CN218227889U - Hot bed subassembly, print platform and 3D printing apparatus - Google Patents

Hot bed subassembly, print platform and 3D printing apparatus Download PDF

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Publication number
CN218227889U
CN218227889U CN202221579595.7U CN202221579595U CN218227889U CN 218227889 U CN218227889 U CN 218227889U CN 202221579595 U CN202221579595 U CN 202221579595U CN 218227889 U CN218227889 U CN 218227889U
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plate
magnetic plate
assembly
printing
bed assembly
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CN202221579595.7U
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Chinese (zh)
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黄立涛
魏国列
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Shenzhen Anycubic Technology Co Ltd
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Shenzhen Anycubic Technology Co Ltd
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Abstract

The utility model provides a hot bed subassembly, print platform and 3D printing apparatus. Wherein, the hot bed subassembly is used for 3D printing apparatus's print platform, the hot bed subassembly includes: the magnetic plate is used for being connected with a flexible plate of the printing platform in an adsorption mode, and the flexible plate is used for bearing a model printed by the 3D printing equipment; and the heating circuit is connected with the magnetic plate and used for heating the magnetic plate. Therefore, the utility model provides an among the hot bed subassembly, the produced heat of heating circuit can directly transmit the magnetic sheet on, can reduce the thermal damage of hot bed subassembly transmission, improves heating efficiency.

Description

Hot bed subassembly, print platform and 3D printing apparatus
Technical Field
The utility model belongs to the technical field of three-dimensional printing equipment technique and specifically relates to a hot bed subassembly, print platform and 3D printing apparatus are related to.
Background
A 3D printer, also called a three-dimensional 3D printer (3 DP), is a machine that is an additive manufacturing technique, i.e., a rapid prototyping technique. In order to enable the printing model to be fixed on the printing platform, the printing platform generally comprises a bearing plate and an aluminum hot plate, and the aluminum hot plate heats the bearing plate to enable the model to be adhered to the bearing plate; further, in order to make the mold easier to remove from the receiving plate, the receiving plate in the prior art is usually made of spring steel, and a magnetic plate is added between the receiving plate and the aluminothermic plate, and the magnetic plate attracts the receiving plate by using its own magnetism.
However, the above-mentioned solution has a problem that the heat generated in the aluminothermic plate is transferred to the magnetic plate and then transferred to the receiving plate by the magnetic plate, so that the magnetic plate absorbs part of the heat, and thus the heating efficiency of the spring steel is low.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model provides a hot bed subassembly, print platform and 3D printing apparatus can improve hot bed subassembly transmission thermal efficiency, and then improves heating efficiency.
The embodiment of the first aspect of the utility model provides a hot bed subassembly for 3D printing apparatus's print platform, hot bed subassembly includes: the magnetic plate is used for being in adsorption connection with a flexible plate of the printing platform, and the flexible plate is used for bearing a model printed by 3D printing equipment; and the heating circuit is connected with the magnetic plate and is used for heating the magnetic plate.
Further, the heating circuit is etched on the magnetic plate.
Further, the heating circuit comprises wires, the distance between adjacent wires is greater than or equal to 0.5mm, and the width of the wires increases with the increase of the heating power.
Further, the hot bed assembly further comprises a temperature sensor for monitoring the temperature of the magnetic plate; wherein, the temperature sensor contacts with the magnetic plate surface and is arranged at the central position of the lead.
Further, the hot bed assembly further comprises a protective layer, and the protective layer is used for wrapping the magnetic plate, the heating circuit and the temperature sensor.
The embodiment of the utility model provides a print platform is applied to 3D printing apparatus, and print platform includes: a flexible board; and the thermal bed assembly of any one of the first aspect, for adsorptive connection with the flexible sheet.
Furthermore, the printing platform also comprises a first supporting plate made of low heat conduction material, and the first supporting plate and the flexible plate are respectively positioned at two opposite sides of the hot bed assembly; wherein the protective layer provided on the side of the hot bed assembly opposite to the first support plate has an adhesive property for fixing the hot bed assembly on the first support plate.
Furthermore, the printing platform also comprises a heat insulation piece, wherein the heat insulation piece is connected with the first supporting plate and is used for insulating the heat bed assembly; the heat preservation piece and the hot bed component are respectively positioned at two opposite sides of the first supporting plate.
Further, the printing platform also comprises a second support plate, a wheel set and a connecting piece; the connecting piece connects hotbed subassembly, first backup pad and heat preservation piece in one side of second backup pad, and the wheelset is connected in the opposite side of second backup pad.
An embodiment of a third aspect of the present invention provides a 3D printing apparatus, comprising a driving assembly and a printing platform of any one of the second aspect; the driving assembly comprises a driving motor and a driving belt, the driving belt is connected with the second supporting plate of the printing platform, and the driving motor is used for driving the driving belt to move so as to drive the printing platform to move.
The embodiment of the utility model provides a hot bed subassembly, print platform and 3D printing apparatus, hot bed subassembly include heating circuit and magnetic sheet, connect heating circuit on the magnetic sheet, and the produced heat of heating circuit can directly transmit the magnetic sheet on, because the magnetic sheet has good magnetism nature of inhaling, can adsorb the flexbile plate on the magnetic sheet reliably. Compared with the prior art, the produced heat of heating circuit has just been conveyed on the flexbile plate through the magnetic sheet in this scheme, and the produced heat of heating circuit can only be transmitted on the flexbile plate through aluminium hot plate and magnetic sheet in the correlation technique, it is thus visible, the hotbed subassembly structure of this scheme is simpler, manufacturing cost is reduced, and simultaneously, owing to reduced aluminium hot plate, and the magnetic sheet has good heat conductivity, calorific loss has been reduced, thermal utilization ratio has been improved, and then hotbed subassembly transmission thermal efficiency has been improved, and heating efficiency is improved.
The above description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented according to the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more obvious and understandable, the following detailed description of the present invention is given.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to refer to like parts throughout the drawings. Wherein:
fig. 1 is a schematic view illustrating a perspective structure of a printing apparatus according to an embodiment of the present invention;
FIG. 2 shows another view structural schematic of the embodiment of FIG. 1;
fig. 3 is a schematic view illustrating a perspective structure of a printing platform according to an embodiment of the present invention;
FIG. 4 shows another view structural diagram of the embodiment of FIG. 3;
fig. 5 is an exploded view of a perspective of a printing platform provided by an embodiment of the present invention;
FIG. 6 is an exploded view of another perspective of the embodiment of FIG. 5;
fig. 7 shows a schematic structural diagram of a flexible board provided by an embodiment of the present invention;
fig. 8 is a schematic structural diagram of a second supporting plate provided by an embodiment of the present invention;
fig. 9 is a schematic structural diagram of a hot bed assembly provided by an embodiment of the present invention;
fig. 10 is a schematic structural diagram of a first support plate provided in an embodiment of the present invention;
fig. 11 shows a schematic structural diagram of the heat preservation member provided by the embodiment of the present invention.
Wherein, the correspondence between the reference numbers and the part names in fig. 1 to 11 is:
100 thermal bed components, 110 magnetic plates, 120 heating circuits, 121 leads, 122 temperature sensors, 130 protective layers, 131 first protective layers, 132 second protective layers, 200 printing platforms, 210 flexible plates, 220 first supporting plates, 230 heat preservation pieces, 240 first connecting holes, 250 second supporting plates, 251 second connecting holes, 252 concentric wheel holes, 253 eccentric wheel holes, 260 wheel sets, 261 concentric wheel components, 262 eccentric wheel components, 270 connecting pieces, 280 supporting columns, 300 printing equipment and 310 base components.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention more clearly understood, the present invention will be described in further detail with reference to the accompanying drawings and detailed description. It should be noted that the embodiments and features of the embodiments of the present invention may be combined with each other without conflict.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and therefore the scope of the present invention is not limited by the specific embodiments disclosed below.
The following describes the hot bed assembly 100, the printing platform 200 and the 3D printing apparatus 300 provided according to some embodiments of the present invention with reference to fig. 1 to 11, wherein the hot bed assembly 100 is applied to the printing platform 200, and the printing platform 200 is applied to the 3D printing apparatus 300,3D, and the printing apparatus 300 can be a hot melt lamination type 3D printer or other 3D printers satisfying the requirement.
Specifically, as shown in fig. 1 and 2, the 3D printing apparatus 300 further includes a base assembly 310, the printing platform 200 is disposed on the base assembly 310 and can move horizontally relative to the base assembly 310, the printing platform 200 is used for carrying a printing model, and the heat bed assembly 100 is used for slowing down the edge cooling speed of the printing material to reduce the possibility of edge warping of the printing model.
As shown in fig. 3, fig. 4, fig. 5, fig. 6, fig. 7, and fig. 9, the thermal bed assembly 100 provided in an embodiment of the present invention is a printing platform 200 for a 3D printing apparatus 300, where the thermal bed assembly 100 includes: the magnetic plate 110, the magnetic plate 110 is connected with the flexible plate 210 of the printing platform 200 in an adsorption manner, and the flexible plate 210 is used for receiving the model printed by the 3D printing device 300; and the heating circuit 120 is connected with the magnetic plate 110 and used for heating the magnetic plate 110.
The magnetic plate 110 may be a rubber magnetic plate or other material meeting the requirement, the heating circuit 120 is connected to the magnetic plate 110 for heating the magnetic plate 110, and the magnetic plate 110 has good magnetism and thermal conductivity. The flexible plate 210 is a deformable spring steel plate, the flexible plate 210 is detachably connected with the magnetic plate 110 and is used for directly contacting with a printing model, when the printing of the model is completed, the flexible plate 210 is detached from the magnetic plate 110, and the flexible plate 210 is bent, so that the printing model can be separated from the flexible plate 210. It can be understood that the magnetic plate 110 can be reliably attached to the spring steel plate by using magnetism, and further, the heat generated by the operation of the heating circuit 120 is directly transferred to the flexible plate 210 through the magnetic plate 110, so as to avoid the possibility of edge warping of the mold on the flexible plate 210. It can be appreciated that the spring steel plate can be rapidly separated from the magnetic plate 110 by an external force. The spring steel plate has good bending performance so as to improve the separation efficiency of the printing model and the spring steel plate.
The magnetic plate 110 includes a first surface and a second surface, the first surface of the magnetic plate 110 is a surface facing the flexible plate 210, that is, the first surface of the magnetic plate 110 can be attached to the flexible plate 210, and the second surface of the magnetic plate 110 is opposite to the first surface, specifically, the first surface of the magnetic plate 110 is shown in a direction of an arrow a in fig. 5, and the second surface of the magnetic plate 110 is shown in a direction of an arrow B in fig. 5.
The embodiment of the utility model provides a hot bed subassembly 100, connect heating circuit 120 on magnetic plate 110, the produced heat of heating circuit 120 can directly transmit magnetic plate 110, because magnetic plate 110 has good magnetism nature, can adsorb flexible sheet 210 on magnetic plate 110 reliably, compare with the correlation technique, the produced heat of heating circuit 120 has just been conveyed to flexible sheet 210 through magnetic plate 110 in this scheme, and the produced heat of heating circuit will just can transmit to the flexible sheet through aluminium hot plate and magnetic sheet in the correlation technique. Therefore, the hot bed assembly 100 of the scheme is simpler in structure, the manufacturing cost is reduced, and meanwhile, due to the fact that the aluminum hot plates are reduced, the magnetic plate 110 has good heat conductivity, heat loss is reduced, the heat utilization rate is improved, the heat transmission efficiency of the hot bed assembly 100 is improved, and the heating efficiency is improved.
In the embodiment of the present application, the heating circuit 120 is etched on the magnetic plate 110, and the heating circuit 120 includes a conductive wire 121, and the conductive wire 121 is made of a metal having a good electrical conductivity, such as copper. It is understood that the wire 121 is directly etched onto the magnetic plate 110, i.e., the wire 121 is directly contacted with the magnetic plate 110, so that the heat generated by the wire 121 is directly transferred to the magnetic plate 110, and then the magnetic plate 110 transfers the heat to the flexible plate 210. Through the embodiment, it can be known that the heating circuit 120 can directly contact the magnetic plate 110, and therefore, the heat generated by the heating circuit 120 can be directly transferred to the magnetic plate 110, thereby further reducing the heat loss.
In some possible embodiments of the present invention, as shown in fig. 9, the heating circuit 120 includes wires 121, a distance between adjacent wires 121 is greater than or equal to 0.5mm, and a width of the wires 121 increases with an increase in heating power. Wherein, the distance between the adjacent wires 121 can be 0.5mm, 0.6mm, 0.8mm, 1.0mm or other numerical values meeting the requirements, and through reasonably setting the distance between the adjacent wires 121, the etched wires 121 are fully distributed on the magnetic plate 110, so that the hot bed assembly 100 can achieve good heat conduction uniformity, and good heat transfer efficiency is ensured.
The width of the conductive wires 121 increases with the increase of the heating power, that is, the larger the heating power is, the larger the width of the conductive wires 121 is, the distance between adjacent conductive wires 121 can be reasonably set, and the reasonable line width of the conductive wires 121 is matched, so as to ensure good thermal conductivity. The line width of the conductive wires 121 can be determined according to the magnitude of the heating power, and the conductive wires 121 etched with the larger heating power are relatively wider, so long as the etched conductive wires 121 are fully distributed on the magnetic plate 110, and the distance between adjacent conductive wires 121 is kept at 0.5mm, or more than 0.5mm, which can meet the requirement of uniform heat conduction of the heat bed assembly 100. Specifically, the conductive wires 121 may be copper wires or other materials meeting the requirement.
In some possible embodiments of the present invention, the thermal bed assembly 100 further comprises a temperature sensor 122, the temperature sensor 122 is used for monitoring the temperature of the magnetic plate 110; the temperature sensor 122 is in surface contact with the magnetic plate 110 and is disposed at the center of the area surrounded by the wires 121.
In the above embodiment, the temperature sensor 122 is arranged to monitor the temperature of the magnetic plate 110, and meanwhile, the temperature sensor is connected to the control device of the printing platform 200, so that the control device can adjust the heating circuit 120 according to the detection information of the temperature sensor to make the flexible plate at a proper temperature, thereby avoiding that the model on the flexible plate 210 cannot be tightly adhered due to too low temperature of the heating circuit 120; meanwhile, the situation that the printing consumables on the flexible board 210 are in a molten state and cannot be molded due to the overhigh temperature of the heating circuit 120 can also be avoided.
The temperature sensor 122 is in surface contact with the magnetic plate 110, so that the contact area between the temperature sensor 122 and the magnetic plate 110 is increased, and the temperature measurement accuracy of the temperature sensor 122 is improved. Meanwhile, the temperature sensor 122 is arranged at the central position of the area surrounded by the wires 121, because the heating circuit 120 is usually formed by winding the wires 121 one turn by one turn, each turn of the wires 121 can be rectangular, circular or other patterns meeting requirements, the temperature of the magnetic plate 110 corresponding to the central position of the wires 121 is relatively uniform, and the temperature of the magnetic plate 110 can be relatively accurately reflected, the temperature difference of the magnetic plate 110 corresponding to the edge position of the wires 121 is relatively large, and the temperature of the magnetic plate 110 cannot be accurately reflected, therefore, the temperature sensor is arranged at the central position of the wires 121, that is, the temperature sensor is arranged at the central position of the inner turn of the wires 121, which is beneficial to improving the uniformity and accuracy of temperature measurement of the temperature sensor.
Specifically, the temperature sensor 122 may be a thermistor, and the thermistor is connected to a main control circuit of the 3D printing apparatus through a wire 121, and the thermistor is used to detect the real-time heating temperature of the magnetic plate 110, so as to achieve the temperature adjustment function. Specifically, the thermistor may be a PTC (Positive Temperature Coefficient thermistor) or an NTC (Negative Temperature Coefficient thermistor), or other Temperature measurement structure that meets the requirements.
The lead 121 is wound around the temperature sensor 122, and the temperature sensor 122 is located at the center of the lead 121 of the heating circuit 120, which is beneficial to improving the uniformity and accuracy of temperature measurement of the thermistor installed at the center of the area surrounded by the installation lead 121.
In some possible embodiments, as shown in fig. 9, the thermal bed assembly 100 further includes a protective layer 130, and the protective layer 130 is used to wrap the magnetic plate 110, the heating circuit 120 and the temperature sensor.
The protective layer 130 protects the magnetic plate 110, the heating circuit 120 and the temperature sensor well, and the heating circuit 120 and the temperature sensor can be reliably wrapped on the magnetic plate 110, so that the reliability and stability of the connection between the heating circuit 120 and the magnetic plate 110 and the connection between the temperature sensor and the magnetic plate 120 are improved.
Specifically, the protective layer 130 may be wrapped around the entire circumference of the magnetic plate 110 and the heating circuit 120 and the temperature sensor may be wrapped around a side of the protective layer 130 close to the magnetic plate 110, or the protective layer 130 may be wrapped around a portion of the circumference of the magnetic plate 110 and the heating circuit 120 and the temperature sensor may be wrapped around the protective layer 130 once close to the magnetic plate 110.
For example, the magnetic plate 110 is a rectangular plate, and the protective layer 130 can be wrapped outside six faces of the rectangle. Or, the protection layer 130 may be wrapped on the front and back surfaces of the magnetic plate 110, as shown in fig. 9, the protection layer 130 includes a first protection layer 131 wrapping the first surface of the magnetic plate 110, and a second protection layer 132 wrapping the second surface of the magnetic plate 110, because in a normal condition, the first surface of the magnetic plate 110 is used for adsorbing the flexible plate 210, the first protection layer 131 on the first surface of the magnetic plate 110 can protect the magnetic plate 110 well, reduce the abrasion of the magnetic plate 110 by the flexible plate 210, and improve the service life of the magnetic plate 110. Because the heating circuit 120 and the temperature sensor are disposed on the second surface of the magnetic plate 110, the second protective layer 132 on the second surface of the magnetic plate 110 can protect the heating circuit 120, the temperature sensor 122, and the magnetic plate 110 well, reduce the influence of the external environment on the heating circuit 120 and the temperature sensor 122, improve the reliability of the heating circuit 120 and the temperature sensor 122, and meanwhile, can reliably wrap the heating circuit 120, the temperature sensor 122, and the magnetic plate 110 together, and improve the reliability and stability of the connection. It can be understood that the area of the side surface of the magnetic plate 110 connecting the first surface and the second surface is small, and the probability of abrasion and damage is small, so the protective layer 130 may not be provided, thereby simplifying the structure.
Specifically, the protective layer 130 may be a rubber layer, or may be a protective layer 130 made of other materials meeting the requirement.
Embodiments of the second aspect of the present invention, as shown in fig. 3, fig. 4, fig. 5, and fig. 6, provide a printing platform 200, the printing platform 200 includes a flexible plate 210 and the hot bed assembly 100 of any one of the embodiments of the first aspect, and the hot bed assembly 100 is used for being connected with the flexible plate 210 in an adsorption manner. Since the printing platform 200 includes the thermal bed assembly 100 of any of the above embodiments, all the advantages of the thermal bed assembly 100 are provided, and are not repeated herein.
In the embodiment of the present application, the flexible board 210 is adsorbed to the first surface of the magnetic board 110, and a protective film is disposed on a side of the flexible board 210 away from the magnetic board 110, where the protective film is a high temperature resistant film with strong adhesion, so as to improve the adhesion of the printing material, reduce the possibility of curling of the printing model, and ensure good printing quality. Specifically, the protection film can be PEI sticker, or other rete that satisfy the requirement, to this the utility model discloses do not specifically prescribe a limit. Specifically, the flexible board 210 may be a spring steel board.
In the above embodiment, as shown in fig. 5, 6 and 10, the printing platform 200 further includes a first support plate 220 made of a low thermal conductive material, the first support plate 220 and the flexible plate 210 are respectively located at two opposite sides of the thermal bed assembly 100; wherein the protective layer 130 disposed at a side of the hot bed assembly 100 opposite to the first support plate 220 has an adhesive property for fixing the hot bed assembly 100 to the first support plate 220.
That is, the second protective layer 132 on the second surface of the hot bed assembly 100 has an adhesive property, the hot bed assembly 100 is bonded to the first support plate 220 by the adhesive property, and since the strength of the hot bed assembly 100 is not high, in order to prevent the hot bed assembly 100 from being damaged due to bending, the first support plate 220 provides reliable support for the hot bed assembly 100, so that the overall strength of the hot bed assembly 100 can be improved, and the service life of the hot bed assembly 100 can be prolonged.
Wherein, first backup pad 220 is made by low heat conduction material, and the heat conductivity of first backup pad 220 is less than the heat conductivity of magnetic plate 110 promptly, if first backup pad 220 is low heat conduction backup pad, such setting for most in the heat that heating circuit 120 produced can directly transmit to flexible plate 210 through magnetic plate 110, only few part heat transmit through the lower first backup pad 220 of heat conductivity, and then can reduce thermal loss, improve hot bed subassembly 100 and transmit thermal efficiency.
In the above embodiment, as shown in fig. 5, 6 and 11, the hot bed assembly 100 further includes: a heat insulating member 230, the heat insulating member 230 being connected to the first support plate 220 for insulating the heat bed assembly 100; the insulating member 230 and the hot bed assembly 100 are located on opposite sides of the first support plate 220.
The heat preservation member 230 may be heat preservation cotton, heat preservation glue, a heat preservation tape, or another heat preservation member 230 meeting the requirement, the heat preservation member 230 and the hot bed assembly 100 are respectively located at two sides of the first support plate 220, that is, the heat preservation member 230 is located at a side of the first support plate 220 far away from the hot bed assembly 100. Thus, the heat on the hot bed assembly 100 can be prevented from being lost from the first supporting plate 220, the heating efficiency of the hot bed assembly 100 is further improved, the utilization rate of the heat is improved, and the use cost is reduced.
Specifically, heat preservation 230 can be for keeping warm cotton, and the cotton front of keeping warm is provided with the binder, is glue or tie coat like the binder, utilizes the binder, can directly with the one side of heat preservation 230 adhesion keeping away from magnetic sheet 110 in first backup pad 220, can be with the cotton back of bonding in first backup pad 220 that keeps warm promptly, easy operation, convenient assembling.
In the above-described embodiment, as shown in fig. 5, 6, and 8, the printing platform 200 further includes: a second support plate 250, a wheel set 260, and a connector 270, the connector 270 connecting the thermal bed assembly 100, the first support plate 220, and the thermal insulation member 230 to one side of the second support plate 250, and the wheel set 260 to the opposite side of the second support plate 250.
That is, the heat bed assembly 100, the first support plate 220, and the adiabatic member 230 are mounted on the second support plate 250 on the same side as the second support plate 250 using the connection member 270, and then the wheel assembly 260 is mounted on the opposite side of the second support plate 250. It can be understood that printing apparatus 300 includes drive assembly, and drive assembly includes driving motor and drive belt, and the drive belt is with this body coupling of second backup pad 250 of print platform 200, and driving motor is used for driving the drive belt motion, and then can drive print platform 200 and remove, can drive print platform 200 through second backup pad 250 and remove in the horizontal direction to realize the printing of 3D model.
As shown in fig. 1 and 2, the printing apparatus 300 further includes a base assembly 310, the printing platform 200 is movably disposed on the base assembly 310, a guide rail (not shown) is disposed on the base assembly 310, and the wheel set 260 is slidably disposed on the guide rail and drives the driving belt to rotate through the driving portion so as to bring the wheel set 260 to slide on the guide rail, thereby reducing resistance to movement of the printing platform 200.
In the practice of the present application, as shown in fig. 3, 4 and 8, the wheel set 260 may include a concentric wheel assembly 261 and an eccentric wheel assembly 262, the second support plate 250 is provided with a concentric wheel hole 252 and an eccentric wheel hole 253, respectively, the concentric wheel assembly 261 is mounted on the second support plate 250 through the concentric wheel hole 252, and the eccentric wheel assembly 262 is mounted on the second support plate 250 through the eccentric wheel hole 253. Specifically, concentric wheel assembly 261 includes a concentric nut and a roller, and eccentric wheel assembly 262 includes an eccentric nut and a roller, it being understood that by adjusting the eccentric wheel assembly, the distance between the roller and the guide rail can be adjusted to better conform the roller to the guide rail, and printing platform 200 can move more stably.
In the above embodiment, as shown in fig. 3, 4, 5, and 6, the printing platform 200 further includes: and a support post 280 disposed between the second support plate 250 and the insulating member 230, wherein the connecting member 270 passes through the heat bed assembly 100, the first support plate 220, the insulating member 230, and the support post 280 to be connected to the second support plate 250 in the direction from the heat bed assembly 100 to the second support plate 250.
Since the wheel blocks 260 are provided at the side of the second support plate 250 remote from the heat bed assembly 100, it is necessary to provide fixing members (e.g., nuts) between the second support plate 250 and the heat insulating member 230 to rotatably mount the wheel blocks 260 on the second support plate 250, and therefore, a gap is generally provided between the second support plate 250 and the heat insulating member 230 to receive the fixing members, so that there is a problem in that the connection between the second support plate 250 and the first support plate 220 to which the heat insulating member 230 is adhered is unstable. Therefore, by disposing the supporting columns 280 between the second supporting plate 250 and the thermal insulation member 230, and by using the supporting columns 280 to limit the distance between the second supporting plate 250 and the first supporting plate 220 adhered with the thermal insulation member 230, the connecting members 270 are connected to the second supporting plate 250 after passing through the thermal bed assembly 100, the first supporting plate 220, the thermal insulation member 230 and the supporting columns 280 in sequence along the direction from the thermal bed assembly 100 to the second supporting plate 250, i.e. from the front to the back of the thermal bed assembly 100, so that the thermal bed assembly 100, the first supporting plate 220, the thermal insulation member 230 and the second supporting plate 250 can be reliably and stably connected, and the stability of the connection between the second supporting plate 250 and the thermal bed assembly 100 is improved.
Specifically, the connecting member 270 is a bolt, the supporting column 280 is provided with a through hole, the second supporting plate 250 is provided with a second connecting hole 251, the second connecting hole 251 is a threaded hole, and the corresponding positions of the heat bed assembly 100, the first supporting plate 220 and the heat insulating member 230 are all provided with a first connecting hole 240. That is, the first connection holes 240 are disposed at the corresponding positions of the first protection layer 131 on the front surface of the magnetic plate 110, the heating circuit 120, the second protection layer 132 on the back of the magnetic plate 110, the first support plate 220, and the thermal insulation member 230. The first connection hole 240 on the thermal insulation member 230 is matched with the shape of the support column 280, so that the support column 280 can be inserted into the first connection hole 240 on the thermal insulation member 230, and a good pre-positioning effect is achieved. Then, the bolts sequentially pass through the first connection hole 240 on the first protection layer 131 on the front surface of the magnetic plate 110, the first connection hole 240 on the heating circuit 120, the first connection hole 240 on the second protection layer 132 on the back surface of the magnetic plate 110, the first connection hole 240 on the first support plate 220, the first connection hole 240 on the heat retaining member 230, and the through holes of the support columns 280, and then are connected with the threaded holes on the second support plate 250, so that the thermal bed assembly 100, the first support plate 220, the heat retaining member 230, and the second support plate 250 can be reliably and stably connected.
Embodiments of the third aspect of the present invention, as shown in fig. 1 and 2, provide a 3D printing apparatus 300 comprising the printing platform 200 of any of the embodiments of the second aspect. Therefore, all the advantageous technical effects of the printing platform 200 according to any of the above embodiments, or all the advantageous technical effects of the printing platform 200 according to any of the above embodiments, are not repeated herein.
In a specific embodiment, as shown in fig. 1 to 11, the present invention provides a thermal bed assembly 100 for a printing platform 200 of a 3D printing apparatus 300, the thermal bed assembly 100 comprising: the magnetic plate 110, the magnetic plate 110 is used for being connected with the flexible plate 210 of the printing platform 200 in an adsorption manner, and the flexible plate 210 is used for receiving the model printed by the 3D printing device 300; and the heating circuit 120 is connected with the magnetic plate 110 and used for heating the magnetic plate 110.
Wherein the heating circuit 120 is etched on the magnetic plate 110.
Wherein, the heating circuit 120 comprises conducting wires 121, the distance between adjacent conducting wires 121 is greater than or equal to 0.5mm, and the width of the conducting wires 121 increases with the increase of the heating power.
Wherein, the hot bed assembly 100 further comprises a temperature sensor 122, the temperature sensor 122 is used for monitoring the temperature of the magnetic plate 110; the temperature sensor 122 is in surface contact with the magnetic plate 110 and is disposed at the center of the conductive wire 121.
Wherein, the thermal bed assembly 100 further comprises a protective layer 130, and the protective layer 130 is used for wrapping the magnetic plate 110, the heating circuit 120 and the temperature sensor 122.
The utility model also provides a print platform 200 is applied to 3D printing apparatus 300, and print platform 200 includes: a flexible board 210; and the thermal bed assembly 100 of any of the preceding, the thermal bed assembly 100 for adsorptive connection with the flexible sheet 210.
Wherein, the printing platform 200 further comprises a first supporting plate 220 made of low heat conductive material, the first supporting plate 220 and the flexible plate 210 are respectively located at two opposite sides of the hot bed assembly 100; wherein the protective layer 130 disposed on the side of the hotbed assembly 100 opposite to the first support plate 220 has an adhesive property for securing the hotbed assembly 100 to the first support plate 220.
The printing platform 200 further includes a heat insulating member 230, and the heat insulating member 230 is connected to the first support plate 220 and used for insulating the heat bed assembly 100; the insulating member 230 and the hot bed assembly 100 are located on opposite sides of the first support plate 220.
Wherein, the printing platform 200 further comprises a second supporting plate 250, a wheel set 260 and a connecting member 270; the connecting member 270 connects the hot bed assembly 100, the first support plate 220 and the thermal insulation member 230 to one side of the second support plate 250, and the wheel unit 260 to the opposite side of the second support plate 250.
The utility model also provides a 3D printing apparatus 300, including the drive assembly and the printing platform 200 of any one of the preceding items; the driving assembly comprises a driving motor and a driving belt, the driving belt is connected with the second supporting plate 250 of the printing platform 200, and the driving motor is used for driving the driving belt to move so as to drive the printing platform 200 to move.
In the description of the present invention, the description of the terms "one embodiment," "some embodiments," "specific embodiments," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In the present disclosure, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A thermal bed assembly for a print platform of a 3D printing device, the thermal bed assembly comprising:
the magnetic plate is connected with a flexible plate of the printing platform in an adsorption manner, and the flexible plate is used for bearing a model printed by the 3D printing equipment;
and the heating circuit is connected with the magnetic plate and is used for heating the magnetic plate.
2. The hotbed assembly of claim 1, wherein the heating circuit is etched on the magnetic plate.
3. The hotbed assembly of claim 2, wherein the heating circuit comprises wires, wherein a distance between adjacent wires is greater than or equal to 0.5mm, and wherein the width of the wires increases with increasing heating power.
4. The hotbed assembly of claim 3, further comprising a temperature sensor for monitoring the temperature of the magnetic plate; the temperature sensor is in surface contact with the magnetic plate and is arranged at the center of the lead.
5. The hotbed assembly of claim 4, further comprising a protective layer for encasing the magnetic plate, the heating circuit and the temperature sensor.
6. A printing platform is applied to a 3D printing device, and comprises:
a flexible board; and a thermal bed assembly as claimed in any one of claims 1 to 5 for adsorptive connection with the flexible sheet.
7. The printing platform of claim 6, further comprising a first support plate made of a low thermal conductivity material, the first support plate and the flexible plate being located on opposite sides of the thermal bed assembly;
wherein the protective layer provided on the side of the hot bed assembly opposite to the first support plate has an adhesive property for fixing the hot bed assembly on the first support plate.
8. The printing platform of claim 7, further comprising a thermal insulator coupled to the first support plate for insulating the thermal bed assembly; the heat preservation piece with the hotbed subassembly is located respectively the opposite both sides of first backup pad.
9. The printing platform of claim 8, further comprising a second support plate, a wheel set, and a connector;
the connecting piece will the hotbed subassembly, first backup pad with the heat preservation connects one side of second backup pad, the wheelset is connected the opposite side of second backup pad.
10. A 3D printing apparatus comprising a drive assembly and a printing platform according to any one of claims 6 to 9;
the driving assembly comprises a driving motor and a driving belt, the driving belt is connected with the second supporting plate of the printing platform, and the driving motor is used for driving the driving belt to move so as to drive the printing platform to move.
CN202221579595.7U 2022-06-22 2022-06-22 Hot bed subassembly, print platform and 3D printing apparatus Active CN218227889U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202221579595.7U CN218227889U (en) 2022-06-22 2022-06-22 Hot bed subassembly, print platform and 3D printing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202221579595.7U CN218227889U (en) 2022-06-22 2022-06-22 Hot bed subassembly, print platform and 3D printing apparatus

Publications (1)

Publication Number Publication Date
CN218227889U true CN218227889U (en) 2023-01-06

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Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
CN (1) CN218227889U (en)

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