CN213694672U - Conductor structure and electronic device - Google Patents

Conductor structure and electronic device Download PDF

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Publication number
CN213694672U
CN213694672U CN202022911109.4U CN202022911109U CN213694672U CN 213694672 U CN213694672 U CN 213694672U CN 202022911109 U CN202022911109 U CN 202022911109U CN 213694672 U CN213694672 U CN 213694672U
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adhesive layer
copper foil
conductor structure
composite sheet
layer
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CN202022911109.4U
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张水林
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Vivo Mobile Communication Co Ltd
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Vivo Mobile Communication Co Ltd
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Abstract

The application discloses conductor structure and electronic equipment, this conductor structure includes: the adhesive comprises an elastomer, a copper foil composite sheet, a first adhesive layer and a second adhesive layer; the elastomer is provided with a first surface, a second surface and a first side surface, wherein the first surface is opposite to the second surface; the first adhesive layer is arranged on the first surface, and the second adhesive layer is arranged on the second surface; the copper foil composite sheet is fixedly connected with the elastic body through the first adhesive layer and the second adhesive layer, the copper foil composite sheet comprises a first part, a second part and a third part which is connected with the first part and the second part, the first part is fixed on the first adhesive layer in a stacked mode, the second part is fixed on the second adhesive layer in a stacked mode, and the third part is located on one side where the first side face is located. In the embodiment of the application, the copper foil composite sheet is used for conducting on the first surface and the second surface of the elastic body, which are opposite to each other, so that the heat conduction effect and the grounding effect of the conductor structure when the conductor structure is used for conducting heat and grounding of an element are effectively improved.

Description

Conductor structure and electronic device
Technical Field
The application belongs to the technical field of electronics, concretely relates to conductor structure and electronic equipment.
Background
In the related art, components in the electronic device generate heat during operation, and the components need to be powered by a battery during operation, so that a grounding requirement is also needed. In the existing electronic equipment, the conductive copper foil is arranged at the bottom of the element and led out to a position outside the range of the element, so as to achieve the aims of grounding and heat conduction. Conductive foam or buffering foam is arranged on one side of the conductive copper foil to achieve the buffering purpose.
In the process of implementing the present application, the applicant finds that at least the following problems exist in the prior art: the conductor structure used for element heat conduction and grounding in the prior art has poor heat conduction effect and grounding effect.
Disclosure of Invention
The present application aims to provide a conductor structure that solves at least one of the problems of poor heat conduction and grounding effects of conductor structures for heat conduction and grounding of components.
In order to solve the technical problem, the present application is implemented as follows:
in a first aspect, an embodiment of the present application provides a conductor structure, including: the adhesive comprises an elastomer, a copper foil composite sheet, a first adhesive layer and a second adhesive layer;
the elastomer has a first surface, a second surface and a first side, the first surface being opposite the second surface;
the first adhesive layer is arranged on the first surface, and the second adhesive layer is arranged on the second surface;
the copper foil composite sheet passes through first glue film and the second glue film with elastomer fixed connection, the copper foil composite sheet includes the first portion, the second portion and connects the first portion with the third part of second portion, the first portion is range upon range of to be fixed in on the first glue film, the second portion is range upon range of to be fixed in on the second glue film, the third portion is located one side at first side place.
In a second aspect, embodiments of the present application provide an electronic device, which includes a conductor structure as described in any one of the above.
In the embodiment of the application, the copper foil composite sheet is used for conducting on the first surface and the second surface of the elastic body, which are opposite to each other, so that the heat conduction effect and the grounding effect of the conductor structure when the conductor structure is used for conducting heat and grounding of an element are effectively improved.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is one of the schematic structural diagrams of a conductor structure according to an embodiment of the present application;
FIG. 2 is an exploded view of FIG. 1;
FIG. 3 is one of schematic structural diagrams of a conductor structure disposed within an electronic device according to an embodiment of the present application;
FIG. 4 is a second schematic diagram of a conductor structure according to an embodiment of the present application;
FIG. 5 is an exploded view of FIG. 4;
fig. 6 is a second schematic structural diagram of a conductor structure disposed in an electronic device according to an embodiment of the present application;
FIG. 7 is a third schematic diagram of a conductor structure according to an embodiment of the present application;
FIG. 8 is an exploded view of FIG. 7;
fig. 9 is a third schematic structural diagram of a conductor structure in an electronic device according to an embodiment of the present application.
Reference numerals:
1-elastomer, 2-copper foil composite sheet, 21-first part, 22-second part, 23-third part, 24-fourth part, 25-fifth part, 3-first adhesive layer, 31-first insulating adhesive layer, 32-second insulating adhesive layer, 33-PET sheet, 4-second adhesive layer, 5-shell and 6-camera.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The features of the terms first and second in the description and in the claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality" means two or more unless otherwise specified. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.
In the description of the present application, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present application.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
Conductor structures according to embodiments of the present application are described below in conjunction with fig. 1-9.
As shown in fig. 1-3, a conductor structure according to some embodiments of the present application, the conductor structure comprising: elastomer 1, copper foil composite sheet 2, first glue film 3 and second glue film 4.
The elastomer 1 has a first surface, a second surface and a first side surface, and the first surface is opposite to the second surface. The elastic body 1 has elasticity and can provide sufficient cushioning.
The first glue layer 3 is arranged on the first surface, and the second glue layer 4 is arranged on the second surface.
Copper foil composite piece 2 passes through first glue film 21 and second glue film 22 with 1 fixed connection of elastomer, copper foil composite piece 2 includes first portion 21, second portion 22 and connects first portion 21 with the third portion 23 of second portion 22, first portion 21 is range upon range of to be fixed in on the first glue film 3, first glue film 3 makes first portion 21 form the bonding fixed on the first surface. The second portion 22 is fixed to the second layer of glue 4 in a stacked manner, and the second layer of glue 4 forms an adhesive bond to the second portion 22 on the second surface. The third portion 23 is located on the side of the first side.
In this embodiment, the copper foil composite sheet 2 is attached to the first surface and then disposed onto the second surface around the first side. The copper foil composite sheet 2 comprises a copper foil layer formed by a copper foil material, the copper foil material has excellent electric conduction effect and heat conduction effect, and the elastomer 1 has a buffering effect. The copper foil composite sheet 2 wraps a part of the surface of the elastic body 1, so that the conductor structure has excellent electric conduction, heat conduction and buffering effects. Conductor structures are used for components within electronic devices to form a ground, heat conducting, and cushioning protective structure for the components. The first surface and the second surface which are opposite to each other are conducted through the copper foil composite sheet, so that the conductor structure can effectively improve the grounding and heat conducting effects on elements in the electronic equipment.
For example, the component is a camera 6 and the conductor structure is intended to be arranged between the bottom of the camera 6 and the housing 5 of the electronic device. The elastomer 1 enables the conductor structure to have a buffering effect and protects the camera 6 structure from being damaged.
The first part 21 is used for being connected with the bottom of the camera 6, the second part 22 is used for being connected with the shell 5 of the electronic equipment, and the copper foil composite sheet 2 conducts the bottom of the camera 6 with the shell 5 of the electronic equipment along the first surface, the first side face and the second surface in sequence. The copper foil composite sheet 2 forms a grounding and heat conducting path in the thickness direction in which the camera 6 is stacked with the conductor structure, i.e., forms a heat and heat conducting path in the Z direction of the electronic device, i.e., the thickness direction of the electronic device.
The conductive path formed by the copper foil composite sheet 2 makes the grounding path of the camera 6 shorter, and the heat conduction path formed by the copper foil composite sheet 2 makes the heat conduction path of the camera shorter. The conductor structure can effectively reduce the distance between the grounding path and the heat conduction path, thereby improving the heat dissipation effect and the grounding effect.
The second portion 22 is laminated to a surface of the second layer of glue 4, the second layer of glue 4 forming a connection between the second portion 22 and the second surface. The second portion 22 may cover a part of the second glue layer 4 or may cover the second glue layer 4 completely.
The second glue layer 4 may be a conductive glue layer, the second glue layer 4 having both the function of connecting the second portion 22 to the second surface and the function of conducting electricity. Under the condition that the second part 22 does not completely cover the second adhesive layer 4, the uncovered second adhesive layer 4 is connected with the shell 5, so that the path for conducting the second part 22 and the shell 5 is increased, and the conducting area of the copper foil composite sheet 2 and the shell 5 is increased.
Optionally, the second adhesive layer 4 is a conductive adhesive layer, the second portion 22 covers a part of the conductive adhesive layer 4, and another part of the conductive adhesive layer 4 not covered by the second portion 22 is used for forming a connection with an external structure.
The other part of the second adhesive layer 4 which is not covered by the second part 22 is connected with the shell 5, so that the path for conducting the second part 22 and the shell 5 is increased, and the conducting area of the copper foil composite sheet 2 and the shell 5 is increased.
The buffer effect of the elastic body 1 and the shorter heat conduction path and the electric conduction path of the copper foil composite sheet 2 enable one part of the conductor structure to simultaneously meet the requirements of buffering, grounding and heat dissipation. The operation procedures in the assembling and disassembling process are less and more convenient.
In one embodiment, as shown in fig. 2-6, the elastomeric body 1 further includes a second side opposite the first side.
The copper foil composite sheet 2 further comprises a fifth part 25 and a fourth part 24 for connecting the first part with the fifth part 25, the fourth part 24 is positioned on one side where the second side surface is positioned, and the fifth part 25 is fixed on the second adhesive layer 4 in a stacking mode.
In this embodiment, the copper foil composite sheet 2 forms two paths for heat conduction and electric conduction from both sides of the elastic body 1. One of the paths is: the element is in turn in communication with the housing 5 along a first section 21, a third section 23 and a second section 22. The other path is as follows: the element is in turn in communication with the housing 5 along the first, fourth and fifth sections 21, 24, 25.
The component is, for example, a camera 6. The two paths enable the heat of the camera 6 to be led out to the shell 5 more quickly, so that the heat productivity of the camera 6 is reduced, and the heat dissipation effect is improved. The two paths enable the grounding effect of the camera 6 to be better, and the safety can be further improved.
The second portion 22 and the fifth portion 25 both cover the surface of the second glue layer 4, for example, the second portion 22 covers a part of the surface of the second glue layer 4, and the fifth portion 25 covers a part of the surface of the second glue layer 4.
The second and fifth portions 22 and 25 are in electrical communication with the housing 5, and are capable of both making electrical connection for grounding and making electrical contact for heat dissipation.
Optionally, the second adhesive layer 4 covers the second surface, the second portion 22 covers a partial area of the second adhesive layer 4 close to the first side surface, and the fifth portion 25 covers a partial area of the second adhesive layer 4 close to the second side surface.
For example, there may be a spacing between the second portion 22 and the fifth portion 25, the uncovered portion of the second glue layer 4 being thermally or electrically conductive between the second portion 22 and the fifth portion 25 and conducting the second portion 22 and the fifth portion 25 with the housing 5 to increase a path of the second portion 22 and the fifth portion 25 with the housing 5 through the uncovered second glue layer 4.
In one embodiment, as shown in fig. 7-9, the second adhesive layer 4 extends from the second surface toward the second side surface, the fifth portion 25 is fixed to the portion of the second adhesive layer 4 extending from the second surface in a stacked manner, and the second portion 22 extends from the second surface toward the second side surface.
In this embodiment, the second portion 22 is in communication with the housing 5 within the second surface and extending beyond the second surface, increasing the area of communication between the copper foil composite sheet 2 and the housing 5.
The fifth part 25 and the part of the second adhesive layer 4 extending out of the second surface are conducted with the shell 5 outside the second surface, so that the conducting area of the copper foil composite sheet 2 and the shell 5 is increased.
As shown in fig. 9, the camera 6 is taken as an example of the device. At the bottom of the camera 6, it is in communication with the first part 21, via the third part 23 to the second part 22. The second part 22 is in communication with the part of the housing 5 opposite to the bottom of the camera 6 and extends to the side of the second side face, so that the contact area of the second part to the housing 5 is increased.
And the first section 21 is conducted via the fourth section 24 to the fifth section 25. The fifth part 25 is stacked on the part of the second adhesive layer 4 extending out of the second surface, and the second adhesive layer 4 extending out of the second surface is conducted with the shell 5 outside the range of the elastic body 1, so that the contact area of the shell 5 is increased.
The range of conduction of the copper foil composite sheet 2 and the shell 5 is increased by the second part 22, the second adhesive layer 4 and the fifth part 25 extending out of the elastic body 1 and extending out of the elastic body 1, so that heat can be conducted to a position farther away from the camera 6 along the copper foil composite sheet 2, and the heat dissipation effect is improved.
Optionally, the fifth portion 25 extends beyond the second layer of glue 4.
The fifth portion 25 protruding from the second glue layer 4 may be in direct communication with the housing 5. The copper foil composite sheet 2 has higher electric and thermal conductivity compared with the second adhesive layer 4, and can enable a conduction path from the first portion 21 to the shell 5 through the fourth portion 24 and the fifth portion 25 in sequence to have higher heat dissipation and grounding effects.
Optionally, the second portion 22 covers a partial area of the second glue layer 4.
The second portion 22 is in contact with the housing 5 and the second layer of glue 4 not covered by the second portion 22 forms an adhesive bond on the housing 5. The second adhesive layer 4 is bonded with the shell 5, so that the contact firmness degree of the second part 22 and the shell 5 is improved, the contact firmness degree of the fifth part 25 and the shell 5 is improved, and the reliability of the conduction structure of the copper foil composite sheet 2 and the shell 5 is effectively improved.
In one embodiment, as shown in fig. 2, 5, and 8, the first adhesive layer 3 includes a first adhesive layer 31 and a second adhesive layer 32, a PET sheet 33(polyethylene terephthalate) is disposed between the first adhesive layer 31 and the second adhesive layer 32, and the first adhesive layer 31, the second adhesive layer 32, and the PET sheet 33 are stacked.
In this embodiment the first layer of insulating glue 31 forms a bond with the first portion 21 and the second layer of insulating glue 32 forms a bond with the first surface. The PET sheet 33 provides a supporting function to the first glue layer 3 so that the first glue layer 3 can maintain an unfolded state. The first part 21 is bonded with the first glue layer 3, the unfolded state can be kept, the effective contact area of the first part 21 and the camera 6 is kept, and the heat conduction and electric conduction capabilities are improved.
The bonding face that first glue film 3 formed between first portion 21 and first surface is level and smooth, can not influence the roughness of copper foil composite sheet 2, has improved the area of copper foil composite sheet 2 and the contact of 6 bottoms of camera.
In one embodiment, the copper foil composite sheet 2 includes a copper foil layer and a Polyimide layer (PI Film) laminated with the Polyimide layer, the Polyimide layer facing the elastic body 1 side.
The polyimide layer serves as a support structure for the copper foil composite sheet 2 and is located against the elastomer 1 to provide sufficient structural strength to the copper foil composite sheet 2 to support the copper foil layer. The copper foil layer on the outside, away from the elastomer 1, provides a complete electrical conduction path and a heat dissipation path for components within the electronic device.
In one embodiment, the elastic body 1 comprises conductive foam.
The conductive foam has elasticity and enough structural strength. Under the condition of buffering elements in the electronic equipment, overlarge deformation cannot occur, the copper foil composite sheet 2 can be effectively kept in contact conduction with the elements and the shell 5, and the stability of a conductor structure is guaranteed. For example, the component is the camera 6, and the elastomer 1 provides effective buffering for the camera 6 through the conductive foam, so that excessive deformation is not formed in the process of buffering the camera 6, and the copper foil composite sheet 2 is effectively kept to be conducted between the camera 6 and the shell 5.
In an embodiment, there is provided an electronic device comprising a conductor structure as described in any of the above.
The conductor structure in the electronic equipment has better heat conduction and electric conduction effects, and meets three requirements of grounding, heat dissipation and buffering of elements through the conductor structure.
In one embodiment, as shown in fig. 3, 6, and 9, the electronic device further includes a housing 5 and a camera 6, the housing 5 forms a receiving cavity, the camera 6 is located in the receiving cavity, the first portion 21 is connected to a bottom of the camera 6, and the second portion 22 abuts against the housing 5.
In this embodiment, the conductor structure provides a conduction path in the thickness direction of the electronic apparatus, making the grounding and heat dissipation paths of the camera 6 shorter, improving the grounding and heat dissipation effects. When the conductor structure has a Z-direction conduction path in the thickness direction of the electronic device, that is, in the Z direction of the electronic device, the heat of the camera 6 can be quickly conducted to the housing 5, thereby reducing the heat accumulation of the camera 6. And a shorter conduction path leads to a better grounding effect.
In the description herein, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims (10)

1. A conductor structure, comprising: the adhesive comprises an elastomer, a copper foil composite sheet, a first adhesive layer and a second adhesive layer;
the elastomer has a first surface, a second surface and a first side, the first surface being opposite the second surface;
the first adhesive layer is arranged on the first surface, and the second adhesive layer is arranged on the second surface;
the copper foil composite sheet passes through first glue film and the second glue film with elastomer fixed connection, the copper foil composite sheet includes the first portion, the second portion and connects the first portion with the third part of second portion, the first portion is range upon range of to be fixed in on the first glue film, the second portion is range upon range of to be fixed in on the second glue film, the third portion is located one side at first side place.
2. The conductor structure of claim 1, wherein the elastomer further comprises a second side opposite the first side;
the copper foil composite sheet further comprises a fifth part and a fourth part connected with the first part and the fifth part, the fourth part is located on one side where the second side face is located, and the fifth part is fixed on the second adhesive layer in a stacked mode.
3. The structure of claim 2, wherein the second adhesive layer extends beyond the second surface toward the second side surface, the fifth portion is laminated and fixed to a portion of the second adhesive layer extending beyond the second surface, and the second portion extends beyond the second surface toward the second side surface.
4. The conductor structure of claim 3, wherein the fifth portion extends beyond the second layer of glue.
5. The conductor structure according to claim 1, wherein the second adhesive layer is a conductive adhesive layer, the second portion covers a part of the area of the conductive adhesive layer, and another part of the area of the conductive adhesive layer not covered by the second portion is used for forming a connection with an external structure.
6. The conductor structure according to claim 1, wherein the first adhesive layer comprises a first adhesive layer and a second adhesive layer, a PET sheet is arranged between the first adhesive layer and the second adhesive layer, and the first adhesive layer, the second adhesive layer and the PET sheet are stacked.
7. The conductor structure of claim 1, wherein the copper foil composite sheet comprises a copper foil layer and a polyimide layer, the copper foil layer being disposed on top of the polyimide layer, the polyimide layer facing the elastomer side.
8. The conductor structure of claim 1, wherein the elastomer comprises conductive foam.
9. An electronic device, characterized in that it comprises a conductor structure according to any one of claims 1-8.
10. The electronic device of claim 9, further comprising a housing and a camera, wherein the housing forms a receiving cavity, the camera is located in the receiving cavity, the first portion is connected to a bottom of the camera, and the second portion abuts against the housing.
CN202022911109.4U 2020-12-07 2020-12-07 Conductor structure and electronic device Active CN213694672U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113993362A (en) * 2021-09-30 2022-01-28 深圳市卓汉材料技术有限公司 Grounding elastic body and electronic equipment
WO2022166912A1 (en) * 2021-02-07 2022-08-11 维沃移动通信有限公司 Electronic device, and method for preparing elastic grounding assembly

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022166912A1 (en) * 2021-02-07 2022-08-11 维沃移动通信有限公司 Electronic device, and method for preparing elastic grounding assembly
CN113993362A (en) * 2021-09-30 2022-01-28 深圳市卓汉材料技术有限公司 Grounding elastic body and electronic equipment
CN113993362B (en) * 2021-09-30 2022-05-10 深圳市卓汉材料技术有限公司 Grounding elastic body and electronic equipment
US11646509B2 (en) 2021-09-30 2023-05-09 Shenzhen Johan Material Technology Co., Ltd. Grounding elastic contact and electronic device

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