CN218181474U - Server board card heat dissipation device and server board card - Google Patents
Server board card heat dissipation device and server board card Download PDFInfo
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- CN218181474U CN218181474U CN202222550203.0U CN202222550203U CN218181474U CN 218181474 U CN218181474 U CN 218181474U CN 202222550203 U CN202222550203 U CN 202222550203U CN 218181474 U CN218181474 U CN 218181474U
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Abstract
The disclosure relates to the field of heat dissipation of processors of servers, and provides a server board card heat dissipation device and a server board card; the server board card heat dissipation device comprises a thermoelectric conversion module, a fan and a heat dissipation component, and the server board card further comprises a processor, a circuit board and a bottom plate; one surface of the thermoelectric conversion module is used for being attached to the processor, the thermoelectric conversion module is electrically connected with the fan, and an air outlet of the fan is arranged opposite to the heat dissipation part; the thermoelectric conversion module is used for converting heat emitted by the processor into electric energy so as to drive the fan, so that wind flow generated by the work of the fan is blown to the heat dissipation part, and the heat dissipation of the heat dissipation part is accelerated; the heat dissipation component is arranged to dissipate heat which is not absorbed by the thermoelectric conversion module; thus realizing double heat dissipation effect, improving heat dissipation efficiency, realizing reutilization of heat energy, the heat released to the nature is reduced, and the method is green, energy-saving, low-carbon and environment-friendly.
Description
Technical Field
The present disclosure relates to the field of heat dissipation of processors of servers, and in particular, to a heat dissipation device for a server board card and a server board card.
Background
As the degree of integration of semiconductor devices is higher and higher, the power of electronic components is higher and higher, the generated heat is higher and higher, and the heat has a fatal negative effect on the performance of servers. In order to reduce the environmental pollution caused by the heat energy generated by the electronic components and effectively utilize the heat energy generated by the electronic components, a heat conduction device and a heat collection device are arranged outside the heat dissipation device so as to collect the heat energy which cannot be dissipated by the heat dissipation device and convert the heat energy into electric energy through a thermoelectric conversion device.
At present, in the technology of reducing heat extraction of a heat dissipation device to the outside through a thermoelectric conversion principle, an electronic component generating heat energy and a thermoelectric conversion device are arranged in a separated mode, the heat dissipation device is adopted to release part of the heat emitted by the electronic component, and the heat is converted into electric energy through the thermoelectric conversion device, so that the heat is wasted, the environment is polluted, and the structure is complicated.
SUMMERY OF THE UTILITY MODEL
In order to solve the above technical problem or at least partially solve the above technical problem, the present disclosure provides a server board heat dissipation device and a server board.
The utility model provides a server board card heat dissipation device, which comprises a thermoelectric conversion module, a fan and a heat dissipation component;
one surface of the thermoelectric conversion module is used for being attached to the processor, and the thermoelectric conversion module is electrically connected with the fan; the air outlet of the fan is opposite to the heat dissipation part.
The thermoelectric conversion module is used for converting heat emitted by the processor into electric energy so as to drive the fan.
Optionally, the heat dissipation part includes a heat dissipation plate and a heat dissipation fin set, one side of the heat dissipation plate is attached to the other side of the thermoelectric conversion module, and the heat dissipation fin set is disposed on the heat dissipation plate and deviates from one side of the thermoelectric conversion module.
Optionally, the server board card heat dissipation device further includes a battery module, the battery module includes a rechargeable battery and a battery bracket adapted to mount the rechargeable battery, and the rechargeable battery is electrically connected to the thermoelectric conversion module and the fan, respectively.
Optionally, the fan and the battery module are both located on one surface of the heat dissipation plate away from the thermoelectric conversion module.
Optionally, the fan is an axial fan, the air inlet of the fan is located on a side of the fan away from the thermoelectric conversion module, and the air outlet of the fan is disposed toward the heat dissipation component.
Optionally, the heat dissipation fin group includes a plurality of heat dissipation fins that are spaced at equal distances and distributed in parallel, and the heat dissipation fins are all perpendicular to the air outlet.
Optionally, the thermoelectric conversion module comprises a peltier module.
Optionally, the peltier module comprises a plurality of peltier modules, and the peltier modules are electrically connected with each other.
Another aspect of the present disclosure provides a server board, including any one of the above server board heat dissipation devices.
Optionally, the server integrated circuit board still includes treater, circuit board and bottom plate, the circuit board sets up bottom plate one side, the treater sets up the circuit board is kept away from one side of bottom plate, the treater is in orthographic projection on the bottom plate is located server integrated circuit board heat abstractor's thermoelectric conversion module is in orthographic projection on the bottom plate.
In the server board card heat dissipation device provided by the disclosure, the thermoelectric conversion module is arranged on the surface of the processor, so that a large amount of heat energy generated by the processor during working is absorbed and converted into electric energy to supply power for the fan and drive the fan to work; the heat dissipation component is arranged to dissipate heat which is not absorbed by the thermoelectric conversion module; set up the air outlet and the heat dissipation part of fan relatively, make the air current that the fan rotation produced blow to the heat dissipation part for the radiating rate of heat dissipation part, dual radiating effect has been realized, partial heat is absorbed by thermoelectric conversion module and turns into electric energy drive fan work promptly, partial heat transfer dispels the heat in to the heat dissipation part, and the air flow speed that improves heat dissipation part week side through the fan has accelerated the heat dissipation. The double heat dissipation not only improves the heat dissipation efficiency, but also realizes the reutilization of heat energy, reduces the heat released to the nature, and is green, energy-saving, low-carbon and environment-friendly.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.
In order to more clearly illustrate the embodiments or technical solutions in the prior art of the present disclosure, the drawings used in the description of the embodiments or prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.
Fig. 1 is a structural diagram of a server board heat dissipation device and a server board according to an embodiment of the disclosure;
fig. 2 is a cross-sectional view of a server board heat dissipation device and a server board according to an embodiment of the present disclosure;
fig. 3 is an exploded view of a server board heat dissipation device and a server board according to an embodiment of the disclosure.
Wherein, 1, thermoelectric conversion module; 2. a fan; 3. a heat dissipating member; 4. a heat dissipation plate; 5. a set of heat dissipating fins; 6. a rechargeable battery; 7. a battery holder; 8. a processor; 9. a circuit board; 10. a base plate.
Detailed Description
In order that the above objects, features and advantages of the present disclosure may be more clearly understood, aspects of the present disclosure will be further described below. It should be noted that the embodiments and features of the embodiments of the present disclosure may be combined with each other without conflict.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present disclosure, but the present disclosure may be practiced otherwise than as described herein; it is to be understood that the embodiments disclosed in the specification are only a few embodiments of the present disclosure, and not all embodiments.
The server board heat dissipation device is described in detail by specific embodiments as follows:
as shown in fig. 1 to 3, the present embodiment provides a server board heat dissipation device, which includes a thermoelectric conversion module 1, a fan 2 and a heat dissipation component 3; one side of the thermoelectric conversion module 1 is suitable for being attached to a processor to convert heat emitted by the processor into electric energy, and the thermoelectric conversion module 1 is electrically connected with the fan 2 and can be connected through a lead and conduct current; the air outlet of the fan 2 is arranged opposite to the heat dissipation member 3.
When the server works, the processor of the server can generate a large amount of heat energy, the heat energy is partially absorbed by the thermoelectric conversion module 1 attached to the surface of the processor and is converted into electric energy to supply power for the fan 2, the air outlet of the fan 2 is opposite to the heat dissipation part 3, and the air flow blows to the heat dissipation part 3 to accelerate heat dissipation. Therefore, the dual heat dissipation effect is achieved, part of heat energy is absorbed and converted by the thermoelectric conversion module 1 to be electric energy, and part of heat is transferred to the heat dissipation part 3 to be dissipated, so that the heat dissipation efficiency is improved, the heat energy is recycled, the heat released to the nature is reduced, and the solar energy heat dissipation device is green, energy-saving, low-carbon and environment-friendly.
As shown in fig. 3, the heat dissipation member 3 includes a heat dissipation plate 4 and a heat dissipation fin set 5, one surface of the heat dissipation plate 4 is attached to the other surface of the thermoelectric conversion module 1, and at least part of heat that cannot be absorbed by the thermoelectric conversion module 1 is released through the heat dissipation plate 4 attached to the thermoelectric conversion module 1; the heat dissipation fin group 5 is disposed on the side of the heat dissipation plate 4 away from the thermoelectric conversion module 1, and the heat dissipation fin group 5 may be welded on the heat dissipation plate. The heat dissipating fin group 5 can improve the heat dissipating effect by increasing the contact area between the heat dissipating member 3 and the air, thereby improving the heat dissipating performance of the heat dissipating member 3. The heat dissipation member 3 may include metallic aluminum or copper to improve heat conduction.
In some embodiments, the thermoelectric conversion module 1 may include a peltier module. Two different conductors in the Peltier module are connected into a loop, and the temperatures of the two connectors are different, namely the temperature of one surface, attached to the processor, of the Peltier module is higher than that of the other surface, electromotive force is generated in the loop, and current appears. Of course, it should be noted that in other embodiments, the thermoelectric conversion module 1 may be a thermocouple, as long as the effect of absorbing heat energy and converting the heat energy into electric energy is achieved.
In some embodiments, the peltier module comprises a plurality of peltier modules, and the peltier modules are electrically connected with each other, specifically, connected in series through a wire. When the server comprises more than one processor, the number of the Peltier modules is equal to that of the processors, the Peltier modules and the processors are arranged and attached to the processors in a one-to-one correspondence mode, heat emitted by the processors is converted into electric energy, and then the electric energy is connected in series through the conducting wires and connected with the fan 2 to provide electric energy for the fan 2.
As shown in fig. 1, the server board heat sink further includes a battery module, the battery module includes a rechargeable battery 6 and a battery bracket 7 adapted to mount the rechargeable battery 6, and the rechargeable battery 6 is electrically connected to the thermoelectric conversion module 1 and the fan 2, respectively, and may be connected to conduct current through a wire. The rechargeable battery 6 may be a storage battery, and the rechargeable battery 6 with different capacities may be selected according to the power of the fan 2. The rechargeable battery 6 is arranged to store the electric energy converted by the thermoelectric conversion module 1 and provide the electric energy for the fan 2. On one hand, the processor generates unstable heat, and the rechargeable battery 6 is arranged to store the electric energy converted by the thermoelectric conversion module 1, so that stable power supply according to the power of the fan 2 is ensured; on the other hand, when the electric energy converted by the thermoelectric conversion module 1 exceeds the requirement of the fan 2, the redundant electric energy is stored in the rechargeable battery 6, and the waste of the electric energy is avoided. The battery bracket 7 is a die casting, is mainly used for supporting and protecting batteries, and can adapt to batteries with different capacities.
As shown in fig. 3, the fan 2 and the battery module are both located on a side of the heat dissipation plate 4 away from the thermoelectric conversion module 1. The battery module and the heat sink 4 may be connected by bolts, and the fan 2 and the heat sink 4 may be connected by bolts. The fan 2 is positioned on the heat dissipation plate 4 and is positioned on the same plane with the heat dissipation fin group, so that the wind flow can bring away heat flow conveniently, and the heat dissipation efficiency is improved; the battery module is located heating panel 4, with battery module and server integrated circuit board, retrencies the structure, reduces the length of the wire of connecting fan and battery module.
As shown in fig. 1, the fan 2 is an axial flow fan, and when the fan 2 rotates, the airflow flows into the rotary blade path along the axial direction, i.e. the direction perpendicular to the heat dissipation plate 4, and is thrown to the outer edge of the impeller under the action of centrifugal force; the fan 2 comprises a fan cover body, the air inlet and the air outlet are arranged on the fan cover body, the air inlet of the fan 2 is arranged on one side, away from the thermoelectric conversion module 1, of the fan 2, on one hand, the air flow inflow direction of the axial flow fan is matched, on the other hand, the air temperature on one side, away from the thermoelectric conversion module 1, is low, and the cooling efficiency is high; the air outlet of the fan 2 is arranged towards the heat dissipation part 3, specifically towards the heat dissipation fin group 5, the air outlet on the fan cover body limits and guides air at the edge of the impeller to flow out from the air outlet to form an air flow, and the heat of the heat dissipation fin group 5 is taken away by the air flow.
As shown in fig. 1, the heat dissipating fin group 5 includes a plurality of heat dissipating fins distributed in parallel at equal intervals, so that the contact area between the heat dissipating member 3 and air is enlarged, and the heat dissipating efficiency of the heat dissipating member 3 is improved; by making the radiating fins perpendicular to the air outlet, the air flow generated by the operation of the fan 2 can pass through the gaps between the radiating fins to take away the heat on the radiating fins.
Based on the server board card heat dissipation device, the embodiment of the disclosure also provides a server board card, which is adapted to the server board card heat dissipation device provided by the embodiment of the disclosure, the server board card heat dissipation device is installed at a corresponding position on the server board card according to the position of the server processor, and the server board card heat dissipation device can be realized by connecting the heat dissipation plate 4 with the circuit board 9 and the bottom plate 10 through bolts.
The server board card further comprises a processor 8, a circuit board 9 and a bottom plate 10, the circuit board 9 is arranged on one side of the bottom plate 10, the processor 8 is arranged on one side, far away from the bottom plate 10, of the circuit board 9, the orthographic projection of the processor 8 on the bottom plate 10 is located in the orthographic projection of the thermoelectric conversion module 1 of the server board card heat dissipation device on the bottom plate 10, the fact that the thermoelectric conversion module 1 completely covers the processor 8 is guaranteed, and the efficiency of absorbing and converting heat energy released by the processor 8 through the thermoelectric conversion module 1 is improved. The structure size of the circuit board 9 is a standard mainboard, one side of the circuit board 9 is provided with the processor 8 and other required electronic components, and specifically, the processor 8 and the electronic components can be welded on the circuit board 9; the other side of the circuit board 9 is provided with a bottom plate 10, and the bottom plate 10 and the circuit board 9 can be connected through bolts. The base plate 10 may be a sheet metal member, which serves to reinforce and support the circuit board 9; the bottom plate 10 is hollow, so that heat dissipated by the processor 8 in the direction far away from the thermoelectric conversion module 1 can be dissipated to the air conveniently, a reinforcing beam is arranged on the bottom plate 10 at a set distance along the length direction of the circuit board 9, and a mounting hole is formed in the reinforcing beam. The provision of the reinforcement beam on the one hand strengthens the function of the base plate 10 supporting and reinforcing the circuit board 9, making the circuit board 9 less prone to bending damage, and on the other hand provides mounting holes for the bolts connecting the circuit board 9 and the heat sink 4.
It is noted that, in this document, relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrases "comprising one of 8230; \8230;" 8230; "does not exclude the presence of additional like elements in a process, method, article, or apparatus that comprises the element.
The foregoing are merely exemplary embodiments of the present disclosure, which enable those skilled in the art to understand or practice the present disclosure. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the disclosure. Thus, the present disclosure is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A server board card heat dissipation device is characterized by comprising a thermoelectric conversion module (1), a fan (2) and a heat dissipation component (3);
one surface of the thermoelectric conversion module (1) is used for being attached to a processor, and the thermoelectric conversion module (1) is electrically connected with the fan (2); the air outlet of the fan (2) is opposite to the heat dissipation part (3);
the thermoelectric conversion module (1) is used for converting heat emitted by the processor into electric energy so as to drive the fan (2).
2. The server board heat dissipation device as claimed in claim 1, wherein the heat dissipation component (3) comprises a heat dissipation plate (4) and a heat dissipation fin set (5), one surface of the heat dissipation plate (4) is attached to the other surface of the thermoelectric conversion module (1), and the heat dissipation fin set (5) is arranged on the heat dissipation plate (4) on the surface facing away from the thermoelectric conversion module (1).
3. The server board heat sink according to claim 2, further comprising a battery module including a rechargeable battery (6) and a battery bracket (7) adapted to mount the rechargeable battery (6), the rechargeable battery (6) being electrically connected to the thermoelectric conversion module (1) and the fan (2), respectively.
4. The server board heat sink according to claim 3, wherein the fan (2) and the battery module are both located on a side of the heat sink (4) remote from the thermoelectric conversion module (1).
5. The server board heat sink according to claim 4, wherein the fan (2) is an axial fan, the air inlet of the fan (2) is located on the side of the fan (2) away from the thermoelectric conversion module (1), and the air outlet of the fan (2) is located toward the heat sink (3).
6. The server board heat sink as claimed in claim 5, wherein the heat sink fin set (5) comprises a plurality of heat sink fins spaced apart from each other at equal intervals and distributed in parallel, and the heat sink fins are perpendicular to the air outlet.
7. The server board heat sink according to claim 1, wherein the thermoelectric conversion module (1) comprises a peltier module.
8. The server board heat sink of claim 7, wherein the peltier module comprises a plurality of peltier modules, the peltier modules being electrically connected to one another.
9. A server board comprising the server board heat sink of any of claims 1-8.
10. The server board according to claim 9, further comprising a processor (8), a circuit board (9) and a bottom plate (10), wherein the circuit board (9) is disposed on one side of the bottom plate (10), the processor (8) is disposed on one side of the circuit board (9) away from the bottom plate (10), and an orthographic projection of the processor (8) on the bottom plate (10) is located within an orthographic projection of the thermoelectric conversion module (1) of the server board heat sink on the bottom plate (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222550203.0U CN218181474U (en) | 2022-09-23 | 2022-09-23 | Server board card heat dissipation device and server board card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222550203.0U CN218181474U (en) | 2022-09-23 | 2022-09-23 | Server board card heat dissipation device and server board card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218181474U true CN218181474U (en) | 2022-12-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222550203.0U Active CN218181474U (en) | 2022-09-23 | 2022-09-23 | Server board card heat dissipation device and server board card |
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| Country | Link |
|---|---|
| CN (1) | CN218181474U (en) |
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- 2022-09-23 CN CN202222550203.0U patent/CN218181474U/en active Active
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