CN218243988U

CN218243988U - Cutting equipment for high-density PCB

Info

Publication number: CN218243988U
Application number: CN202222117524.1U
Authority: CN
Inventors: 黄绍清; 吴福和
Original assignee: Xiamen Nuohua Precision Electronics Co ltd
Current assignee: Xiamen Nuohua Precision Electronics Co ltd
Priority date: 2022-08-12
Filing date: 2022-08-12
Publication date: 2023-01-06
Anticipated expiration: 2032-08-12

Abstract

The utility model discloses a high density is cutting tool for PCB board, including cutting the mounting bracket, be equipped with cutting assembly on cutting the mounting bracket, the cutting assembly below is equipped with the pay-off subassembly, it is equipped with the unloading subassembly in the mounting bracket to cut. The utility model belongs to the technical field of the PCB board processing, specifically a high density is cutting equipment for PCB board, through setting up the pay-off subassembly, improved cutting equipment's work efficiency, reduced the low possibility of security that artifical pay-off leads to, improved the degree of automation of device simultaneously to and the fixed knot who sets up constructs, increased the stability of panel when cutting, adopt scale mark and unloading subassembly, improved cutting equipment's use and experienced.

Description

Cutting tool for high-density PCB

Technical Field

The utility model belongs to the technical field of the PCB board processing, specifically indicate a cutting equipment for high density PCB board.

Background

The PCB is called a printed circuit board, also called a printed circuit board, and is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components. With the development of economy, the PCB is developed in the direction of environmental protection with high density, high speed, low power consumption and low cost. And need often cut it in the in-process of carrying out production and processing to the circuit board, conveniently install different electronic components.

However, the existing cutting equipment is complex in structure and quite troublesome to install, manual feeding is mostly used during cutting, so that the safety and the automation degree of the existing cutting equipment are low, and the requirement of modern production is difficult to meet, and therefore, the novel cutting equipment for the high-density PCB is provided.

SUMMERY OF THE UTILITY MODEL

To the above situation, for overcoming prior art's defect, the utility model provides a high density is cutting equipment for PCB board has improved cutting equipment's work efficiency through setting up the pay-off subassembly, has reduced the low possibility of security that artifical pay-off leads to, has improved the degree of automation of device simultaneously to and the fixed knot who sets up constructs, has increased the stability of panel when cutting, adopts scale mark and unloading subassembly, has improved cutting equipment's use and has experienced.

The utility model discloses the technical scheme who takes as follows: the utility model relates to a cutting equipment for high density PCB board, including cutting the mounting bracket, be equipped with cutting assembly on cutting the mounting bracket, the cutting assembly below is equipped with pay-off subassembly, be equipped with unloading subassembly in cutting the mounting bracket, be equipped with control panel on cutting the outer wall of mounting bracket, be equipped with the supporting leg on cutting the lower wall of mounting bracket; the feeding assembly comprises a feeding movable groove, the feeding movable groove is arranged in the cutting mounting frame, a linear guide rail is arranged in the feeding movable groove, a linear motor is arranged on the linear guide rail, a connecting column is arranged on the linear motor, a feeding baffle is arranged on the connecting column, and a fixing structure is arranged in the feeding baffle.

Furthermore, a guide sliding groove is formed in the upper wall of the cutting mounting frame, and the connecting column is connected with the guide sliding groove in a clamping and sliding mode.

Further, fixed knot constructs including lifting guide, lifting guide locates in the pay-off baffle, the last elevator motor that is equipped with of lifting guide, the last fixed plate that is equipped with of elevator motor, be equipped with buffer spring on the fixed plate, the last buffer board that is equipped with of buffer spring.

Further, cutting assembly is including cutting the frame, cut the frame and locate on cutting the upper wall of mounting bracket, be equipped with lifting threaded rod in the frame cuts, lifting threaded rod is last to be equipped with the elevating movement platform, lifting threaded rod's one end is equipped with driving motor, be equipped with the mounting panel on the elevating movement platform, be equipped with on the mounting panel and cut the cylinder, it cuts the sword to cut to be equipped with on the cylinder.

Furthermore, the blanking assembly comprises a blanking groove, the blanking groove is embedded in the cutting mounting frame, a blanking roller is rotationally arranged in the blanking groove, a blanking conveyor belt is arranged on the blanking roller, a blanking motor is arranged on the side wall of the cutting mounting frame, and the output end of the blanking motor is connected with the blanking roller; the upper wall and the front wall of the discharging groove are both rectangular openings.

Furthermore, scale marks are arranged on the outer wall of the cutting mounting frame, and the cutting precision can be improved through the scale marks; the cutting and installing frame is internally provided with a buffer column, the buffer column is internally provided with a cutter buffer layer, and the cutter buffer layer is provided with two groups and two groups of cutter buffer layers which are symmetrically arranged.

Adopt above-mentioned structure the utility model discloses the beneficial effect who gains as follows: this scheme is cutting equipment for high density PCB board, through setting up the pay-off subassembly, has improved cutting equipment's work efficiency, has reduced the low possibility of security that artifical pay-off leads to, has improved the degree of automation of device simultaneously to and the fixed knot who sets up constructs, has increased the stability of panel when cutting, adopts scale mark and unloading subassembly, has improved cutting equipment's use and has experienced.

Drawings

FIG. 1 is a front cross-sectional view of a cutting apparatus for a high-density PCB according to the present invention;

FIG. 2 is a first side sectional view of the cutting apparatus for the high-density PCB board according to the present embodiment;

FIG. 3 is a side view and sectional view of a cutting tool for a high density PCB board of the present scheme

Fig. 4 is a front view of a cutting apparatus for a high-density PCB board according to the present embodiment.

The device comprises a cutting mounting frame 1, a cutting assembly 2, a cutting assembly 3, a feeding assembly 4, a blanking assembly 5, a control panel 6, support legs 7, a feeding movable groove 8, a linear guide rail 9, a linear motor 10, a connecting column 11, a feeding baffle plate 12, a fixing structure 13, a lifting guide rail 14, a lifting motor 15, a fixing plate 16, a buffer spring 17, a buffer plate 18, a cutting frame 19, a lifting threaded rod 20, a lifting moving platform 21, a driving motor 22, a mounting plate 23, a cutting cylinder 24, a cutting knife 25, a blanking groove 26, a blanking roller 27, a blanking conveyor belt 28, a blanking motor 29, a scale line 30, a guide sliding groove 31, a buffer column 32 and a knife buffer layer.

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments; based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

As shown in fig. 1-4, the cutting device for high-density PCB of the present invention comprises a cutting mounting frame 1, a cutting assembly 2 is arranged on the cutting mounting frame 1, a feeding assembly 3 is arranged below the cutting assembly 2, a blanking assembly 4 is arranged in the cutting mounting frame 1, a control panel 5 is arranged on the outer wall of the cutting mounting frame 1, and a support leg 6 is arranged on the lower wall of the cutting mounting frame 1; the feeding assembly 3 comprises a feeding movable groove 7, the feeding movable groove 7 is arranged in the cutting mounting frame 1, a linear guide rail 8 is arranged in the feeding movable groove 7, a linear motor 9 is arranged on the linear guide rail 8, a connecting column 10 is arranged on the linear motor 9, a feeding baffle 11 is arranged on the connecting column 10, and a fixing structure 12 is arranged in the feeding baffle 11.

Wherein, be equipped with direction sliding tray 30 on cutting the upper wall of mounting bracket 1, spliced pole 10 and direction sliding tray 30 block sliding connection.

Specifically, the fixed structure 12 includes a lifting guide rail 13, the lifting guide rail 13 is disposed in the feeding baffle 11, a lifting motor 14 is disposed on the lifting guide rail 13, a fixed plate 15 is disposed on the lifting motor 14, a buffer spring 16 is disposed on the fixed plate 15, and a buffer plate 17 is disposed on the buffer spring 16.

Specifically, cutting assembly 2 includes cutting frame 18, and cutting frame 18 is located on cutting the upper wall of mounting bracket 1, is equipped with lifting threaded rod 19 in cutting frame 18, is equipped with lifting movable platform 20 on the lifting threaded rod 19, and lifting threaded rod 19's one end is equipped with driving motor 21, is equipped with mounting panel 22 on the lifting movable platform 20, is equipped with on the mounting panel 22 and cuts cylinder 23, cuts and is equipped with on the cylinder 23 and cuts sword 24.

Specifically, the blanking assembly 4 comprises a blanking groove 25, the blanking groove 25 is embedded in the cutting mounting frame 1, a blanking roller 26 is rotatably arranged in the blanking groove 25, a blanking conveyor belt 27 is arranged on the blanking roller 26, a blanking motor 28 is arranged on the side wall of the cutting mounting frame 1, and the output end of the blanking motor 28 is connected with the blanking roller 26; the upper wall and the front wall of the discharging groove 25 are both rectangular openings.

Specifically, the outer wall of the cutting mounting frame 1 is provided with scale marks 29, and the scale marks 29 can improve the cutting precision; cut and be equipped with buffer column 31 in the mounting bracket 1, be equipped with cutter buffer layer 32 in the buffer column 31, cutter buffer layer 32 is equipped with two sets ofly, and two sets of cutter buffer layer 32 symmetry sets up.

When the circuit board cutting machine is used specifically, a user places a circuit board on the cutting installation frame 1, then the lifting motor 14 is started to drive the fixing plate 15 to move downwards along the lifting guide rail 13, the circuit board is fixed, after the fixing is completed, the linear motor 9 and the driving motor 21 are started, the linear motor 9 drives the feeding baffle plate 11 to move towards the lower portion of the cutting knife 24 along the linear guide rail 8, the driving motor 21 drives the lifting threaded rod 19 to rotate at the moment, then the lifting moving platform 20 and the mounting plate 22 on the lifting moving platform are driven to move downwards to a proper height and stop, then the cutting cylinder 23 pushes the cutting knife 24 to move towards the circuit board and cut, the cutting knife 24 falls onto the knife buffer layer 32, the cut circuit board enters the blanking conveyor belt 27 under the action of continuous pushing of the feeding baffle plate 11, the blanking motor 28 is started by the user to drive the blanking roller 26 to rotate, and then the blanking conveyor belt 27 transmits, so that the circuit board is driven to enter the next procedure. It is above that the utility model discloses holistic work flow, when using next time repeat this step can.

It should be noted that, in this document, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

The present invention and the embodiments thereof have been described above, but the description is not limited thereto, and the embodiment shown in the drawings is only one of the embodiments of the present invention, and the actual structure is not limited thereto. In summary, those skilled in the art should understand that they should not be limited to the embodiments described above, and that they can design the similar structure and embodiments without departing from the spirit of the invention.

Claims

1. The utility model provides a high density is cutting equipment for PCB board which characterized in that: the cutting device comprises a cutting mounting rack (1), wherein a cutting assembly (2) is arranged on the cutting mounting rack (1), a feeding assembly (3) is arranged below the cutting assembly (2), a blanking assembly (4) is arranged in the cutting mounting rack (1), a control panel (5) is arranged on the outer wall of the cutting mounting rack (1), and supporting legs (6) are arranged on the lower wall of the cutting mounting rack (1); pay-off subassembly (3) are including pay-off movable groove (7), pay-off movable groove (7) are located and are cut in mounting bracket (1), be equipped with linear guide (8) in pay-off movable groove (7), be equipped with linear electric motor (9) on linear guide (8), be equipped with spliced pole (10) on linear electric motor (9), be equipped with pay-off baffle (11) on spliced pole (10), be equipped with fixed knot structure (12) in pay-off baffle (11).

2. The cutting apparatus for the high-density PCB board as claimed in claim 1, wherein: fixed knot constructs (12) including lift guide (13), in pay-off baffle (11) is located in lift guide (13), be equipped with elevator motor (14) on lift guide (13), be equipped with fixed plate (15) on elevator motor (14), be equipped with buffer spring (16) on fixed plate (15), be equipped with buffer board (17) on buffer spring (16).

3. The cutting apparatus for the high-density PCB board as claimed in claim 2, wherein: cutting assembly (2) is including cutting frame (18), cutting frame (18) are located and are cut on the upper wall of mounting bracket (1), be equipped with lifting screw rod (19) in cutting frame (18), be equipped with lifting moving platform (20) on lifting screw rod (19), the one end of lifting screw rod (19) is equipped with driving motor (21), be equipped with mounting panel (22) on lifting moving platform (20), be equipped with on mounting panel (22) and cut cylinder (23), it cuts sword (24) to cut to be equipped with on cylinder (23).

4. The cutting apparatus for the high density PCB as claimed in claim 3, wherein: unloading subassembly (4) are including unloading silo (25), in unloading silo (25) embedded locating cuts mounting bracket (1), unloading silo (25) internal rotation is equipped with unloading roller (26) down, be equipped with unloading conveyer belt (27) on unloading roller (26), be equipped with unloading motor (28) on cutting the lateral wall of mounting bracket (1), the output of unloading motor (28) is connected with unloading roller (26).

5. The cutting apparatus for the high-density PCB as recited in claim 4, wherein: and the outer wall of the cutting mounting frame (1) is provided with scale marks (29).

6. The cutting apparatus of claim 5, wherein: the cutting and installing frame is characterized in that a guide sliding groove (30) is formed in the upper wall of the cutting and installing frame (1), and the connecting column (10) is connected with the guide sliding groove (30) in a clamping and sliding mode.

7. The cutting apparatus for the high-density PCB as recited in claim 6, wherein: cut and be equipped with buffering post (31) in mounting bracket (1), be equipped with cutter buffer layer (32) in buffering post (31), cutter buffer layer (32) are equipped with two sets ofly, two sets of cutter buffer layer (32) symmetry sets up.

8. The cutting apparatus for the high-density PCB board as claimed in claim 7, wherein: the upper wall and the front wall of the discharging groove (25) are both rectangular openings.