CN105932175A - To-be-encapsulated substrate, encapsulating method, encapsulating structure and display device - Google Patents
To-be-encapsulated substrate, encapsulating method, encapsulating structure and display device Download PDFInfo
- Publication number
- CN105932175A CN105932175A CN201610488323.9A CN201610488323A CN105932175A CN 105932175 A CN105932175 A CN 105932175A CN 201610488323 A CN201610488323 A CN 201610488323A CN 105932175 A CN105932175 A CN 105932175A
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- China
- Prior art keywords
- laser scanning
- limit
- substrate
- plastic box
- sealed plastic
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Packaging Frangible Articles (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention provides a to-be-encapsulated substrate, an encapsulating method, an encapsulating structure and a display device. The to-be-encapsulated substrate comprises a first surface, wherein a frame sealing adhesive is formed on the first surface and comprises a frame sealing adhesive main body part, a laser scanning starting part and a laser scanning terminating part; the frame sealing adhesive is formed by surrounding the periphery of the first surface; the laser scanning starting part and the laser scanning terminating part are formed at preset positions of the frame sealing adhesive main body part; the laser scanning starting part is used for starting laser scanning; the laser scanning terminating part is used for terminating laser scanning; and the laser scanning starting part and the laser scanning terminating part protrude outside of the frame sealing adhesive main body part and is connected with the frame sealing adhesive main body part. High stability and air-tightness can be achieved; and the encapsulation reliability and yield are improved.
Description
Technical field
The present invention relates to Display Technique field, particularly relate to a kind of substrate to be packaged, method for packing, encapsulation knot
Structure and display device.
Background technology
Along with the raising of people's living standard, people are more and more higher to the requirement of display quality, liquid crystal display
Device (LCD) is the most highly developed, the figure of all visible LCD such as mobile phone, camera, computer, TV.
People's wilderness demand to display product, has objectively promoted the development of Display Technique, and new Display Technique is not
Disconnected occur, such as low temperature polycrystalline silicon, organic display etc..
Active matrix organic light-emitting diode (AMOLED) panel (AMOLED) is referred to as Display Technique of future generation, bag
Include Samsung, LG, Philip and all attach great importance to this new Display Technique.No matter AMOLED is drawing
On matter, usefulness and cost, congenital performance is all a lot of compared with TFT LCD advantage.Low temperature polycrystalline silicon (LTPS)
Compared with tradition non-crystalline silicon (a-Si), having more advantage, LTPS technology is considered as optimal
The backplane technology of AMLCD Yu AMOLED.
The manufacturing process of AMLCD and AMOLED at present, including cover-plate glass and the encapsulation of back-panel glass
Process, material and structural requirement to encapsulation are high, are directly connected to the reliability (Reliability) of product
With yields (yield).It is generally used for glass cement encapsulation (Frit encapsulation) of OLED, exists
Many problems.Generally, as in figure 2 it is shown, the surrounding at cover-plate glass 10 is printed with a circle packaging plastic 20,
Utilize laser scanning direction packaging plastic shown in arrow along Fig. 1 so that after packaging plastic is melted, and and backboard
Glass-encapsulated is together.Wherein, in crossover region (the dotted line institute in Fig. 1 of starting point and terminating point of laser scanning
The joint shown), due to laser problem such as Laser Energy Change and sweep speed sudden change when initiateing and terminate,
Can cause being susceptible in joint bad, such as: packaging plastic is the spilling of sizing material, joint when laser melts
Place's residual stress is relatively big, causes packaging plastic cracking etc. so that packaging air tightness is bad, and trusting letter evaluation cannot
Pass through, thus cause yield to reduce.
Summary of the invention
It is an object of the invention to provide a kind of substrate to be packaged, method for packing, encapsulating structure and display device,
It is capable of high stability and sealing, improves the encapsulation reliability of substrate.
Technical scheme provided by the present invention is as follows:
A kind of substrate to be packaged, including first surface, is formed with sealed plastic box on the first surface, described
Sealed plastic box includes:
The sealed plastic box main part formed around the surrounding of described first surface；
And, formed in the precalculated position of described sealed plastic box main part is sharp for start for laser scanning
Optical scanning initial part and the laser scanning end portion terminated for confession laser scanning, described laser scanning initial part
Outside all protruding from described sealed plastic box main part with described laser scanning end portion, and with described sealed plastic box main body
Portion is connected.
Further, described sealed plastic box main part includes the surrounding being looped around described first surface and sweeps along laser
Retouch the first limit, the second limit, the 3rd limit and the 4th limit that direction sets gradually；Wherein said precalculated position is institute
State the position that the first limit and described 4th limit are overlapping.
Further, described laser scanning initial part is extended to it by described first limit and overlaps with described 4th limit
Position outside formed；
Described laser scanning end portion by described 4th limit extend to its position overlapping with described first limit it
Outer formation.
Further, a length of on the bearing of trend on described first limit of described laser scanning initial part
1～5mm；
Described laser scanning end portion on the bearing of trend on described 4th limit a length of 1～5mm.
Further, on the first surface with the position corresponding to the precalculated position of described sealed plastic box main part
Put be formed one cave inward formed buffer groove.
Further, described buffer groove is circular groove, its diameter and described first limit and described 4th limit
Width identical.
Further, a diameter of 0.6 ± 0.1mm of described buffer groove.
A kind of method for packing, described method is for sealing substrate to be packaged as above with another substrate
Dress；Described method includes:
Utilizing the sealed plastic box on substrate to be packaged described in laser scanning, wherein laser initiates from described laser scanning
Portion starts scanning, and scans after described sealed plastic box main part along predetermined direction, terminates in described laser scanning
Portion terminates scanning；
By involutory with another substrate for described substrate to be packaged, to encapsulate described substrate to be packaged and another substrate.
Further, utilizing the sealed plastic box on substrate to be packaged described in laser scanning, wherein laser swashs from described
Optical scanning initial part starts scanning, and scans after described sealed plastic box main part along predetermined direction, swashs described
Optical scanning end portion terminates scanning, specifically includes:
Utilize laser to start scanning from described laser scanning initial part, and scan described sealed plastic box main part successively
The first limit, the second limit, the 3rd limit and the 4th limit after, described laser scanning end portion terminate scanning.
Further, described method also includes:
After utilizing the sealed plastic box on substrate to be packaged described in laser scanning, by described laser scanning initial part
Remove with described laser scanning end portion.
A kind of encapsulating structure, described encapsulating structure uses method as above to be formed.
A kind of display device, including encapsulating structure as above.
What the present invention was brought has the beneficial effect that:
In such scheme, start by being provided for laser scanning on the precalculated position of sealed plastic box main part
Laser scanning initial part and for the laser scanning end portion terminated for laser scanning to envelope
When frame glue carries out laser scanning, laser starts scanning from described laser scanning initial part, and whole scanning through
Terminate scanning after sealed plastic box main part in described laser scanning end portion, thus reduce and initiate in laser scanning
The exception caused with Laser Energy Change when terminating and sweep speed sudden change, can realize high stability and sealing,
Improve encapsulation reliability and yield.
Accompanying drawing explanation
Fig. 1 represents the structural representation of the cover-plate glass of prior art；
Fig. 2 represents the structural representation of the substrate to be packaged provided in the embodiment of the present invention.
Detailed description of the invention
For making the purpose of the embodiment of the present invention, technical scheme and advantage clearer, below in conjunction with the present invention
The accompanying drawing of embodiment, is clearly and completely described the technical scheme of the embodiment of the present invention.Obviously, institute
The embodiment described is a part of embodiment of the present invention rather than whole embodiments.Based on described
Embodiments of the invention, the every other embodiment that those of ordinary skill in the art are obtained, broadly fall into this
The scope of bright protection.
For when prior art utilizes during encapsulating products laser scanning packaging plastic in laser scanning starting point and
The joint location of terminating point is susceptible to bad problem, the invention provides a kind of substrate to be packaged, encapsulation
Method, encapsulating structure and display device, it is possible to solve above-mentioned technical problem, it is achieved high stability and sealing,
Improve the encapsulation reliability of substrate.
As in figure 2 it is shown, the substrate to be packaged provided in the embodiment of the present invention includes: include first surface 100,
Being formed with sealed plastic box on described first surface 100, described sealed plastic box includes:
The sealed plastic box main part 201 formed around the surrounding of described first surface 100；
And, formed in the precalculated position of described sealed plastic box main part 201 starts for confession laser scanning
Laser scanning initial part 202 and for for laser scanning terminate laser scanning end portion 203, described swash
Optical scanning initial part 202 and described laser scanning end portion 203 all protrude from described sealed plastic box main part 201
Outside, and be connected with described sealed plastic box main part 201.
Such scheme, described sealed plastic box main part 201 can be by substrate to be packaged after laser scanning is melted
Together with another substrate package, by being provided for swashing in the precalculated position of described sealed plastic box main part 201
Laser scanning initial part 202 that optical scanning starts and for the laser scanning end portion terminated for laser scanning
203, say, that area in preparation (dummy area) is set outside sealed plastic box main part 201, can make
Must be when sealed plastic box be carried out laser scanning, laser starts scanning from described laser scanning initial part 202, and
After scanning through whole sealed plastic box main part 201, finally terminate in described laser scanning end portion 203 sweeping
Retouch so that unstable situation when laser scanning is initial and terminates occurs in outside sealed plastic box main part 201
Local, it is ensured that laser scanning stability during sealed plastic box main part 201 laser scanning, and avoid existing
There is laser in technology can scan twice in joint location that is initial and that terminate, thus greatly reduce at laser
What when scanning is initial and terminates, Laser Energy Change and sweep speed sudden change caused is bad, can realize high stability
And sealing, improve encapsulation reliability and yield；Additionally, substrate to be packaged provided by the present invention, to envelope
Dress technique will not produce impact, compatible strong, simple possible.
In embodiment provided by the present invention, it is preferred that as in figure 2 it is shown, described sealed plastic box main part
201 include being looped around the surrounding of described first surface 100 and along laser scanning direction (in Fig. 2 shown in arrow
Direction) the first the 2011, second limit the 2012, the 3rd, limit limit 2013 and the 4th limit 2014 of setting gradually；
Wherein said precalculated position is described first limit 2011 and described 4th overlapping position, limit 2014.
Using such scheme, described laser scanning initial part 202 and described laser scanning end portion 203 are arranged
Position at a turning of generally rectangular shaped sealed plastic box main part 201.
It should be appreciated that in actual applications, described laser scanning initial part 202 and described laser scanning
End portion 203 is arranged on other positions of generally rectangular shaped sealed plastic box main part 201.
Additionally, in embodiment provided by the present invention, it is preferred that as in figure 2 it is shown, described laser scanning
Initial part 202 is extended to the profile of itself and described 4th overlapping position, limit 2014 by described first limit 2011
Become；Described laser scanning end portion 203 is extended to itself and described first limit 2011 by described 4th limit 2014
Formed outside overlapping position.
Using such scheme, described laser scanning initial part 202 is extended a bit of by described first limit 2011
Formed, so that without changing scanning direction again during laser scanning, can directly be initiateed by described laser scanning
Portion 202 enters into described first limit 2011 and proceeds by scanning, when scanning terminates, sweeps without change
Retouch direction, directly entered into described laser scanning end portion 203 by the 4th limit 2014 and terminate scanning.
And, it is preferred that described laser scanning initial part 202 is at the bearing of trend on described first limit 2011
On a length of 1～5mm；Described laser scanning end portion 203 is at the bearing of trend on described 4th limit 2014
On a length of 1～5mm.
It should be appreciated that in other embodiments of the invention, described laser scanning initial part 202 and institute
Stating laser scanning end portion 203 can also be otherwise be arranged on described sealed plastic box main part 201 pre-
Location is put, and is not defined this；Further, described laser scanning initial part 202 and described laser scanning
The length of end portion 203 can be adjusted according to the actual requirements.
Additionally, conventionally, as sealed plastic box is initial in laser scanning and the joint location that terminates due to
Laser has sizing material and overflows when melting, the residual stress of joint location is relatively big, causes sealed plastic box to ftracture.In order to
Solve the problems referred to above, in embodiment provided by the present invention, it is preferred that as in figure 2 it is shown, described the
On one surface 100 with the position corresponding to the precalculated position of described sealed plastic box main part 201 on be formed one to
The buffer groove 300 that sunken inside is formed.
Use such scheme, by initial and whole in laser scanning on the first surface 100 of substrate to be packaged
Joint location (the most described precalculated position) only arranges a buffer groove 300, can make the envelope of joint location
Frame glue has the space extended or buffer when twice lf, prevents glue from escaping, and balances internal stress,
Reduce encapsulation to split risk.
In preferred embodiment provided by the present invention, as in figure 2 it is shown, described buffer groove 300 is circular
Groove, its diameter is identical with the width on described first limit 2011 and described 4th limit 2014.It is to say,
The diameter of described buffer groove 300 is identical with package width, and the diameter of described buffer groove 300 is about
0.6±0.1mm。
It is the preferred arrangement of described buffer groove 300 it should be noted that provided above, but also
This is not limited to.
In addition it is also necessary to explanation, in such scheme, described substrate to be packaged could be for manufacturing
The cover-plate glass of AMLCD and AMOLED, cover-plate glass specifically includes that ILD (interlayer insulating film)
With SD (source-drain electrode layer) etc., described buffer groove 300 can be by the ILD in described pre-position
Or realization of punching on SD.
In addition it is also necessary to explanation, described laser scanning initial part 202 and described laser scanning end portion
203 can complete to cut away afterwards in laser scanning.
Additionally, additionally provide a kind of method for packing in embodiments of the invention, described method is for by the present invention
Substrate to be packaged provided in embodiment is packaged with another substrate；Described method includes:
Utilizing the sealed plastic box on substrate to be packaged described in laser scanning, wherein laser initiates from described laser scanning
Portion 202 starts scanning, and scans after described sealed plastic box main part 201 along predetermined direction, at described laser
Scanning end portion 203 terminates scanning；
By involutory with another substrate for described substrate to be packaged, to encapsulate described substrate to be packaged and another substrate.
Such scheme, described sealed plastic box main part 201 can be by substrate to be packaged after laser scanning is melted
Together with another substrate package, after scanning through whole sealed plastic box main part 201, finally at described laser
Scanning end portion 203 terminates scanning so that unstable situation when laser scanning is initial and terminates occurs in envelope
Place outside frame glue main part 201, it is ensured that during sealed plastic box main part 201 laser scanning, laser is swept
Retouch stability, and avoid laser in prior art and can scan twice in joint location that is initial and that terminate, from
And greatly reduce Laser Energy Change and sweep speed sudden change when laser scanning initiates and terminates and cause
Bad, can realize high stability and sealing, improve encapsulation reliability and yield；Additionally, such scheme
Compared with existing packaging technology, other steps will not be produced, compatible strong, simple possible.
In the method that the embodiment of the present invention is provided, utilize the envelope frame on substrate to be packaged described in laser scanning
Glue, wherein laser starts scanning from described laser scanning initial part 202, and scans described envelope along predetermined direction
After frame glue main part 201, terminate scanning in described laser scanning end portion 203, specifically include: utilize
Laser starts scanning from described laser scanning initial part 202, and scans described sealed plastic box main part 201 successively
The first limit 2013, the 2011, second limit the 2012, the 3rd, limit and the 4th limit 2014 after, at described laser
Scanning end portion 203 terminates scanning.
In such scheme, laser can start scanning from laser scanning initial part 202, then without change side
To, directly scanning the first limit 2011, scans the second limit the 2012, the 3rd limit 2013 and the 4th limit the most successively
After 2014, enter directly into laser scanning end portion 203.
Described method also includes: after utilizing the sealed plastic box on substrate to be packaged described in laser scanning, by institute
State laser scanning initial part 202 and described laser scanning end portion 203 is removed.
Additionally, additionally provide a kind of encapsulating structure in embodiments of the invention, described encapsulating structure uses as above
Described method is formed.
Additionally, embodiments of the invention additionally provide a kind of display device, including encapsulating knot as above
Structure.
The above is only the preferred embodiment of the present invention, it is noted that common for the art
For technical staff, on the premise of without departing from the technology of the present invention principle, it is also possible to make some improvement and replace
Changing, these improve and replace and also should be regarded as protection scope of the present invention.
Claims (12)
1. a substrate to be packaged, including first surface, is formed with sealed plastic box on the first surface,
It is characterized in that, described sealed plastic box includes:
The sealed plastic box main part formed around the surrounding of described first surface；
And, formed in the precalculated position of described sealed plastic box main part is sharp for start for laser scanning
Optical scanning initial part and the laser scanning end portion terminated for confession laser scanning, described laser scanning initial part
Outside all protruding from described sealed plastic box main part with described laser scanning end portion, and with described sealed plastic box main body
Portion is connected.
Substrate to be packaged the most according to claim 1, it is characterised in that
Described sealed plastic box main part includes the surrounding being looped around described first surface and depends on along laser scanning direction
First limit of secondary setting, the second limit, the 3rd limit and the 4th limit；Wherein said precalculated position is described first limit
The position overlapping with described 4th limit.
Substrate to be packaged the most according to claim 2, it is characterised in that
Described laser scanning initial part by described first limit extend to its position overlapping with described 4th limit it
Outer formation；
Described laser scanning end portion by described 4th limit extend to its position overlapping with described first limit it
Outer formation.
Substrate to be packaged the most according to claim 3, it is characterised in that
Described laser scanning initial part on the bearing of trend on described first limit a length of 1～5mm；
Described laser scanning end portion on the bearing of trend on described 4th limit a length of 1～5mm.
Substrate to be packaged the most according to claim 2, it is characterised in that
Formed with on the position corresponding to the precalculated position of described sealed plastic box main part on the first surface
Have one cave inward formed buffer groove.
Substrate to be packaged the most according to claim 5, it is characterised in that
Described buffer groove is circular groove, and its diameter is identical with the width on described first limit and described 4th limit.
Substrate to be packaged the most according to claim 6, it is characterised in that
A diameter of 0.6 ± 0.1mm of described buffer groove.
8. a method for packing, it is characterised in that described method is used for will be as arbitrary in claim 1 to 7
Substrate to be packaged described in Xiang is packaged with another substrate；Described method includes:
Utilizing the sealed plastic box on substrate to be packaged described in laser scanning, wherein laser initiates from described laser scanning
Portion starts scanning, and scans after described sealed plastic box main part along predetermined direction, terminates in described laser scanning
Portion terminates scanning；
By involutory with another substrate for described substrate to be packaged, to encapsulate described substrate to be packaged and another substrate.
Method for packing the most according to claim 8, it is characterised in that utilize and treat described in laser scanning
Sealed plastic box on base plate for packaging, wherein laser starts scanning from described laser scanning initial part, and along predetermined party
After scanning described sealed plastic box main part, terminate scanning in described laser scanning end portion, specifically include:
Utilize laser to start scanning from described laser scanning initial part, and scan described sealed plastic box main part successively
The first limit, the second limit, the 3rd limit and the 4th limit after, described laser scanning end portion terminate scanning.
Method for packing the most according to claim 8, it is characterised in that described method also includes:
After utilizing the sealed plastic box on substrate to be packaged described in laser scanning, by described laser scanning initial part
Remove with described laser scanning end portion.
11. 1 kinds of encapsulating structures, it is characterised in that described encapsulating structure uses such as claim 8 to 10
Method described in any one is formed.
12. 1 kinds of display devices, it is characterised in that include encapsulating structure as claimed in claim 11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201610488323.9A CN105932175B (en) | 2016-06-28 | 2016-06-28 | Substrate, packaging method, encapsulating structure and display device to be packaged |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610488323.9A CN105932175B (en) | 2016-06-28 | 2016-06-28 | Substrate, packaging method, encapsulating structure and display device to be packaged |
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| CN105932175A true CN105932175A (en) | 2016-09-07 |
| CN105932175B CN105932175B (en) | 2019-04-23 |
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| CN109004100A (en) * | 2017-06-06 | 2018-12-14 | 上海和辉光电有限公司 | Flexible display device |
| CN109427996A (en) * | 2017-08-31 | 2019-03-05 | 昆山国显光电有限公司 | A kind of flexible display apparatus and preparation method |
| CN110326363A (en) * | 2017-02-24 | 2019-10-11 | 夏普株式会社 | Manufacturing method, the manufacturing device of oled panel, oled panel of oled panel |
| CN112313793A (en) * | 2018-06-25 | 2021-02-02 | 日本电气硝子株式会社 | Method for manufacturing cover member, and method for manufacturing electronic component package |
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| CN105932175B (en) | 2019-04-23 |
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