CN218241527U - Large-current chip inductor - Google Patents
Large-current chip inductor Download PDFInfo
- Publication number
- CN218241527U CN218241527U CN202221575025.0U CN202221575025U CN218241527U CN 218241527 U CN218241527 U CN 218241527U CN 202221575025 U CN202221575025 U CN 202221575025U CN 218241527 U CN218241527 U CN 218241527U
- Authority
- CN
- China
- Prior art keywords
- heat
- conducting plate
- integral type
- magnetic material
- tablet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Coils Or Transformers For Communication (AREA)
Abstract
The utility model discloses a heavy current paster inductance, including integral type magnetic material and tin-plated flat wire tablet, be equipped with tablet draw-in groove and air gap breach on the integral type magnetic material, tin-plated flat wire tablet card forms two symmetrical paster pins in the lower terminal surface both sides of integral type magnetic material at back both ends in locating the tablet draw-in groove, the upper end of integral type magnetic material is hugged closely and is equipped with heat-conducting plate A, the both sides that lie in tin-plated flat wire tablet same direction on heat-conducting plate A are equipped with two symmetries and hug closely heat-conducting plate B that integral type magnetic material both sides lateral wall set up, the lower extreme of heat-conducting plate B is higher than the upper end setting of tin-plated flat wire tablet slightly, both sides that lie in the perpendicular direction of tin-plated flat wire tablet on heat-conducting plate A are equipped with two symmetries and hug closely heat-conducting plate C that integral type magnetic material both sides lateral wall set up, the lower extreme of heat-conducting plate C is equipped with hugs closely the enhancement pad that integral type magnetic material lower terminal surface set up, the lower terminal surface of enhancement pad sets up with the lower terminal surface parallel and level of paster pin; the utility model has the advantages of the radiating effect is good, welded connection intensity is high.
Description
Technical Field
The utility model belongs to the technical field of the inductor product, concretely relates to heavy current paster inductance.
Background
The large-current surface-mounted inductor has the advantages of small volume and small occupied space, and is very suitable for the miniaturization development requirement of the current electronic product; if the granted announcement number is CN214012700U Chinese utility model patent A heavy current integral patch inductor, including integral type magnetic material and tin-plated flat wire tablet, the integral type magnetic material adopts high saturation current ferrite manganese zinc magnetic material to make, tin-plated flat wire tablet is the integrated into one piece structure that comprises paster pin A, the flat wire coil of the shape of falling U and paster pin B, integral type magnetic material one side is seted up the air gap breach, the bottom of air gap breach is seted up the tablet draw-in groove, two sides below the tablet draw-in groove bottom are symmetrically seted up L-shaped tablet accommodation area A and L-shaped tablet accommodation area B, paster pin A, the flat wire coil of the shape of falling U, paster pin B clamp in L-shaped tablet accommodation area A, tablet draw-in groove, L-shaped tablet accommodation area B; the surface mount device has the advantages of simple and compact structure, small volume and small occupied space, and also has the advantages of convenient assembly, high production efficiency, capability of reducing the production cost and effectively improving the temperature rise current, the saturation current and the working stability of the surface mount device inductor; however, because the inductor can continuously generate a large amount of heat under a large-current working state, the existing structure does not fully consider heat dissipation, and the problems of long service time, overhigh temperature of the inductor and poor working stability exist; in order to solve the above problems, it is necessary to develop a high-current chip inductor.
SUMMERY OF THE UTILITY MODEL
The utility model aims at overcoming the not enough of prior art, and provide a great current paster inductance that the radiating effect is good, welding connection intensity is high.
The purpose of the utility model is realized like this: the utility model provides a large current paster inductance, includes integral type magnetism material and tin-plating flat line tablet, be equipped with tablet draw-in groove and air gap breach on the integral type magnetism material, tin-plating flat line tablet card is located back both ends are hugged closely in proper order in the integral type magnetism material go up and in the lower terminal surface both sides of integral type magnetism material form the paster pin of two symmetries, be equipped with heat-conducting plate A is hugged closely to the upper end of integral type magnetism material, lie in on the heat-conducting plate A both sides on the same side of tin-plating flat line tablet are equipped with two symmetries and hug closely the heat-conducting plate B that integral type magnetism material both sides lateral wall set up, heat-conducting plate B's lower extreme is higher than slightly the upper end setting of tin-plating flat line tablet, lie in on the heat-conducting plate A both sides on the tin-plating flat line tablet vertical direction are equipped with two symmetries and hug closely the heat-conducting plate C that integral type magnetism material both sides lateral wall set up, heat-conducting plate C's lower extreme is equipped with hugs enhancement pad, two the lower terminal surface and two of enhancement pad the lower terminal surface parallel and level of paster pin sets up.
Preferably, the heat-conducting plate A, the two heat-conducting plates B, the two heat-conducting plates C and the two reinforcing welding plates are of an integrated structure.
Preferably, a groove A matched with the heat-conducting plate A is formed in the position, located on the heat-conducting plate A, of the integrated magnetic material.
Preferably, a groove B matched with the heat-conducting plate B is formed in the position, located on the heat-conducting plate B, of the integrated magnetic material.
Preferably, a groove C matched with the heat-conducting plate C is formed in the position, located on the heat-conducting plate C, of the integrated magnetic material.
Preferably, the integrated magnetic material is provided with grooves D matched with the reinforcing bonding pads at the positions of the two reinforcing bonding pads.
Preferably, the heat conducting plate a is a cross structure.
Further preferably, the width of the edge of the cross-shaped structure, the heat conducting plate B and the heat conducting plate C are arranged in the same width.
Owing to adopted above technical scheme, the beneficial effects of the utility model are that: the utility model discloses on the basis of current structure, adopt the mode of increasing the heat conduction passageway on integral type magnetism material surface, the heat conduction passageway comprises heat-conducting plate A, heat-conducting plate C and enhancement pad, through the heat conduction passageway that increases, distribute around after effectively carrying out the drainage in time with the heat of each department on integral type magnetism material surface, prevent that the heat from piling up locally, cause the inductor temperature high, influence its job stabilization nature; the utility model discloses a strengthen the pad, strengthen the pad and the paster pin of inductor together during the use, weld on the circuit board, when designing for strengthen the pad and lie in the welding point on the circuit board and link to each other with the ground of circuit board, the heat of inductor can also distribute away in time through strengthening the pad and the large tracts of land ground connection on the circuit board, further improve the radiating effect of inductor self, two newly-increased strengthen pads still help more firmly connecting the inductor on the circuit board through the welding simultaneously; always, the utility model has the advantages of the radiating effect is good, welded connection intensity is high.
Drawings
Fig. 1 is a schematic view of the structure of the present invention.
Fig. 2 is a schematic diagram of the right-side view structure of the present invention.
Fig. 3 is a schematic top view of the present invention.
Fig. 4 is a schematic bottom view of the present invention.
Fig. 5 is a schematic perspective view of the heat conducting plate a, two heat conducting plates B, two heat conducting plates C and two reinforced pads of the integrated structure before assembly.
Fig. 6 is a schematic perspective view of the assembled heat conducting plate a, two heat conducting plates B, two heat conducting plates C and two reinforcing pads of the integrated structure of the present invention.
In the figure: 1. integral type magnetism material 2, tablet draw-in groove 3, tin-plated flat wire tablet 4, heat-conducting plate C5, strengthen pad 6, paster pin 7, air gap breach 8, heat-conducting plate B9, recess B10, heat-conducting plate A11, recess C12, recess A13, recess D14, pre-crease.
Detailed Description
The technical scheme of the utility model is further explained in detail with the attached drawings.
As shown in fig. 1, fig. 2, fig. 3 and fig. 4, the utility model provides a large current chip inductor, including integral type magnetic material 1 and tin-plated flat wire tablet 3, be equipped with tablet draw-in groove 2 and air gap breach 7 on the integral type magnetic material 1, tin-plated flat wire tablet 3 card is located in tablet draw-in groove 2 back both ends hug closely in proper order and buckle on integral type magnetic material 1 and form the chip pin 6 of two symmetries in integral type magnetic material 1's lower terminal surface both sides. This is the prior art and will not be described herein.
Be equipped with heat-conducting plate A10 is hugged closely to integral type magnetic material 1's upper end, lie in the heat-conducting plate B8 that the same ascending both sides of 3 same sides of tinned flat wire tablets were equipped with two symmetries and hug closely 1 both sides lateral wall of integral type magnetic material set up on the heat-conducting plate A10, the lower extreme of heat-conducting plate B8 is higher than the upper end setting of tinned flat wire tablets 3 slightly, lie in the both sides on 3 vertical direction of tinned flat wire tablets on the heat-conducting plate A10 and be equipped with two symmetries and hug closely the heat-conducting plate C4 that 1 both sides lateral wall of integral type magnetic material set up, heat-conducting plate C4's lower extreme is equipped with the enhancement pad 5 of hugging closely 1 lower terminal surface setting of integral type magnetic material. Specifically, a heat conduction channel is formed by the heat conduction plate A10, the heat conduction plate B8, the heat conduction plate C4 and the reinforcing bonding pad 5, so that heat on the surface of the integrated magnetic material 1 can be conducted and transferred from a high temperature position to a low temperature position, and local accumulation of heat to cause overhigh local temperature of the inductor is prevented.
The lower terminal surface parallel and level setting of two lower terminal surfaces that strengthen pad 5 and two paster pins 6 makes things convenient for the whole welded connection of inductor and circuit board, guarantees that four welding points all connect fully, and joint strength is high.
Preferably, heat-conducting plate A10, two heat-conducting plates B8, two heat-conducting plates C4 and two strengthen pad 5 formula structures as an organic whole, make things convenient for follow-up production.
In specific implementation, as shown in fig. 5 and 6, for convenience of assembly, the heat conducting plate C and the reinforcing pad 5 on one side are pre-processed into a linear shape before assembly, a pre-folding mark 16 is cut at a bending position between the reinforcing pad 5 and the heat conducting plate C4 on the side, and after the integrated structure is clamped into the manufactured inductor, the reinforcing pad 5 on the side is bent inwards to be tightly attached to the lower end face of the integrated magnetic material 1 through the pre-folding mark 16.
Preferably, the position department that lies in heat-conducting plate A10 on the integral type magnetism material 1 is equipped with the recess A12 that matches heat-conducting plate A10 and sets up, the position department that lies in heat-conducting plate B8 on the integral type magnetism material 1 is equipped with the recess B9 that matches heat-conducting plate B8 and sets up, the position department that lies in heat-conducting plate C4 on the integral type magnetism material 1 is equipped with the recess C11 that matches heat-conducting plate C4 and sets up, the position department that lies in two enhancement pads 5 on the integral type magnetism material 1 is equipped with the recess D13 that matches the setting of enhancement pad 5 respectively. Specifically, the groove a12, the groove B9, the groove C11, and the groove D13, which are respectively and correspondingly disposed, are used for facilitating the assembly positions of the heat-conducting plate a10, the two heat-conducting plates B8, the two heat-conducting plates C4, and the two reinforcing pads 5 of the later-stage integrated structure to be accurately and quickly in place.
During specific implementation, the groove A12, the groove B9, the groove C11 and the groove D13 are integrally formed on the integrated magnetic material 1 by modifying the existing mold in the manufacturing process of the integrated magnetic material 1.
Preferably, the heat conducting plate A10 is of a cross-shaped structure, is light and saves materials.
Further preferably, the edge width of the cross-shaped structure, the heat conduction plate B8, the heat conduction plate C4 and the reinforcing bonding pad 5 are arranged in the same width, and the manufacturing is convenient.
Accomplish above-mentioned installation back, can the utility model discloses the input is used, at first adopts prior art to make the inductor of compriseing integral type magnetism material 1 and tin-plated flat line material 3, then with heat-conducting plate A10, two heat-conducting plates B8, two heat-conducting plates C4 and two enhancement pads 5 of integral type structure from one side card of inductor on the inductor is surperficial, then through in advance crease 14 with corresponding enhancement pad 5 buckle on the lower terminal surface of integral type magnetism material 1 of inductor can.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.
Claims (8)
1. The utility model provides a large current paster inductance, includes integral type magnetism material and tin-plating flat line tablet, be equipped with tablet draw-in groove and air gap breach on the integral type magnetism material, tin-plating flat line tablet card is located back both ends in the tablet draw-in groove hug closely in proper order buckle in on the integral type magnetism material and in the lower terminal surface both sides of integral type magnetism material form the paster pin of two symmetries, its characterized in that: be equipped with heat-conducting plate A is hugged closely to the upper end of integral type magnetism material, lie in on the heat-conducting plate A both sides on the same side of tin-plating flat line tablet are equipped with two symmetries and hug closely heat-conducting plate B that integral type magnetism material both sides lateral wall set up, heat-conducting plate B's lower extreme is higher than a little the upper end setting of tin-plating flat line tablet, heat-conducting plate A is last to be located both sides on the tin-plating flat line tablet vertical direction are equipped with two symmetries and hug closely the heat-conducting plate C that integral type magnetism material both sides lateral wall set up, heat-conducting plate C's lower extreme is equipped with hugs closely the enhancement pad that the terminal surface set up under the integral type magnetism material, two strengthen the lower terminal surface and two of pad the lower terminal surface parallel and level setting of paster pin.
2. The high-current patch inductor according to claim 1, wherein: the heat-conducting plate A, two heat-conducting plates B, two heat-conducting plates C and two strengthen the pad formula structure as an organic whole.
3. The high current patch inductor of claim 1, wherein: and a groove A matched with the heat-conducting plate A is arranged at the position of the heat-conducting plate A on the integrated magnetic material.
4. The high current patch inductor of claim 1, wherein: and a groove B matched with the heat-conducting plate B is arranged at the position of the heat-conducting plate B on the integrated magnetic material.
5. The high-current patch inductor according to claim 1, wherein: and a groove C matched with the heat-conducting plate C is arranged at the position of the heat-conducting plate C on the integrated magnetic material.
6. The high-current patch inductor according to claim 1, wherein: and grooves D matched with the reinforcing bonding pads are respectively arranged at the positions of the two reinforcing bonding pads on the integrated magnetic material.
7. The high-current patch inductor according to claim 1, wherein: the heat conducting plate A is of a cross structure.
8. The high current patch inductor of claim 7, wherein: the edge width of the cross-shaped structure, the heat conduction plate B, the heat conduction plate C and the reinforcing welding disc are arranged in the same width.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221575025.0U CN218241527U (en) | 2022-06-23 | 2022-06-23 | Large-current chip inductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221575025.0U CN218241527U (en) | 2022-06-23 | 2022-06-23 | Large-current chip inductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218241527U true CN218241527U (en) | 2023-01-06 |
Family
ID=84673883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221575025.0U Active CN218241527U (en) | 2022-06-23 | 2022-06-23 | Large-current chip inductor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218241527U (en) |
-
2022
- 2022-06-23 CN CN202221575025.0U patent/CN218241527U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10856417B2 (en) | Power supply module used in a smart terminal and power supply module assembly structure | |
| CN106160412B (en) | The energy conversion device of power module and the application power module | |
| KR102041645B1 (en) | Power semiconductor module | |
| CN205985686U (en) | Electric connector subassembly and carrier thereof | |
| TW201644027A (en) | Vertically connected power module and stacked and connected pins thereof | |
| CN101980589B (en) | Method for manufacturing power module circuit board, power module and magnetic core of power module | |
| CN218241527U (en) | Large-current chip inductor | |
| CN204793295U (en) | Slim power module | |
| CN111064344A (en) | Power module with bottom metal heat dissipation substrate | |
| CN201796690U (en) | Manganese zinc ferrite magnetic core for power supply transformer | |
| CN217061714U (en) | Planar transformer | |
| CN112259517A (en) | Photovoltaic module bypass element soldering lug, bypass protection element module and junction box | |
| CN217426721U (en) | Semiconductor integrated circuit packaging structure | |
| CN206697313U (en) | A kind of inductance | |
| CN211181922U (en) | Vertical double-sheet assembled inductor | |
| CN211295085U (en) | Multi-chip series connection packaging structure | |
| CN219163126U (en) | Vertical type combined inductor | |
| CN221329210U (en) | Rectifier bridge circuit board stacking structure | |
| CN216016703U (en) | Module power supply radiating through circuit board | |
| CN202514159U (en) | Circuit board with accurate welding component and function of restraining peak voltage | |
| CN221766757U (en) | Power single tube, power module and electronic equipment | |
| CN213818327U (en) | Circuit board based on auxiliary heat dissipation of inserted sheet | |
| CN216626232U (en) | Plate-level inductive element and radiating fin makeup type bonding device | |
| CN218274582U (en) | Miniature bridge rectifier and rectifier frame | |
| CN220155343U (en) | Coupling inductance and power supply with low coupling coefficient |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |