CN218241881U

CN218241881U - LED backlight module

Info

Publication number: CN218241881U
Application number: CN202222600211.1U
Authority: CN
Inventors: 申崇渝; 王明雪
Original assignee: Beijing Yimei New Technology Co ltd
Current assignee: Beijing Yimei New Technology Co ltd
Priority date: 2022-09-29
Filing date: 2022-09-29
Publication date: 2023-01-06
Anticipated expiration: 2032-09-29

Abstract

The utility model relates to a show technical field, provide a LED backlight unit, this LED backlight unit includes: the LED substrate is provided with a bonding pad; the Mini LED chip is arranged on the bonding pad; the coarsening layer is arranged above the LED substrate and comprises a silica gel layer doped with diffusion powder, and the concentration of the diffusion powder in the silica gel layer is 0.1-5%; the light guide plate is arranged above the coarsening layer.

Description

LED backlight module

Technical Field

The utility model relates to a show technical field, more specifically say, relate to a LED backlight unit.

Background

In the related art, the Mini LED chip has a small light emitting angle, so that the problem of uneven light emitting brightness and color of the light emitting surface of the Mini LED backlight module is caused.

There are currently two main approaches to solve this problem. One way is to dot a convex cup on a transparent package support to form a primary optical lens, and the Light Emitting angle of the LED (Light Emitting Diode) is enlarged from about 120 degrees to about 170 degrees through the primary optical lens. In another method, a reflective layer is added directly above a Mini LED Chip in any one of two types of packaging, namely, CSP (Chip Scale Package) and NCSP (Near Chip Scale Package), and most of light on the front surface is reflected and emitted from the periphery of the Mini LED Chip, thereby enlarging the light emission angle of the LED.

The two schemes have certain defects, the problem that the size of the convex cup is uncontrollable during manufacturing exists in the transparent support point convex cup, the change of the light shape is uncontrollable, and meanwhile, the product yield is low due to the fact that the patch is not easy to absorb when the client is used; and a layer of reflecting layer is directly added right above the Mini LED chips of the CSP and the NCSP, so that the light-emitting rate can be greatly reduced, the brightness of the LED is reduced by 30% -35% compared with the brightness of the LED without the reflecting layer, in addition, the light reflected back from the front surface can be absorbed by being repeatedly reflected inside the packaging body after being vertically reflected, the light reflected back from the front surface cannot be LED out from the periphery, and the light-emitting angle of the LED cannot be effectively enlarged.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a LED backlight module to solve the technical problem that light-emitting brightness and light-emitting colour are inhomogeneous among the prior art Mini LED backlight module's play plain noodles.

In order to achieve the above object, the utility model adopts the following technical scheme:

in one aspect, the utility model provides a LED backlight module, include: the LED substrate is provided with a bonding pad; the Mini LED chip is arranged on the bonding pad; the coarsening layer is arranged above the LED substrate and comprises a silica gel layer doped with diffusion powder, and the concentration of the diffusion powder in the silica gel layer is 0.1% -5%; and the light guide plate is arranged above the coarsening layer.

In one embodiment, the thickness of the roughened layer is 10 μm to 100 μm.

In one embodiment, the LED substrate comprises any one of: FR-4 substrate, BT substrate and aluminum substrate.

In one embodiment, a solder resist ink layer is arranged between the LED substrate and the coarsening layer, and the solder resist ink layer covers the LED substrate at other parts except the position of the pad.

In one embodiment, the package form of the Mini LED chip includes any one of the following: die, chip scale package, and near chip scale package.

In one embodiment, the Mini LED chip is a multi-faceted light emitting Mini LED chip.

In one embodiment, the roughened layer covers over all of the LED substrate including the Mini LED chip locations.

In one embodiment, the coarsening layer covers the LED substrate at other parts except the position of the Mini LED chip.

In one embodiment, the solder mask ink layer comprises a solder mask white ink layer.

In one embodiment, the thickness of the roughened layer is less than the thickness of the Mini LED chip.

The utility model provides a LED backlight module and manufacturing method's beneficial effect lies in at least: through set up the coarseness layer that the one deck doping has the diffusion powder that is used for strengthening light diffusion on the LED base plate for the light that reflects to the coarseness layer is changed light propagation direction by the coarseness layer, thereby forms each and gives out light, can make light misce bene in the backlight unit cavity through the light diffusion of relapse, and then makes the light-emitting brightness and the light-emitting colour of backlight unit's play plain noodles more even.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

FIG. 1 is a schematic structural diagram of an LED backlight module in the prior art;

fig. 2 is a schematic structural diagram of an LED backlight module according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of another LED backlight module according to an embodiment of the present invention;

fig. 4 is a schematic flow chart of a manufacturing method of an LED backlight module according to an embodiment of the present invention.

Wherein, in the figures, the respective reference numerals:

1. a light guide layer; 2. a Mini LED chip; 3. an LED substrate; 4. a coarsening layer; 5. and (7) solder resist ink layer.

Detailed Description

In order to make the technical problem, technical solution and beneficial effects to be solved by the present invention more clearly understood, the following description is made in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly or indirectly secured to the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "upper", "lower", "left", "right", "front", "back", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positions based on the orientations or positions shown in the drawings, and are for convenience of description only and not to be construed as limiting the technical solution. The terms "first", "second" and "first" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "plurality" is two or more unless specifically limited otherwise.

Referring to fig. 1, an LED backlight module in the prior art sequentially includes, from bottom to top: the LED light source comprises an LED substrate 3, a Mini LED chip 2, and a light guide plate 1, and the direction indicated by the arrow in fig. 1 is the light propagation direction of the light emitted by the Mini LED chip. The Mini LED chips 2 are uniformly disposed behind the liquid crystal panel as light sources, so that the backlight can be uniformly transmitted to the whole screen, and the details of the picture are more fine and vivid. Different backlight source module authority areas can be respectively set as light emitting sources by uniformly configuring the Mini LED chips at the rear of the liquid crystal panel, but due to the particularity of the Mini LED chips, the backlight module with uniform light mixing can achieve a high light mixing effect by using more Mini LED chips, so that the cost is high.

In order to solve the above technical problem, an embodiment of the present invention provides an LED backlight module and a manufacturing method thereof.

The following describes in detail an LED backlight module and a manufacturing method according to embodiments of the present invention with reference to the accompanying drawings.

As shown in fig. 2, an embodiment of the present invention provides an LED backlight module, which includes:

the LED substrate 3 is provided with pads (not shown).

And the Mini LED chip 2 is arranged on the bonding pad.

And the coarsening layer 4 is arranged above the LED substrate and comprises a silica gel layer doped with diffusion powder, and the concentration of the diffusion powder in the silica gel layer is 0.1-5%.

And the light guide plate 1 is arranged above the coarsened layer.

The direction of the arrow shown in fig. 2 is the light propagation direction of the light emitted by the Mini LED chip.

According to the utility model discloses technical scheme forms the coarsening layer in the top of LED base plate, and the main material on this coarsening layer can be silica gel, and the doping has the concentration to be 0.1% -5% diffusion powder in this silica gel, and the coarsening layer that this silica gel that the doping has diffusion powder formed can be regarded as a diffusion barrier, and it can be so that the light that reflects the diffusion barrier changes the light propagation direction, forms each direction and gives out light. The light can be uniformly mixed in the cavity of the backlight module through repeated diffusion, and the light emitting brightness and the light emitting color of the light emitting surface of the backlight module are more uniform.

Further, according to the utility model discloses according to the technical scheme, can use less Mini LED number to make backlight unit's play plain noodles light-emitting brightness and light-emitting colour's homogeneity higher to reduce the quantity of Mini LED chip among the backlight unit of same volume, reduced backlight unit's cost of manufacture.

In an embodiment of the present invention, the thickness of the roughened layer may be designed to be in a range of 10 μm to 100 μm. For example, the thickness of the roughened layer may be designed to be 10 μm, 20 μm, 60 μm, or 100 μm, but is not limited thereto.

In the related art, the Mini LED chip is an LED device with a chip size between 50 μm and 200 μm. Typically, the thickness of the roughened layer is less than the thickness of the Mini LED chip.

In the embodiment of the present invention, the coarsening layer can cover the top of the whole LED substrate including the Mini LED chip position, and the coarsening layer can also cover the top of the LED substrate of other parts except the Mini LED chip position.

As shown in fig. 2, in an embodiment of the present invention, the roughened layer is located above the LED substrate, but does not cover the Mini LED chip.

As shown in fig. 3, in another embodiment of the present invention, the roughened layer is located above the LED substrate and covers the Mini LED chip.

In the embodiment of the present invention, the LED substrate may be any one of an FR-4 substrate, a BT substrate, and an aluminum substrate, and is not limited thereto.

Specifically, the FR-4 substrate is a Printed Circuit Board (PCB) substrate having a flame retardant material rating of FR-4. The BT substrate is a substrate whose base material is BT resin. The LED lamp generates large heat, the aluminum material has high heat dissipation efficiency, and the backlight module with good heat dissipation effect can be obtained by using the aluminum substrate as the LED substrate.

As shown in fig. 2 and 3, a solder resist ink layer may be disposed between the LED substrate and the roughening layer, and the solder resist ink layer may cover the LED substrate at a portion other than the pad position.

Specifically, the solder resist ink layer may be made of solder resist white oil ink. The solder resist white oil ink can be coated or printed on the LED substrate to play a role in solder resist and also has a certain light reflection function. The solder resist white oil ink has the advantages of stable performance, good light reflection, long-term yellowing resistance, high temperature resistance and the like, so that the LED backlight module with stable performance, good light reflection, long-term yellowing resistance and high temperature resistance can be obtained.

In the embodiment of the utility model provides an in, mini LED chip is the luminous Mini LED chip of multiaspect. The package form of the Mini LED chip may be any one of a die, a chip scale package, and a near chip scale package, and is not limited thereto.

The embodiment of the utility model provides an in, the top of Mini LED chip can also be provided with the silica gel protective layer for the light reflection that sends Mini LED chip top is to the layer of coarsening.

The utility model discloses technical scheme strengthens Mini LED's mixed light performance through the mode with the base plate alligatoring. Specifically, in the process of roughening the substrate, a roughening layer may be provided on the front surface of the substrate. Because the coarseness layer can change the reflection light from the mirror reflection to the diffuse reflection, thereby leading the Mini LED backlight plate module to have better light mixing effect.

According to the utility model discloses technical scheme can make Mini LED backlight unit have better mixed light effect under the quantity condition that need not increase current Mini LED chip to can reduce the use of Mini LED chip, and then can the greatly reduced mix the light inhomogeneous and the chip that causes extravagant.

According to the utility model discloses LED backlight unit has the diffusion powder's that is used for strengthening light diffusion coarseness layer through setting up the one deck doping on the LED base plate for the light that reflects to coarseness layer is changed the light direction of propagation by coarseness layer, thereby forms each and gives out light, and light diffusion through relapse can be so that light at backlight unit cavity misce bene, and then makes the light-emitting brightness and the light-emitting colour on backlight unit's the play plain noodles more even.

As shown in fig. 4, an embodiment of the present invention provides a method for manufacturing an LED backlight module, including:

and S401, fixing a Mini LED chip on a bonding pad of the LED substrate to form a lamp panel.

Step S402, forming a coarsened layer above the LED substrate through a glue spraying or silk screen printing process, wherein the coarsened layer comprises a silica gel layer doped with diffusion powder, and the concentration of the diffusion powder in the silica gel layer is 0.1% -5%.

Step S403, covering the light guide plate above the roughened layer.

Prior to step S401, a solder resist ink layer may be formed over portions of the LED substrate other than the pad locations.

In step S402, a silica gel doped with diffusion powder may be coated on the solder resist ink layer by a glue spraying or screen printing process to form a roughened layer. After the rough layer is formed, the rough layer also needs to be cured, and the curing method may be thermal curing or ultraviolet curing, but is not limited thereto.

Before step S403, a silicone protective layer may be formed over the Mini LED chip, and the silicone protective layer may reflect light emitted over the Mini LED chip to the roughening layer.

The utility model discloses technical scheme, through the mixed light performance with the mode reinforcing Mini LED of base plate alligatoring. Specifically, in the process of roughening the substrate, a roughened layer may be provided on the front surface of the substrate. Because the coarseness layer can change the reflection light from the mirror reflection to the diffuse reflection, thereby leading the Mini LED backlight plate module to have better light mixing effect.

The utility model discloses in the LED backlight unit manufacturing method of embodiment, mini LED chip can be blue light chip, and Mini LED backlight unit's manufacturing method can include following step:

firstly, 0.1% -5% of silica gel containing diffusion powder is prepared, the silica gel is covered on the PCB substrate except the bonding pad through screen printing, and the silica gel is solidified in a high-temperature mode. The temperature for high temperature curing may be 150 degrees celsius, but is not limited thereto.

And secondly, fixing the Mini LED blue light chip on a bonding pad position of the PCB substrate through a die bonder, and curing the Mini LED blue light chip in a high-temperature mode.

And thirdly, a lenticular silica gel protective layer is dotted on the Mini LED blue light chip through a glue dispenser, and the Mini LED backlight plate is formed through curing in a high-temperature mode.

And fourthly, covering the light guide plate on the Mini LED backlight plate to form the Mini LED backlight module.

According to the embodiment of the utility model provides a LED backlight unit manufacturing method is through the coarsening layer that forms the one deck doping and have the diffusion powder that is used for strengthening light diffusion on the LED base plate for the light that reflects to the coarsening layer is changed light direction of propagation by the coarsening layer, thereby forms each side and gives out light, and light diffusion through relapse can make light at backlight unit cavity misce bene, and then makes backlight unit's the play plain noodles the light brightness and the light-emitting colour more even.

The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims

1. An LED backlight module, comprising:

the LED substrate is provided with a bonding pad;

the Mini LED chip is arranged on the bonding pad;

the coarsening layer is arranged above the LED substrate and comprises a silica gel layer doped with diffusion powder, and the concentration of the diffusion powder in the silica gel layer is 0.1-5%;

and the light guide plate is arranged above the coarsening layer.

2. The LED backlight module of claim 1, wherein the roughened layer has a thickness of 10 μm to 100 μm.

3. The LED backlight module of claim 1, wherein the LED substrate comprises any one of: FR-4 substrate, BT substrate and aluminum substrate.

4. The LED backlight module according to claim 1, wherein a solder resist ink layer is disposed between the LED substrate and the roughened layer, the solder resist ink layer covering an upper side of the LED substrate at a portion other than the pad position.

5. The LED backlight module according to claim 1, wherein the package form of the Mini LED chip comprises any one of the following: die, chip scale package, and near chip scale package.

6. The LED backlight module of claim 1, wherein the Mini LED chips are multi-faceted Mini LED chips.

7. The LED backlight module of claim 1, wherein the roughened layer covers all of the LED substrates including the Mini LED chip locations.

8. The LED backlight module according to claim 1, wherein the roughened layer covers the LED substrate except the Mini LED chip.

9. The LED backlight module of claim 4, wherein the solder resist ink layer comprises a solder resist white oil ink layer.

10. The LED backlight module of claim 1, wherein the thickness of the roughened layer is less than the thickness of the Mini LED chips.