CN218321617U - Parallel film coating equipment - Google Patents

Abstract

A parallel film plating device is suitable for plating a film on an object to be plated carried by a carrier and comprises a double-layer feeding cavity, a plurality of processing cavities and a discharging cavity. The double-layer feeding cavity comprises an upper layer feeding chamber and a lower layer feeding chamber which are arranged oppositely in the Z-axis direction, and the carrier is fed by the upper layer feeding chamber or the lower layer feeding chamber. The process chambers are used for coating the objects to be coated, each process chamber comprises a conveying device used for moving the carrier, one process chamber is adjacent to the double-layer feeding chamber and is also provided with a first lifting mechanism, and the first lifting mechanism is used for driving the carrier to move along the Z-axis direction. The discharging cavity is adjacent to the other side of the double-layer feeding cavity and is used for discharging the carrier. The discharging cavity, the double-layer feeding cavity and the processing cavity are arranged in parallel in two rows.

Description

Parallel film coating equipment

Technical Field

The utility model relates to a coating equipment, especially relate to a block form coating equipment.

Background

Referring to fig. 1, a conventional continuous coating production line includes a loading chamber 81, a unloading chamber 82 disposed opposite to the loading chamber 81, a plurality of coating regions 83 disposed between the loading chamber 81 and the unloading chamber 82, a plurality of buffer regions 84 disposed at both sides of each coating region 83, and an automatic reflow unit 85, wherein a plurality of substrates (not shown) are carried by a plurality of carriers 86, pass through the coating regions 83 from the loading chamber 81 toward the unloading chamber 82, and are moved back and forth between adjacent buffer regions 84 to form a multilayer film on the substrates, and the carriers 86 are returned to the loading chamber 81 one by the automatic reflow unit 85 after being discharged from the unloading chamber 82, which has advantages of high production speed and high throughput.

However, in this continuous coating production line, two buffer areas 84 need to be arranged before and after each coating area 83 to regulate the timing sequence of the carrier 86 entering each coating area 83, so the length of the equipment is long, the floor area is large, and the configuration of the factory space is not favorable. In addition, if the outgassing rate (outgassing) of the substrate or build-up material is high, a long time of outgassing (degas) operation is performed in a chamber before the plasma region or the coating region, which can reduce the contamination of material outgassing during the plasma treatment or coating process, but also significantly prolong the production cycle, and the equipment capacity is limited. Sometimes, the load lock 81 requires a lower pressure and increases the vacuum pumping time due to certain process requirements, which also affects the timing of the coating zones 83 and reduces throughput.

Disclosure of Invention

The utility model aims to provide a block-type coating equipment which can shorten the length of the equipment and increase the productivity.

The utility model discloses a block filming equipment is applicable to and treats that the plating carries and plate the coating film to the carrier, block filming equipment contains double-deck feeding chamber, a plurality of processing procedure chamber and goes out the material chamber. The double-layer feeding cavity comprises an upper layer feeding chamber and a lower layer feeding chamber which are arranged oppositely in the Z-axis direction, the upper layer feeding chamber and the lower layer feeding chamber are independent vacuum cavities and are provided with conveying devices used for moving the carriers, and the carriers are fed by the upper layer feeding chamber or the lower layer feeding chamber. The process chambers are used for coating the objects to be coated, each process chamber comprises a conveying device used for moving the carrier, one process chamber is adjacent to one side of the double-layer feeding chamber and is also provided with a first lifting mechanism, and the first lifting mechanism is used for driving the carrier to move along the Z-axis direction. The discharging cavity is adjacent to the other side of the double-layer feeding cavity and used for discharging the carriers, and the discharging cavity comprises a conveying device used for moving the carriers. The discharging cavity, the double-layer feeding cavity and the processing cavity are arranged in parallel in a double row in the Y-axis direction, and the Y-axis direction is perpendicular to the Z-axis direction.

The utility model discloses a block form filming equipment still contains in border on double-deck feeding chamber with the loading and unloading district in unloading chamber, the loading and unloading district includes at least one adjacent to double-deck feeding chamber just is used for driving the carrier is followed the pay-off elevating system that Z axle direction removed, and two are used for removing the conveyer of carrier, the conveyer in loading and unloading district respectively corresponding to double-deck feeding chamber with the unloading chamber, pay-off elevating system supplies one of them conveyer setting in loading and unloading district, the carrier by one of them conveyer in loading and unloading district gets into double-deck feeding chamber passes through behind the processing procedure chamber by the ejection of compact of unloading chamber extremely another in loading and unloading district conveyer.

The utility model discloses a block form filming equipment, each conveyor is used for driving the carrier removes along an X axle direction, each conveyer is used for driving the carrier is followed X axle direction reaches Y axle direction removes.

The utility model discloses a block form filming equipment, in border on double-deck feeding chamber the cavity height in processing procedure chamber with the cavity height in double-deck feeding chamber is the same in essence, other the processing procedure chamber is in Z axle ascending position with the ejection of compact chamber is in Z axle ascending position is the same.

The utility model discloses a block filming equipment, the upper feed chamber with the lower floor's feed chamber all still has the heating device that is used for toasting.

The utility model discloses a block form filming equipment, go out the material chamber double-deck feeding chamber with the processing procedure chamber is arranged with 2X 3, 2X 4 or 2X 5's mode.

The parallel coating equipment of the utility model comprises a process chamber for titanium plating and a process chamber for copper plating.

The parallel coating equipment of the utility model comprises a plurality of process chambers, wherein each process chamber is provided with a cooling means arranged on a respective conveyer.

The utility model discloses a block form filming equipment, in adjoining in double-deck feeding chamber just has first elevating system the processing procedure chamber is first processing procedure chamber, connect in the X axle direction of perpendicular to Y axle direction in first processing procedure chamber the processing procedure chamber is second processing procedure chamber, second processing procedure chamber is used for right it carries out one of them of plasma washing, plasma activation, surface modification, plasma etching, reactive ion etching and inductive coupling plasma reactive ion etching to wait to plate the thing.

The utility model discloses a block form filming equipment has first elevating system the vacuum in processing procedure chamber is higher than the upper feeding chamber with the vacuum of lower floor's feeding chamber.

The beneficial effects of the utility model reside in that: by utilizing the double-layer feeding design of the double-layer feeding cavity, the operation time of waiting for degassing or vacuumizing can be reduced, the production period is shortened, and the productivity is increased. In addition, the double-layer feeding cavity, the discharging cavity and the processing cavity are arranged in parallel, so that the length of the equipment in the X-axis direction is shortened, and the factory building configuration is facilitated.

Drawings

Other features and advantages of the present invention will become apparent from the following detailed description of the preferred embodiments with reference to the accompanying drawings, in which:

FIG. 1 is a schematic view illustrating a conventional continuous coating line;

FIG. 2 is a schematic top view of an embodiment of the parallel plating apparatus of the present invention;

FIG. 3 is a schematic cross-sectional view of the embodiment illustrating a carrier being fed from the upper feeder chamber of the embodiment;

FIG. 4 is a view similar to FIG. 3 illustrating another carrier being fed from the lower feed chamber of the embodiment;

FIG. 5 is a schematic cross-sectional view of an embodiment illustrating the carrier out of the out-feed chamber of the embodiment;

fig. 6 to 7 are schematic views illustrating the operation of transporting the carrier;

FIG. 8 is a view similar to FIG. 2 illustrating a variation in use of the embodiment;

FIGS. 9-10 illustrate variations of the number of process chambers according to the embodiments described herein.

Detailed Description

Referring to fig. 2 to 4, the embodiment of the parallel coating apparatus of the present invention is suitable for coating the object 91 to be coated, which is respectively carried by the carriers 9, wherein the object 91 to be coated may be a wafer, a chip, a semiconductor material, a substrate (substrate), a semi-finished product of a semiconductor package, a finished product of a semiconductor package, an optical lens, a plastic product, or other objects, the kind of the object is not limited thereto, and the object 91 to be coated may be suitable for coating on an object, and the object 91 to be coated is a fan-out type panel package (FOPLP).

The parallel film plating equipment comprises a material loading and unloading area 1, a double-layer material inlet cavity 2, four process cavities and a material outlet cavity 4. The double-layer feeding cavity 2, the process cavity and the discharging cavity 4 are all vacuum cavities, and the discharging cavity 4, the double-layer feeding cavity 2 and the process cavity are arranged in a 2 x 3 mode. For convenience of description, the process chambers are hereinafter referred to as a first process chamber 31, a second process chamber 32, a third process chamber 33, and a fourth process chamber 34, respectively.

The material loading and unloading area 1 is in an atmospheric environment and comprises two material feeding lifting mechanisms 11 and two conveying devices 12. The feeding lifting mechanism 11 is used for driving the carrier 9 to move along the Z-axis direction and is arranged at intervals in the Y-axis direction perpendicular to the Z-axis direction. Each of the feeding lifting mechanisms 11 has a feeding lifting seat 111 capable of moving along the Z-axis direction, and a feeding driver 112 for driving the feeding lifting seat 111 to lift, in which the feeding driver 112 of the embodiment is an electric cylinder, but may also be a pneumatic cylinder, a linear motor, a motor and a screw rod, or other transmission mechanisms capable of driving the feeding lifting seat 111 to move along the Z-axis direction, which is not limited to this. The conveying devices 12 of this embodiment are respectively disposed on the feeding lifting seats 111. Each of the conveyors 12 is configured to drive the carrier 9 to move along an X-axis direction and a Y-axis direction, wherein the X-axis direction, the Y-axis direction and the Z-axis direction are perpendicular to each other. Each of the conveying devices 12 is a roller conveying system, and a plurality of rollers arranged in a transverse direction and a longitudinal direction are used to achieve the double-axial conveying in the X-axis direction and the Y-axis direction. For the sake of easy viewing, the conveyors 12 are numbered #1 and #2, and when the feeding lifter base 111 is equal in height in the Z-axis direction, the carrier 9 can be conveyed from the conveyor 12 numbered #2 to the conveyor 12 numbered #1 in the Y-axis direction.

In some variations, the number of the feeding lifting mechanisms 11 can be one, and the conveying device 12 with the number #2 is arranged on a high platform (not shown), so long as the conveying device 12 with the number #2 can be as high as the feeding lifting seat 111 to convey the carrier 9.

The double-layer feeding cavity 2 is connected to the material loading and unloading area 1 in the X-axis direction and is close to the conveyer 12 with the number #1, and the double-layer feeding cavity 2 comprises an upper feeding chamber 21 and a lower feeding chamber 22 which are oppositely arranged in the Z-axis direction. The upper layer feeding chamber 21 and the lower layer feeding chamber 22 are independent vacuum chambers, so that the two opposite sides of the upper layer feeding chamber 21 and the lower layer feeding chamber 22 are provided with independent vacuum valves 5 to be capable of opening/closing and adjusting the vacuum degree respectively. When the feeding lifter 111 is raised to the height of the upper feeding chamber 21, the carrier 9 can be fed into the upper feeding chamber 21 by the conveyor 12 of number #1 of the loading and unloading section 1; when the feeding lifting seat 111 is lowered to the height of the lower feeding chamber 22, the carrier 9 can be fed into the lower feeding chamber 22. The upper layer feeding chamber 21 and the lower layer feeding chamber 22 are provided with a conveying device 23 for moving the carrier 9 and a heating device 24 for baking the objects to be plated 91. The conveying device 23 is used to drive the carrier 9 to move along the X-axis direction, the conveying device 23 of the embodiment is a roller conveying system, conveying in the X-axis direction is achieved by using a plurality of rollers, and the roller conveying system is a conventional technology and has various changes, so description thereof is omitted. The heating device 24 is used to heat and bake the object 91 to remove moisture (outgassing), and in some variations, for example, when the double-layer feeding chamber 2 is used to perform rough vacuum pumping in two stages, the heating device 24 is not required to be provided in the upper feeding chamber 21 and the lower feeding chamber 22.

The first process chamber 31 is configured with a high pumping rate vacuum pump with a vacuum degree higher than the vacuum degree of the upper layer feed chamber 21 and the lower layer feed chamber 22 of the double layer feed chamber 2, and can be used as a buffer chamber between the former process chamber (usually low vacuum) and the latter process chamber (usually high vacuum), and the first process chamber 31 has a cooling means 30 such as, but not limited to, introducing cooling water or cooling gas, which can be used to reduce the heat accumulated in the carrier 9 and the object to be plated 91 in the former process chamber. The first process chamber 31 is connected to one side of the double-layer feeding chamber 2 in the X-axis direction, and the height of the first process chamber 31 is substantially the same as that of the double-layer feeding chamber 2. The upper and lower vacuum valves 5 between the first process chamber 31 and the double feed chamber 2 can be opened/closed respectively, when the carrier 9 is to enter the first process chamber 31 from the upper feed chamber 21, only the upper vacuum valve 5 is opened, and when the carrier 9 is to enter the first process chamber 31 from the lower feed chamber 22, only the lower vacuum valve 5 is opened, thereby maintaining the vacuum degree of the unopened upper feed chamber 21 or lower feed chamber 22.

The first process chamber 31 includes a first lifting mechanism 311 and a conveying device 35 installed on the first lifting mechanism 311, wherein the first lifting mechanism 311 is used to drive the carrier 9 to move along the Z-axis direction so as to receive the carrier 9 conveyed from the upper layer feeding chamber 21 or the lower layer feeding chamber 22. The first lifting mechanism 311 has a first lifting base 313 capable of moving along the Z-axis direction, and a first actuator 314 for driving the first lifting base 313 to lift, wherein the first actuator 314 of the embodiment is an electric cylinder, but can be other linear transmission mechanisms. The conveying device 35 is used for driving the carrier 9 to move along the X-axis direction and the Y-axis direction, and the conveying device 35 is also a roller conveying system, which is not described again.

The second process chamber 32 is a pre-processing chamber and is connected to one side of the first process chamber 31 in the X-axis direction, and the height of the second process chamber 32 is smaller than that of the first process chamber 31. The second process chamber 32 also includes the conveying device 35 for moving the carrier 9 along the X-axis direction and the Y-axis direction. The vacuum valve 5 is also disposed between the second process chamber 32 and the first process chamber 31. The second process chamber 32 receives the carrier 9 conveyed from the first process chamber 31 and is used to perform a pretreatment on the object 91, such as but not limited to plasma cleaning, plasma activation and surface modification, plasma etching, reactive Ion Etching (RIE), inductively coupled plasma reactive ion etching (ICP-RIE), etc., thereby removing surface contaminants of the object 91, cleaning the metal surface, or changing the physical/chemical properties of the object 91, which helps to improve the adhesion of the subsequent coating.

Referring to fig. 2 and 5, the third process chamber 33 is a coating chamber and is connected to one side of the second process chamber 32 in the Y-axis direction, and the third process chamber 33 also includes the conveying device 35 for driving the carrier 9 to move along the X-axis direction and the Y-axis direction. The vacuum valve 5 is disposed between the third process chamber 33 and the second process chamber 32. The third process chamber 33 receives the carrier 9 transferred from the second process chamber 32 and is used for performing a first sputtering process on the object to be plated 91. The third process chamber 33 of this embodiment is used for sputtering titanium (Ti) on the object 91.

The fourth process chamber 34 is a coating chamber and is connected to the third process chamber 33 in the X-axis direction and is connected to the first process chamber 31 in the Y-axis direction. The fourth process chamber 34 also includes the conveyor 35 for moving the carrier 9 along the X-axis and the Y-axis. The vacuum valve 5 is disposed between the fourth process chamber 34 and the third process chamber 33. The fourth process chamber 34 receives the carrier 9 transferred from the third process chamber 33 and is used for performing a second sputtering process on the object to be plated 91. The fourth process chamber 34 of this embodiment is used to sputter copper (Cu) on the titanium layer of the plating object 91.

The object 91 to be plated is plated at a fixed point through the process chambers (i.e., no displacement is generated in the plating process), and the carrier 9 is driven by the conveying device 35 to be conveyed among the process chambers, so that a Ti-Cu multilayer film can be formed on the object 91 to be plated to serve as a redistribution layer (RDL) of a fan-out type panel-level package (FOPLP). In order to avoid the high heat generated by the spot plating from damaging the object 91, as shown in fig. 3 to 5, the first process chamber 31, the second process chamber 32, the third process chamber 33 and the fourth process chamber 34 all have a cooling means 30 disposed on the conveying device 35 thereof, such as but not limited to, introducing cooling water or cooling gas, which can lower the temperature of the carrier 9 or the object 91.

The discharge chamber 4 is connected to the fourth process chamber 34 in the X-axis direction and is connected to the double-layer feed chamber 2 in the Y-axis direction, and is adjacent to the conveyor 12 numbered # 2. The vacuum valve 5 is arranged between the discharging chamber 4 and the fourth process chamber 34, and the vacuum valve 5 is also arranged at one side adjacent to the material loading and unloading area 1. The discharging chamber 4 includes a conveying device 41 for driving the carriers 9 to move along the X-axis direction, and the discharging chamber 4 is used for receiving the carriers 9 transferred from the fourth process chamber 34 and discharging the carriers 9 to the loading and unloading area 1.

The discharging cavity 4, the double-layer feeding cavity 2 and the processing cavity are arranged in two rows in the Y-axis direction, and the discharging cavity 4 and the double-layer feeding cavity 2 respectively correspond to the conveying device 12 of the material loading and unloading area 1. The positions of the second process chamber 32, the third process chamber 33 and the fourth process chamber 34 in the Z-axis direction are the same as the positions of the discharge chamber 4 in the Z-axis direction.

Referring to fig. 3 and 4, in operation, the material loading and unloading section 1 is alternately lifted and lowered by the material loading and lowering base 111 adjacent to the double-layered material loading chamber 2, and a plurality of carriers 9 are transferred to the upper material loading chamber 21 and the lower material loading chamber 22 one by one.

Referring to fig. 6, after the vacuum valve 5 at the upper right of the first process chamber 31 is opened, the carrier 9 in the upper feed chamber 21 is transferred to the first process chamber 31, the vacuum valve 5 at the upper right is closed, the vacuum valve 5 at the left side of the first process chamber 31 is opened, and the carrier 9 is transferred from the first process chamber 31 to the second process chamber 32 for pretreatment.

Referring to fig. 2 and 7, the first lift seat 313 is lowered and the vacuum valve 5 at the lower right of the first process chamber 31 is opened, and the vacuum valve 5 at the lower right is closed after the carrier 9 in the lower feed chamber 22 is transferred to the first process chamber 31. After the carrier 9 in the second process chamber 32 moves to the third process chamber 33, the first lifting base 313 is lifted up to transfer the carrier 9 from the first process chamber 31 to the second process chamber 32 for pretreatment. Through the double-layer feeding cavity design of the upper-layer feeding chamber 21 and the lower-layer feeding chamber 22 of the double-layer feeding cavity 2, the time for waiting for baking and degassing can be reduced, and the production period is shortened.

Of course, the application mode of this embodiment can also match with the requirement of high vacuum degree or the product requirement of short cycle, and the multi-stage vacuum pumping operation is firstly performed in the double-layer feeding cavity 2, for example, from low vacuum to high vacuum. Or, when one of the upper layer feeding chamber 21 or the lower layer feeding chamber 22 is abnormal, the continuous operation of the equipment can be maintained, and the utilization rate of the equipment can be improved.

Referring to fig. 2 and 5, after the carrier 9 passes through the third process chamber 33 and the fourth process chamber 34 and a multi-layer Ti-Cu film is sputtered, the carrier is discharged from the discharge chamber 4 to the conveyer 12 with the number #2 of the loading and unloading area 1, and then flows back to the conveyer 12 with the number #1 of the loading and unloading area 1, thereby achieving continuous automatic production.

It is noted that the Ti-Cu RDL can be applied to a coreless substrate (core substrate), a fan-out Wafer level package (FOWLP), a fan-out FOPLP, and a Wafer Redistribution Layer (Wafer Redistribution Layer).

Referring to fig. 8, in some variations, the functions of the process chambers may be changed, for example, the first process chamber 31 may be used as a pre-process chamber, the second process chamber 32 may be used for titanium plating, the third process chamber 33 may be used for copper plating, and the fourth process chamber 34 may be used as a buffer chamber.

Or, the present invention can also increase the number of the process chambers, as shown in fig. 9, there are six process chambers, and the discharge chamber 4, the double-layer feeding chamber 2 and the process chambers are arranged in a 2 × 4 manner. The first process chamber 31 is a buffer chamber, the second process chamber 32 is used for pretreatment, the third process chamber 33 is used for titanium plating, the fourth process chamber 34 is used for nickel vanadium plating, the fifth process chamber 36 is used for silver (or copper or gold) plating, and the sixth process chamber 37 is a buffer chamber, so as to apply a Back Side Metallization (Back Side Metal) or a patterned Front Side Metallization (FSM). As mentioned above, the functions of the process chambers can also be modified, such as using the fifth process chamber 36 for nickel vanadium plating, the sixth process chamber 37 for silver (or copper or gold) plating, and the others unchanged. Alternatively, the first process chamber 31 is used for pre-processing, the second process chamber 32 is used for plating titanium, the third process chamber 33 is used for plating nickel and vanadium, the fourth process chamber 34 is used for plating nickel and vanadium, the fifth process chamber 36 is used for plating silver (or copper or gold), and the sixth process chamber 37 is a buffer chamber.

As shown in fig. 10, there are eight process chambers, and the discharge chamber 4, the double-layer feed chamber 2 and the process chambers are arranged in a 2 × 5 manner. The first process chamber 31 is a buffer chamber, the second process chamber 32 is used for pretreatment, the third process chamber 33 is used for aluminum plating, the fourth process chamber 34 is used for titanium plating, the fifth process chamber 36 and the sixth process chamber 37 are used for nickel vanadium plating, the seventh process chamber 38 is used for silver (or copper or gold) plating, and the eighth process chamber 39 is a buffer chamber. Therefore, the present embodiment can increase or decrease the number of process chambers and adjust the configuration of each process chamber by using the modular design of the chamber to meet the requirement of the production capacity, or the requirement of different film structures and different film thicknesses.

The utility model discloses a double-deck feeding design of double-deck feeding chamber 2 can reduce the operating time who waits for the degasification or evacuation, shortens production cycle, increases the productivity. In addition, the double-layer feeding cavity 2, the discharging cavity 4 and the processing cavity are arranged in parallel in double rows, so that the length of the equipment in the X-axis direction is shortened, and the factory building configuration is facilitated. Therefore, the object of the present invention can be achieved.

The above description is only an example of the present invention, and the scope of the present invention should not be limited thereby, and all the simple equivalent changes and modifications made according to the claims and the description of the present invention are still within the scope of the present invention.

Claims (10)

1. A parallel coating equipment is suitable for coating an object to be coated carried by a carrier, and is characterized in that: the parallel coating equipment comprises:

the double-layer feeding cavity comprises an upper layer feeding chamber and a lower layer feeding chamber which are arranged oppositely in the Z-axis direction, the upper layer feeding chamber and the lower layer feeding chamber are independent vacuum cavities and are provided with conveying devices used for moving the carriers, and the carriers are fed by the upper layer feeding chamber or the lower layer feeding chamber;

the processing chambers are used for coating the objects to be coated, each processing chamber comprises a conveying device used for moving the carrier, one of the processing chambers is adjacent to one side of the double-layer feeding chamber and is also provided with a first lifting mechanism, and the first lifting mechanism is used for driving the carrier to move along the Z-axis direction; and

the discharging cavity is adjacent to the other side of the double-layer feeding cavity and used for discharging the carriers, the discharging cavity comprises a conveying device used for moving the carriers, the discharging cavity, the double-layer feeding cavity and the processing cavity are arranged in two rows in the Y-axis direction, and the Y-axis direction is perpendicular to the Z-axis direction.

2. The parallel plating apparatus according to claim 1, characterized in that: the loading and unloading area comprises at least one feeding lifting mechanism which is adjacent to the double-layer feeding cavity and used for driving the carrier to move along the Z-axis direction, and two conveying devices used for moving the carrier, the conveying devices of the loading and unloading area respectively correspond to the double-layer feeding cavity and the discharging cavity, the feeding lifting mechanism is used for arranging one conveying device of the loading and unloading area, and the carrier enters the double-layer feeding cavity from one conveying device of the loading and unloading area, passes through the processing cavity and then is discharged to the other conveying device of the loading and unloading area from the discharging cavity.

3. The parallel plating apparatus according to claim 1, characterized in that: each conveying device is used for driving the carrier to move along an X-axis direction perpendicular to the Y-axis direction, and each conveying device is used for driving the carrier to move along the X-axis direction and the Y-axis direction.

4. The parallel plating apparatus according to claim 1, characterized in that: the height of the process chamber adjacent to the double-layer feeding chamber is substantially the same as the height of the double-layer feeding chamber, and the positions of the other process chambers in the Z-axis direction are the same as the positions of the discharge chambers in the Z-axis direction.

5. The parallel plating apparatus according to claim 1, wherein: the upper layer feeding chamber and the lower layer feeding chamber are both provided with heating devices for baking.

6. The parallel plating apparatus according to claim 1, wherein: the discharge cavity, the double-layer feeding cavity and the process cavity are arranged in a 2 x 3, 2 x 4 or 2 x 5 mode.

7. The parallel plating apparatus according to claim 1, characterized in that: one of the process chambers is used for plating titanium, and the other process chamber is used for plating copper.

8. The parallel plating apparatus according to claim 1, characterized in that: each of the process chambers has cooling means arranged in the respective conveyor.

9. The parallel plating apparatus according to claim 1, characterized in that: the process chamber which is adjacent to the double-layer feeding chamber and is provided with the first lifting mechanism is a first process chamber, the process chamber which is connected with the first process chamber in the X-axis direction is a second process chamber, and the second process chamber is used for carrying out one of plasma cleaning, plasma activation, surface modification, plasma etching, reactive ion etching and inductively coupled plasma reactive ion etching on the object to be plated.

10. The parallel plating apparatus according to claim 1, characterized in that: the vacuum degree of the process cavity with the first lifting mechanism is higher than the vacuum degree of the upper layer feeding chamber and the lower layer feeding chamber.

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