CN218277348U

CN218277348U - Chip mounter that possesses stable absorption function

Info

Publication number: CN218277348U
Application number: CN202222231969.2U
Authority: CN
Inventors: 汪灿宁
Original assignee: Shenzhen Zhiheng Electromechanical Co ltd
Current assignee: Shenzhen Zhiheng Electromechanical Co ltd
Priority date: 2022-08-24
Filing date: 2022-08-24
Publication date: 2023-01-10
Anticipated expiration: 2032-08-24

Abstract

The utility model discloses a chip mounter that possesses stable absorption function, include the base and absorb the subassembly, the middle part of base is provided with band conveyer, and the surface of base is provided with the moving mechanism who is used for removing the PCB pad, moving mechanism includes slider, circular orbit and roof-rack, and the front end of slider slides and is provided with circular orbit, the roof-rack is settled in the middle part of the front end right side of base for absorb components and parts absorb the subassembly and set up in the rear end of roof-rack top, and absorb the subassembly and include bearing frame, electric putter, vent pipe, main suction nozzle, switching ring, a section of thick bamboo of ventilating, vice suction nozzle and aspiration pump, bearing frame's inside middle part is provided with electric putter. This chip mounter that possesses stable absorption function dismantles a set of PCB pad and the new set of PCB pad of replenishment that has accomplished the paster at the in-process of PCB pad paster, and reasonable distribution feed supplement and paster time can reduce chip mounter's idle time, improve output efficiency.

Description

Chip mounter that possesses stable absorption function

Technical Field

The utility model relates to a chip mounter technical field specifically is a chip mounter that possesses stable absorption function.

Background

Chip mounter: the placement machine is also called a placement machine and a surface placement system, and is a device which is configured behind a dispensing machine or a screen printing machine in a production line and accurately places surface-mounted components on PCB pads by moving a placement head. The method is divided into manual operation and full-automatic operation.

As in application No.: CN202021745062.2, the utility model discloses a stable form paster device for integrated circuit design, including the supporting mechanism who is used for the support equipment, still include placement mechanism, paster mechanism, placement mechanism installs the supporting mechanism top, paster mechanism installs placement mechanism top. The utility model discloses a set up placement machine and construct, the cassette links together through the gag lever post with the cardboard, so be convenient for change the cassette of different grade type to make the device can carry out the paster operation to the integrated circuit board of different grade type, through setting up paster mechanism, fixed subassembly can effectively improve the stability of adsorption head at the removal in-process, so improved the paster quality.

Similar to the above applications, the following disadvantages currently exist:

the special-shaped component adsorption device can only be used for components with regular shapes, and when the special-shaped components are adsorbed, the adsorption stability is influenced due to the fact that the contact surface of the suction nozzle and the special-shaped components is small and air leakage occurs simultaneously.

In view of the above, a chip mounter having a stable adsorption function is proposed to achieve the purpose of higher practical value by improving the existing structure and defects.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a chip mounter that possesses stable absorption function to solve the problem of proposing among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the chip mounter with the stable adsorption function comprises a base and a suction assembly, wherein a belt conveyor is arranged in the middle of the base, a moving mechanism used for moving a PCB pad is arranged on the surface of the base, the moving mechanism comprises a sliding block, an annular rail and a top frame, the front end of the sliding block is slidably provided with the annular rail, the top frame is arranged in the middle of the right side of the front end of the base, the suction assembly used for sucking components is arranged above the rear end of the top frame, the suction assembly comprises a bearing frame, an electric push rod, a vent pipeline, a main suction nozzle, a switching ring, a vent cylinder, an auxiliary suction nozzle and an air suction pump, the electric push rod is arranged in the middle of the inside of the bearing frame, the vent pipeline is arranged at the output end of the electric push rod, the air suction pump is connected to the middle of the surface of the vent pipeline through an air pipe, the end, far away from the electric push rod, of the vent pipeline is provided with the main suction nozzle, the switching ring is sleeved outside of the vent cylinder, and the auxiliary suction nozzle is arranged on the surface of the vent cylinder.

Further, the moving mechanism comprises a supporting disc and a clamping station, the front end of the annular track is provided with the supporting disc, and the surface of the supporting disc is provided with the clamping station.

Furthermore, the supporting disk is of a hollow structure, and four clamping stations are annularly distributed on the surface of the supporting disk.

Further, the moving mechanism further comprises a gear ring, a gear and a first forward and reverse rotating motor, the gear ring is arranged at an opening of the supporting disc, the gear is connected to the inner side of the gear ring, and a driving shaft at the front end of the gear penetrates through the top frame and is connected with the first forward and reverse rotating motor.

Furthermore, the gear is in transmission connection with a forward and reverse rotating motor through a driving shaft, and the gear ring is in meshing connection with the gear.

Furthermore, the electric push rod, the vent pipeline and the main suction nozzle are positioned on the same vertical central axis, and the air suction pump is communicated with the main suction nozzle through the air pipe, the vent pipeline and the main suction nozzle.

Furthermore, the air cylinder is also communicated with the air pipeline through an air pipe, and four auxiliary suction nozzles are annularly distributed on the surface of the air cylinder.

The utility model provides a chip mounter that possesses stable absorption function possesses following beneficial effect: this chip mounter that possesses stable absorption function dismantles a set of PCB pad and the new set of PCB pad of replenishment that has accomplished the paster at the in-process of PCB pad paster, and reasonable distribution feed supplement and paster time can reduce chip mounter's idle time, improve output efficiency.

1. The utility model discloses band conveyer's setting, make to absorb the subassembly and can accurately absorb components and parts under the condition of not moving the position, reach and last the material loading to the chip mounter, reduce the human labor, improve production efficiency's effect, order about the drive shaft through positive reverse motor one, the gear rotates around clockwise, the ring gear that is connected with it meshing is driven by the gear and is made rotary motion, enable supporting disk and four centre gripping stations and carry out the direction change, timely with the PCB pad of not paster on the centre gripping station remove to and absorb the subassembly and correspond the position, save the latency who absorbs the subassembly.

2. The utility model discloses switching ring cover is established outside the vent pipe, and the staff of can being convenient for carries out the regulation of height and directionality to it, makes vice suction nozzle can perfectly laminate special-shaped components and parts account for bigger marginal portion, and the main suction nozzle of cooperation adsorbs special-shaped components and parts central point simultaneously, can improve and absorb the overall stability that the subassembly was taken and is put the in-process to special-shaped components and parts, and the reduction dislocation skew condition takes place.

Drawings

Fig. 1 is a schematic view of an overall structure of a chip mounter with a stable adsorption function according to the present invention;

fig. 2 is a schematic top view of a carrier frame of a chip mounter with stable adsorption function according to the present invention;

fig. 3 is a schematic rear view of the vent cylinder of the chip mounter with stable adsorption function according to the present invention;

fig. 4 is the utility model relates to a top frame spatial structure sketch map of chip mounter that possesses stable absorption function.

In the figure: 1. a base; 2. a belt conveyor; 3. a moving mechanism; 301. a slider; 302. an annular track; 303. a support disc; 304. clamping a station; 305. a ring gear; 306. a gear; 307. a top frame; 308. a first forward and reverse rotating motor; 4. a suction assembly; 401. a carrier frame; 402. an electric push rod; 403. an air duct; 404. a main suction nozzle; 405. a transfer ring; 406. a breather tube; 407. an auxiliary suction nozzle; 408. an air pump.

Detailed Description

The following describes embodiments of the present invention in further detail with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.

As shown in fig. 1 and 4, a chip mounter with stable adsorption function includes a base 1 and an absorption assembly 4, a belt conveyor 2 is disposed in the middle of the base 1, and the belt conveyor 2 is disposed so that the absorption assembly 4 can accurately absorb components without moving the position, thereby achieving the effects of continuously feeding the chip mounter, reducing human labor, and improving production efficiency, and a moving mechanism 3 for moving a PCB pad is disposed on the surface of the base 1, the moving mechanism 3 includes a slider 301, an annular rail 302, and a top frame 307, the front end of the slider 301 is slidably disposed with the annular rail 302, the top frame 307 is disposed in the middle of the right side of the front end of the base 1, the moving mechanism 3 includes a support plate 303 and a clamping station 304, the front end of the annular rail 302 is disposed with the support plate 303, the surface of the support plate 303 is disposed with the clamping station 304, the support plate 303 is in a hollow structure, four clamping stations 304 are annularly distributed on the surface of the supporting disc 303, the moving mechanism 3 further comprises a gear ring 305, a gear 306 and a forward and reverse motor I308, the gear ring 305 is arranged at an opening of the supporting disc 303, the gear 306 is connected to the inner side of the gear ring 305, a driving shaft at the front end of the gear 306 penetrates through the top frame 307 and is connected with the forward and reverse motor I308, the gear 306 is in transmission connection with the forward and reverse motor I308 through the driving shaft, the gear ring 305 is in meshing connection with the gear 306, the driving shaft and the gear 306 are driven by the forward and reverse motor I308 to rotate in the clockwise direction, the gear ring 305 in meshing connection with the gear 306 is driven by the gear 306 to rotate, the directions of the supporting disc 303 and the four clamping stations 304 can be exchanged, a PCB pad which is not subjected to surface mounting on the clamping station 304 is timely moved to a position corresponding to the sucking assembly 4, and the waiting time of the sucking assembly 4 is saved; a suction module 4 for sucking a component is provided above the rear end of the top frame 307.

As shown in fig. 2-3, the suction assembly 4 includes a carrier frame 401, an electric push rod 402, an air duct 403, a main suction nozzle 404, an adapter ring 405, an air cylinder 406, an auxiliary suction nozzle 407, and an air pump 408, the electric push rod 402 is disposed in the middle of the interior of the carrier frame 401, the air duct 403 is disposed at the output end of the electric push rod 402, the air pump 408 is connected to the middle of the surface of the air duct 403 through an air pipe, the main suction nozzle 404 is mounted at one end of the air duct 403 away from the electric push rod 402, the air duct 403, and the main suction nozzle 404 are located on the same vertical central axis, the air pump 408 is connected to the air duct 403 and the main suction nozzle 404 through air pipes, the adapter ring 405 is sleeved outside the air duct 403, the air cylinder 406 is connected to the outer side of the adapter ring 405, the auxiliary suction nozzle 407 is disposed on the surface of the air cylinder 406, the air duct 406 is also connected to the air duct 403 through air pipe, the auxiliary suction nozzle 407 is annularly disposed on the surface, the air duct 407, four adapter ring 405 is sleeved outside the air duct 403, the air duct 403 can facilitate height and directional adjustment of workers, the auxiliary suction nozzle can perfectly fit the edge of the special-shaped component, and the suction nozzle can reduce the displacement of the special-shaped component, and improve the displacement of the suction assembly, and improve the overall suction assembly, and improve the displacement of the suction assembly during the assembly, and the displacement of the assembly.

In summary, when the chip mounter with stable adsorption function is used, firstly, four groups of PCB pads are correspondingly placed on four clamping stations 304 which are distributed annularly, then the belt conveyor 2 is started, the belt conveyor 2 conveys the special-shaped component to the suction assembly 4, at this time, the electric push rod 402 drives the air duct 403 and the main suction nozzle 404 to advance towards the position of the relative center of the special-shaped component until the main suction nozzle 404 is attached to the surface of the special-shaped component, because the adapter ring 405 is sleeved outside the air duct 403, the air duct 406 is communicated with the air duct 403 through the air pipe, a worker can perfectly attach the auxiliary suction nozzle 407 to the edge part with larger proportion of the special-shaped component by adjusting the height and the direction of the adapter ring 405, at this time, the air suction pump 408 is started to suck air between the auxiliary suction nozzle 407, the main suction nozzle 404 and the special-shaped component to form negative pressure, the special-shaped components can be tightly attached to the auxiliary suction nozzle 407 and the main suction nozzle 404, the contact surface with the special-shaped components is increased, the influence of the air leakage on the whole stability in the taking and placing process due to the fact that the special-shaped components cannot be sucked is avoided, then the electric push rod 402 drives the auxiliary suction nozzle 407 and the main suction nozzle 404 to move towards the surface far away from the base 1, the forward and reverse motor 308 supported by the top frame 307 is controlled to drive the driving shaft and the gear 306 to rotate clockwise, the gear ring 305 meshed and connected with the gear ring 306 can be driven by the gear 306 to rotate, when the directions of the supporting plate 303 and the four clamping stations 304 are exchanged, the PCB bonding pad without being pasted on the clamping station 304 is timely moved to the position corresponding to the suction assembly 4, wherein the supporting plate 303 is connected with the sliding block 301 through the annular rail 302 at the rear end in a sliding mode, the stability of the supporting plate 303 in the rotating process can be improved under the condition that the work of the belt conveyor 2 is not influenced, this moment again through electric putter 402 to lid PCB pad promote the dysmorphism components and parts that are in by the adsorption state, can replace artifical completion paster operation, and at the in-process of a set of PCB pad paster, the staff can dismantle a set of PCB pad of having accomplished the paster and supply a new set of PCB pad, comes reasonable distribution feed supplement and paster time, makes the chip mounter go on with optimal processing order, through shortening the total idle time of absorbing subassembly 4, improves output efficiency.

The embodiments of the present invention have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiment was chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated.

Claims

1. A chip mounter with a stable adsorption function comprises a base (1) and a suction assembly (4), and is characterized in that a belt conveyor (2) is arranged in the middle of the base (1), a moving mechanism (3) used for moving a PCB pad is arranged on the surface of the base (1), the moving mechanism (3) comprises a sliding block (301), an annular rail (302) and a top frame (307), the front end of the sliding block (301) is provided with the annular rail (302) in a sliding manner, the top frame (307) is arranged in the middle of the right side of the front end of the base (1), the suction assembly (4) used for sucking components is arranged above the rear end of the top frame (307), the suction assembly (4) comprises a bearing frame (401), an electric push rod (402), a ventilation pipeline (403), a main suction nozzle (404), a switching ring (405), a ventilation cylinder (406), an auxiliary suction nozzle (407) and a suction pump (408), the electric push rod (402) is arranged in the middle of the bearing frame (401), the output end of the electric push rod (402) is provided with the ventilation pipeline (403), the ventilation switching ring (405), the ventilation pump (408) is connected with the suction pipe (408), and one end of the ventilation pipe (408) is sleeved on the ventilation pipe (408), one end of the ventilation switching ring (405), the outer side of the adapter ring (405) is connected with an air cylinder (406), and the surface of the air cylinder (406) is provided with an auxiliary suction nozzle (407).

2. The chip mounter with stable adsorption function according to claim 1, wherein the moving mechanism (3) comprises a supporting disk (303) and a clamping station (304), the supporting disk (303) is arranged at the front end of the annular rail (302), and the clamping station (304) is arranged on the surface of the supporting disk (303).

3. The chip mounter with stable adsorption function according to claim 2, wherein the support tray (303) is of a hollow structure, and four clamping stations (304) are annularly distributed on the surface of the support tray (303).

4. The chip mounter with stable adsorption function according to claim 2, wherein the moving mechanism (3) further comprises a gear ring (305), a gear (306) and a forward and reverse motor I (308), the gear ring (305) is arranged at the opening of the supporting disk (303), the gear (306) is connected to the inner side of the gear ring (305), and a driving shaft at the front end of the gear (306) penetrates through the top frame (307) and is connected with the forward and reverse motor I (308).

5. The chip mounter with stable adsorption function according to claim 4, wherein the gear (306) is in transmission connection with a forward-reverse motor I (308) through a driving shaft, and the gear ring (305) is in meshing connection with the gear (306).

6. The chip mounter with stable adsorption function according to claim 1, wherein the electric push rod (402), the air vent pipe (403) and the main suction nozzle (404) are located on the same vertical central axis, and the air suction pump (408) is communicated with the main suction nozzle (404) through an air pipe and the air vent pipe (403).

7. The chip mounter with stable adsorption function according to claim 1, wherein the vent cylinder (406) is also communicated with the vent pipeline (403) through an air pipe, and the number of the sub-suction nozzles (407) is four in an annular distribution around the surface of the vent cylinder (406).