CN216626232U

CN216626232U - Plate-level inductive element and radiating fin makeup type bonding device

Info

Publication number: CN216626232U
Application number: CN202122759897.4U
Authority: CN
Inventors: 黄国平; 罗浩; 蒋攀峰; 温丽; 王多笑
Original assignee: CETC 43 Research Institute
Current assignee: CETC 43 Research Institute
Priority date: 2021-11-10
Filing date: 2021-11-10
Publication date: 2022-05-27
Anticipated expiration: 2031-11-10

Abstract

The utility model discloses a makeup type bonding device for a board-level inductive element and a radiating fin in the field of PCBA, which comprises a base and a pressing device on the base, wherein at least one groove is formed in the surface of the base, a lower board-level magnetic core and the PCBA are sequentially placed in the groove from bottom to top, a slotted hole for extending a magnetic column of the lower board-level magnetic core is formed in the surface of the PCBA, bonding glue is coated on the corresponding position of the upper surface of the PCBA and the radiating fin and on the surface of the magnetic column, and the radiating fin and the upper board-level magnetic core are connected above the PCBA through the bonding glue and are fixed through the pressing device in a pressing mode. The bonding method is extremely convenient, the bonding quality is excellent, the bonding effect of the PCBA, the board-level magnetic core and the radiating fins is ensured, and the inferior quality of products is reduced.

Description

Plate-level inductive element and radiating fin makeup type bonding device

Technical Field

The utility model relates to the field of PCBAs, in particular to a makeup type bonding device for a board-level inductive element and a radiating fin.

Background

At present, a single PCBA integrates all electronic circuits, and the product has high power and high heat dissipation requirements, so that the number of highly integrated board-level magnetic cores is large, and meanwhile, the number of heat radiating fins on the product is also large. At present, the mode of firstly bonding a plate-level magnetic core and then bonding radiating fins is generally adopted, so that the bonding efficiency is low, and the overall production efficiency of products is influenced. And poor bonding of the plate-level magnetic core can lead to the cracking failure of the plate-level magnetic core of the product, and poor bonding of the radiating fins can lead to poor radiating failure of the product, thereby affecting the bonding quality of the product.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to a plate-type bonding apparatus for plate-level inductive components and heat dissipation fins, which solves the above-mentioned problems in the prior art.

In order to achieve the purpose, the utility model provides the following technical scheme:

the utility model provides a makeup formula bonding device of board level inductive element and fin, includes the compression fittings on base and the base, at least one recess has been seted up on the base surface, lower board level magnetic core, PCBA have been placed in proper order from the bottom up in the recess, the slotted hole that the magnetic column that supplies lower board level magnetic core stretches out is seted up on the PCBA surface, the PCBA upper surface all coats with the bonding glue with the corresponding position and the magnetic column surface of fin, and fin and upper plate level magnetic core pass through bonding glue and connect in the PCBA top to it is fixed through the compression fittings crimping.

As an improved scheme of the utility model, the edge part of the upper surface of the base extends upwards to form a buckle, the pressing device comprises a cover plate, and the surface of the cover plate is provided with a clamping groove used for being locked with the buckle.

As the improvement scheme of the utility model, a pressing plate is also arranged below the cover plate.

As an improved scheme of the utility model, a spring column is pressed between the cover plate and the pressure plate.

Has the advantages that: the upper-plate-level magnetic core and the radiating fins are simultaneously placed on the PCBA and are respectively bonded with the lower-plate-level magnetic core and the PCBA, and the bonding is further firm through the pressing device, so that the bonding quality and the bonding efficiency are improved.

Drawings

FIG. 1 is an overall block diagram of the present invention;

fig. 2 is a schematic structural view of the cover plate of the present invention when pressed.

In the figure: 1-cover plate; 2-pressing a plate; 3-PCBA; 4-a base; 5-buckling; 6-groove; 7-a clamping groove; 8-through holes.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Embodiment 1, as shown in fig. 1, an assembling type bonding apparatus for a board-level inductive element and a heat sink includes a base 4 and a pressing device on the base 4. The surface of the base 4 is provided with at least one groove 6, the number of the grooves 6 is two in the figure, and in other embodiments, the number of the grooves 6 is not limited and is determined according to actual requirements. The shape of the recess 6 matches the profile of the lower stage core, PCBA 3. When the magnetic pole bracket is used, the lower-plate-level magnetic core is placed in the groove 6, the PCBA3 is placed above the lower-plate-level magnetic core, and the surface of the PCBA3 is provided with a slotted hole for the magnetic pole of the lower-plate-level magnetic core to extend out. And adhesive glue is coated on the upper surfaces of the magnetic column and the PCBA3 corresponding to the radiating fins, an upper board-level magnetic core is placed above the magnetic column in no sequence, the radiating fins are placed on the corresponding positions of the upper surface of the PCBA3, and then the upper board-level magnetic core and the lower board-level magnetic core, and the PCBA3 and the radiating fins are simultaneously and firmly adhered together through a pressing device.

When the upper board-level magnetic core, the lower board-level magnetic core, the PCBA3 and the radiating fins in the grooves 6 are simultaneously pressed and bonded, the bonding efficiency is greatly improved, and the bonding is firmer due to the pressing device, so that the bonding efficiency is also improved.

Embodiment 2, compression fittings includes apron 1, and the upper surface edge portion of base 4 upwards extends has buckle 5, and apron 1 surface is equipped with the draw-in groove 7 that is used for locking with buckle 5. Therefore, when pressing, the cover plate 1 and the buckle 5 are fastened, and the upper plate-level magnetic core and the radiating fins can be pressed down. Preferably, a pressing plate 2 can be arranged below the cover plate 1, a through hole 8 for the protrusion part of the upper plate-level magnetic core of the PCBA3 to pass through is formed in the surface of the pressing plate 2, and a spring column is pressed between the cover plate 1 and the pressing plate 2. When the cover plate 1 is locked with the buckle 5 through the clamping groove 7, the cover plate 1 is fixed on a combination body of the pressing plate 2 and the base 4, and the pressing plate 2 is tightly adhered to the upper-plate-level magnetic core and the radiating fins through elasticity generated by the spring columns, so that the upper-plate-level magnetic core and the lower-plate-level magnetic core are more firmly adhered to each other, and the radiating fins and the PCBA3 are more firmly adhered to each other.

In other embodiments, compression fittings also can adopt deformation mechanism like cylinder, electric putter etc. to go up and down the operation, with apron 1 pressfitting to base 4 on, realize the effect of pressfitting, consequently compression fittings's concrete structure is not limited, owing to get its simple structure, convenient operation, the 5 draw-in grooves 7 structures of buckle are chooseed for use here.

The bonding method is extremely convenient, the bonding quality is excellent, the bonding effect of the PCBA3, the board-level magnetic core and the radiating fins is ensured, and the inferior quality of products is reduced.

Although the present description is described in terms of embodiments, not every embodiment includes only a single embodiment, and such description is for clarity only, and those skilled in the art should be able to integrate the description as a whole, and the embodiments can be appropriately combined to form other embodiments as will be understood by those skilled in the art.

Therefore, the above description is only a preferred embodiment of the present application, and is not intended to limit the scope of the present application; all changes which come within the meaning and range of equivalency of the claims are to be embraced within their scope.

Claims

1. The utility model provides a makeup formula bonding device of board level inductive element and fin, its characterized in that, includes the compression fittings on base and the base, at least one recess has been seted up on the base surface, lower board level magnetic core, PCBA have been placed in proper order from the bottom up in the recess, the slotted hole that the magnetic column that supplies lower board level magnetic core stretches out is seted up on the PCBA surface, the PCBA upper surface has all coated the adhesive cement with the corresponding position and the magnetic column surface of fin, and fin and upper plate level magnetic core pass through the adhesive cement and connect in the PCBA top to it is fixed through the compression fittings crimping.

2. The apparatus for splicing a board-level inductive component and a heat sink according to claim 1, wherein a clip extends upward from an edge portion of the upper surface of the base, the pressing means includes a cover plate, and a slot is formed on a surface of the cover plate for locking with the clip.

3. The apparatus according to claim 2, wherein a pressing plate is further disposed under the cover plate, and a through hole is formed on the pressing plate corresponding to the protruding portion of the upper plate-level magnetic core.

4. The apparatus of claim 3, wherein a spring column is pressed between the cover plate and the pressing plate.