CN101920721A

CN101920721A - Electronic control device

Info

Publication number: CN101920721A
Application number: CN2009101686864A
Authority: CN
Inventors: 伊藤慎一; 富永努; 喜福隆之; 秋山周三; 谷川正明
Original assignee: Mitsubishi Electric Corp
Current assignee: Mitsubishi Electric Corp
Priority date: 2009-06-09
Filing date: 2009-08-28
Publication date: 2010-12-22
Anticipated expiration: 2029-08-28
Also published as: JP2010288328A; KR20100132408A; CN101920721B

Abstract

The invention provides an electronic control device possessing miniaturization, high output and long service life. The electronic control device comprises a housing (3) which is made from insulated resin and is provided with openings at two ends, an end part disposed at the housing (3), a radiator (5) of a semiconductor switch component (3) which is disposed at the surface of the housing (3), and a circuit substrate (4) which is disposed corresponding to the radiator (5). One surface of the circuit substrate (4) is provided with a plurality of low-current devices with microcomputers which control the driving of the semiconductor switch component (2), and the other surface is provided with a plurality of large-current devices with capacitors which absorbs the current wave flowing through the semiconductor switch component (2).

Description

Electronic control package

Technical field

The present invention relates to be used for for example pass through the electronic control package of the rotational force of electrical motor to the electric type power steering device of steering device of vehicles booster action.

Background technology

In the past, known had a kind of electronic control package, and the power device of this device is that thyristor (FET) is installed on the metal substrate, and the link that the device that metal substrate and metal substrate is outer is electrically connected is installed on the metal substrate.

For example, patent documentation 1 disclosed electronic control package comprises: the power substrate that is mounted with the bridge circuit that the thyristor by the electric current that is used for switching motor constitutes; Conductive plate etc. is inlayed the shell that is formed in insulative resin and is mounted with high-current device; Be mounted with the control basal plate of low current devices such as microcomputer; Link with power substrate and above-mentioned shell and the electrical connection of above-mentioned control basal plate; The radiator of being close to the power substrate; And cover power substrate, shell and control basal plate and be installed in the housing of radiator by the metal sheet drawing.

Patent documentation 1: No. 3644835 specification sheets of Japanese Patent (Fig. 2)

Summary of the invention

In the disclosed electronic control package of patent documentation 1, the problem that exists is: the control basal plate that needs to load the power substrate of thyristor, the shell that loads high-current device and loading low current device respectively, number of devices increases, and cause device maximization, complicated, cost is high.

Problem of the present invention is to provide a kind of electronic control package that solves aforesaid problem, and this electronic control package can also be realized high outputization, high lifeization except realizing miniaturization, simplification, cost degradation.

Electronic control package involved in the present invention comprises: at both ends portion has the shell of the insulative resin system of peristome; Be installed in an above-mentioned end of this shell, at the radiator of the surperficial power loading device of shell side; And the circuit substrate that is oppositely arranged with this radiator, on the foregoing circuit substrate, the a plurality of low current devices that comprise microcomputer are installed at a face, this microcomputer is controlled the driving of above-mentioned power device, at another side a plurality of high-current devices that comprise cond are installed, this cond absorbs the fluctuation of the electric current that flows through above-mentioned power device.

In addition, electronic control package involved in the present invention comprises: at both ends portion has the shell of the insulative resin system of peristome; Be installed in an above-mentioned end of this shell, at the radiator of the surperficial power loading device of shell side; And the circuit substrate that is oppositely arranged with this radiator, on the foregoing circuit substrate, the a plurality of low current devices that comprise microcomputer are installed at a face, this microcomputer is controlled the driving of above-mentioned power device, at another side a plurality of high-current devices that comprise shunt resistance are installed, this shunt resistance detects the electric current that flows through above-mentioned power device.

According to electronic control package involved in the present invention, because power device is loaded on the radiator, and a face at circuit substrate is installed low current device, at another side high-current device is installed, therefore except realizing miniaturization, simplification, cost degradation, can also realize high outputization, high lifeization.

Description of drawings

Fig. 1 is the exploded perspective view of the related electronic control package of expression embodiments of the present invention 1.

Fig. 2 is the exploded perspective view when opposite sense is up and down observed the exploded perspective view of expression electronic control package of Fig. 1.

Fig. 3 is the lateral plan when the coupling for land vehicle side is observed the electronic control package of Fig. 1.

Fig. 4 is the lateral plan when electrical motor adaptor union side is observed the electronic control package of Fig. 1.

Fig. 5 is the block diagram when the direction that radiator is installed is observed the shell of electronic control package of Fig. 1.

Fig. 6 is the main portion enlarged drawing of Fig. 5.

Fig. 7 is the block scheme of the electronic control package of Fig. 1.

Fig. 8 is the sectional view of the electronic control package of Fig. 1.

Fig. 9 is the conductive plate of electronic control package of presentation graphs 1 and the stack-mounted block diagram of bonder terminal.

Figure 10 is the conductive plate of electronic control package of presentation graphs 1 and the stack-mounted block diagram of bonder terminal.

Figure 11 is the parallel sectional view of side section electronic control package and Fig. 8 of Fig. 1.

Figure 12 is the conductive plate of electronic control package of presentation graphs 1 and the stack-mounted block diagram of bonder terminal.

Figure 13 is the holding member of electronic control package of presentation graphs 1 and the stack-mounted block diagram of spring material.

Figure 14 is the parallel sectional view of side section electronic control package and Fig. 8 of Fig. 1.

Figure 15 be Fig. 1 electronic control package to the side section of Fig. 8 cutaway view when right angle orientation is dissectd.

Figure 16 is the parallel sectional view of side section electronic control package and Fig. 8 of Fig. 1.

Figure 17 is the front view of circuit substrate of the electronic control package of presentation graphs 1.

Figure 18 is the exploded perspective view of the position relation of the radiator of electronic control package of presentation graphs 1 and shell.

Figure 19 is the block diagram of the position relation of the radiator of electronic control package of presentation graphs 1 and shell.

Figure 20 is the main portion block diagram of the electronic control package of Fig. 1.

Figure 21 is the sectional view of the related electronic control package of expression embodiments of the present invention 2.

Figure 22 is the block diagram of the variation of the related electronic control package of expression embodiments of the present invention 1,2.

Label declaration

1 electronic control package, 2 thyristors (power device), 3 shells, the 3a insulative resin, 3b maintaining part, 3c peristome internal face, the 3d location division, 3e location division, 4 circuit substrates, 5 radiatores, 5a end face, 5b alumite treated side, the 5c radiating fin, 6a power conductive plate, 6b output conductive plate, 6c signal conductive plate, the 6d conductive plate, 6e conductive plate, 6f holding member, 6ap to 6fp is pressed into mating terminals, 7 cover plates, coupling for land vehicle, 9 electrical motor adaptor unions, 10 sensor connectors, 11 power connector terminals, 12 signal connector terminals, 13 electrical motor bonder terminals, 14 sensor connector terminals, 20 screws, 21 leaf springs, 21a press section, the 21b clamping part, the 21s slit portion, 22 electrical motors, 23 torque sensors, 24 batteries, 41 microcomputers (low current device), 42 power supply IC (low current device), 43 driver ICs (low current device), 44 coils (high-current device), 45 conies (high-current device), 46 relays (high-current device), 47 shunt resistances (high-current device), 51 radiator bodies, 52 alumite tunicles.

The specific embodiment

Embodiment 1.

Below, based on the description of drawings the embodiments of the present invention, but in each figure, identical or suitable parts are described with the position identical label of mark.

In the present embodiment, be that example describes with the rotational force that for example is used for by electrical motor to the electronic control package 1 of the electric type power steering device of steering device of vehicles booster action.

Fig. 1 is the exploded perspective view of the related electronic control package 1 of expression embodiments of the present invention 1; Fig. 2 is the exploded perspective view when opposite sense is up and down observed the exploded perspective view of expression electronic control package 1 of Fig. 1; Fig. 3 is the lateral plan of coupling for land vehicle 8 sides of the electronic control package 1 of presentation graphs 1; Fig. 4 is the electrical motor adaptor union 9 of the electronic control package 1 of presentation graphs 1, the lateral plan of sensor connector 10 sides; Fig. 5 is the block diagram from the shell 3 of the electronic control package 1 of direction indication Fig. 1 that radiator 5 is installed; Fig. 6 is the main portion enlarged drawing of Fig. 5; Fig. 7 is the block scheme of the electronic control package 1 of Fig. 1; Fig. 8 is the cutaway view of the electronic control package 1 of Fig. 1.

This electronic control package 1 comprises: at both ends portion has the shell 3 of the insulative resin system of peristome respectively; Use screw 20 is installed in an end of this shell 3, is formed with the radiator 5 of the aluminum of insulation tunicle on the surface; Be loaded in this radiator 5, be thyristor 2 by the power device that is pressed in radiator 5 sides by leaf spring 21; The circuit substrate 4 that is oppositely arranged with radiator 5; And deposit the cover plate 7 of thyristor 2, circuit substrate 4 with radiator 5.

On the surface of cover plate 7 sides of circuit substrate 4, utilize welded and installed to flow through a plurality of low current devices of the little electric current that signal uses.This low current device is equivalent to respectively calculate assist torque and feedback motor current, generate the microcomputer 41 of the drive signal that is equivalent to assist torque based on the speed of a motor vehicle that turns to torque and vehicle of bearing circle as shown in Figure 1; Drive the power supply IC42 of electronic control package 1; And the driver IC 43 of the action of control thyristor 2.

On the surface of radiator 5 sides of circuit substrate 4, utilize welded and installed to flow through a plurality of high-current devices of the big electric current that direct motor drive uses.This high-current device is equivalent to prevent electromagnetic noise that thyristor 2 the produces coil 44 to external leaks as shown in Figure 2 when switch motion; The cond 45 of fluctuation of the electric current of thyristor 2 is flow through in absorption; To provide the relay 46 that switches on and off to the motor current of electrical motor 22 from the thyristor 2 of battery 24 by bridge circuit; And the shunt resistance 47 that detects the electric current that flows through thyristor 2.

The current circuit of circuit substrate 4 comprises: the bridge circuit that is made of thyristor 2; The high-current circuit that flows through the big electric current that direct motor drive uses that is electrically connected with coil 44, cond 45, relay 46, shunt resistance 47 and constitutes by wiring pattern; And the little current circuit that flows through the little electric current that signal uses that is electrically connected with microcomputer 41, power supply IC42, driver IC 43 and constitutes by wiring pattern.

In addition, electronic control package 1 comprises: be arranged on a side of shell 3, the coupling for land vehicle 8 that is electrically connected with the wiring of vehicle; Be arranged on the another side of shell 3, the electrical motor adaptor union 9 that is electrically connected with electrical motor 22; And with these electrical motor adaptor union 9 sensor connectors 10 adjacent, that be electrically connected with torque sensor 23.

As shown in Figure 3, coupling for land vehicle 8 comprises: the power connector terminal 11 that is electrically connected with the battery 24 of vehicle, is formed by copper or the copper alloy of thickness of slab 0.8mm; And the signal connector terminal 12 of the phosphor bronze system of the thickness 0.64mm of the wiring input/output signal by vehicle.

In addition, as shown in Figure 4, electrical motor adaptor union 9 comprises the copper alloy of high conductivity of thickness 0.8mm or the electrical motor bonder terminal 13 of phosphor bronze system, and sensor connector 10 comprises the sensor connector terminal 14 of the phosphor bronze system of thickness 0.64mm.

And as shown in Figure 5, electronic control package 1 comprises: basic courses department forms power conductive plate 6a integrated and that circuit substrate 4 is electrically connected with thyristor 2, exports usefulness conductive plate 6b and signal conductive plate 6c with shell 3 by inlaying to be shaped; And basic courses department forms conductive plate 6d integrated and that circuit substrate 4 is electrically connected with power connector terminal 11 by inlaying to be shaped with shell 3.

In addition, electronic control package 1 comprises: the conductive plate 6e that circuit substrate 4 is electrically connected with signal connector terminal 12 and sensor connector terminal 14; And have the ground connection of circuit substrate 4 and the holding member 6f of radiator 5 bonded assembly effects.

Devices such as power connector terminal 11, signal connector terminal 12, electrical motor bonder terminal 13 and sensor connector terminal 14, when power is panelized into shape with formation shell 3 with conductive plate 6b, signal with conductive plate 6c,

conductive plate

6d, 6e, holding member 6f with conductive plate 6a, output, be panelized into shape respectively simultaneously, coupling for land vehicle 8, electrical motor adaptor union 9, sensor connector 10 form integrated with shell 3.

In addition, with the side of the peristome side of the peristome opposition side of the shell 3 that radiator 5 is installed, be formed for electronic control package 1 is installed in and be mounted the 3L of installation foot that body is a vehicle.

Each terminal of a pair of each thyristor 2 side by side disposes from the right side with the gate terminal GT1 that supplies with terminals for power supplies VS, high side MOSFET2H, the gate terminal GT2 of electric bridge lead-out terminal OUT, downside MOSFET2L and the serial arrangement of earth terminal GND in Fig. 6.

Herein, supply power terminal VS, electric bridge lead-out terminal OUT, earth terminal GND are in order to make electrical motor 22 work, max-flow cross the big electric current terminal of the big electric current about 50A, gate terminal GT1, gate terminal GT2 are the little electric current terminals that max-flow is crossed the little electric current that the signal about 3A uses, and big electric current is with terminal and little electric current terminal alternate configurations.

Each terminal OUT of thyristor 2 side by side is bent into the shape identical with the crank-like that erects, falls down at two positions of pars intermedia as shown in Figure 8, derives to equidirectional respectively.This for other terminals VS, GT1, GT2, GND too.

Terminal VS, the GT1 of thyristor 2, OUT, GT2, GND form width 0.8mm, thickness 0.5mm, terminal be spaced apart 1.7mm.

As shown in Figure 7, thyristor 2 is integrated with high side MOSFET2H and downside MOSFET2L, forms half-bridge.Then, the half-bridge of thyristor 2 is contained in the packaging part, and with two be one group, be configured for the bridge circuit of the electric current of switching motor 22.

In addition, as Fig. 5, shown in Figure 6, in shell 3, form the location division 3d that body and shell 3 with thyristor 2 position.

Leading section at this location division 3d forms taper, and the hole 2a that is arranged on the radiating part of thyristor 2 is guided, inserted by tapered portion, realizes the location.The location of the derivation direction of location division 3d double as each terminal VS, GT1, OUT, GT2, GND.

In addition, the location division 3e that each terminal VS, GT1, OUT, GT2, GND and

conductive plate

6a, 6b, 6c are positioned is formed in the shell 3 equally.This location division 3e carries out the meet at right angles location of direction of derivation direction with each terminal VS, GT1, OUT, GT2, GND.Location division 3e is formed at the terminal VS at the two ends of thyristor 2, the outside of GND, forms taper at leading section.Use this tapered portion, the outside of each terminal VS, GND of guiding thyristor 2, the location of realizing each terminal VS, GT1, OUT, GT2, GND and

conductive plate

6a, 6b, 6c.

As shown in Figure 6,

conductive plate

6a, 6b, 6c extend and overlay configuration along the derivation direction that terminal VS, GT1, OUT, GT2, the GND of thyristor 2 derives, terminal VS, GT1, OUT, GT2, GND and

conductive plate

6a, 6b, 6c the is configured in face relative with radiator 5.

After using

location division

3d, 3e with thyristor 2 positioning and fixing, each terminal VS, GT1, OUT, GT2, GND and

conductive plate

6a, 6b, 6c for example weld by laser welding.

Laser welding is before radiator 5 is installed, and carries out to the surface irradiation laser LB of terminal VS, GT1, QUT, GT2, GND from the direction that radiator 5 is installed.

As shown in Figure 6, power is connected with the supply power terminal VS of thyristor 2, the leading section of earth terminal GND respectively with the bottom of conductive plate 6a.Output is connected with the leading section of electric bridge lead-out terminal OUT with the bottom of conductive plate 6b.Signal is connected with the leading section of gate terminal GT1, GT2 respectively with the bottom of conductive plate 6c.

Fig. 9 is the block diagram of expression

conductive plate

6a, 6b, 6c and connected peripheral devices.

Conductive plate

6a, 6b, 6c formed respectively be pressed into mating terminals 6ap, 6bp, 6cp.Form a plurality of through hole 4a that the wiring pattern that is made of Copper Foil and inside face carry out copper facing and be electrically connected with above-mentioned wiring pattern at circuit substrate 4, be pressed into each through hole 4a that mating terminals 6ap, 6bp, 6cp are pressed into circuit substrate 4, terminal VS, GT1, OUT, GT2, the GND of thyristor 2 is electrically connected with the wiring pattern of circuit substrate 4.

Power is formed by rolling copper or copper alloy with conductive plate 6b with conductive plate 6a, output.But if with terminal VS, the OUT of

conductive plate

6a, 6b and thyristor 2, GND welding, then owing to can flowing through big electric current in

conductive plate

6a, 6b, so

conductive plate

6a, 6b need guarantee enough volumes.

Yet, be pressed into the viewpoint of mating terminals and punch process from formation, be difficult to increase thickness of slab.Therefore, in the present embodiment, making power is that the thickness of slab of

conductive plate

6a, 6b is identical with the width of terminal VS, OUT, GND with conductive plate, is 0.8mm, forms the plate width greater than thickness of slab, welds with terminal VS, OUT, the GND of thyristor 2.

In addition,, therefore needn't consider resistance is reduced, form with the same sheet material of conductive plate 6b with conductive plate 6a and output but adopt with the power that flows through big electric current because signal flows through little electric current with conductive plate 6c.

As Fig. 8, shown in Figure 9, output is connected with the electric bridge lead-out terminal OUT of thyristor 2 with conductive plate 6b.

In addition, the end 13a that is connected electrical motor bonder terminal 13 with the opposition side end of bottom.Then, the electric bridge lead-out terminal OUT that exports with conductive plate 6b and thyristor 2 is the same with connecting, the end 13a of electrical motor bonder terminal 13 is configured in output with the relative face of the end of conductive plate 6b and radiator 5, welds to the surface irradiation laser LB of electrical motor bonder terminal 13 from the direction of installation radiator 5.

Not via circuit substrate 4, and directly flow to electrical motor 22 from the motor current of the electric bridge lead-out terminal OUT of thyristor 2 via electrical motor bonder terminal 13.

At the pars intermedia of output with conductive plate 6b, form to what circuit substrate 4 extended and be pressed into mating terminals 6bp, the signal of voltage that is used for monitoring motor bonder terminal 13 is to circuit substrate 4 outputs.

Figure 10 is the block diagram of representing power supply conductive plate 6d, reaching connected peripheral devices.

As Fig. 8, shown in Figure 10, be connected the end 11a of power connector terminal 11 with conductive plate 6d with power supply.The end 13a that exports with conductive plate 6b and electrical motor bonder terminal 13 is the same with connecting, power connector terminal 11 is configured in the radiator 5 relative face of power supply with the end of conductive plate 6d, welds to the surface irradiation laser LB of the end of power connector terminal 11 11a from direction that radiator 5 is installed.

At the pars intermedia of power supply with conductive plate 6d, form to what circuit substrate 4 extended and be pressed into mating terminals 6dp, this is pressed into the through hole 4a that mating terminals 6dp is pressed into circuit substrate 4, is electrically connected with the wiring pattern of circuit substrate 4.Then, the electric current of battery 24 via power connector terminal 11, power supply with conductive plate 6d, be pressed into mating terminals 6dp and provide to circuit substrate 4.

Figure 11 is parallel with Fig. 8, along coupling for land vehicle 8 and sensor connector 10 side cross sectional view; Figure 12 is each conductive plate 6e, the block diagram that reaches connected peripheral devices.

As Figure 11, shown in Figure 12, end 12a, the 14a of conductive plate 6e and signal connector terminal 12, sensor connector terminal 14 are overlapping, and this consistent face and forms parallelly with radiator 5 near radiator 5.

At this moment, end 12a, the 14a of signal connector terminal 12, sensor connector terminal 14 is configured in radiator 5 sides, welds to the surface irradiation laser LB of the end 14a of the end of signal connector terminal 12 12a, sensor connector terminal 14 from direction that radiator 5 is installed.

In addition, conductive plate 6e forms in the end with the weld part opposition side and is pressed into mating terminals 6ep, this is pressed into the through hole 4b that mating terminals 6ep is pressed into circuit substrate 4, is electrically connected with the wiring pattern of circuit substrate 4 with conductive plate 6e bonded assembly signal connector terminal 12, sensor connector terminal 14.

Figure 13 be holding member 6f, and and the block diagram of this holding member 6f bonded assembly peripheral devices; Figure 14 be parallel with Fig. 8, along the center side cross sectional view of holding member 6f.

Holding member 6f has the ground connection of circuit substrate 4 and radiator 5 bonded assembly functions.But,, therefore can't make holding member 6f and radiator direct contact owing to form insulation tunicle 52 on the surface of radiator 5.Therefore, by screw 20, leaf spring 21, circuit substrate 4 is electrically connected with radiator 5.

Leaf spring 21 shown in Figure 13 is formed with electric conductors such as phosphor bronze with stainless steel sheet, spring by spring, and slit 21s at one end is set.Be fixed on slit 21s by holding member 6f is pressed into, holding member 6f is electrically connected with leaf spring 21.The leaf spring 21 that is fixed with holding member 6f is configured between the head of shell 3 and screw 20, as shown in figure 14 with the shell 3 fastening radiatores 5 that are fixed on.

Owing to the tapped bore that is arranged on radiator 5 is not implemented insulation processing, therefore holding member 6f is electrically connected with radiator 5.

At holding member 6f, be pressed into mating terminals 6fp in leading section formation, be pressed into the through hole 4a that mating terminals 6fp is pressed into circuit substrate 4.

Utilize this structure, via being pressed into mating terminals 6fp, holding member 6f, leaf spring 21, screw 20, the wiring pattern of circuit substrate 4 is electrically connected with radiator 5.

As Fig. 8, shown in Figure 11, in the present embodiment, be pressed into mating terminals 6ap, 6bp, 6cp, 6dp, 6ep is configured in cover plate 7 sides, laser welding portion is configured in radiator 5 sides.

Utilize this structure; because the distance that is pressed into mating terminals 6ap, 6bp, 6cp, 6dp, 6ep and laser welding portion is elongated, therefore reduce the heat that when laser welding, produces, reflected light, protection with gas to being pressed into the influence that mating terminals 6ap, 6bp, 6cP, 6dp, 6ep bring.

In addition, owing to be pressed between mating terminals 6ap, 6bp, 6cp, 6dp, 6ep and the laser welding portion, have insulative resin 3a and circuit substrate 4, the reflected light that therefore produces when laser welding is difficult to arrive and is pressed into mating terminals 6ap, 6bp, 6cp, 6dp, 6ep.

In addition, each terminal VS, GT1, OUT, GT2, GND, 11,12,13,14 with the parallel line that leaves of line of centers at each center (for example dotted line of Figure 11) by being pressed into mating terminals 6ap, 6bp, 6cp, 6dp, 6ep on the weld, weld with

conductive plate

6a, 6b, 6c, 6d, 6e.Like this, by making the weld be positioned at the position of leaving from each center that is pressed into mating terminals 6ap, 6bp, 6cp, 6dp, 6ep, can prevent to be pressed into mating terminals 6ap, 6bp, 6cp, 6dp, 6ep the being pressed into load when circuit substrate 4 is pressed into and act directly on weld part, can prevent that weld part from producing distortion or peel off.

Circuit substrate 4 is pressed into mating terminals 6ap, 6bp, 6cp, 6dP, 6ep, 6fp at through hole 4a, is mechanically kept.

In addition, because shaping is inlayed in the insulative resin 3a of shell 3 by the basic courses department of each

conductive plate

6a, 6b, 6c, 6d, 6e, 6f, therefore will be pressed into mating terminals 6ap, 6bp, 6cp, 6dp, 6ep, when 6fp is pressed into circuit substrate 4, as Fig. 8, Figure 11 and shown in Figure 14, insulative resin 3a be present in and radiator 5 between, radiator 5 is subjected to being pressed into power.But,, between insulative resin 3a and radiator 5, can produce trickle gap owing to the precision reason on making.

Be pressed into to cooperate and be pressed into, the precision of relative height that is pressed into mating terminals 6ap, 6bp, 6cp, 6dp, 6ep, 6fp and circuit substrate 4 is very important, but because the trickle gap between insulative resin 3a and the radiator 5 causes the precise decreasing of this relative height, therefore at this gap coating adhesive (not shown), remove the influence in this gap.

In the present embodiment, form two at power respectively with conductive plate 6a and be pressed into mating terminals 6ap, form one in output with conductive plate 6b and be pressed into mating terminals 6bp, form one at signal with conductive plate 6c and be pressed into mating terminals 6cp, 27 of configurations are pressed into mating terminals 6ap, 6bp, 6cp for a thyristor.

In addition, by with adjacent

conductive plate

6a, 6b, 6c be pressed into mating terminals 6ap, 6bp, 6cp is configured to cross-like, increases the distance be pressed between mating terminals 6ap, 6bp, 6cp, prevents the short circuit between each terminal 6a, 6b, 6c.

At conductive plate 6d, each power connector terminal is formed two be pressed into mating terminals 6dp, at conductive plate 6e, form 6 and be pressed into mating terminals and 5 with signal connector terminal 12 bonded assemblys and be pressed into mating terminals, amount to and form 11 and be pressed into mating terminals 6ep with sensor connector terminal 14 bonded assemblys.

In addition, at holding member 6f, form one and be pressed into mating terminals 6fp.With the aperture that is pressed into the through hole 4a of the circuit substrate 4 that mating terminals 6ap, 6bp, 6cp, 6dp, 6fp be pressed into form 1.45mm, the aperture that will be pressed into the through hole 4b that mating terminals 6ep is pressed into forms 1mm.

In the electronic control package 1 of said structure, if microcomputer 41 generates drive signal, then in circuit, flow through electric current, produce heat from each several part.The cal val of the coil 44 that is electrically connected with high-current circuit at this moment,, cond 45, relay 46 and shunt resistance 47 is bigger than the cal val of the microcomputer 41, power supply IC42 and the driver IC 43 that are electrically connected with little current circuit.If at the same space, the less microcomputer 41 that then generates heat, power supply IC42, driver IC 43 are subjected to from the influence of the heat of the bigger coil 44 of heating, cond 45, relay 46, shunt resistance 47 generations with these cell configuration, temperature can rise.

In the present embodiment, coil 44, cond 45, relay 46 and the shunt resistance 47 of high-current device is installed in the face of opposition side on surface of the circuit substrate 4 of microcomputer 41, power supply IC42 and driver IC 43 that low current device is installed, and coil 44, cond 45, relay 46 is relative with the surface that on-off element 2 is installed of radiator 5 is configured in like that on the circuit substrate 4.

The position relation of the current device on the circuit substrate 4 of present embodiment is as Figure 15 and shown in Figure 16.Figure 15 represents another section parallel with Fig. 8, and Figure 16 represents section that Figure 15 is dissectd along right angle orientation.

As shown in figure 15, coil 44, cond 45, relay 46 are configured in the space that is surrounded by the internal face of circuit substrate 4, radiator 5 and shell 3.

In addition, as shown in figure 16, in the same space, also dispose shunt resistance 47, be loaded in the thyristor 2 of radiator 5.

The surface and the cover plate 7 of the circuit substrate 4 of the microcomputer 41 of installation low current device, power supply IC42, driver IC 43 sides relatively dispose.That is, microcomputer 41, power supply IC42, driver IC 43 are configured in the space that is surrounded by the internal face of circuit substrate 4 and cover plate 7.

Utilize this configuration, the inner space of the electronic control package 1 that is formed by shell 3, radiator 5, cover plate 7 is divided into two parts by circuit substrate 4, promptly deposits the space A of high-current device; Deposit the space B of low current device.

At space A because deposit the high-current device that flows through big electric current, be the bigger high-current device of cal val, so the temperature of interior volume is higher.In contrast, in space B, owing to deposit the less low current device of cal val, and circuit substrate 4 plays the effect of thermal insulation material, separate with the heat of space A, so the temperature inside of space B is lower.

Microcomputer 41, power supply IC42 and driver IC 43 are small-sized, the high performance integrated circuits of packing into, and to compare cal val less with other current device.

Therefore, by with the space B of these cell configuration at low temperature, the temperature that can prevent is heated is caused rises.

Constitute in the device of electronic control package 1, temperature is minimum is non-exothermic body and the shell 3 that formed by the lower insulative resin of thermal conductivity.

Because comparatively prosperity of thermal boundary layer, therefore near the formation temperature low temperature space lower internal face near the internal face of shell 3 than other parts.In addition, mathematical is because internal face is neighbouring and the close together of extraneous gas, therefore to be easy to dispel the heat to extraneous gas.

That is,, then, therefore can promote heat radiation, suppress temperature and rise because current device is configured near the internal face of shell 3 if will be installed in the circumference that the current device of circuit substrate 4 is configured in circuit substrate 4.Particularly,, then, can more effectively dispel the heat, therefore can realize the miniaturization of electronic control package 1, high outputization, long lifetime because two faces of the internal face of current device and shell 3 are approaching if dispose current device in the corner portion of circuit substrate 4.

The front view of the circuit substrate 4 of present embodiment as shown in figure 17.

As shown in Figure 17, because cond 45 is configured in the corner portion of circuit substrate 4, be configured near the inwall corner portion of shell 3 when therefore assembling.

In addition, shunt resistance 47 also is configured in the edge part of circuit substrate 4, is configured in during assembling near the inwall of shell 3.

In addition, the device that is configured in the circumference of circuit substrate 4 is not limited to cond 45, shunt resistance 47, for example also can be coil 44, relay 46, microcomputer 41, power supply IC42, driver IC 43.

In addition, also a plurality of high-current devices, low current device can be configured in the circumference of circuit substrate 4 respectively.

In addition, as Figure 16, shown in Figure 17, cond 45 is approaching with the point of connection that is formed at the wiring on the circuit substrate 4 with point of connection that is formed at the wiring on the circuit substrate 4 and shunt resistance 47.Therefore, cond 45 and shunt resistance 47 approaching being configured on the circuit substrate 4.

If cond 45 is connected apart from elongated with shunt resistance 47, then the inductance of system becomes big, and it is big that noise becomes.Therefore, distance between being connected of cond 45 and shunt resistance 47 is configured in the 3mm.

In addition, radiator 5 is that alumite tunicle 52 constitutes by radiator body 51, the insulation tunicle that is formed at the surface of this radiator body 51.

Radiator 5 is that aluminium or aluminum alloy are extruded from mould, whole surface at the extrudate that forms is pre-formed alumite tunicle 52, thereby make the radiator raw MAT'L, this radiator raw MAT'L is cut into the length of expectation with cutting machine, machine ups such as enforcement perforate form.

In this manufacture method, owing to needn't form alumite tunicle 52 to each radiator, so Fabrication procedure obtains simplifying the manufacturing cost reduction.

It is the surface preparation that forms the oxide film thereon of insulativity by aluminium or aluminum alloy are carried out anodic oxidation treatment on the surface that alumite is handled.

The metallo-oxide film thereon generally has the higher radiance in 0.8 to 0.9 left and right sides.

That is,, therefore can obtain higher heat dispersion owing to can produce the heat radiation that heat radiation and radiation caused that the natural air cooling is caused on the surface of the radiator 5 of implementing the alumite processing.

Owing to radiator 5 is that the raw MAT'L cutting that forms alumite tunicle 52 is made, therefore do not implement alumite and handle at end face 5a.Because the radiance of common metal is about 0.1 to 0.2,, also can't obtain sufficient heat dispersion even therefore the end face 5a of radiator 5 is exposed externally.

Therefore, the internal face 3c of the end face 5a that makes radiator 5 and the peristome of the shell 3 of insulative resin system is near relative and dispose.

Figure 18, Figure 19 are the block diagrams that the position of end face 5a of internal face 3c and radiator 5 of the shell 3 of expression present embodiment concerns.

Insulative resin has the thermal emissivity rate more much higher than metal.In addition, the face area of shell 3 is compared enough big with the face area of the end face 5a of radiator 5.

Therefore, contact with the internal face 3c face of shell 3 by the end face 5a that makes radiator 5, a large amount of heat of radiator 5 is by end face 5a, flow to smoothly that dissipating area is big, the higher shell 3 of thermal emissivity rate, discharge to the outside by shell 3, directly expose externally with the end face 5a that makes radiator 5 and to compare, can obtain higher heat dispersion.

In addition, implement on the surface alumite tunicle 52 radiator 5 a side 5b as shown in figure 19, expose externally.

Because the radiator body 51 of radiator 5 is by thermal conductivity higher aluminium or aluminum alloy manufacturing, so the thermal resistance of radiator 5 self is roughly zero, can not bring obstacle.

In addition, since alumite tunicle 52 by aluminium oxide (Al ₂O ₃) form, and thickness is about 10 μ m, extremely thin, can think that therefore thermal resistance is roughly zero.

Radiator 5 forms alumite tunicle 52 on the surface except that end face 5a.

That is, also form alumite tunicle 52 at face that loads thyristor 2 and the face relative with terminal VS, GT1, OUT, GT2, the GND of thyristor 2.Alumite also has the effect as the insulation tunicle except having the effect as the oxide film thereon that improves radiance.

Thyristor 2 flows through higher electric current, but owing to form alumite tunicle 52 on the surface of radiator 5, therefore can prevent the short circuit with radiator 5.

In addition, near even just in case the defective insulation that crackle of generation alumite tunicle 52 etc. is caused thyristor 2, but because the surface of radiator 5 is by alumite tunicle 52 and shell 3 insulation, therefore the outside from electronic control package 1 can not produce electrical short with thyristor 2, can obtain the electronic control package 1 that insulating power improve.

In the present embodiment, use extrudate to make radiator 5, but also can use hot rolling or cold rolling sheet material to make.

In addition, the tunicle that will insulate is as alumite tunicle 52, but also can use the insulative resin that has carried out pre-plated film as the insulation tunicle.

And, also can carry out coating to the spreader surface of aluminium or aluminum alloy with coating.

When thyristor 2 is arranged on radiator 5, thermal conductive adhesive (not shown) is present between the alumite tunicle 52 of the radiating part of thyristor 2 and radiator 5, fix.On radiator 5 surface with radiating part, owing to exist less concavo-convexly, can produce trickle gap even therefore radiating part and radiator 5 are close to also, area of contact is than the area of contact that looks littler really.

If area of contact diminishes, then the thermal resistance of the heat-transfer path of heat to radiator 5 conduction time that is produced by thyristor 2 becomes big, therefore hinders distributing from the heat of thyristor 2.

Therefore, be present in the gap, the thermal resistance between thyristor 2 and the radiator 5 is reduced, promote heat dispersion by making thermal conductive adhesive.

In addition, thyristor 2 and radiator 5 be by being fixed by thermal conductive adhesive, even when for example electronic control package 1 being applied external force or producing vibration, the stress that is applied to the weld part of thyristor 2 also can diminish.

In addition, leaf spring 21 also plays the effect that thyristor 2 is fixed on shell 3 except playing the ground connection and radiator 5 bonded assembly effects with circuit substrate 4.

Figure 20 be expression leaf spring 21 with and the main portion block diagram of on every side device.

As Figure 14, Figure 16 and shown in Figure 20, the clamping part 21b of leaf spring 21 is buckled in the maintaining part 3b of shell 3, and is fixed on radiator 5 with screw 20, and shell 3 is existed therebetween.

At this moment, the press section 21a of leaf spring 21 is by the resin-encapsulated face that is pressed in thyristor 2.Consequently, thermal conductive adhesive is attenuation and expansion equably owing to pushing of leaf spring 21, can reduce the alumite tunicle 52 of radiator 5 and the thermal resistance deviation between the thyristor 2.

And, since thyristor 2 except the bonding force of thermal conductive adhesive also by leaf spring 21 by press fit, therefore can prevent because peeling off of the alumite tunicle 52 that the thermal expansion difference of radiator 5 and thyristor 2 produces and peeling off of alumite tunicle 52 that external force and vibration cause.

In addition, in the thyristor 2, radiating part is connected in internal electrical with electric bridge lead-out terminal OUT, but utilizes alumite tunicle 52 and high heat conduction lining cement and radiator 5 electrical isolations.

Cover plate 7 is deposited over the peristome of shell 3 by being shaped with the same insulative resin of shell 3 with the ultrasonic wave coating machine.

In addition, cover plate 7 and shell 3 deposited also can be that the vibration that utilizes the vibration cladding machine to carry out is deposited.

Vibrating deposited is to make cover plate 7 along cover plate 7 and the round vibration of the face direction of the face of joint of shell 3, utilizes friction heat that cover plate 7 is engaged with the mutual fusion of the resin of shell 3.

Vibrate the deposited bigger situation of face of joint that is applicable to cover plate 7 and shell 3.

In addition, also can carry out laser cladding, to replace the ultrasonic wave coating machine with the laser cladding machine.

During laser cladding, cover plate 7 is made of the bigger material of laser transmittance, and shell 3 is made of the higher material of laser absorption rate.

Then, if from cover plate 7 side irradiating lasers, then laser sees through cover plate 7, is absorbed heating at the face of joint laser of shell 3.Also to cover plate 7 sides conduction, cover plate 7 also can generate heat this heat, in the mutual fusion of face of joint of cover plate 7 and shell 3, deposited.

Laser cladding is in warpage or shrink in the bigger ester moulding, because of being difficult to aim at face of joint, the focus of laser can't use, but in warpage or shrink under the situation of less ester moulding, itself can not produce burr owing to deposited, can not produce vibration, therefore having can be to the such advantage of internal components transmitting vibrations.

As described above, electronic control package 1 according to present embodiment 1, owing to load thyristor 2 at radiator 5, therefore the thermal diffusivity of thyristor 2 improves, and, do not need power substrate necessary in the past, that be used to load thyristor 2, can reduce whole height, realize miniaturization.

In addition, on the circuit substrate 4, because a plurality of low current devices that comprise microcomputer 41 are installed at a face, the driving of these microcomputer 41 control thyristors 2, the a plurality of high-current devices that comprise cond 45 are installed at another side, high-current device and low current device are installed on a circuit substrate, are therefore further reduced whole height, realize miniaturization.

In addition, the less low current device of high-current device that cal val is bigger and cal val is distinguished by circuit substrate 4, suppresses can to make electronic control package 1 long lifetime from the influence to the more weak low current device of resistance to effect of heat of the heat of high-current device.

And, because low current device is installed in the face of the opposition side of the face relative with thyristor 2, therefore also suppressed influence from the heat of the thyristor 2 that flows through big electric current, make electronic control package 1 further long lifetime.

In addition, because cond 45, shunt resistance 47 are configured in the edge part of circuit substrate 4, so the thermal diffusivity of cond 45, shunt resistance 47 improves.

In addition, on the circuit substrate 4,, the inductance of system can be suppressed less, can suppress noise generation because shunt resistance 47 and cond 45, therefore can shorten the distance that is electrically connected of shunt resistance 47 and cond 45 near installing.

In addition, for radiator 5 since on the surface that is mounted with thyristor 2 with and the back side form alumite tunicle 52, so the thermal emissivity rate of radiator 5 improves the thermal radiation raising of radiator 5.

In addition, for radiator 5, owing to there is not the end face 5a that exposes of alumite tunicle 52 to contact with the internal face 3c face of shell 3, therefore a large amount of heat of radiator 5 is by end face 5a, flow to smoothly that dissipating area is big, the higher shell 3 of thermal emissivity rate, discharge to the outside by shell 3, the thermal diffusivity of radiator 5 improves.

In addition, for radiator 5, be roughly zero alumite tunicle 52 owing to forms thermal resistance, so the thermal diffusivity of radiator 5 is higher on the surface of the radiator body 51 that constitutes by higher aluminium of thermal conductivity or aluminum alloy.

In addition, therefore thyristor 2 reduces the thermal resistance between thyristor 2 and the radiator 5 owing to use thermal conductive adhesive to be fixed on the surface of alumite tunicle 52, and the thermal diffusivity of thyristor 2 improves.

In addition, when thyristor 2 is applied external force, can reduce stress, improve the associativity of thyristor 2 and radiator 5 weld part of thyristor 2.

In addition, thyristor 2 since by leaf spring 21 by being pressed in radiator 5, so thyristor 2 and radiator 5 mortise can prevent to cause peeling off of the thyristor 2 that produces because of between the two thermal expansion difference and external force, vibration.

In addition because leaf spring 21 is buckled in shell 3, and is fixed on radiator 5 by shell 3 usefulness screws 20, so leaf spring 21 can be really with thyristor 2 by being pressed in radiator 5.

Embodiment 2.

Figure 21 is the cutaway view of the main portion of the related electronic control package 1 of expression embodiments of the present invention 2.

What electronic control package 1 shown in Figure 21 was different with structure shown in Figure 15 is, the cond 45 of high-current device contacts with radiator 5 by intermediary 45a, and the microcomputer 41 of low current device, power supply IC42 and driver IC 43 contact with cover plate 7 by intermediary 41a, 42a, 43a respectively.

Other structures are identical with embodiment 1.

In the electronic control package 1 of embodiment shown in Figure 15 1, current device only contacts with circuit substrate 4 at the wiring pattern position, and the surface of other current device is exposed in the air of the enclosure interior that is formed by shell 3, radiator 5 and cover plate 7.

Therefore, the major part of the heat that is produced by current device is distributed in the inner air of shell 3.The thermal conductivity of air is 0.03W/mK at normal temperatures, compares less with the thermal conductivity of solid.

In addition, the inside of housing is closed, and the convection current of the air that produces in inside is because the temperature difference causes the caused free convection of density contrast of air.The flow velocity of free convection is generally below the 0.1m/s, and radiating effect is very poor.

That is, if there is air around current device, then thermal resistance increases, and heat dispersion significantly descends.

Therefore, by cond 45 is contacted with radiator 5 by intermediary 45a, microcomputer 41, power supply IC42 and driver IC 43 are contacted with cover plate 7 by intermediary 41a, 42a, 43a respectively, the Btu utilization heat conduction that produces from each current device is directly dispelled the heat to the outside, and do not depend on the convection current of the air that heat dispersion is lower.

But,, therefore be difficult to fully to guarantee the precision of the height of current device because current device is fixed on circuit substrate 4 with scolder.If highly lower, then can't be contacted effect fully, otherwise, if highly too high, then when assembling, can apply excessive power, thereby damage current device.

In addition, even if suppose to make current device, contact with radiator 5 or cover plate 7, but owing to exist a lot of small concavo-convexly on the surface of current device, therefore real area of contact is than the area of contact that looks littler.Because thermal resistance can become greatly if area of contact diminishes then, the result is difficult to obtain sufficient heat transfer property.

Therefore, as shown in figure 21, when current device is contacted with radiator 5 or cover plate 7, make to have gel or elastomeric material between the object, make the method for device contacts more effective like this.As the intermediary that meets this condition, for example can exemplify the grease of heat conductivity or thermal conductive adhesive, heat transfer sheet material, heat radiation rubber.

Because these matter utilization pressurizations can make its distortion, therefore if as the position coating of object or paste intermediary, then when assembling, by being clamped and pressurizing and deformation by current device and radiator 5 or cover plate 7, can fill up the gap, device is contacted each other.

In addition, intermediary 41a, the 42a of present embodiment, 43a, 45a are made of in grease, thermal conductive adhesive, heat transfer sheet material and the heat radiation rubber of heat conductivity any, and heat dispersion improves, and the rate of rise in temperature of current device is slowed down.

Electronic control package 1 since the detection direction dish turn to torque and then work, therefore repeat the unstable state work that current value switched in moment.

That is,, consider the more small current device of heat absorption capacity,, can cause that it produces unfavorable condition if temperature sharply rises though also supposition is that moment ground flows through big electric current.

In contrast, current device contacts by intermediary 41a, 42a, 43a, 45a with radiator 5 or cover plate 7, because the heat absorption capacity of current device increases in appearance, therefore can slow down the rate of rise in temperature of current device.

If the operation of the bearing circle in the same time, then owing to heat absorption capacity under the situation that has intermediary 41a, 42a, 43a, 45a is bigger, the rate of rise in temperature of current device is slack-off, so its result can make the temperature rising value reduce.

In addition, in the electronic control package 1 of embodiment shown in Figure 15 1,, therefore support the wiring pattern that has only of current device because current device only contacts with circuit substrate 4 at the wiring pattern position.So, in this constitutes, owing to need therefore might produce external force, vibrate the thermal stress that stress or het expansion caused that is caused, and make current device damage or peel off in very little position supporting current device.

In contrast, in the present embodiment, owing to intermediary 41a, 42a, 43a, 45a have gel or elastomeric characteristic, the area that therefore supports current device increases, and can reduce because the influence of the thermal stress that stress or het expansion caused of external force, vibration generation.

In addition, because the spring of intermediary 41a, 42a, 43a, 45a also can produce the effect that absorbs vibration, suppresses het expansion.

In addition, in the present embodiment, cond 45 is to contact with radiator 5 by intermediary 45a, but also can contact with shell 3.

In addition, be relay 46 for high-current device, the same with cond 45, also can contact with radiator 5 or shell 3 by intermediary.

More than, electronic control package 1 according to present embodiment 2, because cover plate 7 is installed in the end at shell 3, constitute housing by shell 3, radiator 5 and cover plate 7, high-current device, low current device in this housing contact by intermediary 41a, 42a, 43a, the 45a with heat conductivity with the internal face of housing, the Btu utilization heat conduction that produces from each current device is directly dispelled the heat to the outside, and do not depend on the convection current of the air that heat dispersion is lower.

In addition, because intermediary 41a, 42a, 43a, 45a are gel or elastomeric material, therefore when assembling, the deviation utilization in the gap between housing and high-current device, the low current device is out of shape and is absorbed, and can prevent that excessive power is applied to housing, high-current device and low current device.

In addition, in above-mentioned embodiment 1,2, expose in the exterior of radiator 5 and look like shown in Figure 19, be the plane, but also can the thermal diffusivity of radiator 5 be improved by radiating fin 5c is set as shown in figure 22.

In addition, each terminal VS, GT1, OUT, GT2, GND and splicing ear 11a, the 12a of

thyristor

2,13a, 14a are laser welding with

conductive plate

6a, 6b, 6c, 6d, engaging of 6e, but also can wait other welding methodes with resistance welding, TIG (tungsten inert gas (TIG)) welding.

In addition, also can engage with the super sonic beyond the welding.

In addition, for thyristor 2, be that the half-bridge that is integrated with high side MOSFET2H and downside MOSFET2L is contained in the packaging part, and, with two is one group of bridge circuit that is configured for the electric current of switching motor 22, but also can be that high side MOSFET2H and downside MOSFET2L constitute respectively separately, constitute bridge circuit by 4 thyristors 2.

In addition, also can be to constitute bridge circuit by 6 thyristors 2, form the structure of drive controlling three-phase brushless motor.

In addition, power device is a thyristor 2, but also can be other power devices such as diode, thyristor.

In addition, in the above-described embodiment, be the example that the electric type power steering device that is used for automobile has been described, but also can be used for the electronic control package that the electronic control package of anti-lock braking system (ABS), the electronic control package that air-conditioning is relevant etc. have the big electric current of processing (for example more than the 25A) of power device.

In addition, the size of each above-mentioned component part, shape and quantity are an example, are not limited to this size, shape and quantity certainly.

Claims

1. an electronic control package is characterized in that, comprising:

At both ends portion has the shell of the insulative resin system of peristome;

Be installed in a described end of this shell, at the radiator of the surperficial power loading device of shell side; And

The circuit substrate that is oppositely arranged with this radiator,

On the described circuit substrate, the a plurality of low current devices that comprise microcomputer are installed at a face, described microcomputer is controlled the driving of described power device, at another side a plurality of high-current devices that comprise cond is installed, and described cond absorbs the fluctuation of the electric current that flows through described power device.

2. an electronic control package is characterized in that, comprising:

At both ends portion has the shell of the insulative resin system of peristome;

The circuit substrate that is oppositely arranged with this radiator,

On the described circuit substrate, the a plurality of low current devices that comprise microcomputer are installed at a face, described microcomputer is controlled the driving of described power device, at another side a plurality of high-current devices that comprise shunt resistance is installed, and described shunt resistance detects the electric current that flows through described power device.

3. electronic control package as claimed in claim 1 or 2 is characterized in that, on the described circuit substrate, at the face of the opposition side of the face relative with described power device, described low current device is installed.

4. electronic control package as claimed in claim 1 or 2 is characterized in that, on the described circuit substrate, the electromagnetic noise that is produced when another described installation prevents to drive described power device is to the coil of external leaks.

5. electronic control package as claimed in claim 1 or 2 is characterized in that, on the described circuit substrate, and the relay that the electric current that will flow through described power device in another described installation switches on and off.

6. electronic control package as claimed in claim 1 or 2 is characterized in that, at least one current device in a plurality of described low current devices, a plurality of described high-current device is configured in the edge part of described circuit substrate.

7. electronic control package as claimed in claim 1 is characterized in that, on the described circuit substrate, flows through the shunt resistance of the electric current of described power device in another described installation and measuring, and is approaching with described cond.

8. electronic control package as claimed in claim 1 or 2 is characterized in that, described radiator on the surface that is mounted with described power device with and at least one side at the back side, be formed for improving the tunicle of thermal emissivity rate.

9. electronic control package as claimed in claim 8 is characterized in that, the end face that does not have described tunicle and expose of described radiator contacts with the internal face face of described shell.

10. electronic control package as claimed in claim 8 is characterized in that, described tunicle is the alumite tunicle.

11. electronic control package as claimed in claim 1 or 2 is characterized in that, the face at the opposition side of the face of the described power device of loading of described radiator forms radiating fin.

12. each the described electronic control package as in the claim 1,2 and 7 is characterized in that the radiator body of described radiator is made of aluminium or aluminum alloy.

13. electronic control package as claimed in claim 8 is characterized in that, described power device is fixed on the surface of described tunicle by thermal conductive adhesive.

14. each the described electronic control package as in the claim 1,2 and 7 is characterized in that, described power device by leaf spring by being pressed in described radiator.

15. electronic control package as claimed in claim 14 is characterized in that, described leaf spring is buckled in described shell, and is fixed on described radiator with screw by described shell.

16. each the described electronic control package as in the claim 1,2 and 7 is characterized in that, in another described end of described shell cover plate is installed, and constitutes housing by described shell, described radiator and described cover plate,

Described high-current device, at least one current device in the described low current device in this housing contact with the internal face of described housing by the intermediary with heat conductivity.

17. electronic control package as claimed in claim 16 is characterized in that, described intermediary is gel or elastomeric material.

18. each the described electronic control package as in the claim 1,2 and 7 is characterized in that described power device is a thyristor.

19. each the described electronic control package as in the claim 1,2 and 7 is characterized in that described electronic control package is an electric type power steering device.