CN211005702U - Electroplating bath liquid feeding device capable of preventing air holes and sand holes - Google Patents

Electroplating bath liquid feeding device capable of preventing air holes and sand holes Download PDF

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Publication number
CN211005702U
CN211005702U CN201922200505.3U CN201922200505U CN211005702U CN 211005702 U CN211005702 U CN 211005702U CN 201922200505 U CN201922200505 U CN 201922200505U CN 211005702 U CN211005702 U CN 211005702U
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liquid
plating bath
aqueduct
fixedly connected
holes
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CN201922200505.3U
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Chinese (zh)
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王克刚
张卫卫
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Qingdao Hongyuan Xinyu Machinery Technology Co ltd
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Qingdao Hongyuan Xinyu Machinery Technology Co ltd
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Abstract

The utility model discloses a prevent liquid device on plating bath of gas pocket and sand hole, including the plating bath body, the bottom of plating bath body is provided with the liquid reserve tank, the opening has been seted up to the base face of liquid reserve tank to and fixedly connected with aqueduct, the liquid subassembly is gone up to the bottom fixedly connected with of aqueduct, the bottom fixedly connected with of aqueduct and the connecting pipe that the liquid subassembly leads to and connect, the utility model relates to a plating bath technical field. The utility model discloses, solved the plating bath and gone up the liquid and all bored or milled out the flat slot hole of three rows above the pipe, the round hole, the tank liquor that comes out from these hole spouts has played the stirring effect to the upper trough, makes the upper trough liquid billow roll, also stirs the plating bath completely to the impurity of tank bottom, causes the problem that air pocket, sand hole often appear in the electroplating product.

Description

Electroplating bath liquid feeding device capable of preventing air holes and sand holes
Technical Field
The utility model relates to a plating bath technical field especially relates to a prevent liquid device on plating bath of gas pocket and sand hole.
Background
Since phosphorus-containing copper balls are used for the anode of the copper plating, impurities such as sand grains are contained in the copper balls or are more or less contained in the copper balls, and a certain amount of copper powder is generated in the electroplating process, and a considerable part of the impurities are remained at the bottom of the upper groove. In the traditional electroplating bath, three rows of flat long holes and circular holes are drilled or milled on a circular tube, and bath solution jetted from the holes plays a role in stirring the upper bath, so that the upper bath solution is rolled, impurities at the bottom of the bath are completely stirred into the plating solution, and the electroplated product often has the defects of air holes, sand holes and the like.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem that the liquid feeding of the electroplating bath is realized by drilling or milling three rows of flat long holes and round holes on a round pipe, the bath liquid jetted out from the holes plays a role in stirring the upper bath, so that the upper bath liquid is rolled, and impurities at the bottom of the bath are completely stirred into the electroplating bath, so that the electroplating product often has air holes and sand holes.
In order to achieve the above purpose, the utility model adopts the following technical scheme: a liquid feeding device of a plating bath for preventing air holes and sand holes comprises a plating bath body, wherein a liquid storage tank is arranged at the bottom of the plating bath body, an opening is formed in the base surface of the liquid storage tank, a aqueduct is fixedly connected to the base surface of the liquid storage tank, a liquid feeding assembly is fixedly connected to the bottom of the aqueduct, and a connecting pipe communicated with the liquid feeding assembly is fixedly connected to the bottom of the aqueduct;
go up the liquid subassembly including last liquid portion and the buffering portion that leads to with last liquid portion, two U type slide rails of the equal symmetrical fixedly connected with of inner wall of last liquid portion, the inner wall sliding connection of U type slide rail has the slider, the lateral wall fixedly connected with fly leaf of slider, the lateral wall screw thread cross-under of fly leaf has the lead screw to and bottom fixedly connected with scraper blade, a plurality of liquid feeding hole has been seted up to the base face of last liquid portion to and two clearance holes have been seted up to the equal symmetry of inner wall that is close to the aqueduct both sides.
Preferably, two sides of the bottom of the aqueduct are inclined inwards, and the liquid feeding assembly is positioned on the inclined surface of the aqueduct.
Preferably, the scraper is located on the inner wall of the upper liquid part and is in sliding connection.
Preferably, both ends of the screw rod are rotatably connected with the inner wall of the liquid feeding part, and one end of the screw rod is connected with a motor fixedly arranged on the side wall of the electroplating bath body through a shaft.
Preferably, the connecting pipe is connected with the bottom of the upper liquid part, the connection position is positioned right below the buffer part, and the connecting pipe is positioned inside the plating bath body.
Compared with the prior art, the utility model discloses the beneficial effect who realizes: the output end of a liquid feeding pump is connected with a connecting pipe, the input end of the liquid feeding pump extends into a liquid storage tank through a pipeline to pump liquid, electroplating liquid upwards gushes into an upper liquid part from the connecting pipe and then enters an aqueduct from an upper liquid hole through a scraper, and the upper liquid device actually increases the section of an outlet of the gushing at the port of the connecting pipe immediately before entering the aqueduct, so that the flowing speed of the electroplating liquid is rapidly reduced under the condition of not changing the flow rate, and meanwhile, the upper liquid part also plays a role of buffering, so that the electroplating liquid flowing out from the upper liquid hole is very stable, the liquid level is very calm, and only pure electroplating liquid is arranged around an object to be electroplated without other components, and no air hole or sand hole is generated; a large amount of impurities can be accumulated in the liquid feeding assembly after long-time use, so that the aqueduct is in a liquid-free state, the motor drives the movable plate to move through the screw rod, the impurities accumulated in the buffer part are scraped to the cleaning hole by the scraper, and the impurities can be directly cleaned out of the cleaning hole by a worker.
Drawings
The invention is described in further detail below with reference to the following figures and detailed description:
fig. 1 is a schematic overall structure diagram of the present invention;
FIG. 2 is a side view of the cross-sectional structural diagram of the present invention;
fig. 3 is a schematic structural diagram of part a of the present invention.
In the figure: 1-plating bath body, 2-liquid storage tank, 3-opening, 4-aqueduct, 5-liquid feeding component, 6-connecting pipe, 7-liquid feeding part, 8-buffer part, 9-U-shaped slide rail, 10-slide block, 11-movable plate, 12-screw rod, 13-scraper, 14-liquid feeding hole, 15-cleaning hole and 16-motor.
Detailed Description
The following description is provided for illustrative purposes, and other advantages and features of the present invention will become apparent to those skilled in the art from the following detailed description.
Please refer to fig. 1 to 3. It should be understood that the structure, ratio, size and the like shown in the drawings attached to the present specification are only used for matching with the content disclosed in the specification, so as to be known and read by those skilled in the art, and are not used for limiting the limit conditions that the present invention can be implemented, so that the present invention has no technical essential meaning, and any structure modification, ratio relationship change or size adjustment should still fall within the scope that the technical content disclosed in the present invention can cover without affecting the function that the present invention can produce and the purpose that the present invention can achieve. Meanwhile, the terms such as "upper", "lower", "left", "right", "middle" and "one" used in the present specification are for convenience of description, and are not intended to limit the scope of the present invention, and changes or adjustments of the relative relationship thereof may be made without substantial technical changes, and the present invention is also regarded as the scope of the present invention.
The utility model provides a technical scheme: a liquid feeding device of a plating bath for preventing air holes and sand holes comprises a plating bath body 1, wherein a liquid storage tank 2 is arranged at the bottom of the plating bath body 1, an opening 3 is formed in a base surface of the liquid storage tank 2, a aqueduct 4 is fixedly connected with the base surface of the liquid storage tank 2, a liquid feeding assembly 5 is fixedly connected to the bottom of the aqueduct 4, and a connecting pipe 6 communicated with the liquid feeding assembly 5 is fixedly connected to the bottom of the aqueduct 4;
go up liquid subassembly 5 including last liquid portion 7 and the buffer 8 that leads to with last liquid portion 7 and connect, two U type slide rails 9 of the equal symmetrical fixedly connected with of inner wall of last liquid portion 7, the inner wall sliding connection of U type slide rail 9 has slider 10, the lateral wall fixedly connected with fly leaf 11 of slider 10, the lateral wall screw thread cross-under of fly leaf 11 has lead screw 12 to and bottom fixedly connected with scraper blade 13, liquid hole 14 on a plurality of has been seted up to the base face of last liquid portion 7 to and be close to the equal symmetry of inner wall of aqueduct 4 both sides and seted up two clearance holes 15.
The two sides of the bottom of the aqueduct 4 incline inwards, and the liquid feeding component 5 is positioned on the inclined surface of the aqueduct 4.
The scraper 13 is located on the inner wall of the upper liquid part 7 and is connected in a sliding manner.
Two ends of the screw rod 12 are rotatably connected with the inner wall of the upper liquid part 7, and one end of the screw rod is connected with a motor 16 fixedly arranged on the side wall of the electroplating bath body 1 through a shaft.
The connecting pipe 6 is connected with the bottom of the upper liquid part 7, the connecting position is positioned right below the buffer part 8, and the connecting pipe 6 is positioned in the plating bath body 1.
When the electroplating device is used, the output end of the upper liquid pump is connected with the connecting pipe 6, the input end of the upper liquid pump extends into the liquid storage tank 2 through a pipeline to pump liquid, electroplating liquid upwards gushes into the upper liquid part 7 from the connecting pipe 6 and then enters the aqueduct 4 from the upper liquid hole 14 through the scraper 13, the upper liquid device actually enables the electroplating liquid pumped out by the upper liquid pump to suddenly increase the outlet section of the gushing at the port of the connecting pipe 6 immediately before entering the aqueduct 4, so that the flowing speed of the electroplating liquid is rapidly reduced under the condition of not changing the flow, meanwhile, the upper liquid part 7 also plays a buffering role, the electroplating liquid flowing out from the upper liquid hole 14 is very stable, the liquid level is very flat, only pure electroplating liquid is contained around an object to be electroplated, and no other components exist, and no air holes or sand holes are generated; after long-time use, a large amount of impurities can be accumulated in the liquid feeding assembly 5, so that the aqueduct 4 is in a liquid-free state, the motor 16 drives the movable plate 11 to move through the screw rod 12, the scraper 13 scrapes the impurities accumulated in the buffer part 8 to the cleaning hole 15, and a worker can directly clean the impurities from the cleaning hole 15.
The above embodiments are merely illustrative of the principles and effects of the present invention, and are not to be construed as limiting the invention. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.

Claims (5)

1. The utility model provides a prevent plating bath of gas pocket and sand hole and go up liquid device, includes plating bath body (1), its characterized in that: a liquid storage tank (2) is arranged at the bottom of the electroplating bath body (1), an opening (3) is formed in a base surface of the liquid storage tank (2), a aqueduct (4) is fixedly connected with the base surface, a liquid feeding assembly (5) is fixedly connected with the bottom of the aqueduct (4), and a connecting pipe (6) communicated with the liquid feeding assembly (5) is fixedly connected with the bottom of the aqueduct (4);
go up liquid subassembly (5) including last liquid portion (7) and buffer portion (8) that connect with last liquid portion (7) expert, two U type slide rails (9) of the equal symmetry fixedly connected with of inner wall of last liquid portion (7), the inner wall sliding connection of U type slide rail (9) has slider (10), the lateral wall fixedly connected with fly leaf (11) of slider (10), the lateral wall screw cross-under of fly leaf (11) has lead screw (12) to and bottom fixedly connected with scraper blade (13), liquid hole (14) have been seted up to a plurality of to the base face of going up liquid portion (7) to and two clearance holes (15) have been seted up to the equal symmetry of inner wall that is close to aqueduct (4) both sides.
2. The apparatus of claim 1, wherein the apparatus is adapted to prevent air holes and sand holes from being introduced into the plating bath: the two sides of the bottom of the aqueduct (4) incline inwards, and the liquid feeding assembly (5) is positioned on the inclined surface of the aqueduct (4).
3. The apparatus of claim 1, wherein the apparatus is adapted to prevent air holes and sand holes from being introduced into the plating bath: the scraper (13) is positioned on the inner wall of the upper liquid part (7) and is in sliding connection.
4. The apparatus of claim 1, wherein the apparatus is adapted to prevent air holes and sand holes from being introduced into the plating bath: two ends of the screw rod (12) are rotatably connected with the inner wall of the liquid feeding part (7), and one end of the screw rod is connected with a motor (16) fixedly arranged on the side wall of the electroplating bath body (1) in a shaft mode.
5. The apparatus of claim 1, wherein the apparatus is adapted to prevent air holes and sand holes from being introduced into the plating bath: the connecting pipe (6) is communicated with the bottom of the upper liquid part (7), the communicated part is positioned under the buffer part (8), and the connecting pipe (6) is positioned in the plating bath body (1).
CN201922200505.3U 2019-12-10 2019-12-10 Electroplating bath liquid feeding device capable of preventing air holes and sand holes Active CN211005702U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201922200505.3U CN211005702U (en) 2019-12-10 2019-12-10 Electroplating bath liquid feeding device capable of preventing air holes and sand holes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201922200505.3U CN211005702U (en) 2019-12-10 2019-12-10 Electroplating bath liquid feeding device capable of preventing air holes and sand holes

Publications (1)

Publication Number Publication Date
CN211005702U true CN211005702U (en) 2020-07-14

Family

ID=71481310

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201922200505.3U Active CN211005702U (en) 2019-12-10 2019-12-10 Electroplating bath liquid feeding device capable of preventing air holes and sand holes

Country Status (1)

Country Link
CN (1) CN211005702U (en)

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