CN218215265U - High-power diode chip packaging structure - Google Patents

Abstract

The utility model discloses a high-power diode chip packaging structure, including unable adjustment base, radiating gasket is installed to unable adjustment base top intermediate position, the chip body is installed at the radiating gasket top, the unable adjustment base top is equipped with the closing cap, all be equipped with the gag lever post of closing cap inner wall both sides, the gag lever post outside is equipped with the clamp plate, closing cap both ends bottom all is equipped with the gag lever post, all be equipped with fixing bolt between unable adjustment base four corners and the closing cap. The utility model discloses when encapsulating the diode chip, the radiating gasket can be fixed and dispel the heat to the chip for the chip can keep normal temperature in the course of the work, and the fixed plate can suppress the stitch when the clamp plate is suppressed the chip body, and the limiting plate can encapsulate and prescribe a limit to the stitch, runs through the fixed orifices through fixing bolt and the mounting hole can be connected closing cap and unable adjustment base, makes the encapsulation of diode chip and dismantlement more convenient.

Description

High-power diode chip packaging structure

Technical Field

The utility model relates to a diode packaging technology field, concretely relates to high-power diode chip packaging structure.

Background

A diode is an electronic device made of semiconductor material (silicon, selenium, germanium, etc.). It has one-way conducting performance, that is, when positive voltage is applied to the anode of the diode, the diode is conducted. When a reverse voltage is applied to the anode and the cathode, the diode is turned off. Therefore, turning on and off the diode corresponds to turning on and off the switch. Diodes are one of the earliest semiconductor devices and are widely used. In particular, in various electronic circuits, diodes and components such as resistors, capacitors and inductors are reasonably connected to form circuits with different functions, so that various functions such as alternating current rectification, modulation signal detection, amplitude limiting and clamping, and power supply voltage stabilization can be realized.

The prior art has the following defects: when packaging a chip, the conventional diode chip packaging structure cannot be conveniently and rapidly pressed and limited for the pin and the chip body are easily deviated in the packaging process, so that the pin is easily damaged, and meanwhile, a worker cannot conveniently assemble and disassemble the packaging structure, and further cannot conveniently overhaul and replace the chip.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a high-power diode chip packaging structure, can fix and dispel the heat the chip through the radiating gasket, the fixed plate can suppress the stitch when the clamp plate is suppressed the chip body under traction spring's spring action, limiting plate and restricted groove can encapsulate and prescribe a limit to the stitch simultaneously, run through the fixed orifices through fixing bolt and can connect closing cap and unable adjustment base with the mounting hole, make the encapsulation of diode chip with dismantle more convenient, can make things convenient for the staff to overhaul and change the diode chip simultaneously, with the above-mentioned weak point in the solution technique.

In order to achieve the above object, the present invention provides the following technical solutions: a high-power diode chip packaging structure comprises a fixed base, wherein a radiating gasket is fixedly mounted in the middle of the top of the fixed base, a chip body is fixedly mounted at the top of the radiating gasket through bolts, a plurality of pins are fixedly mounted at two ends of the chip body, a sealing cover is arranged at the top of the fixed base, movable grooves are formed in two ends of two sides of the inner wall of the sealing cover, limiting rods are arranged on the inner walls of the four movable grooves, sliding blocks are movably sleeved on the outer sides of the limiting rods, a traction spring is arranged between each sliding block and the inner wall of the adjacent movable groove, a pressing plate is arranged between each sliding block, the bottom of each pressing plate is movably connected with the chip body, limiting plates are arranged at the bottoms of two ends of each sealing cover, a plurality of limiting grooves are formed in the bottom of each limiting plate, the inner walls of the limiting grooves are movably connected with the adjacent pins, and fixing bolts are arranged between four corners of the fixed base and the sealing cover.

Preferably, the four corners of the top of the fixed base are provided with mounting holes, and the four feet of the bottom of the sealing cover are provided with fixing holes.

Preferably, the four fixing holes are respectively formed in the tops of the four mounting holes, and the inner walls of the fixing holes are in threaded connection with the inner walls of the adjacent mounting holes and the outer side of the same fixing bolt.

Preferably, the inner walls of the four movable grooves are fixedly connected with the four limiting rods respectively, and the inner walls of the four movable grooves are movably connected with the outer sides of the four sliding blocks respectively.

Preferably, the top ends of the inner walls of the four movable grooves are fixedly connected with one ends of four traction springs respectively, one ends of the traction springs, far away from the inner walls of the movable grooves, are fixedly connected with the tops of the adjacent sliding blocks respectively, and the four traction springs are movably sleeved outside the four limiting rods respectively.

Preferably, two ends of two sides of the pressing plate are fixedly connected with the four sliding blocks respectively, fixing plates are fixedly mounted at two ends of the pressing plate, and the bottoms of the two fixing plates are movably connected with the tops of the pins at two ends respectively.

Preferably, two ends of the bottom of the sealing cover are fixedly connected with two limiting plates respectively, and the limiting plates are arranged to be elastic rubber material members.

In the technical scheme, the utility model provides a technological effect and advantage:

1. through the arrangement of the pressing plate, the fixing plate and the radiating gasket, when the diode chip is packaged, the radiating gasket can fix the chip and can perform radiating treatment on the chip at the same time, so that the chip can keep normal temperature in the working process, the service life of the chip can be further prolonged, the pressing plate can press and fix the chip body under the elastic action of the traction spring, the fixing plate can press and limit pins at the same time, the chip body and the pins can be kept stable in the packaging and working processes, the limiting plate and the limiting groove can seal and limit the pins at the same time, the sealing cover and the fixing base can be connected by penetrating through the fixing holes and the mounting holes through the fixing bolts, the packaging and the dismounting of the diode chip are more convenient, and meanwhile, a worker can conveniently overhaul and replace the diode chip;

2. through the setting of activity groove and limited rod, the activity groove can be injectd the removal of slider with limited rod, and then makes the slider remain stable at the removal in-process, and then makes the clamp plate remain stable at the removal in-process for the clamp plate can be stable suppress the chip body and injecing, and then makes the chip body remain stable at the packaging process.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required to be used in the embodiments will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present invention, and other drawings can be obtained by those skilled in the art according to these drawings.

Fig. 1 is a schematic view of the overall structure of the present invention.

Fig. 2 is a perspective sectional view of the present invention.

Fig. 3 is an enlarged view of a portion a of fig. 2 according to the present invention.

Fig. 4 is an exploded view of the three-dimensional structure of the present invention.

Fig. 5 is a bottom perspective view of the sealing cap of the present invention.

Description of the reference numerals:

1. a fixed base; 2. a heat sink pad; 3. a chip body; 4. a stitch; 5. sealing the cover; 6. a movable groove; 7. a restraining bar; 8. a slider; 9. a traction spring; 10. pressing a plate; 11. a fixing plate; 12. a limiting plate; 13. defining a slot; 14. a fixing hole; 15. mounting holes; 16. and (5) fixing the bolt.

Detailed Description

The utility model provides a as shown in fig. 1-5 a high-power diode chip packaging structure, including unable adjustment base 1, unable adjustment base 1's top intermediate position fixed mounting has radiator spacer 2, there is chip body 3 at radiator spacer 2's top through bolt fixed mounting, the equal fixed mounting in both ends of chip body 3 has a plurality of stitches 4, unable adjustment base 1's top is provided with closing cap 5, movable groove 6, four have all been seted up at the both ends of the inner wall both sides of closing cap 5 the inner wall of movable groove 6 all is provided with limiting rod 7, limiting rod 7's the equal activity in outside has cup jointed slider 8, be provided with traction spring 9, four between slider 8 and the adjacent movable groove 6 inner wall be provided with clamp plate 10 between slider 8, clamp plate 10's bottom and chip body 3 swing joint, the both ends bottom of closing cap 5 all is provided with limiting plate 12, a plurality of limiting plate 13 have been seted up to limiting plate 12's bottom, limiting groove 13's inner wall and adjacent stitch 4 swing joint, all be provided with fixing base 1 four corners and closing cap 5 between can carry out limiting plate 16 to chip body 3 through pin 10, and can carry out limiting plate 3 and chip body, and keep limiting plate 3 simultaneously, and chip body to chip body suppression chip body 2, and keep limiting plate 3, and chip body in the chip body suppression chip body.

Further, in the above technical scheme, mounting holes 15 have all been seted up at unable adjustment base 1's top four corners, fixed orifices 14 have all been seted up to the bottom four feet of closing cap 5, make closing cap 5 and unable adjustment base 1 align through correspondence between fixed orifices 14 and the mounting holes 15, four fixed orifices 14 set up respectively in the top of four mounting holes 15, the inner wall of fixed orifices 14 and adjacent mounting holes 15 inner wall and same fixing bolt 16 outside threaded connection are connected fixed orifices 14 and mounting holes 15 through fixing bolt 16 for closing cap 5 and unable adjustment base 1 zonulae occludens, and then make chip body 3 encapsulate inside the device.

Further, in the above technical solution, the inner walls of the four movable grooves 6 are respectively fixedly connected with four limiting rods 7, the inner walls of the four movable grooves 6 are respectively movably connected with the outer sides of the four sliding blocks 8, the movable grooves 6 can mount and fix the limiting rods 7, the movable grooves 6 and the limiting rods 7 can limit the movement of the sliding blocks 8, so that the sliding blocks 8 are kept stable in the moving process, the top ends of the inner walls of the four movable grooves 6 are respectively fixedly connected with one ends of four traction springs 9, one ends of the four traction springs 9 far away from the inner walls of the movable grooves 6 are respectively fixedly connected with the tops of the adjacent sliding blocks 8, the four traction springs 9 are respectively movably sleeved on the outer sides of the four limiting rods 7, and the traction springs 9 can draw and limit the sliding blocks 8, so that the sliding blocks 8 and the pressing plates 10 are kept stable in the moving process.

Further, in above-mentioned technical scheme, the both ends at clamp plate 10 both sides respectively with four slider 8 fixed connection, the equal fixed mounting in both ends of clamp plate 10 has fixed plate 11, two the bottom of fixed plate 11 respectively with the stitch 4 top swing joint at both ends, clamp plate 10 can install and fix fixed plate 11, and clamp plate 10 can suppress chip body 3, and fixed plate 11 can be fixed stitch 4 simultaneously.

Further, in the above technical solution, two ends of the bottom of the cover 5 are respectively fixedly connected with two limiting plates 12, the limiting plates 12 are configured as elastic rubber material members, and the pins 4 can be pressed and limited by the limiting plates 12, so that the chip body 3 and the pins 4 are kept stable during the packaging process.

The implementation mode is specifically as follows: the chip body 3 can extrude the pressing plate 10, the pressing plate 10 can move towards the top of the inner side of the sealing cover 5, the sliding block 8 can move upwards along the inner wall of the movable groove 6 on the outer side of the limiting rod 7, the traction spring 9 contracts, the limiting plate 12 can press and limit the pins 4, the outer side of the pins 4 can be attached to the inner wall of the limiting groove 13, the pressing plate 10 resets under the elastic force action of the traction spring 9, the pressing plate 10 can press and fix the chip body 3, the fixing plates 11 on the two ends can press and limit the pins 4 on the two ends, the chip body 3 and the pins 4 can be kept stable in the packaging process, the sealing cover 5 can be tightly connected with the fixed base 1 by penetrating the fixing bolts 16 through the fixing holes 14 and the mounting holes 15, the diode packaging is completed, the packaging and the diode packaging are convenient, the diode chip can be conveniently packaged and disassembled, the maintenance and the replacement of the chip can be conveniently carried out by workers, the chip body 3 can be conveniently carried out in the work of the heat dissipation pad 2, the chip can be kept in the normal work of the chip, the diode, the service life of the diode, and the diode can be conveniently maintained, and the diode, and the service life of the diode can be prolonged, and the diode.

This practical theory of operation: through fixing chip body 3 to 2 tops of cooling pad, fix closing cap 5 to 1 top of unable adjustment base, chip body 3 can produce the extrusion to clamp plate 10, make clamp plate 10 move towards the inboard top of closing cap 5, limiting plate 12 can suppress stitch 4, clamp plate 10 can suppress and fix chip body 3 under traction spring 9's spring action, the fixed plate 11 at both ends can suppress and prescribe to the stitch 4 at both ends simultaneously, run through fixing hole 14 and mounting hole 15 with fixing bolt 16 and make closing cap 5 and unable adjustment base 1 zonulae occludens, make diode encapsulation accomplish, can dispel the heat to chip body 3 through the work of cooling pad 2.

While certain exemplary embodiments of the present invention have been described above by way of illustration only, it will be apparent to those of ordinary skill in the art that the described embodiments may be modified in various different ways without departing from the spirit and scope of the present invention. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive on the scope of the appended claims.

Claims (7)

1. The utility model provides a high-power diode chip packaging structure, includes unable adjustment base (1), its characterized in that: the utility model discloses a heat sink, including unable adjustment base (1), fixed base (1), heat sink middle position fixed mounting have radiating gasket (2), the top of radiating gasket (2) has chip body (3) through bolt fixed mounting, the equal fixed mounting in both ends of chip body (3) has a plurality of stitch (4), the top of unable adjustment base (1) is provided with closing cap (5), activity groove (6), four have all been seted up at the both ends of the inner wall both sides of closing cap (5) the inner wall of activity groove (6) all is provided with spacing pole (7), slider (8) have all been cup jointed in the equal activity in outside of spacing pole (7), be provided with between slider (8) and adjacent activity groove (6) inner wall traction spring (9), four be provided with clamp plate (10) between slider (8), the bottom and chip body (3) swing joint of clamp plate (10), the both ends bottom of closing cap (5) all is provided with limiting plate (12), a plurality of limiting plate (13) have been seted up to limiting plate's (12) bottom, the inner wall and the adjacent four corners swing joint of limiting groove (13) pin (4), the equal four corners swing joint of unable adjustment base (1) and the base (16) are provided with bolt.

2. The high power diode chip package structure of claim 1, wherein: mounting holes (15) are formed in four corners of the top of the fixed base (1), and fixing holes (14) are formed in four feet of the bottom of the sealing cover (5).

3. The high power diode chip package structure of claim 2, wherein: the four fixing holes (14) are respectively formed in the tops of the four mounting holes (15), and the inner walls of the fixing holes (14) are in threaded connection with the inner walls of the adjacent mounting holes (15) and the outer side of the same fixing bolt (16).

4. The high power diode chip package structure of claim 1, wherein: the inner walls of the four movable grooves (6) are fixedly connected with the four limiting rods (7) respectively, and the inner walls of the four movable grooves (6) are movably connected with the outer sides of the four sliding blocks (8) respectively.

5. The high power diode chip package structure of claim 1, wherein: four the inner wall top of activity groove (6) respectively with the one end fixed connection of four traction spring (9), four the one end that activity groove (6) inner wall was kept away from in traction spring (9) respectively with adjacent slider (8) top fixed connection, four the outside of four limiting rod (7) is located to traction spring (9) movable sleeve respectively.

6. The high power diode chip package structure of claim 1, wherein: the two ends of the two sides of the pressing plate (10) are fixedly connected with the four sliding blocks (8) respectively, the two ends of the pressing plate (10) are fixedly provided with fixing plates (11), and the bottoms of the fixing plates (11) are movably connected with the tops of the pins (4) at the two ends respectively.

7. The high power diode chip package structure of claim 1, wherein: the two ends of the bottom of the sealing cover (5) are fixedly connected with two limiting plates (12) respectively, and the limiting plates (12) are elastic rubber material members.

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