CN218163406U

CN218163406U - Semiconductor refrigeration wireless charging integrated device and mobile terminal accessory

Info

Publication number: CN218163406U
Application number: CN202222119417.2U
Authority: CN
Inventors: 蔡润武
Original assignee: Individual
Current assignee: Individual
Priority date: 2022-08-11
Filing date: 2022-08-11
Publication date: 2022-12-27
Anticipated expiration: 2032-08-11

Abstract

The utility model discloses a wireless integrated device and mobile terminal accessory that charges of semiconductor refrigeration, wherein, this wireless integrated device that charges of semiconductor refrigeration includes: a circuit board; the semiconductor refrigerating piece comprises a substrate and a plurality of semiconductor particles, the semiconductor particles are welded on one side of the substrate, the circuit board is arranged on the substrate, and the refrigerating circuit is coupled with the semiconductor refrigerating piece; the wireless subassembly that charges and wireless charging circuit coupling connection, the wireless subassembly that charges include the charging coil, and the charging coil setting is in one side of circuit board. The utility model discloses welding semiconductor particle on the base plate of semiconductor refrigeration piece, with the circuit board setting on the base plate of semiconductor refrigeration piece, refrigerating circuit and wireless charging circuit on the circuit board are connected with semiconductor refrigeration piece and wireless charging assembly coupling respectively, effectively reduce the wireless integrated device that charges of semiconductor refrigeration's volume, avoid wireless charging device heat transfer to mobile terminal, realize cooling, the effect of charging mobile terminal.

Description

Semiconductor refrigeration wireless charging integrated device and mobile terminal accessory

Technical Field

The utility model relates to a mobile terminal accessory technical field especially relates to a wireless integrated device and mobile terminal accessory that charge of semiconductor refrigeration.

Background

When the mobile terminal runs a large application program and wirelessly charges, the situation that the body of the mobile terminal is overheated easily exists, when the temperature exceeds a certain threshold value, the mobile terminal can trigger a protection program to limit the performance and the charging power of the mobile terminal, and for the situation, a user can generally adopt a heat dissipation back clip to cool the mobile terminal so as to maintain the high-performance use of the mobile terminal.

In the prior art, a back clip for radiating the mobile terminal occupies most of the space on the back side of the mobile terminal, so that the wireless charging and the mobile terminal cooling are difficult to realize, although some manufacturers adopt a setting mode of overlapping a wireless charger and a radiator aiming at the problem, the whole thickness of the device is too thick, the wireless charger is directly and directly connected to the mobile terminal, the heat loss of the semiconductor refrigeration piece through the wireless charger is reduced, the radiating effect of the mobile terminal is greatly reduced, and the charging effect is not ideal.

Accordingly, the prior art is yet to be improved and developed.

SUMMERY OF THE UTILITY MODEL

Because occupied the dorsal most space of mobile terminal owing to the back splint to mobile terminal among the solution prior art, consequently be difficult to realize taking into account wireless charging and to mobile terminal cooling two kinds of functions, though there is some firm to this problem adoption with wireless charger and radiator superimposed mode that sets up, nevertheless also leads to the whole thickness of device too thick simultaneously, wireless charging distance too big results in the effect of charging also not ideal problem, the utility model provides an integrated device that charges that semiconductor refrigeration is wireless.

The utility model discloses a following technical scheme realizes:

the utility model provides an integrated device that charges that semiconductor refrigeration is wireless, wherein, integrated device that charges that semiconductor refrigeration is wireless includes:

the circuit board is provided with a refrigeration circuit and a wireless charging circuit;

the semiconductor refrigeration piece comprises a substrate and a plurality of semiconductor particles, the semiconductor particles are welded on one side of the substrate, the circuit board is arranged on the substrate, and the refrigeration circuit is coupled with the semiconductor refrigeration piece;

the wireless charging assembly is in coupling connection with the wireless charging circuit, the wireless charging assembly comprises a charging coil, and the charging coil is arranged on one side of the circuit board.

The semiconductor refrigeration and wireless charging integrated device further comprises a heat dissipation piece, wherein the heat dissipation piece is arranged on one side, away from the semiconductor particles, of the substrate;

the heat sink includes:

the radiating fins are arranged on the substrate at intervals of a preset distance and in an array along a preset angle;

and the radiating fan is arranged on the substrate and is in circuit connection with the semiconductor refrigerating element.

The semiconductor refrigeration and wireless charging integrated device is characterized in that a mounting part is arranged at the central position of one side of the substrate, which is far away from the semiconductor particles, a plurality of radiating fins are circumferentially arranged on the outer side of the mounting part, and the radiating fan is fixedly arranged on the mounting part;

the height dimension of the heat radiation fan corresponds to the height dimension of the heat radiation fins.

The wireless integrated device that charges of semiconductor refrigeration, wherein, the wireless integrated device that charges of semiconductor refrigeration still includes:

the casing, the casing cover is established the radiating piece with the outside of semiconductor refrigeration piece, the side on the casing side circumference is provided with a plurality of ventilation holes, and is a plurality of the ventilation hole corresponds with a plurality of the position that heat radiation fins set up.

Semiconductor refrigeration integrated device that wirelessly charges, wherein, semiconductor refrigeration spare is including setting up the refrigeration face at the opposite side, semiconductor refrigeration integrated device that wirelessly charges still includes:

first collar, it is first the collar laminating sets up on the refrigeration face, just first collar gomphosis cover is established in the casing, just first collar with one side setting of casing is in same horizontal plane.

The semiconductor refrigeration and wireless charging integrated device is characterized in that the inner diameter of the first mounting ring is matched with the diameter of the charging coil;

the first mounting ring is a permanent magnet mounting ring;

or, the first mounting ring is a primary magnet mounting ring.

The semiconductor refrigeration and wireless charging integrated device is characterized in that a mounting hole is formed in the center of the semiconductor refrigeration piece, the circuit board is arranged in the mounting hole, a connecting plug is arranged on the semiconductor refrigeration piece, and the connecting plug is embedded on the semiconductor refrigeration piece in a coupling mode and protrudes towards one side where the mounting hole is located;

the circuit board is provided with a mounting groove at a position corresponding to the connecting plug, and the mounting groove is matched with the connecting plug in a clamping manner.

The semiconductor refrigeration wireless charging integrated device is characterized in that a first contact electrode is arranged on one side, facing the circuit board, of the connecting plug, a second contact electrode is arranged in the mounting groove corresponding to the first contact electrode, and when the connecting plug is clamped in the mounting groove, the first contact electrode is coupled with the second contact electrode.

The semiconductor refrigeration wireless charging integrated device is characterized in that a control chip and a wireless connector are arranged on the circuit board, and the wireless connector is connected with the control chip through a circuit.

The semiconductor refrigeration and wireless charging integrated device is characterized in that the circuit board and the charging coil are separated from the semiconductor refrigeration piece, and the semiconductor refrigeration piece is independently used for heat dissipation of the mobile terminal.

A mobile terminal accessory, wherein the mobile terminal accessory comprises the semiconductor refrigeration and wireless charging integrated device;

the mobile terminal accessory further comprises:

the protective housing, the gomphosis is provided with the second collar on the protective housing, the shape of second collar with the shape adaptation of the first collar that sets up in the wireless integrative device that charges of semiconductor refrigeration, the second collar is the permanent magnet collar, or, the second collar is former magnet collar.

The beneficial effects of the utility model reside in that: the utility model discloses a welding semiconductor particle on the base plate of semiconductor refrigeration piece, with the circuit board setting on the base plate of semiconductor refrigeration piece, refrigeration circuit and wireless charging circuit on the circuit board respectively with semiconductor refrigeration piece and wireless charging assembly coupling connection, effectively reduce the volume of the wireless integrated device that charges of semiconductor refrigeration, avoid wireless charging device heat transfer to mobile terminal, realize cooling, the effect of charging to mobile terminal.

Drawings

Fig. 1 is a schematic structural view of the semiconductor refrigeration and wireless charging integrated device of the present invention;

fig. 2 is a schematic structural diagram of a second embodiment of the integrated semiconductor refrigeration and wireless charging device of the present invention;

fig. 3 is an enlarged view of the a-node structure of the semiconductor refrigeration and wireless charging integrated device in fig. 2;

figure 4 is the utility model discloses mobile terminal protective housing's among the mobile terminal accessory structural schematic.

In fig. 1 to 4: 100. a semiconductor refrigeration member; 101. a substrate; 102. a semiconductor particle; 110. mounting holes; 120. a connecting plug; 200. a charging coil; 300. a circuit board; 310. mounting grooves; 320. a second contact electrode; 330. a control chip; 340. a wireless connector; 400. a heat sink; 411. an installation part; 420. heat dissipation fins; 430. a heat radiation fan; 500. a housing; 510. a vent hole; 520. a hole for abdication; 600. a first mounting ring; 700. a protective shell; 710. a second mounting ring; 800. a mobile terminal.

Detailed Description

In order to make the objects, technical solutions and effects of the present invention clearer and clearer, the following description of the present invention will refer to the accompanying drawings and illustrate embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.

It should be noted that, if directional indications (such as upper, lower, left, right, front and rear \8230;) are involved in the embodiments of the present invention, the directional indications are only used to explain the relative positional relationship between the components in a specific posture (as shown in the attached drawings), the motion situation, etc., and if the specific posture is changed, the directional indications are changed accordingly.

In addition, if there is a description of "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

Based on the above-mentioned problem among the prior art, the utility model provides a wireless integrated device that charges of semiconductor refrigeration, as shown in FIG. 1, this wireless integrated device that charges of semiconductor refrigeration includes: the circuit board is provided with a refrigeration circuit and a wireless charging circuit; the semiconductor refrigeration piece comprises a substrate and a plurality of semiconductor particles, the semiconductor particles are welded on one side of the substrate, the circuit board is arranged on the substrate, and the refrigeration circuit is coupled with the semiconductor refrigeration piece; the wireless charging assembly is in coupling connection with the wireless charging circuit, the wireless charging assembly comprises a charging coil, and the charging coil is arranged on one side of the circuit board.

The utility model discloses a welding semiconductor particle on the base plate of semiconductor refrigeration piece, with the circuit board setting on the base plate of semiconductor refrigeration piece, refrigeration circuit and wireless charging circuit on the circuit board respectively with semiconductor refrigeration piece and wireless charging assembly coupling connection, effectively reduce the volume of the wireless integrated device that charges of semiconductor refrigeration, avoid wireless charging device heat transfer to mobile terminal, realize cooling, the effect of charging to mobile terminal.

In the above embodiment, as shown in fig. 1, the main body of the semiconductor refrigeration and wireless charging integrated device of the present invention includes a semiconductor refrigeration piece, a circuit board and a charging coil, wherein the semiconductor refrigeration piece is a semiconductor refrigeration piece, in this embodiment, the circuit board is prefabricated with a refrigeration circuit and a wireless charging circuit, the semiconductor refrigeration piece includes a substrate and a plurality of semiconductor particles, the semiconductor particles in fig. 1 are wrapped by a housing, and the specific state of the semiconductor particles can refer to the structure of the semiconductor particles in the semiconductor refrigeration piece in the prior art; during actual manufacturing, a plurality of semiconductor particles are welded on one side of the substrate, the circuit board is fixed on the substrate in a welding mode, and the wireless coil in the wireless charging assembly is fixed on the circuit board, so that the structural mode that the wireless charging assembly and the circuit board are arranged inside the semiconductor refrigerating piece is formed.

In the prior art, devices which have wireless and cool mobile terminals are often arranged in a manner of superposing a semiconductor refrigeration sheet and a charging coil, and the arrangement problem is that when the semiconductor refrigeration sheet is adhered to the mobile terminal, the charging coil is necessarily far away from the mobile terminal, so that the wireless charging effect is influenced; when the charging coil is attached to the mobile terminal, the semiconductor refrigerating sheet needs to conduct temperature to the mobile terminal through a medium, and the process inevitably causes reduction of heat dissipation efficiency; the utility model discloses a set up wireless charging assembly inside semiconductor refrigeration spare, can realize the function that charges to mobile terminal promptly, also can realize the function to the mobile terminal cooling, simultaneously, effectively reduced the volume of the wireless integrated device that charges of semiconductor refrigeration, be convenient for assemble and carry.

In the above embodiment, the semiconductor refrigeration piece is a heat transfer tool, which includes an N-type semiconductor material and a P-type semiconductor material, when the N-type semiconductor material and the P-type semiconductor material are connected to form a thermocouple pair, and when a current flows through the thermocouple pair, heat transfer occurs at both ends of the N-type semiconductor material and the P-type semiconductor material, i.e. one side is refrigerated and the other side is heated, in the process, the temperature difference heat between the two polar plates can be reversely transferred through the air and the semiconductor refrigeration piece, and when the refrigeration surface and the heat dissipation surface reach a certain temperature difference, a balance point can be reached.

In this embodiment, as shown in fig. 1, after one side of the cooling surface of the semiconductor cooling device is attached to the mobile terminal, the temperature of one side of the cooling surface rises, so as to ensure that one side of the cooling surface of the semiconductor cooling device can continuously maintain a low temperature, in this embodiment, a heat dissipation member is further disposed in the wireless heat dissipation device, the heat dissipation member is disposed on one side of the heat dissipation surface of the semiconductor cooling device and is used for accelerating the speed of heat exchange between one side of the heat dissipation surface and air, and when the wireless heat dissipation device is specifically disposed, the heat dissipation member is based on a substrate in the semiconductor cooling device, and a heat dissipation fin and a heat dissipation fan are disposed on the substrate, wherein the substrate of the semiconductor cooling device is made of a metal material with a high thermal conductivity coefficient, such as copper, aluminum, and the heat dissipation fin is directly disposed on one side of the substrate away from the semiconductor particles.

In one embodiment, as shown in fig. 1, the semiconductor cooler 100 and the circuit board 300 are mounted by soldering, in a specific manufacturing process, the circuit board 300 and the semiconductor cooler 100 are connected before the semiconductor cooler 100 is manufactured, specifically, the circuit board 300 is mounted in the mounting hole 110 before the semiconductor cooler 100 is manufactured, the circuit board 300 is fixed by soldering, the soldering temperature is 288 ℃ in the process according to the soldering temperature requirement, after the circuit board 300 is mounted, the N-type semiconductor particles and the P-type semiconductor particles in the semiconductor cooler 100 are mounted, the bonding temperature of the N-type semiconductor particles and the P-type semiconductor particles is 188 ℃ in the process, and the mounting process avoids the influence of the circuit board 300 and the semiconductor cooler 100 on the N-type semiconductor particles and the P-type semiconductor particles in the semiconductor cooler, and the N-type semiconductor particles and the P-type semiconductor particles are prevented from falling off or moving due to high temperature.

The heat dissipation fins are arranged on the substrate at preset intervals and arranged on the substrate along a preset angle array and located on the opposite side of the substrate connected with the semiconductor refrigeration piece, the heat dissipation fins are made of metal materials with high temperature conduction coefficients such as copper and aluminum, and are perpendicular to the substrate when in actual setting, the heat dissipation fins are fixed on the substrate in a welding mode and the like, the temperature conducted on the substrate can be quickly conducted to the heat dissipation fins, and the contact area between the heat dissipation surface of the semiconductor refrigeration piece and the air is increased due to the arrangement of the heat dissipation fins and the substrate, so that the heat dissipation efficiency of the heat dissipation surface can be improved, and the effect of continuous refrigeration and cooling of the refrigeration surface is further ensured.

Furthermore, the heat dissipation fan is also arranged on the heat dissipation substrate and is positioned at one side of the heat dissipation substrate corresponding to the plurality of heat dissipation fins, the heat dissipation fan is in circuit connection with the semiconductor refrigeration sheet, when the semiconductor refrigeration sheet obtains electric energy supply, the electric energy is synchronously conveyed to the heat dissipation fan to enable the heat dissipation fan to rotate, and the air flow generated by the rotating heat dissipation fan can accelerate the air flow speed on the surfaces of the heat dissipation fins, so that the heat exchange efficiency between the heat dissipation fins and the air is further improved.

Specifically, as shown in fig. 1, an installation portion is further disposed at a central position of a side of the heat dissipation substrate away from the semiconductor refrigeration element, the plurality of heat dissipation fins are circumferentially disposed at an outer side of the installation portion, even though a relief space is reserved at the central position of the heat dissipation substrate, the heat dissipation fan is fixedly disposed on the installation portion, after the heat dissipation fan is disposed, the plurality of heat dissipation fins form an arrangement form surrounding the heat dissipation fan, and since the heat dissipation fins are disposed at a predetermined angle and a certain distance is reserved between adjacent heat dissipation fins, when the heat dissipation fan starts to rotate, generated air flow moves along a gap between adjacent heat dissipation fins, i.e., a plurality of air channels are formed, so that a flow velocity of air on the surface of the heat dissipation fins is further ensured, and the heat dissipation efficiency of the heat dissipation fins is effectively improved.

In actual installation, the height of the heat dissipation fan is preferably set to correspond to the height of the heat dissipation fins, which has the advantages that on one hand, airflow generated by the heat dissipation fan can correspondingly flow into gaps between adjacent heat dissipation fins to accelerate heat exchange between air and the heat dissipation fins, and on the other hand, the setting size of the integrated semiconductor refrigeration and wireless charging device can be smaller and more compact, so that a user can hold the mobile terminal in the process of charging and cooling the mobile terminal.

The utility model discloses an in another can the implementation way, as shown in fig. 1, for avoiding the user to use the wireless integrated device that charges of semiconductor refrigeration to carry out charging and radiating in-process to mobile terminal, above-mentioned radiator fan and heat radiation fins fish tail user's hand, still be provided with a casing in the wireless integrated device that charges of semiconductor refrigeration in this embodiment, this casing cover is established in the outside of above-mentioned radiating piece and semiconductor refrigeration piece, form the protection to radiator fan and heat radiation fins, simultaneously, for guaranteeing the radiating efficiency of radiating piece, in the utility model discloses a still be provided with a plurality of ventilation holes in the side of casing all around, a plurality of ventilation hole fretwork settings, and correspond with the position that heat radiation fins in the radiating piece set up, when radiator fan rotates, the air current that radiator fan formed blows off through the passageway that adjacent heat radiation fins formed, the position that corresponds the ventilation hole setting makes the gas that has carried out the heat exchange discharge from the casing, at this moment because the casing inside atmospheric pressure is low, the outside fresh air of casing flows into inside the casing, carries out the heat exchange of new round, consequently can improve the radiating efficiency.

In another possible implementation manner of the present invention, as shown in fig. 1, based on the above embodiment, in order to realize the portable installation of the integrated semiconductor refrigeration and wireless charging device on the mobile terminal, in this embodiment, a first installation ring is further disposed on one side of the refrigeration surface of the semiconductor refrigeration piece, and in actual installation, the first installation ring is attached to the refrigeration surface, the first installation ring is made of a material with a higher temperature conductivity coefficient, so that the low temperature generated by the refrigeration surface on the semiconductor refrigeration piece can be conducted to the mobile terminal, and the whole integrated semiconductor refrigeration and wireless charging device can be quickly installed or detached on the back of the mobile terminal through the first installation ring, so as to facilitate the use of a user; when the first installation ring is assembled, the first installation ring is embedded in the shell and fixed with the shell in a clamping mode except that the first installation ring is attached to the semiconductor refrigeration piece, and when the first installation ring is manufactured, the first installation ring is required to be installed at the bottom of the shell (below the shell shown in figure 1) and located in the same horizontal plane with the first installation ring, so that the temperature conduction efficiency of the semiconductor refrigeration wireless charging integrated device in the use process of the back of the mobile terminal is guaranteed.

Further, because in the mobile terminal who has wireless function of charging among the prior art, magnetic material is predetermine at the position that wireless charging coil set up, therefore the utility model discloses in, install semiconductor refrigeration wireless integrated device that charges on mobile terminal through first collar, can set up first collar as the permanent magnet collar (the collar of the material preparation that has permanent magnetism promptly), or set up first collar as former magnet collar (the collar of the material preparation that can be attracted by the magnet promptly), the first collar that sets up like this can be dismantled with the mobile terminal who has wireless function of charging and be connected through magnetism, and the user of being convenient for uses or dismantles at any time.

Furthermore, when the first installation ring is actually arranged, the inner diameter of the first installation ring is preferably set to be matched with the diameter of the charging coil, so that the interference of the first installation ring on the charging coil when generating magnetic induction current is reduced, and on the other hand, when a user does not need to use a wireless charging function in wireless charging decoration, the circuit board and the charging coil can be conveniently detached by the user.

In another possible implementation manner of the present invention, as shown in fig. 2 and fig. 3, the semiconductor refrigeration device, the circuit board, and the charging coil can be further configured as a detachable structure, so that a user can replace different functional components according to actual needs, in this embodiment, a connection plug is further disposed on the semiconductor refrigeration device, the connection plug is disposed on the semiconductor refrigeration device in an embedded manner and coupled with the semiconductor refrigeration device, when the user supplies power to the connection plug through a wire, the semiconductor refrigeration device starts to operate, and the cooling fan is synchronously powered to ensure the operation of the cooling fan;

on the other hand, the semiconductor refrigerating piece is provided with a mounting hole, the connecting plug is arranged on one side of the mounting hole of the semiconductor refrigerating piece in a protruding mode, correspondingly, a mounting groove is further formed in the position, corresponding to the connecting plug, of the circuit board, the shape of the mounting groove is matched with the shape of the protruding portion of the semiconductor refrigerating piece, when the circuit board is clamped in the mounting hole, the mounting groove and the connecting plug form clamping matching, and therefore the fixed mounting effect of the circuit board is achieved; through the setting mode, realize making the utility model discloses semiconductor refrigeration wireless integrated device that charges has the effect that wireless charging accessory selectivity installation was used, satisfies different users' different user demands.

Specifically, as shown in fig. 2 and 3, a first contact electrode (not shown in the figure) is disposed on one side of the connection plug facing the circuit board, and correspondingly, a second contact electrode is disposed in the mounting groove at a position corresponding to the first contact electrode, the first contact electrode and the second contact electrode are adapted to each other, and when the connection plug is engaged in the mounting groove, the first contact electrode and the second contact electrode are coupled, so that a power supply effect for the circuit board and the charging coil can be achieved.

Further, for the convenience of controlling the semiconductor refrigeration wireless charging integrated device by a user, in the embodiment, a control chip and a wireless connector are further arranged on the circuit board, the control chip is connected with a wireless connector circuit and connected with a charging coil circuit, when the device is used, the wireless connector can be in signal connection with the mobile terminal in modes such as wifi, bluetooth and data connection, the user can control the device through a program in the mobile terminal, an instruction can be given to the control chip to change a wireless charging mode, and therefore the semiconductor refrigeration wireless charging integrated device is adjusted to a more targeted use state.

The utility model discloses an among other implementable manners, at the setting in-process of above-mentioned first contact electrode and second contact electrode, still can pass through the multielectrode complex mode that sets up, make control chip have control effect to semiconductor refrigeration spare, the user is when the program that uses mobile terminal adjusts the charge mode of charging coil, still can realize the regulation to semiconductor refrigeration spare refrigeration mode, and then realizes more manifold type usage pattern.

In the above embodiment, as shown in fig. 2, because the semiconductor refrigeration piece is provided with the connecting plug, a yielding hole for yielding the connecting plug is further formed in the casing, the yielding hole is hollowed out and arranged in the casing, and is matched with the shape of the connecting plug, when the semiconductor refrigeration piece is sleeved in the casing, the connecting plug is correspondingly sleeved in the yielding hole of the casing, on one hand, the clamping fixation of the casing and the semiconductor refrigeration piece is realized, on the other hand, a user can use a wire for plugging and unplugging, and the convenience for the user to use is ensured.

Based on the above-mentioned embodiment, the utility model provides a mobile terminal accessory is still provided, this mobile terminal accessory includes arbitrary one in the above-mentioned embodiment semiconductor refrigeration wireless integrated device that charges, specifically, as shown in fig. 4, this mobile terminal accessory still includes the protective housing, and this protective housing is used for protecting mobile terminal, the utility model discloses this protective housing of mobile terminal accessory accessible realizes carrying out erection joint's effect to mobile terminal's protection effect simultaneously, still can realize carrying out the effect of erection joint with above-mentioned semiconductor refrigeration wireless integrated device that charges.

Specifically, the second mounting ring is embedded in the protective shell and is similar to the first mounting ring, that is, the first mounting ring and the second mounting ring correspond in shape and size and are made of a material with a high thermal conductivity coefficient, and in addition, in the actual installation, the second mounting ring also serves as a permanent magnet mounting ring (i.e., a mounting ring made of a material with permanent magnetism), or the first mounting ring is set as an original magnet mounting ring (i.e., a mounting ring made of a material capable of being attracted by a magnet).

To sum up, the utility model provides an integrated device and mobile terminal accessory that charge that semiconductor refrigeration is wireless, wherein, this integrated device that charges that semiconductor refrigeration is wireless specifically includes: the circuit board is provided with a refrigeration circuit and a wireless charging circuit; the semiconductor refrigeration piece comprises a substrate and a plurality of semiconductor particles, the semiconductor particles are welded on one side of the substrate, the circuit board is arranged on the substrate, and the refrigeration circuit is coupled with the semiconductor refrigeration piece; the wireless charging assembly is in coupling connection with the wireless charging circuit, the wireless charging assembly comprises a charging coil, and the charging coil is arranged on one side of the circuit board. The utility model discloses a welding semiconductor particle on the base plate of semiconductor refrigeration piece, with the circuit board setting on the base plate of semiconductor refrigeration piece, refrigeration circuit and wireless charging circuit on the circuit board respectively with semiconductor refrigeration piece and wireless charging assembly coupling connection, effectively reduce the volume of the wireless integrated device that charges of semiconductor refrigeration, avoid wireless charging device heat transfer to mobile terminal, realize cooling, the effect of charging to mobile terminal.

It should be understood that the application of the present invention is not limited to the above examples, and that modifications or changes can be made by those skilled in the art based on the above description, and all such modifications and changes are intended to fall within the scope of the appended claims.

Claims

1. The utility model provides a semiconductor refrigeration integrated device that charges that wirelessly, semiconductor refrigeration integrated device that charges that wirelessly includes:

2. The integrated semiconductor refrigeration and wireless charging device of claim 1, further comprising a heat sink disposed on a side of the substrate facing away from the semiconductor particles;

the heat sink includes:

3. The integrated semiconductor refrigeration and wireless charging device as claimed in claim 2, wherein a mounting portion is disposed at a central position of a side of the substrate facing away from the semiconductor particles, a plurality of heat dissipation fins are circumferentially disposed at an outer side of the mounting portion, and the heat dissipation fan is fixedly disposed on the mounting portion;

4. The integrated semiconductor refrigeration and wireless charging device of claim 2, further comprising:

5. The integrated semiconductor refrigeration and wireless charging device as claimed in claim 4, wherein the semiconductor refrigeration piece comprises a refrigeration surface arranged on the other side, and the integrated semiconductor refrigeration and wireless charging device further comprises:

6. The integrated semiconductor refrigeration and wireless charging device of claim 5, wherein the first mounting ring has an inner diameter size matched with the diameter size of the charging coil;

the first mounting ring is a permanent magnet mounting ring;

or, the first mounting ring is a primary magnet mounting ring.

7. The integrated semiconductor refrigeration and wireless charging device according to claim 1, wherein a mounting hole is formed in the center of the semiconductor refrigeration piece, the circuit board is arranged in the mounting hole, a connecting plug is arranged on the semiconductor refrigeration piece, and the connecting plug is embedded on the semiconductor refrigeration piece in a coupling manner and protrudes towards one side where the mounting hole is;

8. The integrated semiconductor refrigeration and wireless charging device as claimed in claim 7, wherein a first contact electrode is disposed on a side of the connection plug facing the circuit board, a second contact electrode is disposed in the mounting groove corresponding to the first contact electrode, and when the connection plug is engaged in the mounting groove, the first contact electrode is coupled to the second contact electrode.

9. The integrated semiconductor refrigeration and wireless charging device as claimed in claim 1, wherein a control chip and a wireless connector are disposed on the circuit board, and the wireless connector is electrically connected to the control chip.

10. The integrated device that charges that semiconductor refrigeration is wireless of claim 1, characterized in that, when circuit board and charging coil and semiconductor refrigeration piece separate, semiconductor refrigeration piece independently is used for mobile terminal heat dissipation.

11. A mobile terminal accessory, characterized in that the mobile terminal accessory comprises the integrated semiconductor refrigeration and wireless charging device of any one of the claims 1-10;

the mobile terminal accessory further comprises: