CN218321739U

CN218321739U - Thermal field device connecting structure and combined thermal field device

Info

Publication number: CN218321739U
Application number: CN202222395682.3U
Authority: CN
Inventors: 申富强; 申富胜; 申钰静; 牛龙祥
Original assignee: Shanghai Qic Composite Material Technology Co ltd
Current assignee: Shanghai Qic Composite Material Technology Co ltd
Priority date: 2022-09-09
Filing date: 2022-09-09
Publication date: 2023-01-17
Anticipated expiration: 2032-09-09

Abstract

The utility model relates to a thermal field device connection structure and combination thermal field device, connection structure includes mechanism and slot, the cross-section of mechanism is the big, the little shape in the middle of two, the cross sectional shape of slot with mechanism cross sectional shape corresponds, the slot with the mechanism closely cooperates. This application leaves nation ring used repeatedly, need not scrap whole thermal field device, perhaps utilizes unnecessary new material to make nation ring, piles up the combination thermal field device that forms and can use, has save material, reduces the effect that takes.

Description

Thermal field device connecting structure and combined thermal field device

Technical Field

The utility model relates to a thermal field device, in particular to a combined thermal field device and a connecting structure which are made of a thermal field device or made of redundant whole new materials and have different connecting modes and rings in the manufacturing process of monocrystalline silicon or polycrystalline silicon.

Background

In the production of silicon single crystals, the czochralski method (CZ method), i.e. a method of pulling a single crystal from a melt in a vertical direction, is currently widely used. In the manufacturing facility, one component is a graphite thermal field device which is used to carry the internal quartz thermal field device. In the using process, the problems of cracking, corrosion and strength loss of the graphite thermal field device and the like exist due to different expansion coefficients of the quartz thermal field device and the graphite thermal field device and the corrosion reaction between silicon steam and graphite. In addition, in the manufacturing process of the integrated thermal field device, excess materials are often generated, and the excess materials cannot be manufactured into the integrated thermal field device.

The integral thermal field device in the prior art is particularly easy to break and damage at the arc-shaped position at the bottom of the thermal field device, once the thermal field device breaks, the whole thermal field device must be scrapped, and in addition, the waste material is scrapped, so the cost is high; the arc-shaped position of the bottom close to the outer side is particularly easy to break and damage, the arc-shaped position is designed into a split structure by taking measures, but the arc-shaped position still has the problems of insufficient furnace number and large-area scrapping of the cylinder wall in use.

Therefore, the heat field device in the prior art has high scrapping cost and a lifting place.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a combination thermal field device that ring was banned to mechanism and slot and different connected modes new has, utilizes and scraps the preparation of thermal field device, perhaps utilizes the preparation of unnecessary whole new material to solve current technical problem.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a thermal field device connection structure for connect the device of two-layer amalgamation, connection structure includes mechanism and slot, the cross-section of mechanism is the big, little shape in the middle of both ends, the cross-sectional shape of slot with mechanism cross-sectional shape corresponds, the slot with the mechanism closely cooperates.

In the thermal field device connecting structure according to the preferred embodiment of the present application, the thickness of the outer edge of the cross section of the mechanism is greater than the thickness of the inner portion of the cross section of the mechanism.

The utility model provides a combination thermal field device includes as above thermal field device connection structure, combination thermal field device still includes the section of thick bamboo wall, the section of thick bamboo wall includes a plurality of nation's rings that vertically pile up, nation ring formula cylinder as an organic whole, two are adjacent nation includes a limit structure between the ring.

In the combined thermal field apparatus of the preferred embodiment of the present application, the position-limiting structure is a connection plane inclined inward or outward.

In the combined thermal field device according to the preferred embodiment of the present application, the position-limiting structure is a step surface.

In the combined thermal field device according to the preferred embodiment of the present application, the limiting structure is a gear-shaped connecting structure.

Owing to adopted above technical scheme, make the utility model discloses following advantage effect has:

firstly, the bonding ring of the combined thermal field device can be manufactured by adopting the undamaged part of the scrapped integral thermal field device, namely, the damaged part is cut off, and an intact annular body is left, or the bonding ring is manufactured by utilizing redundant integral new materials;

secondly, in the connecting structure adopting the mechanism and the groove, the thicknesses of the two arc-shaped sides of the bottom of the mechanism are increased, so that the mechanism is not easy to damage, the number of actually used furnaces is increased, and the cost is reduced;

thirdly, the limit structure can increase the stability of the stack of the bonding rings and ensure the use and production safety;

fourthly, when the fragile component in the thermal field device is seriously corroded or cracked to cause scrapping, only partial components need to be replaced, the whole thermal field does not need to be scrapped, the use cost of consumables can be reduced, and the service cycle of the thermal field is prolonged;

fifthly, the member in the application can also be produced by utilizing leftover materials in the production process, so that the material is saved, the cost is reduced, and the market competitiveness of enterprises can be improved.

Of course, it is not necessary for any particular embodiment of the present disclosure to achieve all of the above benefits.

Drawings

FIG. 1 is a schematic view of a combined thermal field device;

FIG. 2 is a schematic view of a crucible bottom incorporating a thermal field apparatus;

FIG. 3 is a schematic view of a position-limiting structure;

FIG. 4 is a schematic view of another limiting structure;

fig. 5 is a schematic view of another limiting structure.

In the drawings, the components represented by the respective reference numerals are listed below:

10-cylinder wall, 20-mechanism, 30-groove, 11-ring and 111-limit structure

Detailed Description

For the purpose of understanding, the preferred embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

Referring to fig. 1 and 2, a combined thermal field device according to the present application is schematically illustrated, which is only for illustrating the technical features of the present application and is not intended to limit the present application. The combined thermal field device comprises a connecting structure and a device for connecting two layers of splicing, wherein the connecting structure comprises a mechanism and a groove, the cross section of the mechanism is in a shape with two large ends and a small middle part, the cross section of the groove corresponds to the cross section of the mechanism, and the groove is tightly matched with the mechanism; in FIG. 1, the thickness of the outer edge of the cross section of the mechanism is larger than the thickness of the inner part of the cross section of the mechanism, the outer edge of the cross section of the mechanism is inwards stepped, the thickness is equal to the thickness of the arc position of the bottom close to the outer side, the thickness is large, the mechanism is not easy to damage, the reinforcement is carried out at the position easy to damage, the number of actually used furnaces is increased, and the cost is reduced; as shown in fig. 1, the thermal field apparatus of this embodiment is specifically a combined crucible, the mechanism and the groove are the crucible bottom 20 and the support rod upper plate 30, respectively, and the crucible bottom 20 and the support rod upper plate 30 are tightly matched.

The combined thermal field device comprises a cylinder wall 10, a crucible bottom 20 and a support rod upper plate 30, wherein as shown in fig. 1, the cylinder wall 10 is sleeved on the outer edges of the crucible bottom 20 and the support rod upper plate 30, the length of the connecting surface between the crucible bottom 20 and the cylinder wall 10 is longer than that of the prior art, the connecting surface is easier to conform to the change during sleeving, the outer edge of the support rod upper plate 30 is inwards provided with two steps, one step is used for bearing the crucible bottom 20, and the other step is used for bearing the cylinder wall 10; in addition, the cylinder wall 10 includes a plurality of vertically stacked bonding rings 11, in fig. 1, the heights of the bonding rings 11 are different, and after all, the usable heights of the waste bonding rings obtained each time are not necessarily the same, but cannot be used to limit the application, and it should be within the scope of the application that the bonding rings 11 are all processed to a height as long as they can be stably connected.

The nation ring 11 is the integral type cylinder, nation ring is a part of the section of thick bamboo wall of old and useless thermal field device, just also utilizes the section of thick bamboo wall of old and useless thermal field device to cut out the part that can use, perhaps utilizes unnecessary whole new material to make nation ring, just also utilizes unnecessary whole new material to cut and grind out nation ring. A limiting structure 111 is arranged between two adjacent upper rings 11, and the limiting structure 111 is a shape feature capable of being stably connected between two adjacent upper rings 11; the crucible bottom 20 is inserted into and connected with the cylinder wall 10, as shown in fig. 2, the crucible bottom 20 is a solid circular block, the crucible bottom 20 comprises an arc inner surface 21, an outer edge surface 22 and an outer edge bottom surface 23, and the outer edge surface 22 is connected with the inner wall surface of the cylinder wall 10; the upper surface of the upper tray 30 is connected with the end surface of the cylinder wall 10 and the outer edge bottom surface 23 of the crucible bottom 20. The upper surface of the upper tray 30 is connected with the end surface of the cylinder wall 10 to play a role in fixing and supporting.

One of the technical characteristics of the application is that the bonding rings with different connection modes are provided, that is, when the cylinder wall of a waste thermal field device is processed or the bonding rings are manufactured by using redundant whole new materials, the connection surface between two adjacent bonding rings 11 is a limiting structure 111 to increase the connection stability, and the limiting structure 111 in fig. 1 is a plane and has the stable connection effect due to higher surface roughness; in addition, as shown in fig. 3, in an embodiment of the present application, the position-limiting structure 111 is a connection plane inclined inward or outward, in the figure, if the quartz thermal field device is on the left side, the position-limiting structure 111 is a connection plane inclined inward, and if the quartz thermal field device is on the right side, the position-limiting structure 111 is a connection plane inclined outward.

In addition, referring to fig. 4, in another embodiment of the present application, the limiting structure 111 is a step surface, which is a stepped surface in this embodiment, but it should not be used to limit the present application, for example, there is one more step, and it should be within the scope of the present application as long as the limiting structure can be firmly connected.

In addition, referring to fig. 5, in another embodiment of the present application, the limiting structure 111 is a gear-shaped connecting structure, which is a gear-shaped connecting structure with a flat tooth in this embodiment, but it should not be construed as limiting the present application, such as a conical tooth or a triangular tooth, as long as the connecting structure can be stably connected.

secondly, in the connecting structure adopting the mechanism and the groove, the thickness of the arc-shaped two sides of the bottom of the mechanism is increased, the mechanism is not easy to damage, the number of actually used furnaces is increased, and the cost is reduced;

fifthly, the member in this application can also utilize leftover bits production in the production process, has material saving, reduce cost's effect, can improve enterprise market competition.

Of course, it is not necessary to implement any particular embodiment of the present invention to achieve all of the above technical effects at the same time.

The above disclosure is only for the preferred embodiment of the present invention, but not intended to limit itself, and all the equivalent changes and modifications made by those skilled in the art without departing from the spirit and scope of the present invention shall fall within the protection scope of the present invention.

Claims

1. The utility model provides a thermal field device connection structure for connect the device of two-layer amalgamation, its characterized in that, connection structure includes mechanism and slot, the cross-section of mechanism is the big shape in both ends, the little shape in middle, the cross-sectional shape of slot with mechanism cross-sectional shape corresponds, the slot with mechanism closely cooperates.

2. The thermal field device attachment structure of claim 1, wherein a cross-sectional outer edge thickness of said mechanism is greater than a cross-sectional inner thickness of said mechanism.

3. A combined thermal field device comprising the thermal field device connection structure of claim 1, wherein the combined thermal field device further comprises a cylinder wall, the cylinder wall comprises a plurality of longitudinally stacked bonding rings, the bonding rings are an integral cylinder, and a limiting structure is included between two adjacent bonding rings.

4. A combined thermal field apparatus as defined in claim 3 wherein said limiting structure is a connecting plane sloping inwardly or outwardly.

5. A combined thermal field device according to claim 3 wherein said limiting structure is a stepped surface.

6. A combined thermal field apparatus according to claim 3 wherein said limiting structure is a gear-like connection.