CN218215215U - Lobe of a leaf machine - Google Patents

Abstract

The utility model relates to a wafer splitting technical field particularly, relates to a lobe of a leaf machine. The splitting machine comprises a supporting structure, a feeding assembly, a first positioning assembly, a splitting assembly, a second positioning assembly, a processing platform deck and a conveying assembly, wherein the feeding assembly comprises a material box, material sheets are stacked in the material box, the first positioning assembly is located between the feeding assembly and the splitting assembly, and the processing platform deck is located between the second positioning assembly and the splitting assembly. The utility model discloses a tablet in the transportation subassembly will material loading subassembly material box takes out, and the transportation subassembly drives the tablet and passes through first locating component in proper order, the processing microscope carrier, and on the processing microscope carrier, fix a position by second locating component, and carry out the splitting processing by the wafer of splitting subassembly on to the tablet, processing is accomplished the back, put back the magazine by the tablet that the transportation subassembly was accomplished the splitting, come the magazine overall change by artifical or machinery at last, realize full automatic wafer splitting processing from this, the processing production efficiency has greatly been improved.

Description

Lobe of a leaf machine

Technical Field

The utility model relates to a wafer splitting technical field particularly, relates to a lobe of a leaf machine.

Background

In the process of producing chips, since a plurality of chips are prepared on a wafer, the wafer needs to be divided into a plurality of small pieces according to the shapes of the chips. The wafer splitting machine on the market at present needs a lot of manual work in the processes of loading, processing and unloading of wafers, the automation degree and the processing efficiency of equipment are low, and the processing quality cannot be guaranteed.

SUMMERY OF THE UTILITY MODEL

The utility model provides a problem be that the lower machining efficiency and the quality that leads to of equipment degree of automation are low excessively.

In order to solve the problems, the utility model provides a splitting machine, the splitting machine includes a supporting structure, a feeding component, a first positioning component, a splitting component, a second positioning component, a processing carrying platform and a transportation component, the feeding component, the first positioning component, the splitting component, the second positioning component, the processing carrying platform and the transportation component are installed on the supporting structure, the feeding component includes a material box, material sheets are stacked in the material box, the first positioning component is located between the feeding component and the splitting component, and the processing carrying platform is located between the second positioning component and the splitting component; the transportation assembly is used for moving the material sheet in the material box to the first positioning assembly, the first positioning assembly is used for positioning the position of a wafer on the material sheet, the transportation assembly is also used for placing the positioned material sheet on the processing platform deck, the processing platform deck is used for adjusting the direction of the material sheet and the support of the wafer during splitting, the second positioning assembly is used for positioning the position of the wafer cutting path and the shape and size of a crystal grain, and the splitting assembly is used for splitting the material sheet along the cutting path.

Optionally, the feeding assembly further includes a first driving mechanism, the first driving mechanism is mounted on the supporting structure, the first driving mechanism is in driving connection with the magazine, and the first driving mechanism is adapted to drive the magazine to move along a first direction.

Optionally, the first positioning assembly comprises a first positioning camera and a first light source, the web being adapted to be moved between the first positioning camera and the first light source, the first light source being for glazing a bottom of the web, the first positioning camera being for capturing a profile of a wafer on the web.

Optionally, the transportation assembly includes a second driving mechanism and a clamping jaw mechanism, the second driving mechanism is installed on the supporting structure, the second driving mechanism is in driving connection with the clamping jaw mechanism, the second driving mechanism is suitable for driving the clamping jaw mechanism to move along the second direction, and the clamping jaw mechanism is used for clamping or placing the material sheet.

Optionally, gripper mechanism includes third actuating mechanism, fourth actuating mechanism, first clamping jaw and second clamping jaw, third actuating mechanism with second actuating mechanism's drive end is connected, second actuating mechanism is suitable for the drive third actuating mechanism follows the second direction removes, third actuating mechanism with first clamping jaw drive is connected, third actuating mechanism is suitable for the drive first clamping jaw removes along the first direction, fourth actuating mechanism install in on the first clamping jaw, fourth actuating mechanism with second clamping jaw drive is connected, fourth actuating mechanism is suitable for the drive the second clamping jaw to being close to or keeping away from the direction of first clamping jaw removes.

Optionally, the cleaving assembly includes a first connecting member, a fifth driving mechanism, a first cleaver assembly, and a sixth driving mechanism, the fifth driving mechanism is mounted on the supporting structure, the fifth driving mechanism is in driving connection with the first connecting member, and the fifth driving mechanism is adapted to drive the first connecting member to move along the second direction; the sixth driving mechanism is arranged on the first connecting piece, is in driving connection with the first riving knife assembly and is suitable for driving the first riving knife assembly to move towards the direction close to or far away from the processing carrying platform.

Optionally, the splitting assembly further includes a second chopper assembly and a seventh driving mechanism, the seventh driving mechanism is mounted on the first connecting member, the seventh driving mechanism is in driving connection with the second chopper assembly, and the seventh driving mechanism is adapted to drive the second chopper assembly to move toward or away from the processing carrier.

Optionally, the second positioning assembly includes an eighth driving mechanism and a second positioning camera, a support is disposed on the support structure, the eighth driving mechanism is mounted on the support, the eighth driving mechanism is in driving connection with the second positioning camera, the eighth driving mechanism is adapted to drive the second positioning camera to move along a second direction, the second positioning camera is located below the moving stage, and the second positioning camera is configured to capture a wafer on the material sheet.

Optionally, the processing stage includes a ninth driving mechanism, a second connecting member, and a first stage, the ninth driving mechanism is mounted on the supporting structure, the ninth driving mechanism is connected to the second connecting member in a driving manner, the ninth driving mechanism is adapted to drive the second connecting member to move along a third direction, the first stage is movably mounted on the second connecting member, and the first stage is adapted to rotate around the first direction.

Optionally, the processing stage further includes a tenth driving mechanism and a second stage, the second stage is used for supporting when the wafer is cleaved, the second stage is located in a central area of the first stage, the tenth driving mechanism is mounted on the supporting structure, the tenth driving mechanism is in driving connection with the second stage, and the tenth driving mechanism is adapted to drive the second stage to move along the third direction.

Compared with the prior art, the embodiment of the utility model provides a beneficial effect that splitting machine has is:

the material sheet in the material loading component material box is taken out through the transportation component, the transportation component drives the material sheet to sequentially pass through the first positioning component and the processing carrying platform, the second positioning component is used for positioning on the processing carrying platform, the splitting component is used for splitting the wafer on the material sheet, after the processing is completed, the material sheet completed by the splitting is placed back into the material box through the transportation component, and finally the material box is integrally replaced through manpower or machinery, so that the full-automatic wafer splitting processing is realized, and the processing production efficiency is greatly improved.

Drawings

Fig. 1 is a schematic structural view of an embodiment of the breaking machine of the present invention;

fig. 2 is a schematic structural diagram of another embodiment of the splitting machine of the present invention;

fig. 3 is a schematic structural diagram of another embodiment of the splitting machine of the present invention;

FIG. 4 is an enlarged view of a portion of FIG. 1 at A;

fig. 5 is a partially enlarged view of fig. 2 at B.

Description of the reference numerals:

1-a support structure; 11-a scaffold; 2-a feeding assembly; 21-a magazine; 211-a riser; 22-a first drive mechanism; 3-a first positioning assembly; 31-a first positioning camera; 32-a first light source; 33-material sheet positioning rails; 4-splitting the assembly; 41-a first connector; 42-a fifth drive mechanism; 43-a first riving knife assembly; 431-a first blade; 44-a sixth drive mechanism; 45-a second riving knife assembly; 451-a second blade; 46-a seventh drive mechanism; 5-a second positioning assembly; 51-an eighth drive mechanism; 52-a second positioning camera; 6-processing a carrying platform; 61-a ninth drive mechanism; 62-a second connector; 63-a first stage; 64-a tenth drive mechanism; 65-a second stage; 7-a transport assembly; 71-a second drive mechanism; 72-a jaw mechanism; 721-a third drive mechanism; 722-a fourth drive mechanism; 723-a first jaw; 724-second jaw.

Detailed Description

The terms "mounted," "connected," and "coupled" are to be construed broadly and may include, for example, a fixed connection, a removable connection, or a rotatable connection; may be a mechanical connection; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

The present invention provides a coordinate system XYZ in the drawings of the embodiments, wherein the forward direction of the X axis represents the right direction, the backward direction of the X axis represents the left direction, the forward direction of the Z axis represents the top, the backward direction of the Z axis represents the bottom, the forward direction of the Y axis represents the front, the backward direction of the Y axis represents the back, and the directions or positional relationships indicated by the terms "up", "down", "front", "back", "left" and "right" etc. are based on the directions or positional relationships shown in the drawings, and are only for convenience of description, rather than indicating or implying that the device to be referred must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation of the present invention.

The terms "first", "second", and "third", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first," "second," and "third" may explicitly or implicitly include at least one of the feature.

In order to make the aforementioned objects, features and advantages of the present invention more comprehensible, embodiments accompanied with figures are described in detail below.

As shown in fig. 1 and 3, an embodiment of the present invention provides a splinter machine. The splitting machine comprises a supporting structure 1, a feeding component 2, a first positioning component 3, a splitting component 4, a second positioning component 5, a processing carrying table 6 and a conveying component 7, wherein the feeding component 2, the first positioning component 3, the splitting component 4, the second positioning component 5, the processing carrying table 6 and the conveying component 7 are mounted on the supporting structure 1, the feeding component 2 comprises a material box 21, material sheets are stacked in the material box 21, the first positioning component 3 is positioned between the feeding component 2 and the splitting component 4, and the processing carrying table 6 is positioned between the second positioning component 5 and the splitting component 4;

the transportation assembly 7 is used for moving the material sheet in the material box 21 to the first positioning assembly 3, the first positioning assembly 3 is used for positioning the position of a wafer on the material sheet, the transportation assembly 7 is also used for placing the positioned material sheet on the processing carrying platform 6, the processing carrying platform 6 is used for adjusting the direction of the material sheet and the support when the wafer is split, the second positioning assembly 5 is used for positioning the position of the wafer cutting path and the shape and size of a crystal grain, and the splitting assembly 4 is used for splitting the material sheet along the cutting path.

The material sheet in the material box 21 of the material loading assembly 2 is taken out through the transportation assembly 7, the transportation assembly 7 drives the material sheet to sequentially pass through the first positioning assembly 3 and the processing carrying platform 6, the material sheet is positioned on the processing carrying platform 6 through the second positioning assembly 5, the wafer on the material sheet is split by the splitting assembly 4, after the processing is completed, the material sheet completed by the splitting is placed back into the material box 21 through the transportation assembly 7, and finally, the material box 21 is integrally replaced through manpower or machinery, so that the full-automatic wafer splitting processing is realized, and the processing production efficiency is greatly improved.

As shown in fig. 1, the feeding assembly 2 further includes a first driving mechanism 22, the first driving mechanism 22 is mounted on the supporting structure 1, the first driving mechanism 22 is in driving connection with the magazine 21, and the first driving mechanism 22 is adapted to drive the magazine 21 to move along a first direction.

The first direction may be a Z-axis direction in the drawing, the first driving mechanism 22 may be a linear motor, and may drive the whole magazine 21 to move along the Z-axis direction, the magazine 21 may include two vertical plates 211, a plurality of grooves are correspondingly formed on the two vertical plates 211, the material sheet is located between the two vertical plates 211, and the opposite ends of the material sheet may be clamped into the grooves of the vertical plates 211. The material sheets are placed in the magazine 21 along the Z-axis direction, and when the material loading is needed, the first driving mechanism 22 drives the magazine 21 to move, so that the uppermost material sheet in the magazine 21 is moved to a position flush with the transportation assembly 7, and the material sheet is the first material sheet.

The transport assembly 7 may now move to the magazine 21, take the first sheet of material from the magazine 21 and transfer the first sheet of material to a subsequent station for processing accordingly. When the next sheet needs to be processed, the first driving mechanism 22 drives the magazine 21 to move along the positive direction of the Z axis, so that the second sheet moves to a position flush with the transportation assembly 7, and at this time, the transportation assembly 7 clamps the second sheet again. The third and fourth material sheets are thus fed into the magazine 21 in a manner similar to the feeding of the first and second material sheets previously.

As shown in fig. 1 and 2, the first positioning assembly 3 comprises a first positioning camera 31 and a first light source 32, a web is adapted to be moved between the first positioning camera 31 and the first light source 32, the first light source 32 is used for polishing the bottom of the web, and the first positioning camera 31 is used for collecting the contour of a wafer on the web.

The light emitted by the first light source 32 may be infrared light, which has strong infrared light penetrating capability, and when the infrared light irradiates the bottom of the wafer, the infrared light can better penetrate the wafer, so that the first positioning camera 31 located above the wafer can clearly capture the wafer profile to determine the approximate splitting position of the wafer. The first positioning camera 31 may be a wide-angle camera, and the wide-angle camera may identify the entire wafer due to the large size of the wafer.

The first positioning assembly 3 further comprises material sheet positioning rails 33, and the material sheet positioning rails 33 are distributed on two sides of the material sheet in the Y-axis direction, and the position of the material sheet may deflect in the Z-axis direction after the material sheet is taken out from the material box 21 by the transportation assembly 7. Therefore, the material sheet needs to be rotationally reset along the Z-axis direction by the material sheet positioning rails 33, and the position of the material sheet is corrected by the material sheet positioning rails 33, so that the processing precision of subsequent material sheets can be effectively improved.

As shown in fig. 1, 4 and 2, the transport assembly 7 includes a second driving mechanism 71 and a clamping jaw mechanism 72, the second driving mechanism 71 is mounted on the support structure 1, the second driving mechanism 71 is in driving connection with the clamping jaw mechanism 72, the second driving mechanism 71 is adapted to drive the clamping jaw mechanism 72 to move along a second direction, and the clamping jaw mechanism 72 is used for clamping or placing the material sheet.

The second direction may be the direction of the X axis in the figure, the second driving mechanism 71 may be a linear motor, which may ensure good moving precision, and when the second driving mechanism 71 drives the jaw mechanism 72 to move along the X axis direction, the jaw mechanism 72 may accurately move to the corresponding position.

The jaw mechanism 72 includes a third driving mechanism 721, a fourth driving mechanism 722, a first jaw 723 and a second jaw 724, the third driving mechanism 721 is connected to a driving end of the second driving mechanism 71, the second driving mechanism 71 is adapted to drive the third driving mechanism 721 to move along the second direction, the third driving mechanism 721 is in driving connection with the first jaw 723, the third driving mechanism 721 is adapted to drive the first jaw 723 to move along the first direction, the fourth driving mechanism 722 is mounted on the first jaw, the fourth driving mechanism 722 is in driving connection with the second jaw 724, and the fourth driving mechanism 722 is adapted to drive the second jaw 724 to move towards or away from the first jaw 723.

The first direction may be a direction of a Z-axis in the drawing, and the second direction may be a direction of an X-axis in the drawing. The third driving mechanism 721 may be a cylinder, the cylinder may include a cylinder and a piston rod, the piston rod may extend out or retract from the cylinder, a free end of the piston rod is connected to the first clamping jaw 723, and the piston rod may extend out or retract into the cylinder, so as to drive the first clamping jaw 723 to move along the Z-axis direction. The fourth driving mechanism 722 may also be a cylinder, and may include a cylinder and a piston rod, a free end of the piston rod is connected to the second clamping jaw 724, and the piston rod may extend out or retract from the cylinder, so as to drive the second clamping jaw 724 to move toward or away from the first clamping jaw 723, so as to clamp or release the material sheet.

Before clamping the tablets in the magazine 21, the third driving mechanism 721 may drive the first clamping jaw 723 to move to above the tablet to be taken in advance, and the fourth driving mechanism 722 may drive the second clamping jaw 724 to move to below the tablet to be taken in advance. When the web is completely between the first jaw 723 and the second jaw 724, the fourth drive mechanism 722 may drive the second jaw 724 to move in the web direction, and the third drive mechanism 721 may drive the first jaw 723 to move in the web direction until the web is clamped.

Next, the third driving mechanism 721 may drive the first clamping jaw 723 and the second clamping jaw 724 to move up and down, and the fourth driving mechanism 722 may be configured to drive the second clamping jaw 724 to clamp the material sheet. In actual operation, the third driving mechanism 721 drives the first clamping jaw 723 to be close to the upper surface of the material sheet, and then the fourth driving mechanism 722 drives the second clamping jaw 724 to move towards the direction of the lower surface of the material sheet, so as to clamp the material sheet. And when moving the material sheet to the next processing position, the third driving mechanism 721 can move along the negative direction of the Z axis, so that the material sheet is closer to the upper surface of the processing position, the material sheet is ensured to be stably placed, and the material sheet is prevented from being damaged. After a material sheet is put in place, the third driving mechanism 721 drives the first clamping jaw 723 and the second clamping jaw 724 to lift along the positive direction of the Z axis, the fourth driving mechanism 722 can drive the second clamping jaw 724 to move along the negative direction of the Z axis, and the third driving mechanism 721 can drive the first clamping jaw 723 to move along the positive direction of the Z axis, so that the material sheet is loosened.

As shown in fig. 2 to 4, the cleaving assembly 4 includes a first connecting member 41, a fifth driving mechanism 42, a first cleaver assembly 43 and a sixth driving mechanism 44, the fifth driving mechanism 42 is mounted on the supporting structure 1, the fifth driving mechanism 42 is in driving connection with the first connecting member 41, and the fifth driving mechanism 42 is adapted to drive the first connecting member 41 to move along the second direction; the sixth driving mechanism 44 is mounted on the first connecting member 41, the sixth driving mechanism 44 is in driving connection with the first riving knife assembly 43, and the sixth driving mechanism 44 is adapted to drive the first riving knife assembly 43 to move towards or away from the processing carrier 6.

The second direction may be an X-axis direction in the figure, the fifth driving mechanism 42 may be a lead screw motor, the lead screw motor includes a lead screw and a moving block, a through hole is formed in the moving block, and the lead screw penetrates through the through hole and is in threaded connection with the moving block. The first connecting piece 41 is connected with a moving block, and the moving block can drive the first connecting piece 41 to move along the X-axis direction along with the rotation of the screw rod. The first riving knife assembly 43 is mounted on the first connecting member 41, and the first riving knife assembly 43 can also move to different positions of the wafer along the X-axis direction along with the movement of the first connecting member 41.

The sixth driving mechanism 44 may be a lead screw motor, the lead screw motor may include a lead screw and a moving block, a through hole is formed in the moving block, and the lead screw penetrates through the through hole and is in threaded connection with the moving block. The second riving knife assembly 45 is connected with a moving block, and the moving block can drive the second riving knife assembly 45 to move along the Z-axis direction along with the rotation of the lead screw, so that the splitting of the wafer on the processing carrying platform 6 is realized.

As shown in fig. 2 to 4, the splitting assembly 4 further includes a second riving knife assembly 45 and a seventh driving mechanism 46, the seventh driving mechanism 46 is mounted on the first connecting member 41, the seventh driving mechanism 46 is in driving connection with the second riving knife assembly 45, and the seventh driving mechanism 46 is adapted to drive the second riving knife assembly 45 to move toward or away from the processing carrier 6.

The seventh driving mechanism 46 may be a lead screw motor, and the lead screw motor may include a lead screw and a moving block, and the moving block is provided with a through hole, and the lead screw penetrates through the through hole and is in threaded connection with the moving block. The second riving knife assembly 45 is connected with a moving block, and the moving block can drive the second riving knife assembly 45 to move along the Z-axis direction along with the rotation of the lead screw, so that the splitting of the wafer on the processing carrying platform 6 is realized. The second riving knife assembly 45 is mounted on the first connecting member 41, and the second riving knife assembly 45 can also move to different positions of the wafer along the X-axis direction along with the movement of the first connecting member 41.

The second riving knife assembly 45 comprises a second blade 451, the first riving knife assembly 43 can comprise a first blade 431, the length of the first blade 431 can be smaller than that of the second blade 451, and because in the splitting operation of large-size wafers such as 8 inches and 12 inches, the conventional splitting machine uses a splitting knife which is longer than a product when splitting the large-size wafers, when splitting to the edge part, the splitting knife can collide with the carrier to break the blade. In the present embodiment, the splitting operation is performed on the large-sized wafer by using the first blade 431 and the second blade 451 having different lengths, a long blade is used to split the wafer at a wider portion in the middle of the wafer, and a short blade is used to split the wafer at a narrower portion at both ends of the wafer. Collision of the first blade 431 and/or the second blade 451 with the processing stage 6 is effectively avoided.

As shown in fig. 3, the second positioning assembly 5 includes an eighth driving mechanism 51 and a second positioning camera 52, the support structure 1 is provided with a support 11, the eighth driving mechanism 51 is mounted on the support 11, the eighth driving mechanism 51 is in driving connection with the second positioning camera 52, the eighth driving mechanism 51 is adapted to drive the second positioning camera 52 to move along a second direction, the second positioning camera 52 is located below the moving stage, and the second positioning camera 52 is used for shooting a wafer on the material sheet.

The second direction is the direction of the X axis in the figure, a guide rail structure can be arranged on the support 11, the guide rail structure is arranged along the X axis direction, a sliding block structure can be arranged on the second positioning camera 52, and the sliding block structure is connected with the guide rail structure in a sliding mode, so that the second positioning camera 52 can be stably moved. The second positioning camera 52 can be driven to move by an eighth driving mechanism 51, and the eighth driving mechanism 51 can be an air cylinder, an electric cylinder, a stepping motor, a servo motor, a linear motor, and the like. Two driving mechanisms are further installed below the second positioning camera 52, wherein one of the driving mechanisms is used for driving the second positioning camera 52 to move along the Z-axis direction so as to adjust the focal length of the second positioning camera 52; another drive mechanism may drive the second positioning camera to move in the Y-axis direction to adjust the position of the second positioning camera 52. The eighth driving mechanism 51 drives the second positioning camera 52 to move along the X-axis direction, so that the second positioning camera 52 can capture images of different positions of the wafer.

As shown in fig. 2, 4 and 5, the processing stage 6 includes a ninth driving mechanism 61, a second connecting member 62 and a first stage 63, the ninth driving mechanism 61 is mounted on the supporting structure 1, the ninth driving mechanism 61 is in driving connection with the second connecting member 62, the ninth driving mechanism 61 is adapted to drive the second connecting member 62 to move along the third direction, the first stage 63 is movably mounted on the second connecting member 62, and the first stage 63 is adapted to rotate around the first direction.

The first direction may be a Z-axis direction in the figure, the third direction may be a Y-axis direction in the figure, and the first stage 63, which is rotatable about the Z-axis direction, may rotate the scribe line position of the wafer to the same direction as the first blade 431 and the second blade 451. Therefore, the first blade 431 and/or the second blade 451 can be prevented from damaging the crystal grains on the wafer when the wafer is split by the first blade 431 and/or the second blade 451.

The support structure 1 can be provided with a guide rail structure, the guide rail structure can be arranged along the Y-axis direction, the first carrying platform 63 is provided with a sliding block structure, and the sliding block structure is connected with the guide rail structure in a sliding mode, so that the first carrying platform 63 is guaranteed to move stably. The first stage 63 can be driven to move by a ninth driving mechanism 61, and the ninth driving mechanism 61 can be an air cylinder, an electric cylinder, a stepping motor, a servo motor, a linear motor, or the like.

The second positioning camera 52 can move along the X-axis direction, the first stage 63 can move along the Y-axis direction, and the first stage 63 rotates along the Z-axis direction, so that the second positioning camera 52 can acquire images of any position of the wafer.

As shown in fig. 2, 4 and 5, the processing stage 6 further includes a tenth driving mechanism 64 and a second stage 65, the second stage 65 is used for supporting the wafer during the wafer cleaving, the second stage 65 is located in a central area of the first stage 63, the tenth driving mechanism 64 is mounted on the support structure 1, the tenth driving mechanism 64 is in driving connection with the second stage 65, and the tenth driving mechanism 64 is adapted to drive the second stage 65 to move along the third direction.

The third direction may be a Y-axis direction in the drawing, the wafer is arranged on the material sheet, the second stages 65 are mainly used for supporting the splitting position of the wafer on the material sheet, the number of the second stages 65 is two, and the distance between the two second stages 65 is adjustable. In order to facilitate the second positioning camera 52 to acquire images of the wafers on the material sheet, the first carrying table 63 is ring-shaped, and if the splitting assembly 4 is used for splitting directly, the splitting assembly 4 may damage the wafers directly because the middle of the material sheet is not supported. The upper surface of the second stage 65 is higher than the upper surface of the first stage 63, and the distance difference between the upper surface of the second stage 65 and the upper surface of the first stage 63 may be about 1mm, which is more biased to the force applied when the wafer is cleaved. Therefore, the splitting position of the wafer can be effectively supported by the second stage 65, the distance between the two second stages 65 can be adjusted according to the splitting position, and the positioning effect of the second positioning camera 52 can be guaranteed.

The support structure 1 can be provided with a guide rail structure, the guide rail structure is arranged along the Y-axis direction, the second carrying platform 65 is provided with a sliding block structure, and the sliding block structure is connected with the guide rail structure in a sliding mode, so that the second carrying platform 65 is guaranteed to move stably. The second stage 65 can be driven to move by a tenth driving mechanism 64, and the tenth driving mechanism 64 can be an air cylinder, an electric cylinder, a stepping motor, a servo motor, a linear motor, or the like.

Although the present application has been disclosed above, the scope of protection of the present application is not limited thereto. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present application, and such changes and modifications will fall within the scope of the present invention.

Claims (10)

1. A splitting machine is characterized by comprising a supporting structure, a feeding assembly, a first positioning assembly, a splitting assembly, a second positioning assembly, a processing carrying platform and a conveying assembly, wherein the feeding assembly, the first positioning assembly, the splitting assembly, the second positioning assembly, the processing carrying platform and the conveying assembly are arranged on the supporting structure;

the transportation assembly is used for moving the material sheet in the material box to the first positioning assembly, the first positioning assembly is used for positioning the position of a wafer on the material sheet, the transportation assembly is also used for placing the positioned material sheet on the processing platform deck, the processing platform deck is used for adjusting the direction of the material sheet and the support of the wafer during splitting, the second positioning assembly is used for positioning the position of the wafer cutting path and the shape and size of a crystal grain, and the splitting assembly is used for splitting the material sheet along the cutting path.

2. The cleaving machine of claim 1, wherein the loading assembly further comprises a first drive mechanism mounted to the support structure, the first drive mechanism drivingly coupled to the magazine, the first drive mechanism adapted to drive the magazine in a first direction.

3. A slivering machine according to claim 1 wherein said first positioning assembly includes a first positioning camera and a first light source, a web adapted to be moved between said first positioning camera and said first light source, said first light source for glazing a bottom of said web, said first positioning camera for capturing a contour of a wafer on said web.

4. The slivering machine of claim 1, wherein the transport assembly comprises a second driving mechanism and a gripper mechanism, the second driving mechanism is mounted on the support structure, the second driving mechanism is in driving connection with the gripper mechanism, the second driving mechanism is suitable for driving the gripper mechanism to move along the second direction, and the gripper mechanism is used for clamping or placing the material sheet.

5. The wafer splitting machine of claim 4, wherein the clamping jaw mechanism comprises a third driving mechanism, a fourth driving mechanism, a first clamping jaw and a second clamping jaw, the third driving mechanism is connected with the driving end of the second driving mechanism, the second driving mechanism is suitable for driving the third driving mechanism to move along the second direction, the third driving mechanism is in driving connection with the first clamping jaw, the third driving mechanism is suitable for driving the first clamping jaw to move along the first direction, the fourth driving mechanism is installed on the first clamping jaw, the fourth driving mechanism is in driving connection with the second clamping jaw, and the fourth driving mechanism is suitable for driving the second clamping jaw to move towards or away from the first clamping jaw.

6. The cleaving machine of claim 1, wherein the cleaving assembly includes a first link, a fifth drive mechanism, a first riving knife assembly, and a sixth drive mechanism, the fifth drive mechanism being mounted to the support structure, the fifth drive mechanism being drivingly connected to the first link, the fifth drive mechanism being adapted to drive the first link to move in a second direction; the sixth driving mechanism is arranged on the first connecting piece, is in driving connection with the first riving knife assembly and is suitable for driving the first riving knife assembly to move towards the direction close to or far away from the processing carrying platform.

7. The splitting machine of claim 6, wherein the splitting assembly further comprises a second riving knife assembly and a seventh driving mechanism, the seventh driving mechanism is mounted on the first connecting member, the seventh driving mechanism is drivingly connected to the second riving knife assembly, and the seventh driving mechanism is adapted to drive the second riving knife assembly to move toward or away from the processing stage.

8. The splitting machine of claim 1, wherein the second positioning assembly comprises an eighth driving mechanism and a second positioning camera, a support is disposed on the support structure, the eighth driving mechanism is mounted on the support, the eighth driving mechanism is in driving connection with the second positioning camera, the eighth driving mechanism is adapted to drive the second positioning camera to move along a second direction, the second positioning camera is located below the moving stage, and the second positioning camera is used for shooting a wafer on the web.

9. The splitting machine of claim 1, wherein the processing stage comprises a ninth driving mechanism, a second connecting member, and a first stage, the ninth driving mechanism is mounted on the support structure, the ninth driving mechanism is in driving connection with the second connecting member, the ninth driving mechanism is adapted to drive the second connecting member to move along a third direction, the first stage is movably mounted on the second connecting member, and the first stage is adapted to rotate around a first direction.

10. The cleaving machine of claim 9, wherein the processing stage further includes a tenth driving mechanism and a second stage, the second stage is used for supporting the wafer when the wafer is cleaved, the second stage is located in a central region of the first stage, the tenth driving mechanism is mounted on the supporting structure, the tenth driving mechanism is drivingly connected to the second stage, and the tenth driving mechanism is adapted to drive the second stage to move in the third direction.

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