KR20100132408A - Electronic control apparatus - Google Patents

Abstract

PURPOSE: An electronic control device for preventing a press-fitting load applying to a weld part is provided to reduce a time and cost and simplify a structure due to mounting a part of high current to the other surface. CONSTITUTION: An electronic control device includes a heat-insulating resin housing(3) of an insulating resin agent, a heat sink(5), and a circuit board(4). The housing has the opening. The heat sink is attached to one end part of the housing. A semiconductor switching element(2) is loaded in the surface of the heat sink of the housing. The circuit board is opposite to the heat sink. A plurality of low current parts is mounted in one side of the circuit board. A plurality of high current parts is mounted in the other side of the circuit board.

Description

Electronic control device {ELECTRONIC CONTROL APPARATUS}

TECHNICAL FIELD This invention relates to the electronic control apparatus used for the electric power steering apparatus which adds auxiliary to the steering apparatus of a vehicle by the rotational force of an electric motor, for example.

BACKGROUND ART Conventionally, an electronic control apparatus is known in which a semiconductor switching element (FET) which is a power device is mounted on a metal substrate, and a connecting member for electrically connecting the metal substrate and components other than the metal substrate is attached on the metal substrate. .

For example, the electronic control apparatus described in patent document 1 is a power board | substrate with which the bridge circuit which consists of semiconductor switching elements for switching the electric current of an electric motor, a conductive plate, etc. are insert-molded in insulating resin, and a large current A housing on which components are mounted, a control board on which small current components such as a microcomputer are mounted, a connecting member electrically connecting the power board, the housing and the control board, a heat sink in close contact with the power board, and a power board And a case attached to the heat sink while being press-molded with a metal plate to cover the housing and the control board.

Prior art document (patent document 1): Patent No. 3644835 (FIG. 2)

In the electronic control apparatus described in Patent Document 1, a power substrate on which a semiconductor switching element is mounted, a housing on which a large current component is mounted, and a control substrate on which a small current component is mounted are required, respectively. There is a problem that high cost is generated.

This invention makes it a subject to solve the above-mentioned problems, and provides an electronic control apparatus which enabled high output and high lifetime in addition to size reduction, simplicity, and cost reduction.

An electronic control device according to the present invention includes a heat insulating resin housing having openings at both ends, a heat sink attached to one end of the housing, and having a power device mounted on a surface of the housing side; A circuit board provided to face each other, wherein the circuit board includes a plurality of small current components including a microcomputer for controlling the driving of the power device on one surface thereof, and flowing the power device on the other surface. A plurality of high current components including a capacitor that absorbs the ripple of the current are mounted.

Moreover, the electronic control apparatus which concerns on this invention is the housing made of insulating resin which has an opening part in both ends, the heat sink attached to the said one end of this housing, and the power device was mounted in the housing side surface, and this heat sink. And a circuit board provided opposite to the circuit board, wherein the circuit board includes a plurality of small current components including a microcomputer for controlling driving of the power device on one surface thereof, and on the other surface of the power device. A plurality of high current components including a shunt resistor for detecting a flowing current are mounted.

According to the electronic control apparatus according to the present invention, since the power device is mounted in the heat sink, a small current component is mounted on one surface of the circuit board, and a large current component is mounted on the other surface. In addition to reduction in cost and cost, high output and high service life can be achieved.

Embodiment 1

EMBODIMENT OF THE INVENTION Hereinafter, although embodiment of this invention is described based on drawing, in the figure, the same or equivalent member, a site | part is attached | subjected and demonstrated with the same code | symbol.

In this embodiment, the electronic control apparatus 1 used for the electric power steering apparatus auxiliary added to the steering apparatus of a vehicle by the rotational force of an electric motor is demonstrated to an example.

1 is an exploded perspective view showing the electronic control device 1 according to Embodiment 1 of the present invention, and FIG. 2 is an exploded perspective view showing the electronic control device 1 shown in FIG. 1 when viewed from above and below. 3 is a side view showing the vehicle connector 8 side of the electronic control apparatus 1 of FIG. 1, and FIG. 4 is a motor connector 9 and a sensor connector 10 of the electronic control apparatus 1 of FIG. 1. ) Side view, FIG. 5 is a perspective view showing the housing 3 of the electronic control apparatus 1 of FIG. 1 in a direction in which the heat sink 5 is attached, FIG. 6 is an enlarged view of a main part of FIG. 7 is a block diagram of the electronic control apparatus 1 of FIG. 1, and FIG. 8 is a cross-sectional view of the electronic control apparatus 1 of FIG. 1.

The electronic control device 1 is attached to a housing 3 made of an insulating resin having openings at both ends, and a screw 20 at one end of the housing 3, and an insulating film is formed on the surface thereof. The heat sink 5 made of aluminum, the semiconductor switching element 2 which is a power device mounted in this heat sink 5, and was pressed by the leaf spring 21 to the heat sink 5 side, and the heat sink ( A circuit board 4 provided opposite to 5) and a cover 7 in which the semiconductor switching element 2 and the circuit board 4 are stored in cooperation with the heat sink 5 are provided.

On the surface of the cover 7 side of the circuit board 4, a plurality of small current components through which a small current for a signal flows are mounted by soldering. As shown in Fig. 1, the small current component calculates an auxiliary torque based on the steering torque of the steering wheel and the vehicle speed of the vehicle, and feeds back the motor current to generate a drive signal corresponding to the auxiliary torque. The power supply IC 42 which drives the microcomputer 41, the electronic control apparatus 1, and the driver IC 43 which controls the operation of the semiconductor switching element 2 are respectively corresponded.

On the surface of the heat sink 5 side of the circuit board 4, a plurality of high current components through which a large current for motor driving flows are mounted by soldering. As shown in FIG. 2, the large current component includes a current flowing through the coil 44 and the semiconductor switching element 2, which prevents the electromagnetic noise generated during the switching operation of the semiconductor switching element 2 from leaking to the outside. Condenser 45 absorbing the ripple of the circuit, relay 46 for opening and closing the motor current supplied to the electric motor 22 from the battery 24 via the semiconductor switching element 2 of the bridge circuit, the semiconductor switching element 2 The shunt resistor 47 which detects the current flowing in it is equivalent.

The current circuit of the circuit board 4 is electrically connected to a bridge circuit constituted by the semiconductor switching element 2, the coil 44, the capacitor 45, the relay 46, and the shunt resistor 47. A high current circuit composed of a pattern and flowing with a large current for driving a motor, and electrically connected to the microcomputer 41, the power supply IC 42, and the driver IC 43, and constituted by a wiring pattern, the small current for the signal It consists of a flowing small current circuit.

In addition, the electronic control apparatus 1 is provided on one side of the housing 3, is provided on the vehicle connector 8 electrically connected to the wiring of the vehicle, and on the other side of the housing 3, and is provided with an electric motor ( A motor connector 9 electrically connected to 22 and a sensor connector 10 adjacent to the motor connector 9 and electrically connected to the torque sensor 23 are provided.

As shown in FIG. 3, the vehicle connector 8 includes a power connector terminal 11 formed of 0.8 mm of copper or a copper alloy electrically connected to the battery 24 of the vehicle, and wiring of the vehicle. Phosphor bronze signal connector terminals 12 having a thickness of 0.64 mm through which signals are input and output are provided.

In addition, as shown in FIG. 4, the motor connector 9 includes a copper alloy having a high electric conductivity of 0.8 mm or a motor connector terminal 13 made of phosphor bronze, and the sensor connector 10 has a thickness. A 0.64 mm phosphor bronze sensor connector terminal 14 is provided.

In addition, as shown in FIG. 5, the electronic control device 1 electrically connects the circuit board 4 and the semiconductor switching element 2 while the base portion is integrated with the housing 3 by insert molding. In addition, the power conductive plate 6a, the output conductive plate 6b, and the signal conductive plate 6c, and the base are integrated with the housing 3 by insert molding, and the circuit board 4 and the power connector terminal The conductive plate 6d which electrically connected 11 was provided.

Moreover, the electronic control apparatus 1 heats the electrically conductive board 6e which electrically connected the circuit board 4, the signal connector terminal 12, and the sensor connector terminal 14, and the ground of the circuit board 4 to heat. A supporting member 6f having a role of connecting to the sink 5 is provided.

Components such as the power connector terminal 11, the signal connector terminal 12, the motor connector terminal 13, and the sensor connector terminal 14 include a power conductive plate 6a, an output conductive plate 6b, and a signal conductive plate. When the 6c, the conductive plates 6d and 6e, and the support member 6f are insert-molded to form the housing 3, they are insert-molded at the same time, respectively, and the vehicle connector 8, the motor connector 9, and the sensor connector 10 is formed integrally with the housing 3.

Moreover, the attachment leg part 3L for attaching the electronic control apparatus 1 to the vehicle which is a skin body is formed in the side surface of the opening side on the opposite side to the opening part of the housing 3 with the heat sink 5 attached. .

Each terminal of the pair of semiconductor switching elements 2 in parallel is a power supply terminal VS, a gate terminal GT1 of a high side M0SFET 2H, a bridge output terminal OUT, and a row from the right in FIG. The gate terminals GT2 and the ground terminals GND of the side M0SFET 2L are arranged in this order.

Here, the power supply terminal VS, the bridge output terminal OUT, and the ground terminal GND are terminals for high current and gate terminals GT1 through which a large current of about 50 A flows up to operate the electric motor 22. The gate terminal GT2 is a small current terminal through which a small current for a signal of up to about 3 A flows, and a large current terminal and a small current terminal are alternately arranged.

Each terminal 0UT of the parallel semiconductor switching elements 2 is bent in the same shape in a crank shape standing up and insulated at two positions in the middle portion, as shown in FIG. Each is derived. This also applies to the other terminals VS, GT1, GT2, and GND.

The terminals VS, GT1, OUT, GT2, and GND of the semiconductor switching element 2 are formed with a width of 0.8 mm, a thickness of 0.5 mm, and a gap of terminals of 1.7 mm.

As shown in Fig. 7, the semiconductor switching element 2 has a high side M0SFET 2H and a low side M0SFET 2L integrated with each other to form a half bridge. In addition, while the half bridge is accommodated in one package, the semiconductor switching element 2 constitutes a pair and constitutes the bridge circuit for switching the electric current of the electric motor 22. As shown in FIG.

5 and 6, the housing 3 is provided with a positioning part 3d for positioning the main body of the semiconductor switching element 2 and the housing 3. The taper is formed in the front-end | tip part of this positioning part 3d, The hole 2a provided in the heat spreader part of the semiconductor switching element 2 is guided and inserted in this taper part, and positioning is performed. The positioning unit 3d serves as positioning in the derivation direction of each terminal VS, GT1, OUT, GT2, and GND.

Moreover, the positioning part 3e which performs positioning of each terminal VS, GT1, OUT, GT2, GND and the electroconductive plates 6a, 6b, 6c is similarly formed in the housing 3. The positioning unit 3e performs positioning in the direction perpendicular to the derivation direction of the terminals VS, GT1, OUT, GT2, and GND. The positioning portion 3e is formed outside the terminals VS and GND at both ends of the semiconductor switching element 2, and a taper is formed at the tip portion. The taper portion guides the outside of the terminals VS and GND of the semiconductor switching element 2 to position each terminal VS, GT1, OUT, GT2, GND and the conductive plates 6a, 6b, 6c. This is done.

As shown in FIG. 6, the conductive plates 6a, 6b, 6c are arranged so as to extend in the derivation direction from which the terminals VS, GT1, OUT, GT2, and GND of the semiconductor switching element 2 are drawn out. (VS, GT1, OUT, GT2, GND) and the conductive plates 6a, 6b, 6c are disposed on the surface facing the heat sink 5.

After positioning and fixing the semiconductor switching element 2 with the positioning portions 3d and 3e, the respective terminals VS, GT1, OUT, GT2, GND and the conductive plates 6a, 6b, 6c are laser welded, for example. Is welded.

Laser welding is performed by irradiating the laser LB toward the surface of the terminals VS, GT1, OUT, GT2, and GND in the direction in which the heat sink 5 is attached before the heat sink 5 is attached.

As shown in FIG. 6, the base end part of the power conductive plate 6a is connected to the front end part of the supply power supply terminal VS and the ground terminal GND of the semiconductor switching element 2, respectively. The base end of the output conductive plate 6b is connected to the tip end of the bridge output terminal OUT. The proximal end of the signal conductive plate 6c is connected to the distal end of the gate terminals GT1 and GT2, respectively.

9 is a perspective view of the conductive plates 6a, 6b and 6c and the peripheral parts connected thereto.

Press-fit terminals 6ap, 6bp, 6cp are formed in the conductive plates 6a, 6b, 6c, respectively. The circuit board 4 is provided with a wiring pattern made of copper foil and a plurality of through holes 4a which are made of copper plating on the inner surface and electrically connected to the wiring pattern, and press-fit terminals 6ap, 6bp, and 6cp. The temporary holes are pressed into the respective through holes 4a of the circuit board 4 so that the terminals VS, GT1, OUT, GT2, and GND of the semiconductor switching element 2 and the wiring patterns of the circuit board 4 are electrically connected. It is.

The power conductive plate 6a and the output conductive plate 6b are formed of rolled copper or copper alloy. However, when the conductive plates 6a and 6b and the terminals VS, OUT and GND of the semiconductor switching element 2 are welded, a large current flows through the conductive plates 6a and 6b, so that the conductive plates 6a and 6b It is necessary to secure sufficient volume.

However, in terms of the formation of the press fit terminal and the press working, it is difficult to thicken the plate thickness. Therefore, in this embodiment, the plate | board thickness of the electroconductive plates 6a and 6b which are power conductive plates is set to 0.8 mm equal to the width | variety of the terminal VS, OUT, GND, and plate | board width is formed wider than plate thickness. The terminals VS, OUT, and GND of the semiconductor switching element 2 are welded.

In addition, since a small current flows in the signal conductive plate 6c, it is not necessary to consider the reduction in the electrical resistance, but is formed of the same plate material as the power conductive plate 6a and the output conductive plate 6b for which the large current flows. have.

8 and 9, the bridge output terminal OUT of the semiconductor switching element 2 is connected to the output conductive plate 6b.

Moreover, the edge part 13a of the motor connector terminal 13 is connected to the opposite end part of a base end part. And similarly to the output conductive plate 6b and the bridge output terminal OUT of the semiconductor switching element 2 connected, the end part 13a of the motor connector terminal 13 is the end part of the output conductive plate 6b. It is arrange | positioned on the surface which opposes the heat sink 5, and the laser LB is irradiated and welded toward the surface of the motor connector terminal 13 in the direction to which the heat sink 5 is attached.

The motor current from the bridge output terminal OUT of the semiconductor switching element 2 is configured to flow directly to the electric motor 22 via the motor connector terminal 13 without passing through the circuit board 4. .

In the middle portion of the output conductive plate 6b, a press fit terminal 6bp extending toward the circuit board 4 is formed, and a signal for monitoring the voltage of the motor connector terminal 13 is provided on the circuit board 4. Is output.

10 is a perspective view of the power supply conductive plate 6d and the peripheral parts connected thereto.

As shown to FIG. 8, FIG. 10, the edge part 11a of the power supply connector terminal 11 is connected to 6d of power supply electrically conductive plates. The power supply connector terminal 11 faces the heat sink 5 at the end of the power conducting plate 6d similarly as the output conductive plate 6b and the end 13a of the motor connector terminal 13 are connected. It is arrange | positioned at the surface, and the laser LB is irradiated and welded toward the surface of the edge part 11a of the power supply connector terminal 11 in the direction to which the heat sink 5 is attached.

The press-fit terminal 6dp which extends toward the circuit board 4 is formed in the intermediate part of the power supply conductive plate 6d, and this press-fit terminal 6dp is provided in the through-hole 4a of the circuit board 4; It is press-fitted and electrically connected with the wiring pattern of the circuit board 4. The current of the battery 24 is supplied to the circuit board 4 via the power supply connector terminal 11, the power supply conductive plate 6d, and the press fit terminal 6dp.

FIG. 11 is a cross-sectional view parallel to FIG. 8 and cut along the vehicle connector 8 and the sensor connector 10. FIG. 12 is a perspective view of each conductive plate 6e and the peripheral parts connected thereto.

As shown in FIG. 11, FIG. 12, the electrically conductive board 6e overlaps with the edge part 12a, 14a of the signal connector terminal 12 and the sensor connector terminal 14, and this joint surface is the heat sink 5 In the vicinity, it is also formed in parallel with the heat sink 5.

At this time, the signal connector terminal 12 and the end portions 12a and 14a of the sensor connector terminal 14 are disposed on the heat sink 5 side, and in the direction in which the heat sink 5 is attached, the signal connector terminal 12 The laser LB is irradiated and welded toward the surface of the edge part 12a of the () and the edge part 14a of the sensor connector terminal 14.

In the conductive plate 6e, a press fit terminal 6ep is formed at an end opposite to the welded portion, and the press fit terminal 6ep is press-fitted into the through hole 4b of the circuit board 4, The signal connector terminal 12 and the sensor connector terminal 14 connected to the conductive plate 6e are electrically connected to the wiring pattern of the circuit board 4.

FIG. 13 is a perspective view of the supporting member 6f and the peripheral parts connected to the supporting member 6f, and FIG. 14 is a sectional view taken along the center of the supporting member 6f, parallel to FIG. 8.

The supporting member 6f has a function of connecting the ground of the circuit board 4 to the heat sink 5. However, since the insulating film 52 is formed on the surface of the heat sink 5, the supporting member 6f cannot directly contact the heat sink. Therefore, the circuit board 4 and the heat sink 5 are electrically connected through the screw 20 and the leaf spring 21.

The leaf spring 21 shown in FIG. 13 is formed of conductors, such as a stainless steel plate for springs, phosphor bronze for springs, and the slit 21s is provided in the end. The supporting member 6f is electrically connected to the leaf member 6f by being press-fitted to the slit 2ls. The leaf spring 21 to which the supporting member 6f is fixed is arrange | positioned between the head of the housing 3 and the screw 20, as shown in FIG. 14, and the heat sink 5 with the housing 3 is carried out. Fastening to is fixed.

Since the insulation process is not performed in the screw hole provided in the heat sink 5, the support member 6f and the heat sink 5 are electrically connected.

The press-fit terminal 6fp is formed in the front-end | tip part at the support member 6f, and the press-fit terminal 6fp is press-fitted into the through hole 4a of the circuit board 4. As shown in FIG.

By this structure, the wiring pattern of the circuit board 4 and the heat sink 5 are electrically connected via the press fit terminal 6fp, the support member 6f, the leaf spring 21, and the screw 20. have.

As shown in FIG. 8, FIG. 11, in this embodiment, press-fit terminals 6ap, 6bp, 6cp, 6dp, 6ep are arrange | positioned at the cover 7 side, and a laser welding part is a heat sink 5 side. Is placed on.

This configuration increases the distance between the press-fit terminals 6ap, 6bp, 6cp, 6dp, and 6ep and the laser welding part, so that the effects of heat, reflected light, and shielding gas generated during laser welding are influenced by the press-fit terminals ( 6ap, 6bp, 6cp, 6dp, 6ep).

In addition, since the insulating resin 3a and the circuit board 4 are interposed between the press fit terminals 6ap, 6bp, 6cp, 6dp and 6ep and the laser welding portion, the reflected light generated during laser welding is press fit. It is difficult to reach the terminals 6ap, 6bp, 6cp, 6dp and 6ep.

In addition, each terminal VS, GT1, OUT, GT2, GND, 11, 12, 13, 14 is each center of the press-fit terminal 6ap, 6bp, 6cp, 6dp, 6ep (for example, the dotted line of FIG. 11). It is welded to the conductive plates 6a, 6b, 6c, 6d, and 6e at the line-shaped welding sites parallel to the centerline passing through the cross-section. In this way, the circuit board 4 of the press-fit terminals 6ap, 6bp, 6cp, 6dp, 6ep is made by setting the welded portion away from each center of the press-fit terminals 6ap, 6bp, .6cp, 6dp, 6ep. It is possible to prevent the press-in load at the time of press-fitting against the directly acting on the welded portion, and to prevent distortion or peeling of the welded portion.

The press-fit terminals 6ap, 6bp, 6cp, 6dp, 6ep and 6fp are press-fitted into the through hole 4a and mechanically supported.

Moreover, since the base part of each electrically conductive plate 6a, 6b, 6c, 6d, 6e, 6f is insert-molded in the insulating resin 3a of the housing | casing 3, press-fit terminal 6ap, 6bp, 6cp, 6dp is carried out. , 6ep and 6fp are press-fitted into the circuit board 4, the insulating resin 3a is interposed between the heat sink 5 as shown in FIGS. 8, 11 and 14. The heat sink 5 can be received. However, some gaps arise between the insulating resin 3a and the heat sink 5 by manufacturing precision.

The press fit indentation is important for the relative height accuracy of the press fit terminals 6ap, 6bp, 6cp, 6dp, 6ep and 6fp, and the circuit board 4, but in the slight gap between the insulating resin 3a and the heat sink 5, Since this relative height precision deteriorates by this, an adhesive agent (not shown) is apply | coated to this clearance gap, and the influence of this clearance is removed.

In the present embodiment, two press-fit terminals 6ap are provided for the power conductive plate 6a, one press-fit terminal 6bp is provided for the output conductive plate 6b, and press-fits for the signal conductive plate 6c. One terminal 6cp is formed, respectively, and seven press-fit terminals 6ap, 6bp, 6cp are arranged for one semiconductor switching element 2.

In addition, by arranging the press-fit terminals 6ap, 6bp, 6cp of the adjacent conductive plates 6a, 6b, 6c in a zigzag pattern, the distance between the press-fit terminals 6ap, 6bp, 6cp is increased, and each terminal is made larger. The short circuit between (6a, 6b, 6c) is prevented.

In the conductive plate 6d, two press-fit terminals 6dp are formed for one power connector terminal, and the conductive plate 6e has six press-fit terminals connected to the signal connector terminal 12, Five press-fit terminals connected to the sensor connector terminal 14 are provided with a total of 11 press-fit terminals 6ep.

In addition, one press-fit terminal 6fp is formed in the supporting member 6f. The hole diameter of the through hole 4a of the circuit board 4 into which the press fit terminals 6ap, 6bp, 6cp, 6dp and 6fp are press-fitted is 1.45 mm, and the through hole 4b into which the press fit terminal 6ep is press-fitted. The hole diameter is formed to 1 mm.

In the electronic control apparatus 1 of the said structure, when the microcomputer 41 produces | generates a drive signal, electric current will flow through a circuit and heat will generate | occur | produce in each part. At this time, the heat generation amounts of the coil 44, the condenser 45, the relay 46, and the shunt resistor 47, which are electrically connected to the large current circuit, are the microcomputer 41, which is electrically connected to the small current circuit. It is larger than the heat generation amount of the power supply IC 42 and the driver IC 43. When these components are arranged in the same space, the microcomputer 41, the power supply IC 42, and the driver IC 43, which generate little heat, the coil 44, the condenser 45, the relay 46, which generate a large amount of heat, The temperature rises under the influence of the heat generated from the shunt resistor 47.

In the present embodiment, the coil 44, the capacitor 45, the relay 46, and the shunt resistor 47, which are large current components, are the microcomputer 41, the power supply IC 42, and the driver, which are small current components. The coil 44, the condenser 45, and the relay 46 are mounted on the surface opposite to the surface of the circuit board 4 on which the IC 43 is mounted, and the switching element 2 of the heat sink 5 is provided. ) Is disposed on the circuit board 4 so as to face the mounted surface.

15 and 16 show the positional relationship of the current components on the circuit board 4 according to the present embodiment. FIG. 15 shows another cross section parallel to FIG. 8, and FIG. 16 shows a cross section cut in a direction perpendicular to FIG. 15.

As shown in FIG. 15, the coil 44, the condenser 45, and the relay 46 are disposed in a space surrounded by the inner wall surfaces of the circuit board 4, the heat sink 5, and the housing 3. .

Moreover, as shown in FIG. 16, the semiconductor switching element 2 mounted in the shunt resistor 47 and the heat sink 5 is also arrange | positioned in the same space.

The surface of the circuit board 4 on the side on which the microcomputer 41, the power supply IC 42, and the driver IC 43, which are the small current components, are mounted is disposed to face the cover 7. That is, the microcomputer 41, the power supply IC 42, and the driver IC 43 are arranged in a space surrounded by the inner wall surfaces of the circuit board 4 and the cover 7.

By this arrangement, the internal space of the electronic control device 1 formed by the housing 3, the heat sink 5, and the cover 7 is a space A in which a large current component is stored by the circuit board 4. ) And the space B in which the small current component is stored.

In the space A, since a large current component through which a large current flows, that is, a large current component having a large amount of heat generation, is stored, the temperature inside the space increases. On the other hand, in the space B, a small current component having a small heat generation amount is stored, and the circuit board 4 plays a role of a heat insulating material and insulates the heat of the space A, so that the space B The temperature is lowered.

The microcomputer 41, the power supply IC 42, and the driver IC 43 have a small, high-performance integrated circuit assembled therein, and are less susceptible to heat than other current components.

Therefore, by arranging these parts in the low-temperature space B, it is possible to prevent the temperature rise due to hydrothermal.

Among the components constituting the electronic control device 1, the lowest temperature is the housing 3 formed of a non-heating element and an insulating resin having a low thermal conductivity.

Since a temperature boundary layer develops in the vicinity of the inner wall surface of the housing 3, a low-temperature space with a lower temperature than other parts is formed in the vicinity of the inner wall surface. Moreover, of course, since the distance to the outside air becomes close to the inner wall, the heat radiation to the outside air is easily performed.

That is, when the current component mounted on the circuit board 4 is disposed at the periphery of the circuit board 4, the current component is arranged near the inner wall surface of the housing 3, so that heat dissipation is promoted and the temperature is increased. The rise can be suppressed. Particularly, when the current component is placed at the corner of the circuit board 4, the current component is brought closer to two surfaces of the inner wall surface of the housing 3, and the heat dissipation can be more effectively conducted. Miniaturization, high output, and long life can be achieved.

17 is a front view of the circuit board 4 in the present embodiment.

As can be seen from FIG. 17, since the condenser 45 is disposed at the corner portion of the circuit board 4, it is disposed near the inner wall edge portion of the housing 3 during assembly.

In addition, the shunt resistor 47 is also arranged at the edge of the circuit board 4, and is disposed near the inner wall of the housing 3 during assembly.

In addition, the component arrange | positioned at the periphery of the circuit board 4 is not limited to the capacitor | condenser 45 and the shunt resistor 47, For example, the coil 44, the relay 46, the microcomputer 41, a power supply. Even the IC 42 and the driver IC 43 have no problem.

In addition, there is no problem even if a plurality of large current components and small current components are arranged at the periphery of the circuit board 4, respectively.

16 and 17, the connection point between the capacitor 45 and the wiring formed on the circuit board 4, and the connection point between the shunt resistor 47 and the wiring formed on the circuit board 4. This is approaching. Therefore, the capacitor | condenser 45 and the shunt resistor 47 are arrange | positioned on the circuit board 4 in proximity.

When the connection distance between the capacitor | condenser 45 and the shunt resistor 47 becomes long, the inductance of a system will become large and noise will become large. Therefore, the distance between the connection of the capacitor | condenser 45 and the shunt resistor 47 is arrange | positioned within 3 mm.

In addition, the heat sink 5 is comprised from the heat sink main body 51 and the alumite film 52 which is an insulating film formed in the surface of this heat sink main body 51.

The heat sink 5 manufactures the heat sink material which previously formed the alumite film 52 in the whole surface of the extruded shape material formed by extruding aluminum or an aluminum alloy from the die, and makes this heat sink material a cutter. It is formed by cutting to length and performing machining such as drilling.

In this manufacturing method, since it is not necessary to form the alumite film 52 for each heat sink, a manufacturing process is simplified and manufacturing cost is reduced.

Alumite is a surface treatment method which forms an insulating oxide film on the surface by anodizing aluminum or an aluminum alloy.

The oxide film of metal generally has a high emissivity of about 0.8 to 0.9.

That is, since the heat radiation by natural air cooling and the heat radiation by radiation generate | occur | produce on the surface of the heat sink 5 to which the anodization process was performed, high heat dissipation performance can be obtained.

Since the heat sink 5 is manufactured by cutting the raw material on which the alumite film 52 was formed, the alumite treatment is not performed on the end surface 5a. In general, since the emissivity of the metal is about 0.1 to 0.2, sufficient heat dissipation performance cannot be obtained even when the end surface 5a of the heat sink 5 is exposed to the outside. Therefore, the end surface 5a of the heat sink 5 is arrange | positioned to face the inner wall surface 3c of the opening part of the housing | casing 3 made of insulating resin closely.

18 and 19 show perspective views showing the positional relationship between the inner wall surface 3c of the housing 3 and the end face 5a of the heat sink 5 in the present embodiment.

The insulating resin has a sufficiently high thermal emissivity compared to the metal. In addition, the surface area of the housing 3 is sufficiently large compared with the surface area of the end surface 5a of the heat sink 5.

Therefore, by surface-contacting the end surface 5a of the heat sink 5 and the inner wall surface 3c of the housing 3, a large amount of heat of the heat sink 5 has a large heat dissipation area through the end surface 5a. The heat dissipation performance of the heat sink 5 can be smoothly flowed to the housing 3 having a high thermal emissivity, discharged to the outside through the housing 3, and the heat dissipation performance is higher than that of the heat sink 5 directly exposed to the outside. have.

Moreover, one side surface 5b of the heat sink 5 in which the alumite coating 52 was applied to the surface is configured to be exposed to the outside as shown in FIG. 19.

Since the heat sink 5 is made of aluminum or an aluminum alloy having high thermal conductivity, the heat sink 5 has almost no thermal resistance of the heat sink 5 itself.

The aluminite coating 52 is made of alumina oxide (Al ₂ O ₃ ), and the film thickness is very thin, about 10 μm, so that the thermal resistance can be regarded as almost zero.

In the heat sink 5, except for the end surface 5a, the alumite film 52 is formed in the surface.

That is, the alumite film 52 is formed also on the surface where the semiconductor switching element 2 is mounted, and on the surface of the semiconductor switching element 2 facing the terminals VS, GT1, OUT, GT2, and GND. Alumite has a role as an insulating film in addition to the role as an oxide film which improves emissivity.

In the semiconductor switching element 2, although a high current flows, since the alumite film 52 is formed on the surface of the heat sink 5, the short circuit with the heat sink 5 can be prevented.

In addition, even in the vicinity of the semiconductor switching element 2, even if an insulation failure occurs due to a crack of the alumite film 52 or the like, the surface of the heat sink 5 is insulated by the alumite film 52 and the housing 3. As a result, the electronic control device 1 can be obtained from the outside of the electronic control device 1 with no short-circuit electrically connected to the semiconductor switching element 2 and with improved insulation performance.

In the present embodiment, the heat sink 5 is manufactured using an extruded shape member, but may be manufactured using a hot or cold rolled sheet material.

In addition, although the insulating film was made into the alumite film 52, you may use precoat insulating resin as an insulating film.

Moreover, you may coat the heat sink surface of aluminum or an aluminum alloy with paint.

When the semiconductor switching element 2 is provided in the heat sink 5, a thermally conductive adhesive (not shown) is interposed between the heat spreader portion of the semiconductor switching element 2 and the alumite film 52 of the heat sink 5. Fix it. Since small irregularities exist on the surfaces of the heat sink 5 and the heat spreader, a slight gap occurs even when the heat spreader portion is in close contact with the heat sink 5, and the true contact area is smaller than the external contact area.

When the contact area becomes small, heat resistance in the heat transfer path when heat generated in the semiconductor switching element 2 is transferred to the heat sink 5 increases, so that heat radiation from the semiconductor switching element 2 is reduced. Is disturbed.

Therefore, by interposing a thermally conductive adhesive in the gap, the thermal resistance between the semiconductor switching element 2 and the heat sink 5 can be reduced, and the heat dissipation performance can be promoted.

In addition, when the semiconductor switching element 2 and the heat sink 5 are fixed with a thermally conductive adhesive, for example, when an external force is applied to the electronic control device 1 or vibration occurs, the semiconductor switching element 2 The stress exerted on the welded portion of M becomes small.

In addition to the role of connecting the ground of the circuit board 4 and the heat sink 5, the leaf spring 21 has a role of fixing the semiconductor switching element 2 to the housing 3.

The perspective view of the principal part which showed the leaf spring 21 and the components around it is shown in FIG.

As shown in FIG. 14, FIG. 16, and FIG. 20, the engagement fixing part 21b of the leaf spring 21 is fixed to the support part 3b of the housing 3, and interposes the housing 3 via it. The screw 20 is fixed to the heat sink 5.

At this time, the pressing part 21a of the leaf spring 21 is pressed against the resin package surface of the semiconductor switching element 2. As a result, since the thermally conductive adhesive spreads thinly and uniformly by the pressurizing of the leaf spring 21, between the aluminite coating 52 of the heat sink 5 and the semiconductor switching element 2. Heat resistance variation can be reduced.

In addition, since the semiconductor switching element 2 is fixed by the pressure of the leaf spring 21 in addition to the adhesive force of the thermal conductive adhesive, the alumite generated by the thermal expansion difference between the heat sink 5 and the semiconductor switching element 2. Peeling of the film 52 and peeling of the alumite film 52 due to external force and vibration can be prevented.

Moreover, although the heat spreader part is electrically connected internally with the bridge output terminal OUT in the semiconductor switching element 2, it is electrically insulated from the heat sink 5 with the alumite film 52 and the high thermally conductive adhesive.

The cover 7 is molded from the same insulating resin as the housing 3 and welded to the opening of the housing 3 with an ultrasonic welding machine.

In addition, the welding of the cover 7 and the housing 3 may be vibration welding by a vibration welding machine.

Vibration welding causes the cover 7 to reciprocally vibrate along both directions of the joining surfaces of the cover 7 and the housing 3, and melts the resins of the cover 7 and the housing 3 with each other by frictional heat, have.

Vibration welding is applied when the joint surface of the cover 7 and the housing 3 is large.

In addition, laser welding by a laser welding machine may be sufficient instead of an ultrasonic welding machine.

In laser welding, the cover 7 is made of a material having a high laser transmittance, and the housing 3 is made of a material having a high laser absorption rate.

When the laser beam is irradiated from the cover 7 side, the laser beam passes through the cover 7, and the laser beam is absorbed by the bonding surface of the housing 3 to generate heat. The heat is also conducted to the cover 7 side, so that the cover 7 also generates heat, melts and welds to each other at the joint surface of the cover 7 and the housing 3.

Laser welding cannot be used for resin molding with large warpage or shrinkage because it is difficult to focus the laser on the bonding surface. However, in the case of resin molding with small warpage or shrinkage, welding itself does not generate burrs and vibrates. Since there is no occurrence of, there is an advantage that there is no vibration transmission to the internal parts.

As explained above, according to the electronic control apparatus 1 of Embodiment 1, since the semiconductor switching element 2 is mounted in the heat sink 5, the heat dissipation of the semiconductor switching element 2 is improved, and At the same time, a power substrate for mounting the semiconductor switching element 2, which has been conventionally required, becomes unnecessary, and all heights can be reduced in size.

In the circuit board 4, a plurality of small current components including a microcomputer 41 for controlling the driving of the semiconductor switching element 2 is mounted on one surface thereof, and the capacitor 45 is mounted on the other surface thereof. Since a plurality of high current components including the high current components and the small current components are mounted on one circuit board, all heights can be further reduced.

In addition, a large current component having a large amount of heat generation and a small current component having a small amount of heat generation are distinguished through the circuit board 4, and a small current component having a low heat resistance is suppressed from the influence of heat from the large current component, so that the long life of the electronic control device 1 It becomes possible to paint.

In addition, since the small current component is mounted on the surface on the side opposite to the surface facing the semiconductor switching element 2, the influence of heat from the semiconductor switching element 2 through which the large current flows is also suppressed, and the electronic control device 1 Is further extended.

Moreover, since the capacitor | condenser 45 and the shunt resistor 47 are arrange | positioned at the edge part of the circuit board 4, the heat dissipation of the capacitor | condenser 45 and the shunt resistor 47 improves.

In addition, since the shunt resistor 47 and the condenser 45 are mounted close to each other, the circuit board 4 can shorten the electrical connection distance between the shunt resistor 47 and the condenser 45. The inductance of the system can be reduced to a low level, and the generation of noise can be suppressed.

In addition, since the aluminite film 52 is formed on the surface on which the semiconductor switching element 2 is mounted and the back surface of the heat sink 5, the heat radiation rate of the heat sink 5 is high, and the heat sink 5 ) Improves the heat radiation.

In addition, since the exposed end surface 5a which does not have the alumite coating 52 is in surface contact with the inner wall surface 3c of the housing 3, the heat sink 5 has a large amount of the heat sink 5. The heat flows smoothly through the end face 5a to the housing 3 having a large heat dissipation area and high heat emissivity, and is discharged to the outside through the housing 3 to improve heat dissipation of the heat sink 5.

In addition, since the heat sink 5 is formed on the surface of the heat sink body 51 made of aluminum or an aluminum alloy having high thermal conductivity, an aluminite film 52 having almost zero thermal resistance is formed. High heat dissipation

In addition, since the semiconductor switching element 2 is fixed to the surface of the alumite film 52 using a thermally conductive adhesive, the thermal resistance between the semiconductor switching element 2 and the heat sink 5 is reduced, and the semiconductor The heat dissipation of the switching element 2 is improved.

In addition, when an external force is applied to the semiconductor switching element 2, the stress on the welded portion of the semiconductor switching element 2 is reduced, and the bondability of the semiconductor switching element 2 to the heat sink 5 is improved.

In addition, since the semiconductor switching element 2 is pressurized by the heat sink 5 by the leaf spring 21, the semiconductor switching element 2 and the heat sink 5 are firmly coupled, and thermal expansion between them is carried out. The occurrence of peeling of the semiconductor switching element 2 due to the difference, external force and vibration can be prevented.

In addition, since the leaf spring 21 is fixed to the housing 3 and fixed to the heat sink 5 with the screw 20 through the housing 3, the leaf spring 21 is semiconductor switched. The element 2 can be reliably pressurized by the heat sink 5.

Embodiment 2

FIG. 21: is sectional drawing which shows the principal part of the electronic control apparatus 1 which concerns on Embodiment 2 of this invention. In the electronic control apparatus 1 shown in FIG. 21, in the structure shown in FIG. 15, the capacitor 45, which is a large current component, is in contact with the heat sink 5 through the inclusions 45a. The phosphor, microcomputer 41, power supply IC 42, and driver IC 43 are in contact with the cover 7 via the inclusions 41a, 42a, 43a, respectively.

The other configuration is the same as that of the first embodiment.

In the electronic control apparatus 1 of Embodiment 1 shown in FIG. 15, the electric current component contacts the circuit board 4 only in the wiring pattern part, and the surfaces of the other electric current components are the housing 3 and the heat sink. It is exposed to the air inside the body formed by 5 and the cover 7.

Therefore, most of the heat generated by the current component is radiated by the air inside the housing 3. The thermal conductivity of air is 0.03 W / mK at room temperature, and is smaller than that of solid.

In addition, the inside of the body is sealed, and the convection of air generated inside is a natural convection caused by a difference in air density due to a temperature difference. The flow velocity of natural convection is generally 0.1 m / s or less, and the heat dissipation effect is minute.

In other words, if air is present around the current component, the thermal resistance increases, and the heat dissipation performance is significantly deteriorated.

Thus, the capacitor 45 is brought into contact with the heat sink 5 via the inclusions 45a, and the microcomputer 41, the power supply IC 42, and the driver IC 43 are connected to the inclusions 41a, 42a, and 43a, respectively. By making contact with the cover 7 through this, the heat generated from each current component can be directly radiated to the outside by heat conduction, regardless of convection of air having low heat dissipation performance.

However, since the current component is fixed to the circuit board 4 by soldering, it is difficult to sufficiently secure the height accuracy of the current component. If the height is low, sufficient contact effect cannot be obtained. On the contrary, if the height is too high, an excessive force is applied during assembly and the current component is destroyed.

In addition, even if the current component is brought into contact with the heat sink 5 or the cover 7, even if there are many minute irregularities on the surface of the current component, the true contact area is smaller than the external contact area. As the contact area becomes smaller, the thermal resistance becomes larger, and as a result, it becomes difficult to obtain sufficient heat transfer performance.

Therefore, as shown in FIG. 21, when contacting an electric current component, the heat sink 5, or the cover 7, the means which contact | connects a component through the gel form or an elastic material between objects is effective. Examples of the inclusions corresponding to the conditions include thermally conductive grease, thermally conductive adhesives, heat transfer sheets, and heat dissipation rubbers.

Since these substances can be deformed by pressurization, if the inclusions are applied or adhered to the target position, they are inserted into the current component, the heat sink 5 or the cover 7 and pressurized during assembly. By deforming, a clearance gap is buried and parts can be made to contact.

Incidentally, the inclusions 41a, 42a, 43a, 45a of the present embodiment are composed of any one of a thermally conductive grease, a thermally conductive adhesive, a heat transfer sheet, and a heat dissipation rubber. The speed of temperature rise can be slowed down.

Since the electronic control device 1 operates by sensing steering torque of the handle, the electronic control device 1 repeats the abnormal operation in which the current value is instantly switched.

That is, it is also assumed that a large current flows instantaneously. It is considered that a small current component having a small heat capacity rapidly rises in temperature and causes abnormality.

On the other hand, when the current component and the heat sink 5 or the cover 7 are contacted through the inclusions 41a, 42a, 43a, 45a, the heat capacity of the external current component increases, so that the temperature of the current component rises. You can slow down.

In the case of the steering wheel operation within the same time, the one where the inclusions 41a, 42a, 43a, 45a are present has a larger heat capacity and a slower speed of temperature rise of the current component. As a result, the temperature rise can be reduced.

In addition, in the electronic control apparatus 1 of Embodiment 1 shown in FIG. 15, since the electric current component contacts the circuit board 4 only in the wiring pattern part, only the wiring pattern supports the electric current component. . Therefore, in this configuration, since the current component needs to be supported at a very small site, external force, stress due to vibration, or thermal stress due to thermal expansion may occur, and the current component may be damaged or peel off.

In contrast, in the present embodiment, since the inclusions 41a, 42a, 43a, and 45a have gel or elastic characteristics, the area supporting the current component increases, so that stress caused by external force and vibration is increased. Alternatively, the influence of thermal stress due to thermal expansion can be reduced.

Moreover, the effect of absorbing vibration and suppressing thermal expansion by the spring effect of the inclusions 41a, 42a, 43a, 45a also occurs.

In the present embodiment, the condenser 45 is in contact with the heat sink 5 through the inclusions 45a, but may be in contact with the housing 3.

The relay 46, which is a high current component, may also be brought into contact with the heat sink 5 or the housing 3 through the inclusions, similarly to the capacitor 45.

As mentioned above, according to the electronic control apparatus 1 of this Embodiment 2, the cover 7 is attached to the edge part of the housing 3, and the body is comprised by the housing 3, the heat sink 5, and the cover 7. As shown in FIG. The large current component and the small current component in the body are in contact with the inner wall surface of the body through the inclusions 41a. 42a, 43a, 45a having thermal conductivity, so that heat generated from each current component can be dissipated. The heat can be radiated directly to the outside by heat conduction, regardless of the low air convection.

In addition, since the inclusions 41a, 42a, 43a, and 45a are gel or elastic materials, the deviation of the gap between the body, the large current component, and the small current component is absorbed by deformation, and excessive force is absorbed by the body, during assembly. It is prevented from being applied to large current components and small current components.

In addition, in Embodiment 1, 2, although the surface exposed to the exterior of the heat sink 5 was made into the plane as shown in FIG. 19, by providing the heat radiation fin 5c as shown in FIG. The heat dissipation of the sink 5 may be improved.

In addition, each terminal (VS, GT1, OUT, GT2, GND) of the semiconductor switching element 2, and the connection terminals 11a, 12a, 13a, 14a and the conductive plates 6a, 6b, 6c, 6d, 6e Although joining was performed by laser welding, other welding methods, such as resistance welding and TIG welding, may be sufficient.

In addition, ultrasonic bonding other than welding may be sufficient.

In addition, the semiconductor switching element 2 has a half bridge in which the high side M0SFET 2H and the low side M0SFET 2L are integrated in one package, and is a pair of two to form the electric motor 22. Although a bridge circuit for switching current is configured, the high side M0SFET 2H and the low side M0SFET 2L may be respectively configured to constitute a bridge circuit with four semiconductor switching elements 2.

In addition, the structure which comprises a bridge circuit by the six semiconductor switching elements 2 and drives a three-phase brushless motor may be controlled.

In addition, although the power device was made into the semiconductor switching element 2, other power devices, such as a diode and a thyristor, may be sufficient.

In addition, although the above-mentioned embodiment demonstrated the example applied to the electric power steering apparatus of the motor vehicle, the large current provided with power devices, such as the electronic control apparatus of anti-lock brake system ABS, the electronic control apparatus of an air conditioning relationship, For example, it is applicable also to the electronic control apparatus which handles 25A or more).

In addition, the dimension, shape, and number of each component mentioned above are an example, Of course, it is not limited to this dimension, shape, and number.

BRIEF DESCRIPTION OF THE DRAWINGS The exploded perspective view which shows the electronic control apparatus by Embodiment 1 of this invention.

FIG. 2 is an exploded perspective view of the electronic control device of FIG. 1 when viewed from an upside down direction; FIG.

Fig. 3 is a side view of the electronic control device of Fig. 1 as seen from the vehicle connector side.

Fig. 4 is a side view of the electronic control device of Fig. 1 as seen from the motor connector side.

5 is a perspective view of the housing of the electronic control device of FIG. 1 as viewed from the direction in which the heat sink is attached. FIG.

6 is an enlarged view of a main part of FIG. 5;

7 is a block diagram of the electronic control device of FIG. 1.

8 is a side cross-sectional view of the electronic control device of FIG. 1.

9 is a perspective view illustrating assembly of a conductive plate and a connector terminal of the electronic control device of FIG. 1.

10 is a perspective view illustrating assembly of a conductive plate and a connector terminal of the electronic control device of FIG. 1.

FIG. 11 is a side cross-sectional view parallel to the side cross section of FIG. 8 in the electronic control device of FIG. 1. FIG.

12 is a perspective view illustrating assembly of a conductive plate and a connector terminal of the electronic control device of FIG. 1.

FIG. 13 is a perspective view illustrating assembly of a support member and a spring member of the electronic control apparatus of FIG. 1. FIG.

14 is a side cross-sectional view parallel to the side cross-section of FIG. 8 in the electronic control device of FIG. 1.

FIG. 15 is a cross-sectional view taken along a direction perpendicular to the side cross section of FIG. 8 in the electronic control device of FIG. 1; FIG.

16 is a side cross-sectional view parallel to the side cross-section of FIG. 8 in the electronic control device of FIG.

FIG. 17 is a front view illustrating a circuit board of the electronic control device of FIG. 1. FIG.

FIG. 18 is an exploded perspective view showing a positional relationship between a heat sink and a housing of the electronic control device of FIG. 1. FIG.

19 is a perspective view illustrating a positional relationship between a heat sink and a housing of the electronic control device of FIG. 1.

20 is a perspective view of an essential part of the electronic control device of FIG. 1;

Fig. 21 is a side sectional view showing the electronic control device according to Embodiment 2 of the present invention.

It is a perspective view which shows the modification of the electronic control apparatus by Embodiment 1, 2 of this invention.

(Explanation of symbols for the main parts of the drawing)

1: electronic control unit

2: semiconductor switching element (power device)

3: housing 3a: insulating resin

3b: support part 3c: opening inner wall surface

3d: positioning unit 3e: positioning unit

4: circuit board 5: heat sink

5a: cross section 5b: anodized surface

5c: heat dissipation fin 6a: power conductive plate

6b: output conductive plate 6c: signal conductive plate

6d: conductive plate 6e: conductive plate

6f: support member 6ap to 6fp: press-fit terminal

7: cover 8: vehicle connector

9: motor connector 10: sensor connector

11: power connector terminal 12: signal connector terminal

13: motor connector terminal 14: sensor connector terminal

20: screw 21: leaf spring

21a: pressing part 21b: coupling fixing part

21s: slit part 22: electric motor

23: torque sensor 24: battery

41: microcomputer (small current component) 42: power supply IC (small current component)

43: driver IC (small current component) 44: coil (large current component)

45: capacitor (large current component) 46: relay (large current component)

47: shunt resistor (large current component) 51: heat sink body

52: anodized film

Claims (19)

An insulating resin housing having openings at both ends; A heat sink attached to one end of the housing and mounted with a power device on a surface of the housing; A circuit board provided to face the heat sink; The circuit board includes a capacitor mounted on one surface thereof with a plurality of small current components including a microcomputer for controlling the driving of the power device, and absorbing the ripple of the current flowing through the power device on the other surface. An electronic control apparatus characterized by mounting a plurality of high current components. An insulating resin housing having openings at both ends; A heat sink attached to one end of the housing and mounted with a power device on a housing side surface; A circuit board provided to face the heat sink; The circuit board includes a plurality of small current components including a microcomputer for controlling driving of the power device on one surface thereof, and a shunt resistor for detecting a current flowing through the power device on the other surface. An electronic control apparatus characterized by mounting a plurality of high current components. The method according to claim 1 or 2, The said circuit board is equipped with the said small current component in the surface on the opposite side to the surface which opposes the said power device, The electronic control apparatus characterized by the above-mentioned. The method according to claim 1 or 2, The said circuit board is equipped with the coil which prevents the electromagnetic noise which generate | occur | produces at the time of driving of the said power device to the outside from the other said surface mounted in the outside. The method according to claim 1 or 2, The said circuit board is equipped with the relay which opens and closes the electric current which flows through the said power device in the said other surface, The electronic control apparatus characterized by the above-mentioned. The method according to claim 1 or 2, At least one current component among the plurality of small current components and the plurality of large current components is disposed at an edge of the circuit board. The method of claim 1, The said circuit board is equipped with the shunt resistor which detects the electric current which flows through the said power device in the said other surface, and is mounted in close proximity to the said capacitor | condenser. The method according to claim 1 or 2, The heat sink is formed on a surface on which the power device is mounted, and a film for increasing the thermal emissivity is formed on at least one of the rear surface thereof. The method of claim 8, The said heat sink has an exposed end surface which does not have the said shell film, and is in surface contact with the inner wall surface of the said housing. The method of claim 8, The film is an electronic control device, characterized in that the anodized film. The method according to claim 1 or 2, The heat radiation fin is formed in the surface on the opposite side to the surface where the said power device is mounted of the said heat sink. The method according to any one of claims 1, 2 and 7, The said heat sink is an electronic control apparatus characterized by the heat sink main body being comprised from aluminum or an aluminum alloy. The method of claim 8, And the power device is fixed to the surface of the shell film via a thermally conductive adhesive. The method according to any one of claims 1, 2 and 7, The power device is pressurized to the heat sink by a leaf spring. 15. The method of claim 14, The leaf spring is fixed to the heat sink with screws through the housing and fixed to the housing. The method according to any one of claims 1, 2 and 7, A cover is attached to the other end of the housing, the body is constituted by the housing, the heat sink and the cover, At least one current component of the large current component and the small current component in the body is in contact with an inner wall surface of the body through an inclusion having thermal conductivity. The method of claim 16, The inclusion is an electronic control device, characterized in that the gel or elastic material. The method according to any one of claims 1, 2 and 7, The said power device is a semiconductor switching element, The electronic control apparatus characterized by the above-mentioned. The method according to any one of claims 1, 2 and 7, The electronic control apparatus is an electric power steering apparatus.

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