CN218194602U - 可混合多种抛光液且实时调节多种抛光液配比的供液系统 - Google Patents
可混合多种抛光液且实时调节多种抛光液配比的供液系统 Download PDFInfo
- Publication number
- CN218194602U CN218194602U CN202221509860.4U CN202221509860U CN218194602U CN 218194602 U CN218194602 U CN 218194602U CN 202221509860 U CN202221509860 U CN 202221509860U CN 218194602 U CN218194602 U CN 218194602U
- Authority
- CN
- China
- Prior art keywords
- liquid
- barrel
- flow control
- control valve
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000007788 liquid Substances 0.000 title claims abstract description 405
- 238000005498 polishing Methods 0.000 title claims abstract description 237
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 46
- 239000011550 stock solution Substances 0.000 claims abstract description 37
- 239000013043 chemical agent Substances 0.000 claims abstract description 36
- 230000001105 regulatory effect Effects 0.000 claims description 25
- 239000000126 substance Substances 0.000 claims description 17
- 238000004891 communication Methods 0.000 claims description 7
- 238000003756 stirring Methods 0.000 claims description 3
- 239000000243 solution Substances 0.000 abstract description 81
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 38
- 229910052710 silicon Inorganic materials 0.000 abstract description 38
- 239000010703 silicon Substances 0.000 abstract description 38
- 239000000203 mixture Substances 0.000 abstract description 14
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 230000008901 benefit Effects 0.000 abstract description 8
- 238000007517 polishing process Methods 0.000 abstract description 3
- 230000008859 change Effects 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 33
- 229910021642 ultra pure water Inorganic materials 0.000 description 24
- 239000012498 ultrapure water Substances 0.000 description 24
- 238000005086 pumping Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 10
- 239000012530 fluid Substances 0.000 description 9
- 230000008569 process Effects 0.000 description 9
- 239000000463 material Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000001802 infusion Methods 0.000 description 3
- 239000011259 mixed solution Substances 0.000 description 3
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007518 final polishing process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Landscapes
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
步骤 | 抛光时间(S) | 抛光液成分 | 抛光液配比 | 抛光液流量(ml/min) |
S1 | 5 | 粗抛液A/碱性化学剂D | 1:19 | 1000 |
S2 | 23 | 粗抛液A/碱性化学剂D | 1:19 | 700 |
S3 | 58 | 中抛液B/超纯水 | 1:6 | 700 |
S4 | 23 | 中抛液B/超纯水 | 1:7 | 700 |
S5 | 8 | 中抛液B/超纯水 | 1:9 | 700 |
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202221509860.4U CN218194602U (zh) | 2022-06-16 | 2022-06-16 | 可混合多种抛光液且实时调节多种抛光液配比的供液系统 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202221509860.4U CN218194602U (zh) | 2022-06-16 | 2022-06-16 | 可混合多种抛光液且实时调节多种抛光液配比的供液系统 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN218194602U true CN218194602U (zh) | 2023-01-03 |
Family
ID=84648354
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202221509860.4U Active CN218194602U (zh) | 2022-06-16 | 2022-06-16 | 可混合多种抛光液且实时调节多种抛光液配比的供液系统 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN218194602U (zh) |
-
2022
- 2022-06-16 CN CN202221509860.4U patent/CN218194602U/zh active Active
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100362297B1 (ko) | 화학기계폴리셔및폴리싱방법 | |
KR100668186B1 (ko) | 슬러리 공급장치 | |
US6910954B2 (en) | Method of supplying slurry and a slurry supply apparatus having a mixing unit at a point of use | |
US3500591A (en) | Glass grinding method and apparatus | |
CA2249965C (en) | Slurry mixing apparatus and method | |
CN218194602U (zh) | 可混合多种抛光液且实时调节多种抛光液配比的供液系统 | |
CN201544127U (zh) | 一种研磨抛光机用供液装置 | |
CN113334245B (zh) | 一种研磨液供给系统 | |
CN101670531B (zh) | 一种可调压自搅拌供液系统 | |
CN217120141U (zh) | 一种抛光液自动配液装置 | |
CN1713967B (zh) | 药液供给装置 | |
CN211216492U (zh) | 一种固态肥连续溶注一体机 | |
CN209029336U (zh) | 晶圆清洗装置 | |
CN214538039U (zh) | 一种抛光液配比监测装置 | |
CN219925708U (zh) | 一种半导体研磨液全自动供应系统 | |
CN220482102U (zh) | 一种液体水泥复合增效剂生产系统 | |
KR20050084139A (ko) | 약액 공급 장치 | |
CN219849015U (zh) | 一种半导体化学研磨液输送混料装置 | |
CN204914273U (zh) | 树脂金刚石线锯制线恒温上料系统 | |
CN217371959U (zh) | 研磨液供给系统 | |
CN117381670A (zh) | 研磨液供给组件、装置、方法及化学机械抛光系统 | |
CN117018904A (zh) | 研磨液的混配装置及其控制方法 | |
KR100423784B1 (ko) | 인조 대리석 제조에 있어서의 개시제 공급장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: No. 1, Xinxin Road, Jinshanqiao Development Zone, Xuzhou, Jiangsu 221000 Patentee after: Zhonghuan Leading (Xuzhou) Semiconductor Materials Co.,Ltd. Address before: No. 1, Xinxin Road, Jinshanqiao Development Zone, Xuzhou, Jiangsu 221000 Patentee before: XUZHOU XINJING SEMICONDUCTOR TECHNOLOGY Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20230630 Address after: 221004 No.1 Xinxin Road, Xuzhou Economic and Technological Development Zone, Jiangsu Province Patentee after: Zhonghuan Leading (Xuzhou) Semiconductor Materials Co.,Ltd. Patentee after: Zhonghuan leading semiconductor materials Co.,Ltd. Address before: No. 1, Xinxin Road, Jinshanqiao Development Zone, Xuzhou, Jiangsu 221000 Patentee before: Zhonghuan Leading (Xuzhou) Semiconductor Materials Co.,Ltd. |
|
CP03 | Change of name, title or address |
Address after: 221004 No.1 Xinxin Road, Xuzhou Economic and Technological Development Zone, Jiangsu Province Patentee after: Zhonghuan Leading (Xuzhou) Semiconductor Materials Co.,Ltd. Country or region after: China Patentee after: Zhonghuan Leading Semiconductor Technology Co.,Ltd. Address before: 221004 No.1 Xinxin Road, Xuzhou Economic and Technological Development Zone, Jiangsu Province Patentee before: Zhonghuan Leading (Xuzhou) Semiconductor Materials Co.,Ltd. Country or region before: China Patentee before: Zhonghuan leading semiconductor materials Co.,Ltd. |