CN210053451U - Temperature adjusting device for mobile phone - Google Patents

Temperature adjusting device for mobile phone Download PDF

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Publication number
CN210053451U
CN210053451U CN201921286410.1U CN201921286410U CN210053451U CN 210053451 U CN210053451 U CN 210053451U CN 201921286410 U CN201921286410 U CN 201921286410U CN 210053451 U CN210053451 U CN 210053451U
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mobile phone
fan
temperature
semiconductor
cell
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CN201921286410.1U
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李明
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Jie Li Source Shenzhen Science And Technology Ltd
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Jie Li Source Shenzhen Science And Technology Ltd
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Abstract

The utility model provides a cell-phone temperature regulation apparatus, include: the mobile phone clamping component comprises a mobile phone clamping component, a semiconductor cooling fin, a fan and a battery, wherein the semiconductor cooling fin is arranged on the mobile phone clamping component, the fan is arranged on one side of the semiconductor cooling fin far away from the mobile phone clamping component, and the battery is electrically connected with the semiconductor cooling fin and the fan. The utility model discloses utilize the semiconductor fin to realize the heat dissipation of cell-phone shell, still can be when the temperature is low excessively, utilize the semiconductor fin to give the cell-phone heating, it is not good to have solved cell-phone shell heat dispersion, problem that heat dissipation initiative and controllability are poor, the problem that the temperature is too low can not the normal use cell-phone.

Description

Temperature adjusting device for mobile phone
Technical Field
The utility model relates to a cell-phone accessory field, in particular to cell-phone temperature regulation apparatus.
Background
At present, along with the popularization and the application of smart phones and the continuous expansion of functions of the smart phones, the smart phones become an indispensable part of people in daily life, and the mobile phone games which are produced at the same time become a main way for young people to relax and entertain.
Along with the continuous promotion of mobile phone game quality, the hand trip has all had higher requirement to the performance in all aspects of cell-phone, and in the in-process of using the cell-phone for a long time and playing the mobile phone game, the high frequency input/output makes cell-phone treater consumption increase, the heat dissipation increase, and the trend of integration cell-phone has restricted the radiating way of cell-phone, it is more unfavorable for the heat dissipation to join in marriage the cell-phone shell of taking common silica gel, TPC and PC material, make cell-phone organism overheat influence cell-phone performance and operation experience, more the cell-phone battery explosion incident that overheated arouses takes place occasionally. Meanwhile, if the temperature is too low, the normal use of the mobile phone is affected.
SUMMERY OF THE UTILITY MODEL
The utility model provides a cell-phone temperature regulation apparatus to solve at least one above-mentioned technical problem.
In order to solve the above problem, as an aspect of the present invention, there is provided a mobile phone temperature adjustment device, including: the mobile phone clamping component comprises a mobile phone clamping component, a semiconductor cooling fin, a fan and a battery, wherein the semiconductor cooling fin is arranged on the mobile phone clamping component, the fan is arranged on one side of the semiconductor cooling fin far away from the mobile phone clamping component, and the battery is electrically connected with the semiconductor cooling fin and the fan.
Preferably, the mobile phone temperature adjusting device further comprises a heat-conducting silica gel arranged on one side of the semiconductor radiating fin, which is far away from the fan, and/or a heat-conducting fin arranged between the semiconductor radiating fin and the fan.
Preferably, the mobile phone temperature adjusting device further comprises an upper case and a lower case connected with each other, a receiving space is formed between the upper case and the lower case, and the fan and the battery are disposed in the receiving space.
Preferably, the upper shell is provided with an air inlet and an air outlet.
Preferably, the mobile phone temperature adjusting device further comprises a heat-conducting silica gel spring installed in the accommodating space, and one end of the heat-conducting silica gel spring is in contact with the heat-conducting fins.
Preferably, the mobile phone temperature adjusting device further comprises a temperature sensor and a control circuit board, and the control circuit board controls the semiconductor cooling fin and the fan to be started or stopped according to the temperature value detected by the temperature sensor.
Preferably, the mobile phone temperature adjusting device further comprises a switch key and/or an indicator light connected with the control circuit board.
Preferably, the mobile phone temperature adjusting device further comprises a charging interface for charging the battery.
Preferably, the mobile phone clamping assembly comprises an upper plate, a lower plate and a lower plate spring, and the upper plate is movably connected with the lower plate through the lower plate spring.
Preferably, the upper plate and the lower plate are both provided with silica gel pads.
The utility model discloses utilize the semiconductor fin to realize the heat dissipation of cell-phone shell, still can be when the temperature is low excessively, utilize the semiconductor fin to give the cell-phone heating, it is not good to have solved cell-phone shell heat dispersion, problem that heat dissipation initiative and controllability are poor, the problem that the temperature is too low can not the normal use cell-phone.
Drawings
Fig. 1 schematically shows a first perspective view of the present invention;
fig. 2 schematically shows a first perspective view of the present invention;
figure 3 schematically shows a cross-sectional view of the invention;
fig. 4 schematically shows an exploded view of the present invention;
fig. 5 schematically shows an exploded view two of the present invention.
Reference numbers in the figures: 1. a semiconductor heat sink; 2. a fan; 3. a battery; 4. heat conducting silica gel; 5. heat-conducting fins; 6. an upper shell; 7. a lower case; 8. an air inlet; 9. an air outlet; 10. a thermally conductive silicone spring; 11. a temperature sensor; 12. a control circuit board; 13. an on-off key; 14. an indicator light; 15. a charging interface; 16. an upper plate; 17. a lower plate; 18. a lower plate spring; 19. a silica gel pad; 20. and (4) heat conducting paste.
Detailed Description
The embodiments of the invention will be described in detail below with reference to the drawings, but the invention can be implemented in many different ways as defined and covered by the claims.
The utility model discloses an aspect provides a cell-phone temperature regulation apparatus, include: the mobile phone comprises a mobile phone clamping component, a semiconductor cooling fin 1, a fan 2 and a battery 3, wherein the semiconductor cooling fin 1 is installed on the mobile phone clamping component, the fan 2 is installed on one side, far away from the mobile phone clamping component, of the semiconductor cooling fin 1, and the battery 3 is electrically connected with the semiconductor cooling fin 1 and the fan 2. Preferably, the semiconductor heat sink 1 is detachably mounted.
During the use, will through cell-phone block subassembly the utility model discloses install the back of cell-phone, when the too high needs heat dissipation of cell-phone temperature, refrigerate to the cell-phone back through semiconductor cooling fin 1 to the heat that produces when will refrigerate outwards distributes away through fan 2, and battery 3 is to semiconductor cooling fin 1, fan 2 power supply.
Since the technical scheme is used, the utility model discloses accessible semiconductor refrigeration piece effectively is the cell-phone accuse temperature, promotes the circulation of air through the fan, takes away the heat that semiconductor refrigeration piece produced to thereby solve the problem of the too high performance reduction of temperature that the cell-phone brought because of long-time, high load operation effectively, in addition, adopt the semiconductor refrigeration piece to cool down, the cooling rate is fast, refrigeration effect is good, and the temperature is crossed the end and can be for the cell-phone heating in addition, does not pollute.
Preferably, the mobile phone temperature adjusting device further comprises a heat-conducting silica gel 4 arranged on one side of the semiconductor heat sink 1 far away from the fan 2, and/or a heat-conducting fin 5 arranged between the semiconductor heat sink 1 and the fan 2. Preferably, the temperature adjusting apparatus for a cellular phone further includes an upper case 6 and a lower case 7 connected to each other, a receiving space is formed between the upper case 6 and the lower case 7, and the fan 2 and the battery 3 are disposed in the receiving space. Preferably, the upper shell 6 is provided with an air inlet 8 and an air outlet 9. Therefore, the front and back surfaces of the semiconductor radiating fin 1 are respectively connected with the heat conducting fins 5 and the heat conducting silica gel 4, and the fan 2 is provided with a vent at the corresponding position of the upper shell 6 so as to facilitate the circulation of air.
Preferably, the heat conductive paste 20 may be coated on the surface of the heat conductive fin 5 and the heat conductive silicone gel 4 contacting the semiconductor heat sink 1 to further facilitate the conduction of heat. The heat conducting paste 20 is formed by compounding metal oxide with good heat conductivity and insulating property and organic siloxane and is used for conducting and radiating heat more effectively, when the heat conducting paste is used, the coating is uniformly coated and is as thin as possible so as to increase the contact area, the thinner the heat conducting paste is coated, the flatter the contact area is, and the heat resistance enables the heat conducting fins 5 and the heat conducting silica gel 4 to be respectively attached to the front surface and the rear surface of the semiconductor radiating fin 1.
Preferably, the mobile phone temperature adjusting device further comprises a heat-conducting silicone spring 10 installed in the accommodating space, and one end of the heat-conducting silicone spring 10 is in contact with the heat-conducting fins 5.
Preferably, the mobile phone temperature adjusting device further comprises a temperature sensor 11 and a control circuit board 12, wherein the control circuit board 12 controls the semiconductor heat sink 1 and the fan 2 to be turned on or off according to a temperature value detected by the temperature sensor 11. For example, the temperature sensor 11 can automatically detect the temperature, and when the ambient temperature is lower than 10 ℃, the semiconductor heat sink 1 heats up, and when the ambient temperature is higher than 35 ℃, the semiconductor heat sink 1 cools down. Here, the circuit structure of the control circuit board 12 and the control method for controlling start and stop thereof are conventional and known, and are not described herein again.
Preferably, the mobile phone temperature adjusting device further comprises a switch key 13 and/or an indicator light 14 connected with the control circuit board 12. Preferably, the mobile phone temperature adjusting device further comprises a charging interface 15 for charging the battery 3.
Preferably, the mobile phone clamping assembly comprises an upper plate 16, a lower plate 17 and a lower plate spring 18, wherein the upper plate 16 is movably connected with the lower plate 17 through the lower plate spring 18. Preferably, the upper plate 16 and the lower plate 17 are both provided with a silicone pad 19.
When the device is used, the lower plate 17 is pulled away from the device, the lower plate spring 18 is used for rebounding and buckling the edges of the two sides of the rear shell of the mobile phone, the heat-conducting silica gel 4 can be tightly attached to the rear shell of the mobile phone through the heat-conducting silica gel spring 10, so that heat emitted by the mobile phone is conducted to the refrigerating end of the semiconductor refrigerating piece, the temperature of the refrigerating end of the semiconductor refrigerating piece is rapidly reduced by the Peltier effect, and the purpose of cooling the mobile phone is achieved. Meanwhile, on the other side of the semiconductor refrigerating sheet, the small fan accelerates the air flow to dissipate heat. When the detected ambient temperature is lower than 10 ℃, the product can automatically heat the rear shell of the mobile phone. Like this, when extreme weather temperature is too low, when the cell-phone reduces because the too low performance of temperature, temperature control equipment can automated inspection ambient temperature for the cell-phone heating, has solved that cell-phone shell heat dispersion is not good, the problem that heat dissipation initiative and controllability are poor, the too low problem that can not normal use cell-phone of temperature.
Since the technical scheme is used, the utility model discloses the cooling of cell-phone is realized to the cryogenic principle of usable semiconductor refrigeration piece based on peltier benefit to reinforcing cell-phone radiating effect provides good external environment for the high-efficient operation of cell-phone, and it leads the heat to the heat dissipation layer through heat conduction silica gel contact cell-phone backshell, in order to realize the cell-phone shell that dispels the heat.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A temperature regulation device for a mobile phone, comprising: the mobile phone clamping component comprises a mobile phone clamping component, a semiconductor cooling fin (1), a fan (2) and a battery (3), wherein the semiconductor cooling fin (1) is installed on the mobile phone clamping component, the fan (2) is installed on one side, far away from the mobile phone clamping component, of the semiconductor cooling fin (1), and the battery (3) is electrically connected with the semiconductor cooling fin (1) and the fan (2).
2. The mobile phone temperature adjusting device according to claim 1, further comprising a heat conductive silicone (4) disposed on a side of the semiconductor heat sink (1) away from the fan (2), and/or a heat conductive fin (5) disposed between the semiconductor heat sink (1) and the fan (2).
3. The temperature adjusting apparatus for a cellular phone according to claim 2, further comprising an upper case (6) and a lower case (7) connected to each other, the upper case (6) and the lower case (7) forming a receiving space therebetween, the fan (2) and the battery (3) being disposed in the receiving space.
4. The mobile phone temperature regulating device according to claim 3, wherein the upper case (6) is provided with an air inlet (8) and an air outlet (9).
5. The mobile phone temperature adjusting device according to claim 3, further comprising a heat conductive silicone spring (10) installed in the accommodating space, wherein one end of the heat conductive silicone spring (10) is in contact with the heat conductive fins (5).
6. The mobile phone thermostat according to claim 1, characterized in that the mobile phone thermostat further comprises a temperature sensor (11) and a control circuit board (12), the control circuit board (12) controlling the semiconductor heat sink (1) and the fan (2) to be turned on or off according to a temperature value detected by the temperature sensor (11).
7. The mobile phone temperature regulating device according to claim 6, further comprising a switch key (13) and/or an indicator light (14) connected to the control circuit board (12).
8. The device according to claim 1, further comprising a charging interface (15) for charging the battery (3).
9. The mobile phone temperature adjusting device of claim 1, wherein the mobile phone clamping assembly comprises an upper plate (16), a lower plate (17) and a lower plate spring (18), and the upper plate (16) is movably connected with the lower plate (17) through the lower plate spring (18).
10. The mobile phone temperature adjusting device according to claim 9, wherein the upper plate (16) and the lower plate (17) are provided with a silicone pad (19).
CN201921286410.1U 2019-08-07 2019-08-07 Temperature adjusting device for mobile phone Active CN210053451U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921286410.1U CN210053451U (en) 2019-08-07 2019-08-07 Temperature adjusting device for mobile phone

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921286410.1U CN210053451U (en) 2019-08-07 2019-08-07 Temperature adjusting device for mobile phone

Publications (1)

Publication Number Publication Date
CN210053451U true CN210053451U (en) 2020-02-11

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921286410.1U Active CN210053451U (en) 2019-08-07 2019-08-07 Temperature adjusting device for mobile phone

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CN (1) CN210053451U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111629538A (en) * 2020-05-28 2020-09-04 上海理工大学 Adjustable portable electronic equipment heat abstractor based on semiconductor refrigeration
CN112020279A (en) * 2020-08-31 2020-12-01 维沃移动通信有限公司 Heat sink device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111629538A (en) * 2020-05-28 2020-09-04 上海理工大学 Adjustable portable electronic equipment heat abstractor based on semiconductor refrigeration
CN112020279A (en) * 2020-08-31 2020-12-01 维沃移动通信有限公司 Heat sink device
CN112020279B (en) * 2020-08-31 2022-11-18 维沃移动通信有限公司 Heat sink device

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