CN218163023U

CN218163023U - Novel full transparent heater

Info

Publication number: CN218163023U
Application number: CN202221422445.5U
Authority: CN
Inventors: 孙广军
Original assignee: Weirou Shanghai Electronic Technology Co ltd
Current assignee: Weirou Shanghai Electronic Technology Co ltd
Priority date: 2022-06-09
Filing date: 2022-06-09
Publication date: 2022-12-27
Anticipated expiration: 2032-06-09

Abstract

The utility model discloses a novel full transparent heater contains: a transparent conductive film; the pair of conductive electrodes are respectively arranged on the edges of the top and the bottom of one side of the transparent conductive film; a circuit board, the bonding pad of which is connected with a pair of conductive electrodes; and the transparent outer cover is connected with the transparent conductive film. The utility model discloses process the laminating with high transparent conductive film to being heated the dustcoat inside and can accomplishing, because adopt flexible film, be not limited to the structure of dustcoat, also can laminate on the curved surface. And the present case is connected FPC and printing electrically conductive silver thick liquid, has both guaranteed the electric conductivity, also has fine adhesive force.

Description

Novel full transparent heater

Technical Field

The utility model relates to a heater technical field, in particular to novel full transparent heater.

Background

Most of the existing heaters are based on the principle that a conductive layer of a resistor is formed by using a conductive material, and heat is generated after the conductive layer is electrified so as to heat the surrounding environment. The traditional transparent heating film mostly uses ITO (indium tin oxide) or nano-silver coating as a conductive material for heating, and the visible light transmittance of a processed product can reach more than 80%. However, since the ITO (indium tin oxide) material itself is a brittle material, and is not resistant to bending, and cannot be applied to a flexible scene (i.e. a regular or irregular curved surface), when the surface of the existing ITO (indium tin oxide) material is bent, the ITO (indium tin oxide) material itself may crack to cause performance degradation, so that the application of the conventional transparent heater composed of ITO (indium tin oxide) is limited, and the conventional transparent heater cannot meet the flexible scene, and thus a transparent heater capable of meeting the application of the flexible scene is required at present.

Disclosure of Invention

According to the embodiment of the utility model provides a novel full transparent heater is provided, contains:

a transparent conductive film;

the pair of conductive electrodes are respectively arranged on the edges of the top and the bottom of one side of the transparent conductive film;

a circuit board, wherein a welding plate of the circuit board is connected with a pair of conductive electrodes;

and the transparent outer cover is connected with the transparent conductive film.

Further, the transparent conductive film is a nano silver wire transparent conductive film.

Further, the circuit board is an FPC flexible circuit board.

Further, the bonding pad of the circuit board is bonded with the pair of conductive electrodes through the conductive adhesive tape, and the size of the conductive adhesive tape is consistent with that of the bonding pad of the circuit board.

Further, the circuit board is F-shaped.

Furthermore, the transparent outer cover and the transparent conductive film are bonded together through OCA optical cement, and the size of the OCA optical cement is consistent with that of the transparent conductive film.

Furthermore, the OCA optical cement is of a sandwich structure and comprises a release protective film on the front side and a bonding layer on the back side and an intermediate interlayer.

According to the utility model discloses neotype full transparent heater, the present case is processed high transparent conductive film and is laminated to being heated dustcoat inside and can be accomplished, because adopt flexible film, is not limited to the structure of dustcoat, also can laminate on the curved surface. And the present case is connected FPC and printing electrically conductive silver thick liquid, has both guaranteed the electric conductivity, also has fine adhesive force.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and are intended to provide further explanation of the claimed technology.

Drawings

Fig. 1 is an exploded view of the whole structure of a novel fully transparent heater according to an embodiment of the present invention.

Detailed Description

The present invention will be further described with reference to the following detailed description of preferred embodiments thereof, which is to be read in connection with the accompanying drawings.

First, a novel fully transparent heater for heating the environment according to an embodiment of the present invention will be described with reference to fig. 1, which is widely applicable.

As shown in fig. 1, the novel fully transparent heater according to the embodiment of the present invention includes a transparent conductive film 1, a pair of conductive electrodes 2, a circuit board 3, and a transparent cover 4.

Specifically, as shown in fig. 1, in the present embodiment, the sheet resistance of the transparent conductive film 1 is 75 Ω/sq, the visible light transmittance is 89%, and the design size is 120 × 35mm. The pair of conductive electrodes 2 are respectively arranged at the top and bottom edges of one side of the transparent conductive film 1, and the conductive silver paste is printed on the surface of the transparent conductive film 1 according to the pattern design by a screen printing process in a mode of forming the pair of conductive electrodes 2 at the edges of the transparent conductive film. The used conductive silver paste is a high-conductivity material with high viscosity and high adhesive force, the viscosity of the material is 20000cps, the conductive component is micron silver particles, the solid content is 50%, and the curing condition is 110 ℃ for 30 minutes. The silver electrode of the silk screen printing finally forms a functional conductive structure after being heated and cured, and is completely conducted with the conductive film at the bottom layer; the welding plate of the circuit board 3 is connected with a pair of conductive electrodes 2 and is used for connecting the pair of conductive electrodes 2 with a positive power supply and a negative power supply; the transparent cover 4 is connected to the transparent conductive film 1.

Further, as shown in fig. 1, in the present embodiment, the transparent conductive film 1 is a nano silver wire transparent conductive film (the substrate is polycarbonate).

Further, as shown in fig. 1, in the present embodiment, the circuit board 3 is an FPC flexible circuit board 3.

Further, as shown in fig. 1, in the present embodiment, the land of the circuit board 3 and the pair of conductive electrodes 2 are adhered together by a conductive tape (not shown in the figure) which is in conformity with the land of the circuit board 3 in size. During production and processing, a welding scheme of a conductive adhesive tape conducting in the Z-axis direction is selected, and the conductive adhesive tape is cut to the size of a bonding pad and is adhered to the position of the bonding pad at the tail end of the printed silver paste. The end pads of the circuit board 3 are bonded to the conductive tape, and the circuit board 3 and the pair of conductive electrodes 2 are completely conducted. The effective conductive structure thickness of the conductive adhesive tape is 25 micrometers, and the conductive adhesive tape further comprises a release protective film with the thickness of 50 micrometers.

Further, as shown in fig. 1, in the present embodiment, the circuit board 3 is F-shaped, which facilitates connection with the pair of conductive electrodes 2 and also facilitates the arrangement and generalization of the wiring.

Further, as shown in fig. 1, in the present embodiment, the transparent cover 4 and the transparent conductive film 1 are bonded together by the OCA optical cement 5, and the OCA optical cement 5 is the same size as the transparent conductive film 1.

Further, as shown in fig. 1, in the present embodiment, the OCA optical cement 5 is a sandwich structure, and includes release protective films on the front and back sides and an adhesive layer in the middle layer. The transmittance of the adhesive layer of the OCA optical cement 5 was 100%. When using the installation, need tear one side from the type protection film, one side of the tie coat that OCA glued bonds in transparent conductive film 1, tears the opposite side again from the type protection film and pastes the opposite side of the tie coat that OCA optical cement 5 in the inner wall of transparent dustcoat 4. After the pasting work is finished, the complete product needs to be placed into a high-pressure defoaming machine for defoaming treatment, and bubbles between bonding layers are avoided. The working parameters of high-pressure defoaming are set as follows: slowly relieving pressure at 30-60 deg.C and 3-5kgf/cm2 for 30 min.

When the circuit board is used, the circuit board 3 is connected with positive and negative power supplies of a direct current power supply module (the power supply voltage is 12V), the power supplies are transmitted to the pair of conductive electrodes 2, and the transparent conductive film is transmitted to the pair of conductive electrodes 2 for heating.

Above, having described according to the utility model discloses a novel full transparent heater according to the embodiment of the utility model with reference to fig. 1, the present case is processed high transparent conductive film 1 and is laminated to being heated the dustcoat inside and can be accomplished, because adopt flexible film, is not limited to the structure of dustcoat, also can laminate on the curved surface. And the present case is connected FPC and printing electrically conductive silver thick liquid, has both guaranteed electric conductivity, also has fine adhesive force.

It should be noted that, in the present specification, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrases "comprising 8230; \8230;" comprises 8230; "does not exclude the presence of additional like elements in a process, method, article, or apparatus that comprises the element.

While the present invention has been described in detail with reference to the preferred embodiments thereof, it should be understood that the above description should not be taken as limiting the present invention. Numerous modifications and alterations to the present invention will become apparent to those skilled in the art upon reading the foregoing description. Accordingly, the scope of the invention should be limited only by the attached claims.

Claims

1. A novel fully transparent heater, comprising:

a transparent conductive film;

a pair of conductive electrodes respectively disposed at edges of one side top and bottom of the transparent conductive film;

a circuit board, the pad of which is connected to the pair of conductive electrodes;

2. The novel fully transparent heater of claim 1, wherein said transparent conductive film is a nano-silver wire transparent conductive film.

3. A novel all transparent heater as claimed in claim 1 wherein said circuit board is FPC flex circuit.

4. The novel fully transparent heater of claim 3 wherein said circuit board pads and said pair of conductive electrodes are bonded together by a conductive tape that conforms to the size of said circuit board pads.

5. The novel fully transparent heater of claim 3 in which said circuit board is F-shaped.

6. The novel fully transparent heater of claim 1, wherein said transparent cover and said transparent conductive film are bonded together by an OCA optical cement, said OCA optical cement being of a size consistent with said transparent conductive film.

7. The novel fully transparent heater of claim 6, wherein the OCA optical cement is sandwiched, and comprises a front and a back release protective films and an adhesive layer sandwiched therebetween.