CN218215301U - Lead frame structure of integrated circuit - Google Patents
Lead frame structure of integrated circuit Download PDFInfo
- Publication number
- CN218215301U CN218215301U CN202222498481.6U CN202222498481U CN218215301U CN 218215301 U CN218215301 U CN 218215301U CN 202222498481 U CN202222498481 U CN 202222498481U CN 218215301 U CN218215301 U CN 218215301U
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- Prior art keywords
- lead frame
- screw hole
- circuit lead
- product
- integrated circuit
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The utility model provides an integrated circuit lead frame structure, including circuit lead frame, circuit lead frame is provided with two installation positions on the surface, and installs the position and seted up the screw hole on the surface, the position that the installation position corresponds screw hole top is seted up jaggedly, and the fixed welding of installation position corresponding screw hole breach department has the closing plate, passes through the last core pressure welding plastic envelope product with circuit lead frame, the closing plate constitutes complete screw hole with the installation position, the top both ends of installation position are provided with the oblique angle, carry out the corner protection to the product of plastic envelope through the oblique angle, reduce the wearing and tearing after both installs, through the screw hole with circuit lead frame and product fixed mounting, through the product intensity that the great increase of complete screw hole and product were packaged out, avoid holding the risk that the plastic envelope body cracked can not appear when locking the screw in the application.
Description
Technical Field
The utility model relates to an integrated circuit lead frame field specifically is an integrated circuit lead frame structure.
Background
An integrated circuit is a microelectronic device or component. The elements such as transistor, resistor, capacitor and inductor, etc. and wiring required in a circuit are interconnected by a certain process, and are made on a small or several small semiconductor wafers or dielectric substrates, and then are packaged in a tube shell to form a microstructure with required circuit functions.
The integrated circuit lead frame is easy to be punctured by large current, the lock screw hole in the original frame slide area is open, and the plastic body can crack when the screw hole position is not supported on the lock screw in the actual application of a finished product after plastic ribs are pressed and welded through the upper core, so that the large current is punctured.
Disclosure of Invention
Not enough to prior art exists, the utility model aims at providing an integrated circuit lead frame structure to solve the problem that proposes in the above-mentioned background art, the utility model discloses novel structure changes into the confined through improving back lead frame chip slide glass district screw hole, and product strength that great increase was done avoids holding the risk that the plastic-sealed body cracked that can not appear when locking the screw in the in-service use.
In order to achieve the above purpose, the present invention is realized by the following technical solution: the utility model provides an integrated circuit lead frame structure, includes circuit lead frame, circuit lead frame is provided with two installation positions on the surface, and installs the position and seted up the screw hole on the surface, the position that the installation position corresponds screw hole top is seted up jaggedly, and the installation position corresponds screw hole breach department fixed welding and has the closing plate.
Furthermore, the closing plate and the mounting block form a complete screw hole.
Furthermore, the two ends of the top of the mounting position are provided with oblique angles.
The utility model has the advantages that: the utility model discloses an integrated circuit lead frame structure, which comprises a circuit lead frame; mounting positions; a screw hole; and a closing plate.
This integrated circuit lead frame structure encapsulates the product intensity that great increase was made through complete screw hole and product, avoids supporting the risk that the plastic-sealed body can not appear splitting when locking the screw in the in-service use.
Drawings
Fig. 1 is a schematic diagram of an overall structure of a lead frame structure of an integrated circuit according to the present invention;
fig. 2 is a schematic diagram illustrating welding between a circuit lead frame and a product of the lead frame structure of an integrated circuit according to the present invention;
in the figure: 1. a circuit lead frame; 11. an installation position; 2. a screw hole; 3. and (3) closing the plate.
Detailed Description
In order to make the utility model realize, the technical means, the creation characteristics, the achievement purpose and the efficacy are easy to understand and understand, the utility model is further explained by combining the specific implementation mode.
Referring to fig. 1 and fig. 2, the present invention provides a technical solution: the utility model provides an integrated circuit lead frame 1 structure, includes circuit lead frame 1, circuit lead frame 1 is provided with two installation positions 11 on the surface, and installs 11 positions and seted up screw hole 2 on the surface, 11 positions that correspond 2 tops of screw hole of installation position have seted up the breach, and the fixed welding of 11 positions that correspond 2 breachs of screw hole department of installation position has closing plate 3, with circuit lead frame 1 through last core pressure welding plastic envelope product, through screw hole 2 with circuit lead frame 1 and product fixed mounting.
In this embodiment, the sealing plate 3 and the mounting position 11 form a complete screw hole 2, and the product strength is greatly increased by packaging the product through the complete screw hole 2.
This embodiment, the top both ends of installation position 11 are provided with the oblique angle, carry out corner protection, reduce wear through the product of oblique angle to the plastic envelope.
When the device is used, the circuit lead frame 1 is fixedly installed with the circuit lead frame 1 and a product through the screw hole 2 by core-loading pressure welding plastic package products, the product strength is made by greatly increasing the package through the complete screw hole 2 and the product, and the risk that the plastic package body cracks can not appear is avoided being supported when the screw is locked in the actual application.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above, it will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, but that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (3)
1. An integrated circuit lead frame structure comprising a circuit lead frame (1), characterized in that: circuit lead frame (1) is provided with two installation positions (11) on the surface, and installs position (11) and seted up screw hole (2) on the surface, installation position (11) are seted up jaggedly corresponding the position at screw hole (2) top, and install position (11) and correspond screw hole (2) breach department fixed welding and have closing plate (3).
2. The integrated circuit lead frame structure of claim 1, wherein: the sealing plate (3) and the mounting position (11) form a complete screw hole (2).
3. The integrated circuit lead frame structure of claim 1, wherein: and oblique angles are arranged at two ends of the top of the mounting position (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222498481.6U CN218215301U (en) | 2022-09-21 | 2022-09-21 | Lead frame structure of integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222498481.6U CN218215301U (en) | 2022-09-21 | 2022-09-21 | Lead frame structure of integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218215301U true CN218215301U (en) | 2023-01-03 |
Family
ID=84636375
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222498481.6U Active CN218215301U (en) | 2022-09-21 | 2022-09-21 | Lead frame structure of integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218215301U (en) |
-
2022
- 2022-09-21 CN CN202222498481.6U patent/CN218215301U/en active Active
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