CN112941600A - Electroplating equipment for precision instrument - Google Patents
Electroplating equipment for precision instrument Download PDFInfo
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- CN112941600A CN112941600A CN202110098848.2A CN202110098848A CN112941600A CN 112941600 A CN112941600 A CN 112941600A CN 202110098848 A CN202110098848 A CN 202110098848A CN 112941600 A CN112941600 A CN 112941600A
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- electroplating
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- 238000009713 electroplating Methods 0.000 title claims abstract description 159
- 239000012535 impurity Substances 0.000 claims abstract description 42
- 238000007747 plating Methods 0.000 claims abstract description 39
- 230000007246 mechanism Effects 0.000 claims abstract description 24
- 238000007789 sealing Methods 0.000 claims description 39
- 238000005192 partition Methods 0.000 claims description 27
- 238000005452 bending Methods 0.000 claims description 7
- 238000000926 separation method Methods 0.000 claims description 6
- 239000007788 liquid Substances 0.000 abstract description 15
- 238000007599 discharging Methods 0.000 abstract description 5
- 238000007667 floating Methods 0.000 abstract description 5
- 238000004140 cleaning Methods 0.000 abstract description 4
- 239000011148 porous material Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 7
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/16—Regeneration of process solutions
- C25D21/18—Regeneration of process solutions of electrolytes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention provides electroplating equipment for a precision instrument, relates to the technical field of electroplating, and solves the problems that the existing impurity cleaning of electroplating solution mostly adopts the mode of completely discharging the electroplating solution in an electroplating bath, but the capacity loss of the electroplating solution is too high in the complete discharging mode, and the subsequent high-intensity work of adding the electroplating solution in the electroplating bath again is also required. The utility model provides a precision instruments electroplating device, includes the plating bath main part, the inside right side slidable mounting of plating bath main part has the closing mechanism. When the floated impurity on the liquid level of clearance plating solution, the reciprocal pulling sliding plate about accessible gripping arm-tie is along two spouts to make the floated impurity contact on the sponge piece that the bottom face of sliding plate set up and the liquid level of plating solution, through the characteristic of the porous material of sponge piece, block the floating impurity on the liquid level of plating solution and adsorb into sponge piece space, realize the clean operation of the floating impurity on the liquid level of plating solution.
Description
Technical Field
The invention belongs to the technical field of electroplating, and particularly relates to electroplating equipment for a precision instrument.
Background
Electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electrolysis, and is a process of attaching a layer of metal film on the surface of a metal or other material product by using the action of electrolysis, thereby having the effects of preventing metal oxidation (such as corrosion), improving wear resistance, conductivity, light reflection, corrosion resistance (such as copper sulfate and the like), enhancing the appearance and the like.
For example, application No.: 202010018612.9 the invention relates to the technical field of electroplating, in particular to an electroplating bath structure and electroplating equipment, comprising: the electroplating baths are sequentially connected, and at least one group of two adjacent electroplating baths are arranged at intervals; the expansion joint structure is connected with two adjacent electroplating baths which are arranged at intervals. The invention provides a plating bath structure and plating equipment which effectively solve the problem that the plating bath collides with the plating bath or liquid leaks when the plating bath and the plating bath move relatively due to the existing connection mode between the plating bath and the plating bath.
Based on the search of the above patent and the discovery of combining the equipment in the prior art, after the electroplating of the existing electroplating bath is completed, some impurities will float on the liquid level of the electroplating solution, and a small amount of impurities can remain in the electroplating solution, the impurities in the electroplating bath are mostly cleaned by discharging the electroplating solution in the electroplating bath, and then the impurities in the discharged electroplating solution are blocked and cleaned in a filtering mode and the like, but the capacity loss of the electroplating solution is too high in the whole discharging mode, and the subsequent electroplating solution adding into the electroplating bath again is high-intensity work.
Disclosure of Invention
In order to solve the technical problems, the invention provides a precision instrument electroplating device, which aims to solve the problems that after the electroplating application of the existing electroplating bath is finished, impurities float on the liquid level of electroplating solution, a small amount of impurities also remain in the electroplating solution, the impurities in the electroplating solution are mostly discharged by the existing impurity cleaning method, the impurities in the discharged electroplating solution are blocked and cleaned by the subsequent methods such as filtering, but the capacity loss of the electroplating solution is too high by the all-discharge method, and the subsequent high-intensity work of adding the electroplating solution into the electroplating bath again is required.
The invention relates to a precise instrument electroplating device, which is realized by the following specific technical means:
a precision instrument electroplating device comprises an electroplating bath main body, wherein a sealing mechanism is slidably mounted on the right side in the electroplating bath main body, and a sliding plate is slidably mounted on the left side in the electroplating bath main body; an impurity output mechanism is fixedly arranged in the plating bath main body and positioned at the right side of the sealing mechanism; the electroplating bath main body comprises a fixed connection seat and a circular mounting hole site, the central part of the bottom surface of the inner end of the concave groove is provided with a circular mounting hole site which is communicated with the bottom end surface of the electroplating bath main body, the upper side part of the right side surface of the inner end of the electroplating bath is welded with a fixed connection seat, the impurity output mechanism comprises a conveying pipe, a right-angle bending pipe, a sleeve column and a circular conveying concave cavity, the bottom end of the conveying pipe passes through the circular mounting hole site and is fixedly connected, the bottom end of the conveying pipe is fixedly connected with a right-angle bending pipe, the top end of the conveying pipe is sleeved with a sleeve column which is coaxial with the conveying pipe, and a round conveying concave cavity is formed in the axis part of the bottom end face of the sleeve column, the diameter of the round conveying concave cavity is larger than that of the conveying pipe, the top end face of the sleeve column is fixedly connected with the fixed connecting seat, the top end face of the inner end of the round conveying concave cavity is higher than that of the conveying pipe, and the bottom end face of the sleeve column and the bottom end face of the partition plate are located on the same horizontal plane.
Furthermore, the plating bath main part comprises a plating bath, a supporting frame and a partition plate, the plating bath main part is provided with a plating bath at the top end face, the supporting frame is fixedly arranged at the bottom end face of the plating bath main part, the right side inside the plating bath is fixedly connected with the partition plate, the front end face and the rear end face of the partition plate are respectively and fixedly connected with the front side face and the rear side face of the inner end of the plating bath, the bottom end face of the partition plate is higher than the bottom face of the inner end of the plating bath, and the top end face.
Furthermore, the electroplating bath main body comprises a circular groove, a rectangular groove and a threaded through hole, the bottom end face of the partition plate is provided with the rectangular groove, the length of the rectangular groove is consistent with the width of the electroplating bath, the central part of the top end face of the partition plate is provided with the circular groove, and the axle center part of the bottom surface of the inner end of the circular groove is provided with the threaded through hole communicated with the rectangular groove.
Furthermore, the plating bath main part is including the spout, a spout has all been seted up to plating bath inner front surface and trailing flank, and the spout is located adjacent plating bath open end position, spout left end termination electrocutes plating bath inner left surface, and spout right-hand member contact partition plate left end face, the sliding plate is including arm-tie and sponge piece, sliding plate length is unanimous with plating bath width, and sliding plate front surface and trailing face all are provided with a slider, and two sliders slide block slide with two spouts respectively and be connected, sliding plate bottom face is provided with a sponge piece rather than with same length, and sliding plate top face is provided with an arm-tie.
Furthermore, the electroplating bath main part is including sunken groove, and the adjacent electroplating bath of inner right flank position of electroplating bath inner bottom surface has seted up a sunken groove, and sunken groove width is less than the interval between division board right-hand member face and the electroplating bath inner right flank, and electroplating bath inner bottom surface is the inclined plane structure of high right-hand member low in the left side, and passes through inclined ramp transitional coupling between electroplating bath inner bottom surface and the sunken groove left flank.
Furthermore, the sealing mechanism comprises a rectangular sealing block, a bearing and a screw, the central part of the top end face of the rectangular sealing block is rotatably connected with the screw through a group of bearings, the rectangular sealing block is slidably connected in the rectangular groove, the screw is in threaded connection with the threaded through hole, and when the top face of the head end of the screw and the top end face of the partition plate are positioned at the same level, the distance from the bottom face of the head end of the screw to the bottom face of the inner end of the circular groove is consistent with the distance from the bottom face of the current rectangular sealing block to the bottom face of the.
Furthermore, the bottom end face of the rectangular sealing block adopts an inclined plane structure with a high left and a low right, and the bottom end face of the rectangular sealing block is parallel to the bottom face of the inner end of the electroplating bath.
Compared with the prior art, the invention has the following beneficial effects:
the front side and the rear side of the inner end of the electroplating bath are respectively provided with a sliding groove, the sliding grooves are positioned at the opening end parts of adjacent electroplating baths, the left end of each sliding groove is connected with the left side of the inner end of the electric-contact plating bath, the right end of each sliding groove is in contact with the left end surface of the partition plate, and the sliding plates are slidably installed between the two sliding grooves.
The bottom surface of the inner end of the electroplating bath is of an inclined surface structure with a height from left to right, so that impurities precipitated at the bottom of the electroplating bath can slide into the concave groove along the inclined surface of the electroplating bath, when the impurities in the electroplating bath are required to be cleaned, more than 98% of the impurities are positioned in the concave groove after standing and waiting for the impurities to be precipitated for a period of time, at the moment, a worker can twist a screw along a threaded through hole through a tool, a bearing converts the rotary motion of the screw into linear motion to push the rectangular sealing block to slide down along the rectangular groove, the bottom end surface of the rectangular sealing block adopts the inclined surface structure with the height from left to right, and the bottom end surface of the rectangular sealing block is parallel to the bottom surface of the inner end of the electroplating bath, so that the rectangular sealing block sliding down along the rectangular groove is until the bottom end surface of the rectangular sealing block is tightly attached to the bottom surface of the inner end of, until the liquid level in the small cavity is higher than the top end face of the sleeve column, siphoning conditions are met, electroplating solution in the small cavity is pumped into the conveying pipe along a channel formed between the circular conveying concave cavity and the outer peripheral face of the conveying pipe and is discharged from the right-angle bent pipe, and therefore cleaning operation of residual impurities in the electroplating solution in the electroplating bath is achieved.
Drawings
Fig. 1 is a schematic sectional structure of the present invention.
Fig. 2 is a schematic view of the present invention at a part enlarged in fig. 1.
Fig. 3 is a schematic structural view of the closure mechanism of fig. 2 in a state of being removed according to the present invention.
Fig. 4 is a schematic view of the present invention at a part B in fig. 1.
Fig. 5 is a partially enlarged structural view of a foreign matter discharging mechanism according to the present invention.
Fig. 6 is a schematic structural view of the closing mechanism and the foreign substance discharge mechanism of fig. 1 in a state where they are removed according to the present invention.
In the drawings, the corresponding relationship between the component names and the reference numbers is as follows:
1. a plating bath main body; 101. an electroplating bath; 102. a support frame; 103. a partition plate; 104. a chute; 105. a recessed groove; 106. fixing the connecting seat; 107. a circular groove; 108. a rectangular groove; 109. a threaded through hole; 1010. a circular mounting hole site; 2. a sliding plate; 201. pulling a plate; 202. a sponge block; 3. a sealing mechanism; 301. a rectangular sealing block; 302. a bearing; 303. a screw; 4. an impurity output mechanism; 401. a delivery pipe; 402. a right-angle bent pipe; 403. sleeving a column; 404. a circular conveying concave cavity.
Detailed Description
The embodiments of the present invention will be described in further detail with reference to the drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
In the description of the present invention, "a plurality" means two or more unless otherwise specified; the terms "upper", "lower", "left", "right", "inner", "outer", "front", "rear", "head", "tail", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "connected" and "connected" are to be interpreted broadly, e.g., as being fixed or detachable or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example (b):
as shown in figures 1 to 6:
the invention provides a precise instrument electroplating device, which comprises: the electroplating bath comprises an electroplating bath main body 1, wherein a sealing mechanism 3 is slidably mounted on the right side inside the electroplating bath main body 1, and a sliding plate 2 is slidably mounted on the left side inside the electroplating bath main body 1; the electroplating bath main body 1 comprises an electroplating bath 101, a supporting frame 102 and a partition plate 103, the top end face of the electroplating bath main body 1 is provided with the electroplating bath 101, the supporting frame 102 is fixedly arranged on the bottom end face of the electroplating bath main body 1, the right side inside the electroplating bath 101 is fixedly connected with the partition plate 103, the front end face and the rear end face of the partition plate 103 are respectively and fixedly connected with the front side face and the rear side face of the inner end of the electroplating bath 101, the bottom end face of the partition plate 103 is higher than the bottom face of the inner end of the electroplating bath 101, and the top end; the electroplating bath main body 1 comprises a circular groove 107, a rectangular groove 108 and a thread through hole 109, the bottom end surface of the separation plate 103 is provided with the rectangular groove 108, the length of the rectangular groove 108 is consistent with the width of the electroplating bath 101, the central part of the top end surface of the separation plate 103 is provided with the circular groove 107, and the axle center part of the bottom surface of the inner end of the circular groove 107 is provided with the thread through hole 109 communicated with the rectangular groove 108; an impurity output mechanism 4 is fixedly arranged in the plating bath main body 1 and positioned at the right side of the sealing mechanism 3; the electroplating bath main body 1 comprises a sliding groove 104, the front side surface and the rear side surface of the inner end of the electroplating bath 101 are respectively provided with a sliding groove 104, the sliding grooves 104 are positioned at the opening end parts of the adjacent electroplating bath 101, the left end of the sliding groove 104 is connected with the left side surface of the inner end of the electroplating bath 101, the right end of the sliding groove 104 is contacted with the left end surface of a separation plate 103, the sliding plate 2 comprises a pull plate 201 and a sponge block 202, the length of the sliding plate 2 is consistent with the width of the electroplating bath 101, the front end surface and the rear end surface of the sliding plate 2 are respectively provided with a sliding block, the two sliding blocks are respectively connected with the two sliding grooves 104 in a sliding manner, the bottom end; the electroplating bath main body 1 comprises a fixed connection seat 106 and a circular mounting hole site 1010, the center part of the bottom surface of the inner end of a concave groove 105 is provided with a circular mounting hole site 1010 penetrating through the bottom end surface of the electroplating bath main body 1, the upper side part of the right side surface of the inner end of an electroplating bath 101 is welded with a fixed connection seat 106, an impurity output mechanism 4 comprises a conveying pipe 401, a right-angle bending pipe 402, a sleeve column 403 and a circular conveying concave cavity 404, the bottom end of the conveying pipe 401 passes through the circular mounting hole site 1010 and is fixedly connected with the same, the bottom end of the conveying pipe 401 is fixedly connected with the right-angle bending pipe 402, the top end of the conveying pipe 401 is sleeved with the sleeve column 403 which has the same axle center with the top end of the conveying pipe, the axle center part of the bottom end surface of the sleeve column 403 is provided with a circular conveying concave cavity 404, the diameter of, the bottom end face of the sleeve column 403 and the bottom end face of the partition plate 103 are at the same horizontal plane.
The electroplating bath main body 1 comprises a concave groove 105, the concave groove 105 is formed in the position, adjacent to the right side face of the inner end of the electroplating bath 101, of the bottom face of the inner end of the electroplating bath 101, the width of the concave groove 105 is smaller than the distance between the right end face of the partition plate 103 and the right side face of the inner end of the electroplating bath 101, the bottom face of the inner end of the electroplating bath 101 is of an inclined plane structure with the height from left to right, and the bottom face of the inner end of the electroplating bath 101 and the.
The sealing mechanism 3 comprises a rectangular sealing block 301, bearings 302 and screws 303, the central part of the top end face of the rectangular sealing block 301 is rotatably connected with one screw 303 through a group of bearings 302, the rectangular sealing block 301 is slidably connected in the rectangular groove 108, the screws 303 are in threaded connection with the threaded through holes 109, and when the top face of the head end of the screws 303 and the top end face of the partition plate 103 are in the same horizontal plane, the distance from the bottom face of the head end of the screws 303 to the bottom face of the inner end of the circular groove 107 is consistent with the distance from the bottom end face of the rectangular sealing block 301 to the bottom face of the inner end of.
The bottom end face of the rectangular sealing block 301 is an inclined plane structure with a high left and a low right, and the bottom end face of the rectangular sealing block 301 is parallel to the bottom face of the inner end of the electroplating bath 101, so that the rectangular sealing block 301 sliding downwards along the rectangular groove 108 is tightly attached to the bottom face of the inner end of the electroplating bath 101 until the bottom end face of the rectangular sealing block is tightly attached to the bottom face of the inner end of the electroplating bath 101, and the electroplating bath 101 is divided into two chambers with one.
When in use:
after the electroplating process is finished, impurities can float on the liquid level of the electroplating liquid; in the invention, the front side surface and the rear side surface of the inner end of the electroplating bath 101 are both provided with one sliding chute 104, the sliding chutes 104 are positioned at the opening end parts of the adjacent electroplating bath 101, the left end of each sliding chute 104 is in contact with the left side surface of the inner end of the electroplating bath 101, the right end of each sliding chute 104 is in contact with the left end surface of the partition plate 103, and the sliding plate 2 is slidably arranged between the two sliding chutes 104, so that when impurities floating on the liquid level of electroplating solution are cleaned, the sliding plate 2 can be pulled to and fro along the two sliding chutes 104 by gripping the pull plate 201, so that the sponge block 202 arranged on the bottom end surface of the sliding plate 2 is in contact with the impurities floating on the liquid level of the electroplating solution, and the impurities floating on the liquid level of the electroplating solution are prevented from being adsorbed into gaps of the sponge;
further, after the electroplating process is completed, a small amount of impurities may remain in the electroplating solution in the electroplating tank 101; the bottom surface of the inner end of the electroplating bath 101 is an inclined surface structure with a high left and a low right, so impurities precipitated at the bottom of the electroplating bath can slide into the concave groove 105 along the inclined surface of the electroplating bath 101, and the bottom surface of the inner end of the electroplating bath 101 is in transitional connection with the left side surface of the concave groove 105 through the inclined ramp, so that the impurities moving into the concave groove 105 are blocked through the arrangement of the inclined ramp, the impurities sliding into the concave groove 105 are prevented from being influenced by the water flow of the electroplating bath and being separated from the concave groove 105, when the impurities in the electroplating bath are required to be cleaned, more than 98 percent of the impurities are positioned in the concave groove 105 after the impurities are settled for a period of time after standing, so that a worker can twist the screw 303 along the threaded through hole 109 through a tool, the screw 303 is rotatably connected with the rectangular closed block 301 through the bearing 302, and the bearing 302 converts the rotary motion of the screw 303 into linear motion to push the, the bottom end face of the rectangular sealing block 301 adopts an inclined plane structure with a higher left part and a lower right part, and the bottom end face of the rectangular sealing block 301 is parallel to the bottom face of the inner end of the electroplating bath 101, so the rectangular sealing block 301 sliding downwards along the rectangular groove 108 until the bottom end face is closely attached to the bottom face of the inner end of the electroplating bath 101, at this time, the electroplating bath 101 is divided into two large chambers and two small chambers, then a worker can add electroplating solution into the small chambers until the liquid level in the small chambers is higher than the top end face of the sleeve column 403, at this time, the siphon condition is met, the electroplating solution in the small chambers is pumped into the conveying pipe 401 along a channel formed between the circular conveying concave cavity 404 and the outer peripheral surface of the conveying pipe 401 and is discharged from the part of the right-angle bending pipe 402, because the impurity output mechanism 4 is positioned at the part of the concave groove 105, when the electroplating solution in the small chambers is pumped, impurities in, therefore, when the liquid level of the electroplating solution in the small cavity is lower than the bottom end surface of the sleeve column 403 before the siphoning condition disappears, all impurities in the concave groove 105 are conveyed out along with the extracted electroplating solution through the impurity output mechanism 4, so that the cleaning operation of the residual impurities in the electroplating solution in the electroplating bath 101 is realized.
The embodiments of the present invention have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiment was chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated.
Claims (7)
1. The utility model provides a precision instruments electroplating device which characterized in that: the electroplating bath comprises an electroplating bath main body (1), wherein a sealing mechanism (3) is slidably mounted on the right side in the electroplating bath main body (1), and a sliding plate (2) is slidably mounted on the left side in the electroplating bath main body (1); an impurity output mechanism (4) is fixedly arranged in the plating bath main body (1) and positioned at the right side of the sealing mechanism (3); the electroplating bath main body (1) comprises a fixed connection seat (106) and a circular mounting hole site (1010), the center part of the bottom surface of the inner end of the concave groove (105) is provided with the circular mounting hole site (1010) which penetrates through the bottom end surface of the electroplating bath main body (1), the upper side part of the right side surface of the inner end of the electroplating bath (101) is welded with the fixed connection seat (106), the impurity output mechanism (4) comprises a conveying pipe (401), a right-angle bending pipe (402), a sleeve column (403) and a circular conveying concave cavity (404), the bottom end of the conveying pipe (401) penetrates through the circular mounting hole site (1010) and is fixedly connected with the circular mounting hole site, the bottom end of the conveying pipe (401) is fixedly connected with the right-angle bending pipe (402), the top end of the conveying pipe (401) is sleeved with the sleeve column (403) which has the same axis with the conveying pipe, the circular conveying concave cavity (404), the top end surface of the sleeve column (403) is fixedly connected with the fixed connecting seat (106), the top end surface of the inner end of the circular conveying cavity (404) is higher than the top end surface of the conveying pipe (401), and the bottom end surface of the sleeve column (403) and the bottom end surface of the partition plate (103) are positioned on the same horizontal plane.
2. A precision instrument plating apparatus as recited in claim 1, wherein: the electroplating bath main body (1) comprises an electroplating bath (101), a supporting frame (102) and a partition plate (103), the top end face of the electroplating bath main body (1) is provided with the electroplating bath (101), the supporting frame (102) is fixedly installed on the bottom end face of the electroplating bath main body (1), the right side of the inside of the electroplating bath (101) is fixedly connected with the partition plate (103), the front end face and the rear end face of the partition plate (103) are fixedly connected with the front side face and the rear side face of the inner end of the electroplating bath (101) respectively, the bottom end face of the partition plate (103) is higher than the bottom face of the inner end of the electroplating bath (101), and the top end face of the partition.
3. A precision instrument plating apparatus as recited in claim 1, wherein: the electroplating bath main body (1) comprises a circular groove (107), a rectangular groove (108) and a thread through hole (109), the bottom end face of the separation plate (103) is provided with the rectangular groove (108), the length of the rectangular groove (108) is consistent with the width of the electroplating bath (101), the center part of the top end face of the separation plate (103) is provided with the circular groove (107), and the axle center part of the bottom surface of the inner end of the circular groove (107) is provided with the thread through hole (109) communicated with the rectangular groove (108).
4. A precision instrument plating apparatus as recited in claim 1, wherein: the electroplating bath main body (1) comprises a sliding groove (104), one sliding groove (104) is formed in each of the front side face and the rear side face of the inner end of the electroplating bath (101), the sliding groove (104) is located at the position of the opening end of the adjacent electroplating bath (101), the left end of the sliding groove (104) is connected with the left side face of the inner end of the electroplating bath (101), the right end of the sliding groove (104) is in contact with the left end face of a partition plate (103), a sliding plate (2) comprises a pull plate (201) and a sponge block (202), the length of the sliding plate (2) is consistent with the width of the electroplating bath (101), the front end face and the rear end face of the sliding plate (2) are respectively provided with a sliding block, the two sliding blocks are respectively connected with the two sliding grooves (104) in a sliding mode, the bottom end face of the sliding plate (2.
5. A precision instrument plating apparatus as recited in claim 1, wherein: the electroplating bath main body (1) comprises a concave groove (105), the concave groove (105) is formed in the position, adjacent to the right side face of the inner end of the electroplating bath (101), of the bottom face of the inner end of the electroplating bath (101), the width of the concave groove (105) is smaller than the distance between the right side face of the right end face of the separation plate (103) and the right side face of the inner end of the electroplating bath (101), the bottom face of the inner end of the electroplating bath (101) is of an inclined plane structure with the height from left to right, and the bottom face of the inner end of the electroplating bath (101).
6. A precision instrument plating apparatus as recited in claim 1, wherein: the sealing mechanism (3) comprises a rectangular sealing block (301), a bearing (302) and a screw (303), the center of the top end face of the rectangular sealing block (301) is rotatably connected with the screw (303) through a group of bearings (302), the rectangular sealing block (301) is slidably connected in the rectangular groove (108), the screw (303) is in threaded connection with the threaded through hole (109), and when the top face of the head end of the screw (303) and the top end face of the partition plate (103) are in the same horizontal plane, the distance from the bottom face of the head end of the screw (303) to the bottom face of the inner end of the circular groove (107) is consistent with the distance from the bottom end face of the rectangular sealing block (301) to the bottom face of the inner end of the.
7. A precision instrument plating apparatus as recited in claim 6, wherein: the bottom end face of the rectangular sealing block (301) is of an inclined plane structure with a high left and a low right, and the bottom end face of the rectangular sealing block (301) is parallel to the bottom face of the inner end of the electroplating bath (101).
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| CN117448911A (en) * | 2023-12-25 | 2024-01-26 | 池州市安安新材科技有限公司 | Subway carriage aluminium alloy oxidation equipment |
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| CN112941600B (en) | 2024-06-04 |
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