CN218333724U

CN218333724U - Precision transmission platform for packaging and welding chip substrate transmission

Info

Publication number: CN218333724U
Application number: CN202223274144.5U
Authority: CN
Inventors: 曹悦; 赵雷; 井文丽
Original assignee: Northwest Electronic Equipment Institute of Technology
Current assignee: Northwest Electronic Equipment Institute of Technology
Priority date: 2022-12-07
Filing date: 2022-12-07
Publication date: 2023-01-17
Anticipated expiration: 2032-12-07

Abstract

The utility model relates to the technical field of automatic packaging production of optical devices, and discloses a precision transmission platform for packaging and welding of chip substrate transmission, which comprises a transmission base, wherein a guide rail mounting seat is arranged on the transmission base, four groups of linear motors and left and right movement guide rails are arranged on the guide rail mounting seat, four groups of slider units respectively connected with the four groups of linear motors are arranged on the left and right movement guide rails, and four groups of manipulators are correspondingly arranged on the four groups of slider units; a manual adjusting sliding table is arranged in a groove at the inner side of the transmission base, a welding observation camera is arranged on the manual adjusting sliding table, camera bracket upright posts are connected at two sides of the transmission base, a downward-looking camera mounting plate and a camera bracket top plate are respectively arranged at the upper end and the front side of each camera bracket upright post, the downward-looking camera mounting plate is sequentially provided with a left-right manual adjusting sliding table, an up-down manual adjusting moving sliding table, a positioning camera lens and a positioning light source from bottom to top. The utility model discloses a packaging welding chip and accurate and high efficiency of base plate paste dress.

Description

Precision transmission platform for packaging and welding chip substrate transmission

Technical Field

The utility model relates to an automatic encapsulation production technical field of optical device especially relates to an encapsulation of chip substrate conveying is with accurate transmission platform.

Background

In the automatic packaging production process of a substrate and a chip of an optical device, a downward-looking camera assembly on a mechanism is matched with a substrate feeding blue film mechanism, the downward-looking camera assembly finishes the surface feature positioning of the substrate, the substrate feeding blue film mechanism finishes the mechanical position correction of the substrate, and then the substrate feeding of the substrate at a blue film position is finished through a flexible suction nozzle feeding mechanism on a mechanical arm outside the mechanism. And then, the adsorbed substrate is conveyed by a mechanical arm of the mechanism and placed on a precision positioning platform, adsorption is carried out through negative pressure, and then the precision positioning platform is matched with a downward-looking camera on the mechanism to complete positioning and mechanical position correction of the substrate material. After the accurate positioning of the substrate is completed, the substrate is adsorbed by a flexible suction nozzle welding mechanism on a mechanical arm on the inner side of the mechanism and is transmitted to a welding waiting position to wait for a welding starting signal. The chip material feeding process is the same as the substrate material feeding process, the two materials are independently fed from blue films on two sides of the transmission mechanism, then are transmitted to respective precise positioning platforms to finish position correction, and finally are transmitted to a central welding table of the mechanism to finish substrate welding and chip welding in sequence. And after the substrate and the chip are welded in sequence, the substrate and the chip are transmitted to a blanking carrier through a blanking transmission mechanism, and all time sequence actions are completed. In the actual use process of the mechanism, four groups of mechanical arms on the mechanism need to act on the mechanism according to the equipment time sequence, and the mechanical arms are sequentially connected to finish the quick start-stop action of the mechanical arms, so that the aim of quick feeding is fulfilled. The production efficiency can be ensured in the actual welding process. However, in the use process of the aluminum plate splicing mechanism designed in the past, the quick start and stop action can bring obvious mechanism vibration, so that the positioning accuracy of the four groups of mechanical arms is influenced mutually, the position of a positioning camera on the mechanism fluctuates, the feeding speed is reduced, the material positioning efficiency begins to be reduced, and the actual welding consistency is influenced finally. Meanwhile, the vibration is further transmitted to a rack of the equipment and each execution module through the transmission of the mechanism, so that the rack shakes abnormally, and the corresponding positioning function of each module is influenced. So that the stability of the device is greatly reduced. Therefore, how to meet the working requirements of accurate and high-efficiency mounting of the packaged and welded chip and the substrate is an important technical problem to be solved on site.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model aims at providing a packaging welding of chip base plate conveying is with accurate transmission platform can convey chip and base plate simultaneously and carry out the packaging welding in the automatic transmission packaging production line of optical device, has realized that the accurate and high efficiency of packaging welding chip and base plate pastes the dress.

In order to achieve the purpose of the utility model, the technical proposal is as follows:

the precision transmission platform for packaging and welding chip substrate transmission comprises a transmission base, wherein a guide rail installation base is arranged on the transmission base, four groups of linear motors and two groups of left and right movement guide rails arranged along the length direction of the transmission base are arranged on the guide rail installation base, the two groups of left and right movement guide rails are symmetrically arranged on two sides of each linear motor, four groups of sliding block units are arranged on the two groups of left and right movement guide rails, the four groups of sliding block units are respectively connected with the four groups of linear motors, and a substrate pickup manipulator, a substrate welding manipulator, a chip welding manipulator and a chip pickup manipulator are respectively arranged on the four groups of sliding block units;

be provided with manual regulation slip table in the inboard recess of transmission base, be provided with the welding on the manual regulation slip table and observe the camera, the both sides of transmission base are connected with camera support stand through the shop bolt respectively, are provided with down looking camera mounting panel and camera support roof respectively in the upper end of camera support stand and front side, install manual adjustment slip table about five groups on the down looking camera mounting panel, about install manual adjustment motion slip table about on the manual adjustment slip table, install the location camera on the manual adjustment motion slip table from top to bottom, install location camera lens and location light source on the location camera.

As a further improvement, each group of slider units comprises four sliders, and two sets of four sliders are slidably mounted on the left and right movement guide rails respectively.

As a further improvement, the rear vertical face of the guide rail mounting seat is provided with a linear grating ruler and nine groups of photoelectric switches.

As a further improvement, be provided with four on the transmission base and walk line tow chains, every group walk the upper end of line tow chain and all be connected with tow chain installation sheet metal component, four tow chain installation sheet metal component picks up the manipulator with the base plate respectively, base plate welding manipulator, chip welding manipulator and chip pick up the manipulator and be connected.

As a further improvement, the left and right sides of the transmission base is provided with a wire casing cover plate, and the rear side is provided with a motor socket mounting panel and a rear side line groove cover plate, the both sides of the front vertical face of the transmission base are provided with an ion fan.

As the utility model discloses a further improvement, the transmission base is the return word bridge type structure of aluminium system, and through the characteristic of cast aluminium filtering vibration, the transmission of suppression motion vibration makes the location effect of five groups location cameras stable when having guaranteed the transmission platform rigidity, the effectual motion performance that improves transmission platform, simultaneously very big quality that has alleviateed transmission platform to transmission platform's quality has greatly been improved.

The utility model has the advantages that: the utility model discloses a set up four independent manipulators each other, satisfied the accurate and high efficiency of encapsulation welding chip and base plate and pasted the work requirement of dress, simultaneously through transmission base and camera locating component's motion structure, very big lightening the transmission of vibration in the quick motion process, guaranteed the stability of transmission platform operation and the accuracy of camera location.

The utility model discloses an improve transmission efficiency, motion accuracy nature and operation security, four mutually independent manipulators of group of both sides opposition have been set up, all have the setting of safe position at every technology station, make equipment can be in equipment chronogenesis action, mutual noninterference, simultaneously through the transmission form of assembly line, transmit in proper order and accomplish the welding, the facade is provided with sharp grating chi and nine groups photoelectric switch behind the guide rail mount pad in addition, the actual motion position of the manipulator of four groups of real-time feedback puts and provides its signal that targets in place. In addition, for the motion vibration transmission of restraining the mechanism and improve mechanism operating stability, the utility model discloses set up word bridge type aluminium system transmission base back, through the characteristic of straining the vibration of cast aluminium, restrain the motion vibration transmission. The positioning effect of the five groups of positioning cameras is stable while the rigidity of the mechanism is ensured. The motion performance of the mechanism is effectively improved, and meanwhile, the mass of the mechanism is greatly reduced, so that the quality of equipment is greatly improved.

In the adjusting process of the transmission platform, the positions of the positioning cameras can be accurately and flexibly adjusted through the left and right manual adjusting sliding tables and the upper and lower manual adjusting moving sliding tables, and the picking and placing positions of the four groups of manipulators are adjusted through the accurate control of the four groups of linear motors, so that the manipulators can be accurately adsorbed on the upper surfaces of the substrate and the chip. Compare in the lead screw mechanism in the past, the utility model discloses when reducing the mechanism volume, avoided lead screw mechanism completely because the running friction themogenesis, the positioning accuracy who leads to changes, and the orthogonal setting that simultaneously little mechanism volume is favorable to the mechanism for the debugging degree of difficulty and cycle are all very big reductions.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this application, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. In the drawings:

fig. 1 is a schematic structural view of the present invention;

fig. 2 is a schematic view of a second perspective structure of the present invention;

fig. 3 is a schematic view of a third view structure according to the present invention.

In the figure: 1. a transmission base 2, a guide rail mounting seat 3, a linear motor 4, a left-right motion guide rail 5, a slide block 6, a substrate picking mechanical arm 7, a substrate welding mechanical arm 8, a chip welding mechanical arm 9, a chip picking mechanical arm 10, a linear grating ruler 11, a photoelectric switch 12, a drag chain mounting sheet metal part 13, a wiring drag chain 14, a wire groove cover plate 15 and a motor socket mounting plate, 16, a rear side groove cover plate, 17, an ion fan, 18, a welding observation camera, 19, a manual adjusting sliding table, 20, a positioning pin, 21, a camera support upright post, 22, a downward-looking camera mounting plate, 23, a camera support top plate, 24, a left-right manual adjusting sliding table, 25, an upward-downward manual adjusting moving sliding table, 26, a positioning camera, 27, a positioning camera lens, 28 and a positioning light source.

Detailed Description

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only partial embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

As shown in fig. 1-3, the precision transmission platform for packaging and welding of chip substrate transmission comprises a transmission base 1, wherein a guide rail installation base 2 is arranged on the transmission base 1, four groups of linear motors 3 and two groups of left and right movement guide rails 4 arranged along the length direction of the transmission base 1 are arranged on the guide rail installation base 2, the two groups of left and right movement guide rails 4 are symmetrically arranged on two sides of the linear motors 3, four groups of slider units are arranged on the two groups of left and right movement guide rails 4, the four groups of slider units are respectively connected with the four groups of linear motors 3, a substrate picking manipulator 6, a substrate welding manipulator 7, a chip welding manipulator 8 and a chip picking manipulator 9 are respectively arranged on the four groups of slider units, and the four groups of linear motors 3 can respectively drive the substrate picking manipulator 6, the substrate welding manipulator 7, the chip welding manipulator 8 and the chip picking manipulator 9 to reciprocate along the left and right movement guide rails 4;

each group of the sliding block units comprises four sliding blocks 5, and every two of the four sliding blocks 5 are respectively installed on the two groups of the left and right moving guide rails 4 in a sliding mode.

Be provided with manual regulation slip table 19 in the recess of transmission base 1 inboard, be provided with the welding on the manual regulation slip table 19 and observe camera 18, the both sides of transmission base 1 are connected with camera support stand 21 through dowel 20 respectively, are provided with down looking camera mounting panel 22 and camera support roof 23 respectively at camera support stand 21's upper end and front side, manual adjustment slip table 24 about installing five groups on the down looking camera mounting panel 22, install manual adjustment motion slip table 25 about controlling on the manual adjustment slip table 24, install location camera 26 on the manual adjustment motion slip table 25 from top to bottom, install location camera lens 27 and location light source 28 on the location camera 26.

The rear vertical surface of the guide rail mounting seat 2 is provided with a linear grating ruler 10 and nine groups of photoelectric switches 11, so that the actual motion positions of the four groups of manipulators can be fed back in real time, and manipulator in-place signals can be provided.

Four wiring drag chains 13 are arranged on the transmission base 1, each wiring drag chain 13 is connected to a drag chain installation sheet metal part 12 at the upper end, and the four drag chain installation sheet metal parts 12 are respectively connected with a substrate picking mechanical arm 6, a substrate welding mechanical arm 7, a chip welding mechanical arm 8 and a chip picking mechanical arm 9.

The left side and the right side of the transmission base 1 are provided with wire casing cover plates 14, the rear side is provided with a motor socket mounting plate 15 and a rear side wire casing cover plate 16, and two sides of the front vertical surface of the transmission base 1 are provided with ion fans 17.

The transmission base 1 is a square-rectangular bridge structure made of aluminum, and through the characteristic of vibration filtering of cast aluminum, motion vibration transmission is inhibited, so that the rigidity of the transmission platform is ensured, the positioning effect of the five groups of positioning cameras 26 is stable, the motion performance of the transmission platform is effectively improved, the quality of the transmission platform is greatly reduced, and the quality of the transmission platform is greatly improved.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement, component separation or combination made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. Accurate transmission platform is used in encapsulation welding of chip substrate conveying, its characterized in that: the conveying device comprises a conveying base, wherein a guide rail mounting base is arranged on the conveying base, four groups of linear motors and two groups of left and right movement guide rails arranged along the length direction of the conveying base are arranged on the guide rail mounting base, the two groups of left and right movement guide rails are symmetrically arranged on two sides of the linear motors, four groups of sliding block units are arranged on the two groups of left and right movement guide rails, the four groups of sliding block units are respectively connected with the four groups of linear motors, and a substrate picking manipulator, a substrate welding manipulator, a chip welding manipulator and a chip picking manipulator are respectively arranged on the four groups of sliding block units;

2. The precision transfer platform for package bonding of chip substrate transfer according to claim 1, wherein: each group of sliding block units comprises four sliding blocks, and every two sliding blocks are respectively arranged on the left and right movement guide rails in a sliding mode.

3. The precision transfer platform for package bonding of chip substrate transfer according to claim 1, wherein: and a rear vertical surface of the guide rail mounting seat is provided with a linear grating ruler and nine groups of photoelectric switches.

4. The precision transfer platform for package bonding of chip substrate transfer according to claim 1, wherein: four wiring drag chains are arranged on the transmission base, the upper end of each wiring drag chain is connected with a drag chain installation sheet metal part, and the four drag chain installation sheet metal parts are respectively connected with a substrate picking mechanical arm, a substrate welding mechanical arm, a chip welding mechanical arm and a chip picking mechanical arm.

5. The precision transfer platform for package bonding of chip substrate transfer according to claim 1, wherein: the left and right sides of the transmission base are provided with wire duct cover plates, the rear side of the transmission base is provided with a motor socket mounting plate and a rear side wire duct cover plate, and two sides of the front vertical face of the transmission base are provided with ion fans.

6. The precision transfer platform for package bonding of chip substrate transfer according to claim 1, wherein: the transmission base is of an aluminum-made square-shaped bridge structure.