

Good-sealing light emitting device diode lamp packaging structure

Technical Field

The utility model relates to a light emitting diode lamps and lanterns especially relate to a light emitting diode lamps and lanterns packaging structure that the leakproofness is good, belong to light emitting diode lamps and lanterns encapsulation technical field.

Background

A light emitting diode, referred to as LED for short, is a commonly used light emitting device, emits light by energy released by recombination of electrons and holes, and is widely used in the field of illumination.

In the existing process of packaging the light emitting diode, liquid epoxy resin is injected into an LED forming die cavity, then a pressure-welded LED support is inserted, the LED support is placed into an oven to cure the epoxy resin, and the LED is separated from the die cavity to be formed.

In the process of curing the epoxy resin through the oven, a gap is formed in the epoxy resin, and air easily enters the light-emitting diode from the gap, so that the light-emitting diode lamp is poor in sealing performance.

Therefore, the light emitting diode lamp packaging structure with good sealing performance is designed and produced, so that the problems can be solved.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model is to provide a good light emitting diode lamps and lanterns packaging structure of leakproofness, this good light emitting diode lamps and lanterns packaging structure of leakproofness can realize sealing the not strong technical problem of light emitting diode lamps and lanterns leakproofness among the solution prior art to luminescent chip.

In order to solve the problems, the following technical scheme is provided:

a light emitting diode lamp packaging structure with good sealing performance is designed, the light emitting diode lamp packaging structure comprises a molding compound, a metal plate is inserted into the bottom of the molding compound, a light emitting chip is arranged on the top of the metal plate, the light emitting chip is connected with the surface of the metal plate through a welding flux, the top of the molding compound is inserted with a sealing plate, the two sides of the molding compound are inserted with lead frames in a sliding mode, the inner portion of the light-emitting chip is inserted with gold wires, and the gold wires are electrically connected with the lead frames.

Furthermore, the material of shrouding board is epoxy, just the shrouding top is circular setting.

Furthermore, silica gel and fluorescent powder are filled between the encapsulating plate and the molding compound.

Further, in the above-mentioned case, the metal plate is made of metal heat.

Furthermore, the lead frame is made of a PCB.

Furthermore, one end of the lead frame penetrates through the molding compound and is inserted into the metal plate.

Compared with the prior art, the method has the advantages that, the beneficial effects of the utility model reside in that: fix a position the metal sheet and encapsulate the board through moulding compound, the luminous chip of rethread metal sheet internal weld to the gold thread is connected through the lead frame at luminous chip and both ends, thereby inside leading external power source to luminous chip, and the material of enclosuring board is epoxy, increases enclosuring board's moisture resistance, and insulating nature increases its mechanical strength.

Specific embodiments of the present invention are disclosed in detail with reference to the following description and the accompanying drawings, which specify the manner in which the principles of the invention may be employed. It should be understood that the embodiments of the present invention are not so limited in scope. The embodiments of the invention include many variations, modifications and equivalents within the spirit and scope of the appended claims.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:

fig. 1 is a schematic view of an overall structure of an led lamp package structure according to a preferred embodiment of the present invention;

fig. 2 is an overall schematic perspective view of a light emitting diode lamp packaging structure according to a preferred embodiment of the present invention.

In the figure: 1. molding a molding compound; 2. a metal plate; 3. a light emitting chip; 4. enclosing the plate; 5. a lead frame; 6. and (6) gold wires.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

As shown in fig. 1-2, the light emitting diode lamp package structure with good sealing performance provided in this embodiment includes a molding compound 1, a metal plate 2 is inserted into the bottom of the molding compound 1, a light emitting chip 3 is disposed on the top of the metal plate 2, the light emitting chip 3 is connected to the surface of the metal plate 2 through a solder, a sealing plate 4 is inserted into the top of the molding compound 1, lead frames 5 are inserted into two sides of the molding compound 1 in a sliding manner, gold wires 6 are inserted into the light emitting chip 3, the gold wires 6 are electrically connected to the lead frames 5, the metal plate 2 and the sealing plate 4 are positioned through the molding compound 1, the light emitting chip 3 is welded inside the metal plate 2, and the gold wires 6 are connected to the lead frames 5 at two ends through the light emitting chip 3, so as to guide an external power source into the light emitting chip 3.

In this embodiment, as shown in fig. 1-2, the encapsulating plate 4 is made of epoxy resin, the top of the encapsulating plate 4 is disposed in a circular shape, the encapsulating plate 4 is made of epoxy resin, so as to increase the moisture resistance and the insulation property of the encapsulating plate 4, and increase the mechanical strength thereof, the silica gel and the fluorescent powder are filled between the encapsulating plate 4 and the molding compound 1, so as to increase the light efficiency of the light emitting chip 3, the metal plate 2 is made of metal heat, the metal plate 2 is not affected by temperature, the lead frame 5 is made of a PCB, and one end of the lead frame 5 penetrates through the molding compound 1 and is inserted into the metal plate 2.

The utility model discloses an application principle and use flow: fix a position metal sheet 2 and enclosuring board 4 through moulding compound 1, 2 internal weld of rethread metal sheet send out optical chip 3 to the gold thread 6 is connected through sending out optical chip 3 and the lead frame 5 at both ends, thereby leads external power source to send out optical chip 3 inside, and the material of enclosuring board 4 is epoxy, increases the moisture resistance of enclosuring board 4, and insulating nature increases its mechanical strength.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, such as "connected," which may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection that is connected to, or may be an electrical connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.

The invention has been described with reference to specific embodiments, but it will be clear to a person skilled in the art that, these descriptions are exemplary and are not intended to limit the scope of the present invention. Various modifications and alterations of this invention will become apparent to those skilled in the art based upon the spirit and principles of this invention, and such modifications and alterations are also within the scope of this invention.

Claims

1. The light-emitting diode lamp packaging structure is characterized by comprising a molding compound (1), wherein a metal plate (2) is inserted into the bottom of the molding compound (1), light-emitting chips (3) are arranged on the top of the metal plate (2), the light-emitting chips (3) are connected with the surface of the metal plate (2) through solder, a packaging plate (4) is inserted into the top of the molding compound (1), lead frames (5) are inserted into two sides of the molding compound (1) in a sliding mode, gold threads (6) are inserted into the light-emitting chips (3), and the gold threads (6) are electrically connected with the lead frames (5).

2. The LED lamp packaging structure with good sealing performance as claimed in claim 1, wherein the material of the enclosing plate (4) is epoxy resin, and the top of the enclosing plate (4) is disposed in a circular shape.

3. The LED lamp packaging structure with good sealing performance as claimed in claim 1, wherein the space between the molding compound (1) and the encapsulating plate (4) is filled with silica gel and phosphor.

4. The LED lamp packaging structure with good sealing performance as claimed in claim 1, wherein the metal plate (2) is made of a metal heat material.

5. The LED lamp package structure with good sealing performance as claimed in claim 1, wherein the lead frame (5) is made of a PCB.

6. The LED lamp package structure with good sealing performance according to claim 1, wherein one end of the lead frame (5) penetrates through the molding compound (1) and is inserted into the metal plate (2).