CN218332289U - Vacuum platform for chip printing adsorption positioning - Google Patents
Vacuum platform for chip printing adsorption positioning Download PDFInfo
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- CN218332289U CN218332289U CN202221728116.3U CN202221728116U CN218332289U CN 218332289 U CN218332289 U CN 218332289U CN 202221728116 U CN202221728116 U CN 202221728116U CN 218332289 U CN218332289 U CN 218332289U
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- grid groove
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Abstract
The utility model discloses a vacuum platform that is used for chip printing to adsorb location usefulness relates to semiconductor production facility technical field, including adsorbing the platform, adsorb seat and air exhaust joint, it adopts ventilative steel to make to adsorb the platform, and be rectangle platelike location and adsorbing a up end, adsorb the seat side and seted up the extraction opening, the extraction opening is connected with air exhaust joint, it is provided with the grid groove with adsorbing a contact surface to adsorb the seat, be provided with square boss between the grid groove, grid groove center is equipped with the induction port that communicates with the extraction opening, this vacuum platform adopts novel ventilative steel to replace the platform absorption substrate that the tradition adopted array induction port, can fully guarantee the roughness after the substrate is adsorbed, the plane degree, and utilize the built-in grid groove of evenly bleeding, can disperse every corner of ventilative steel bottom surface with the negative pressure environment, make the adsorption affinity of ventilative steel upper surface even, the substrate is thrown away from the in-process of coming unstuck, can adsorb firmly, be favorable to improving rubber coating precision and photoetching precision, promote the processing procedure process level.
Description
Technical Field
The utility model relates to a semiconductor production facility technical field, concretely relates to be used for chip printing to adsorb vacuum platform of location usefulness.
Background
The most advanced products in the semiconductor field are chips, and the chip manufacturing process is very complicated, including: wafer processing, oxidation, photoetching, etching, film deposition, interconnection, testing and packaging, wherein a substrate is coated with photoresist in a printing process, and the photoresist is coated by a photoresist spinner with freely set rotating speed and rotating time. Firstly, a substrate is sucked on a sucking disc of a spin coater by a vacuum suction method, photoresist with certain viscosity is dripped on the surface of the substrate, and then the photoresist is spun at a set rotating speed and time. Due to the action of centrifugal force, the photoresist is uniformly spread on the surface of the substrate, redundant photoresist is thrown off, a photoresist film with a certain thickness is obtained, and the film thickness of the photoresist is controlled by the viscosity of the photoresist and the rotating speed of the throwing. And the vacuum platform that the vacuum suction method adopted each manufacturer design of factory is different, the tiny hole that sets up with the array is more regarded as the induction port, adsorb the substrate on the platform, and the substrate is even attached on the platform surface, to the extremely high substrate of plane degree requirement, adsorb by the induction port brute force down, the imperceptible slight deformation of naked eye can appear, make the substrate all have recessed deformation curved surface at every induction port, consequently, lead to the coated glue by the throw-away inequality, glue the problem of thickness inequality, this precision that has also restricted photoetching process technology, it is difficult to pile up more transistors. It is therefore desirable to design a vacuum platform that can be used to position a substrate by suction in a highly planar manner.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the purpose: in view of the fact that the vacuum platform adopted by the traditional vacuum suction method in the background technology is designed by different factories and manufacturers, the micro holes formed in an array are used as air suction ports, the substrate is adsorbed on the platform, even if the substrate is attached to the surface of the platform, the substrate with extremely high flatness requirement is adsorbed by the air suction ports, fine deformation which cannot be perceived by naked eyes can occur, and the substrate is provided with a concave deformation curved surface at each air suction port, so that the problem that the coated glue is thrown away unevenly and the glue thickness is uneven is solved.
The technical scheme adopted for solving the problems is as follows:
a vacuum platform for chip printing, adsorption and positioning comprises an adsorption platform, an adsorption seat and an air extraction joint,
the adsorption platform is made of breathable steel and is positioned on the upper end face of the adsorption seat in a rectangular plate shape, an air suction port is formed in the side face of the adsorption seat and is connected with an air suction connector, the air suction connector is externally connected with air suction equipment to provide a negative pressure environment for the adsorption seat,
the adsorption bed is characterized in that a grid groove is formed in the contact surface of the adsorption seat and the adsorption platform, the grid groove is shaped like a Chinese character tian, a square boss is arranged between the grid grooves to support the bottom surface of the adsorption platform, an air suction port communicated with an air suction port is arranged in the center of the grid groove, the air suction port uniformly sucks air from the grid groove, an even negative pressure environment is provided for each position of the grid groove through an air suction joint, sealing edges are arranged on the periphery of the grid groove, and the sealing edges are closely attached to the edge of the end face of the adsorption platform.
Furthermore, a plurality of positioning holes are formed in the outer ring of the air suction port, correspond to threaded holes formed in the lower end face of the adsorption platform in position, and enable the adsorption platform to be fixedly connected with the adsorption seat in a threaded connection mode through screws.
Furthermore, a plurality of positioning grooves are formed in the bottom end face of the adsorption base, and permanent magnets are arranged in the positioning grooves.
Furthermore, a groove is formed in the middle of the bottom end face of the adsorption base.
The utility model has the advantages that:
this a vacuum platform for chip printing adsorbs location usefulness adopts novel ventilative steel to replace the tradition to adopt the platform of array induction port to adsorb the substrate, can fully guarantee the roughness after the substrate is adsorbed, the plane degree, and utilize the built-in grid groove of evenly bleeding, can disperse every corner of ventilative steel bottom surface with the negative pressure environment, make the adsorption affinity of ventilative steel upper surface even, in the substrate is got rid of the in-process that comes unstuck, it is firm to adsorb, be favorable to improving rubber coating precision and photoetching precision, promote the processing procedure technological level.
Drawings
FIG. 1 is a schematic structural diagram of a vacuum platform for positioning and adsorbing a chip during printing according to the present embodiment;
FIG. 2 is a schematic structural diagram of a vacuum platform removal adsorption table for chip printing adsorption positioning according to the present embodiment;
FIG. 3 is an enlarged view of a portion A of FIG. 2;
FIG. 4 is a side bottom view of the suction seat of the present embodiment;
FIG. 5 is a top view of the vacuum platform for positioning and adsorbing a chip for printing according to the present embodiment;
the device comprises an adsorption table 1, an adsorption seat 2, an air suction joint 3, a sealing edge 4, a square boss 5, an air suction port 6, a grid groove 7, a first positioning groove 8, a second positioning groove 9, a groove 10 and a positioning hole 11.
Detailed Description
The technical solution of the present invention will be described clearly and completely by way of example with reference to the accompanying drawings.
Referring to fig. 1-5, the present embodiment provides a vacuum platform for chip printing, absorption and positioning, which includes an absorption table 1, an absorption base 2 and an air suction connector 3.
Specifically speaking, the adsorption platform 1 adopts ventilative steel to make, and ventilative steel is one kind and is formed through the high temperature sintering by fine particle spheroid powder stainless steel, and inside all directions evenly are covered with small exhaust hole, can replace traditional artifical trompil completely and implement the adsorption operation to the aperture is minimum, and is the rectangle platelike location at adsorption base 2 up end, adsorption base 2 side has seted up the extraction opening, the extraction opening is connected with air extraction joint 3, air extraction joint 3 external air exhaust equipment to provide the negative pressure environment for adsorption base 2, adsorption base 2 is provided with grid groove 7 with adsorption platform 1 contact surface, grid groove 7 is the field font, is provided with square boss 5 between the grid groove 7 to support adsorption platform 1 bottom surface, grid groove 7 center is equipped with induction port 6 with the extraction opening intercommunication, and air extraction port 6 evenly bleeds from grid groove 7, provides even negative pressure environment by air extraction joint 3 to grid groove 7 each department, sealing groove 7 is provided with sealing edge 4, and the airtight laminating of adsorption platform 1 lower terminal surface edge.
In a further embodiment, referring to fig. 5, 4 positioning holes 11 are formed in the outer ring of the air suction port 6, the positioning holes 11 correspond to threaded holes formed in the lower end surface of the adsorption table 1, and the adsorption table 1 and the adsorption base 2 are screwed and tightly and fixedly connected through screws.
In a further embodiment, referring to fig. 4, 20 positioning grooves are formed in the bottom end face of the adsorption base 2, and each positioning groove comprises 4 first positioning grooves and 16 second positioning grooves, a permanent magnet is arranged in each positioning groove, the adsorption base 2 is magnetically adsorbed on the workbench, and the position of the adsorption base is convenient to adjust.
In a further embodiment, referring to fig. 4, a groove 10 is formed in the middle of the bottom end surface of the adsorption base 2 for reducing the weight of the adsorption base 2.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes, modifications, substitutions and alterations can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art, and the scope of the present invention is defined by the appended claims and their equivalents.
Claims (4)
1. The utility model provides a vacuum platform that is used for chip printing to adsorb location usefulness, includes adsorption table, adsorption seat and the joint of bleeding, its characterized in that:
the adsorption platform is made of breathable steel and is positioned on the upper end face of the adsorption seat in a rectangular plate shape, an air suction port is formed in the side face of the adsorption seat and is connected with an air suction connector, the air suction connector is externally connected with air suction equipment to provide a negative pressure environment for the adsorption seat,
the adsorption table is characterized in that a grid groove is formed in the contact surface of the adsorption seat and the adsorption table, the grid groove is shaped like a Chinese character 'tian', a square boss is arranged between the grid grooves, an air suction port communicated with an air suction port is arranged in the center of each grid groove, the air suction port uniformly sucks air from the grid grooves, an even negative pressure environment is provided for each position of each grid groove through an air suction joint, sealing edges are arranged on the periphery of each grid groove, and the sealing edges are closely attached to the end face edge of the adsorption table.
2. The vacuum platform for chip printing suction positioning as recited in claim 1, wherein: the outer ring of the air suction port is provided with a plurality of positioning holes, the positioning holes correspond to threaded holes formed in the lower end face of the adsorption platform in position, and the adsorption platform and the adsorption seat are connected in a screwed connection and closed and fixedly connected through screws.
3. The vacuum table for chip printing suction positioning as claimed in claim 1, wherein: the bottom end face of the adsorption base is provided with a plurality of positioning grooves, and permanent magnets are arranged in the positioning grooves.
4. The vacuum platform for chip printing suction positioning as recited in claim 1, wherein: the middle part of the bottom end face of the adsorption base is provided with a groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221728116.3U CN218332289U (en) | 2022-07-05 | 2022-07-05 | Vacuum platform for chip printing adsorption positioning |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221728116.3U CN218332289U (en) | 2022-07-05 | 2022-07-05 | Vacuum platform for chip printing adsorption positioning |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218332289U true CN218332289U (en) | 2023-01-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221728116.3U Active CN218332289U (en) | 2022-07-05 | 2022-07-05 | Vacuum platform for chip printing adsorption positioning |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218332289U (en) |
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2022
- 2022-07-05 CN CN202221728116.3U patent/CN218332289U/en active Active
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