CN218203121U

CN218203121U - Crystallizer copper pipe flow plating device

Info

Publication number: CN218203121U
Application number: CN202222730849.7U
Authority: CN
Inventors: 戴飞鹏
Original assignee: Jinan Weihao Metallurgy Machinery Co ltd
Current assignee: Jinan Weihao Metallurgy Machinery Co ltd
Priority date: 2022-10-18
Filing date: 2022-10-18
Publication date: 2023-01-03
Anticipated expiration: 2032-10-18

Abstract

The utility model discloses a crystallizer copper pipe flow plates device belongs to copper pipe flow and plates technical field, including the plating bath, the one end of plating bath is provided with circulating water pump, and circulating water pump's water inlet and delivery port all are provided with back the liquid pipeline, and the inside of plating bath is provided with the positive pole. Through the device of scraping that sets up, electric telescopic handle reciprocating telescoping motion can drive and scrape the water activity of scraping the water subassembly back and forth in the plating solution of plating bath, can promote the mobility of plating solution in the plating bath greatly, the high mobility's plating solution can push open the bubble that electroplates and produce, thereby reduce the bubble and attach to the trouble on copper pipe surface, scrape the water subassembly through setting up, it is by upper portion wiper blade to scrape the water subassembly, lower part wiper blade and middle part wiper blade constitute, can be to upper portion in the plating bath when scraping water subassembly reciprocating motion, lower part and middle part are regional to scrape the water simultaneously and are handled, be favorable to promoting the promotion effect of plating solution to the bubble, the adaptation is to the application scene of the high degree of depth plating solution in the plating bath.

Description

Crystallizer copper pipe flow plating device

Technical Field

The utility model relates to a copper pipe flow plates technical field, in particular to crystallizer copper pipe flow plates device.

Background

The electroplating refers to performing an electrolytic reaction in a solution by the action of an external direct current to deposit a metal or alloy layer on the surface of an electric conductor, wherein when the electroplating is performed, an anode of an electrode is electrically connected to the electroplating solution, and a cathode of the electrode is connected to a processed object having electric conductivity, and when the current is conducted, positive ions in the solution move toward the cathode of the circuit, are reduced on the surface of the processed object, and form an electroplated layer covering the surface of the processed object, and the fluid plating refers to electroplating performed by placing an electroplated body in a fluid solution, and is divided into outer diameter fluid plating and inner diameter fluid plating; at present, bubbles are generated in the electroplating solution during electroplating, the bubbles are attached to parts to form sand holes, the electroplating solution in the electroplating tank has certain fluidity under the influence of a circulating flow plating mode, but the flowing strength of the electroplating solution is general, the water flow activity difference of each area is large, the bubbles on copper pipes in each area cannot be effectively pushed away when the electroplating tank is long, and the electroplating quality of the copper pipes is unstable.

SUMMERY OF THE UTILITY MODEL

The utility model mainly aims to provide a crystallizer copper pipe flow plates device can effectively solve the problem in the background art.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a crystallizer copper pipe flow plating device, includes the plating bath, the one end of plating bath is provided with circulating water pump, circulating water pump's water inlet and delivery port all are provided with back the liquid pipeline, the inside of plating bath is provided with the positive pole, the inside of plating bath is provided with scrapes the water installation, it includes direction balladeur train, linking arm, electric telescopic handle and scrapes the water subassembly to scrape the water installation, movable mounting has the water subassembly of scraping in the direction balladeur train, the upper portion of scraping the water subassembly is provided with the linking arm, a side fixed surface of linking arm installs electric telescopic handle, it includes upper portion wiper blade, lower part wiper blade and middle part wiper blade to scrape the water subassembly, the below of upper portion wiper blade is provided with the lower part wiper blade, be provided with the middle part wiper blade between upper portion wiper blade and the lower part wiper blade.

As a further improvement of the scheme, one end of each of the upper water scraping plate and the lower water scraping plate is fixedly provided with a guide sliding block, and a connecting rod is fixedly arranged between the guide sliding blocks.

As a further improvement of the scheme, the upper water scraping plate is fixedly connected with the lower water scraping plate through the middle water scraping plate, and the lower end of the connecting arm is fixedly connected with the guide sliding block of the upper water scraping plate.

As a further improvement of the above scheme, a guide sliding groove is formed in a surface of one side of the guide sliding frame, and the upper wiper blade and the lower wiper blade both slide at the guide sliding groove of the guide sliding frame through a guide sliding block.

As a further improvement of the above scheme, the guide carriage is fixedly connected with the inner wall of the electroplating bath, a connecting arm is arranged on the upper surface of the guide carriage, a position adjusting chute is arranged on the upper surface of the guide carriage, and the connecting arm slides at the position adjusting chute of the guide carriage.

As a further improvement of the above scheme, an electric control device is fixedly mounted on the surface of one side of the electroplating bath, the circulating water pump, the anode and the electric telescopic rod are electrically connected with the electric control device through wires, a hanging tool is arranged on the upper portion of the electroplating bath in a hanging mode, and the hanging tool is electrically connected with the cathode.

Compared with the prior art, the utility model discloses following beneficial effect has:

the utility model discloses in, scrape the water installation through setting up, electric telescopic handle reciprocating telescoping motion can drive and scrape the water activity of making a round trip in the plating solution of plating bath of water subassembly, can promote the mobility of plating solution in the plating bath greatly, high-mobility's plating solution can push away the bubble that electroplates and produce, thereby reduce the trouble that the bubble is attached to copper pipe surface, scrape the water subassembly through setting up, it is by the upper portion wiper blade to scrape the water subassembly, lower part wiper blade and middle part wiper blade constitute, can be to upper portion in the plating bath when scraping water subassembly reciprocating motion, lower part and middle part are regional to scrape the water simultaneously and are handled, be favorable to promoting the promotion effect of plating solution to the bubble, the adaptation is to the applied scene of the high degree of depth plating solution in the plating bath.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

fig. 2 is a schematic structural view of a wiper device according to the present invention;

fig. 3 is a schematic structural view of the wiper assembly of the present invention.

In the figure: 1. an electroplating bath; 2. an electric control device; 3. a water circulating pump; 4. a liquid return pipeline; 5. an anode; 6. a wiper device; 7. a guide carriage; 8. a connecting arm; 9. an electric telescopic rod; 10. a wiper assembly; 11. an upper wiper blade; 12. a lower wiper blade; 13. a middle wiper blade; 14. a guide slider; 15. a connecting rod; 16. a positioning chute; 17. a guide chute.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.

As shown in fig. 1-3, a crystallizer copper pipe electroplating apparatus includes an electroplating bath 1, a circulating water pump 3 is disposed at one end of the electroplating bath 1, a liquid return pipe 4 is disposed at a water inlet and a water outlet of the circulating water pump 3, an anode 5 is disposed inside the electroplating bath 1, a wiper device 6 is disposed inside the electroplating bath 1, an electric control device 2 is fixedly mounted on one side surface of the electroplating bath 1, the circulating water pump 3, the anode 5 and an electric telescopic rod 9 are electrically connected to the electric control device 2 through wires, a hanger is suspended above the electroplating bath 1 and electrically connected to a negative electrode, when electroplating is performed, the anode 5 of an electrode is electrically connected to the electroplating bath, and a cathode of the electrode is connected to a workpiece with electric conductivity, when current is conducted, cations with positive charges in the solution move toward the cathode of the circuit, and are reduced on the surface of the workpiece, and an electroplated layer covering the surface of the workpiece is formed.

The water scraping device 6 comprises a guide carriage 7, a connecting arm 8, an electric telescopic rod 9 and a water scraping component 10, the water scraping component 10 is movably installed in the guide carriage 7, the connecting arm 8 is arranged on the upper portion of the water scraping component 10, the electric telescopic rod 9 is fixedly installed on one side surface of the connecting arm 8, guide sliders 14 are fixedly installed at one ends of an upper water scraping plate 11 and a lower water scraping plate 12 respectively, a connecting rod 15 is fixedly installed between the guide sliders 14, the upper water scraping plate 11 is fixedly connected with the lower water scraping plate 12 through a middle water scraping plate 13, the lower end of the connecting arm 8 is fixedly connected with the guide sliders 14 of the upper water scraping plate 11, a guide chute 17 is formed in one side surface of the guide carriage 7, upper portion wiper blade 11 and lower part wiper blade 12 all slide in direction spout 17 department of direction balladeur train 7 through direction slider 14, the inner wall fixed connection of direction balladeur train 7 and plating bath 1, linking arm 8 has been seted up to the upper surface of direction balladeur train 7, the upper surface of direction balladeur train 7 is provided with positioning spout 16, linking arm 8 slides in positioning spout 16 department of direction balladeur train 7, the reciprocal concertina movement of electric telescopic handle 9 can drive to scrape water subassembly 10 and make a round trip to scrape water the activity in the plating solution of plating bath 1, can promote the mobility of plating solution in plating bath 1 greatly, the high mobility's plating solution can push open the bubble that the electroplating produced, thereby reduce the trouble that the bubble is attached to copper pipe surface.

Scrape water subassembly 10 and include upper portion wiper blade 11, lower part wiper blade 12 and middle part wiper blade 13, the below of upper portion wiper blade 11 is provided with lower part wiper blade 12, be provided with middle part wiper blade 13 between upper portion wiper blade 11 and the lower part wiper blade 12, it comprises upper portion wiper blade 11 to scrape water subassembly 10, lower part wiper blade 12 and middle part wiper blade 13, can scrape upper portion in water subassembly 10 reciprocating motion to plating bath 1, lower part and middle part are regional to scrape water simultaneously and are handled, be favorable to promoting the promotion effect of plating solution to the bubble, the adaptation is to the application scene of the high degree of depth plating solution in plating bath 1.

It should be noted that the utility model relates to a crystallizer copper pipe flow plating device, before the electroplating of crystallizer copper pipe, the copper pipe stretches into the plating solution of plating bath 1 through the hanger, at this moment, the positive pole 5 of electrode sets up in the plating solution of plating bath 1, and the negative pole of electrode is connected with the copper pipe on the hanger, when the electric current switches on, the positive ion that has positive electricity in the solution moves towards the negative pole of circuit, the reduction takes place on the surface of the work piece, and form the plating layer that covers the surface of the work piece, in the plating stock process, the plating solution is taken out from plating bath 1 to the liquid return pipe 4 of circulating water pump 3 water inlet, the liquid return pipe 4 of electrically controlled device 2 water outlet flows back the plating solution to plating bath 1, can promote the mobility of plating solution, when electroplating was gone on, the reciprocal concertina movement of electric telescopic handle 9 can drive and scrape water subassembly 10 and make a round trip to scrape the water activity in the plating solution of plating bath 1, can promote the mobility of plating solution in plating bath 1 greatly, the high mobility's plating solution can push away the bubble that electroplates and produce, thereby reduce the bubble and adhere to the trouble on copper pipe surface, wherein, it is by upper portion wiper blade 11 to scrape water subassembly 10, lower part wiper blade 12 and middle part wiper blade 13 constitute, can be to upper portion in the plating bath 1 when scraping water subassembly 10 reciprocating motion, the lower part is scraped water the processing with the middle part region simultaneously, be favorable to promoting the promotion effect of plating solution to the bubble, the adaptation is to the application scene of plating bath 1 high-depth plating solution.

The foregoing shows and describes the basic principles and principal features of the invention, together with the advantages thereof. Although embodiments of the present invention have been shown and described, it is not intended to limit the scope of the invention, which is defined by the appended claims and their equivalents, and all changes in equivalent structure or equivalent flow process that can be made by using the contents of the specification and drawings or applied directly or indirectly to other related technical fields are intended to be embraced therein by the scope of the invention.

Claims

1. The utility model provides a crystallizer copper pipe flow plating device, includes plating bath (1), its characterized in that: the one end of plating bath (1) is provided with circulating water pump (3), the water inlet and the delivery port of circulating water pump (3) all are provided with back liquid pipeline (4), the inside of plating bath (1) is provided with positive pole (5), the inside of plating bath (1) is provided with scrapes water device (6), it includes direction carriage (7), linking arm (8), electric telescopic handle (9) and scrapes water subassembly (10) to scrape water device (6), movable mounting has in direction carriage (7) scrapes water subassembly (10), it is provided with linking arm (8) to scrape the upper portion of water subassembly (10), one side fixed surface of linking arm (8) installs electric telescopic handle (9), it includes upper portion wiper blade (11), lower part wiper blade (12) and middle part wiper blade (13) to scrape water subassembly (10), the below of upper portion wiper blade (11) is provided with lower part wiper blade (12), be provided with middle part wiper blade (13) between upper portion wiper blade (11) and lower part wiper blade (12).

2. The crystallizer copper tube flow plating device as recited in claim 1, wherein: the upper portion wiper blade (11) with the one end of lower part wiper blade (12) all fixed mounting have direction slider (14), fixed mounting has connecting rod (15) between direction slider (14).

3. The crystallizer copper tube flow plating device as recited in claim 2, wherein: the upper part wiper blade (11) is fixedly connected with the lower part wiper blade (12) through a middle part wiper blade (13), and the lower end of the connecting arm (8) is fixedly connected with a guide sliding block (14) of the upper part wiper blade (11).

4. The crystallizer copper pipe flow coating device according to claim 3, wherein: a guide sliding groove (17) is formed in the surface of one side of the guide sliding frame (7), and the upper water scraping plate (11) and the lower water scraping plate (12) slide at the guide sliding groove (17) of the guide sliding frame (7) through a guide sliding block (14).

5. The crystallizer copper tube flow plating device as recited in claim 4, wherein: the electroplating bath guiding device is characterized in that the guiding carriage (7) is fixedly connected with the inner wall of the electroplating bath (1), a connecting arm (8) is arranged on the upper surface of the guiding carriage (7), a position adjusting sliding groove (16) is formed in the upper surface of the guiding carriage (7), and the connecting arm (8) slides in the position adjusting sliding groove (16) of the guiding carriage (7).

6. The crystallizer copper pipe flow coating device according to claim 5, wherein: the electroplating tank is characterized in that an electric control device (2) is fixedly mounted on the surface of one side of the electroplating tank (1), the circulating water pump (3), the anode (5) and the electric telescopic rod (9) are electrically connected with the electric control device (2) through wires, a hanging tool is arranged in the upper portion of the electroplating tank (1) in a hanging mode, and the hanging tool is electrically connected with the cathode.