CN218137508U - Manipulator is used in carborundum chip encapsulation with adjustable - Google Patents
Manipulator is used in carborundum chip encapsulation with adjustable Download PDFInfo
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- CN218137508U CN218137508U CN202222153948.3U CN202222153948U CN218137508U CN 218137508 U CN218137508 U CN 218137508U CN 202222153948 U CN202222153948 U CN 202222153948U CN 218137508 U CN218137508 U CN 218137508U
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Abstract
The utility model discloses a carborundum chip encapsulation is with manipulator with adjustable relates to manipulator technical field, which comprises a base, the drive structure is all installed near transport structure's both sides to the base upper surface, the removal frame is installed in the outside of drive structure, remove the first cylinder of the equal fixedly connected with in both sides of frame inside, and remove the inside fixedly connected with second cylinder that is located between two sets of first cylinders of frame, it is two sets of the equal fixedly connected with gripper of output of first cylinder, the output fixedly connected with locating rack of second cylinder, it is two sets of bottom sprag structure is all installed to the lower surface of gripper. The utility model discloses after two sets of gripper carry out the centre gripping with the chip, bottom sprag structure can support the lower surface of chip and protect, compares in prior art, and its protective area is bigger to can avoid the chip when shifting, the surface is damaged.
Description
Technical Field
The utility model relates to a manipulator technical field specifically is a carborundum chip encapsulation is with manipulator with adjustable.
Background
The manipulator is an automatic operation device which can imitate certain action functions of a human hand and an arm and is used for grabbing and carrying objects or operating tools according to a fixed program.
When using the manipulator to remove the chip, current manipulator centre gripping area is limited, can not carry out good protection to the chip at the in-process of centre gripping to when the centre gripping, because the touching probably leads to the chip to shift when the centre gripping, lead to follow-up processing to need recalibrate the position, reduce work efficiency easily.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a carborundum chip encapsulation is with manipulator with adjustable, solve following technical problem:
how to carry out better protection to the chip when centre gripping chip to when the centre gripping, avoid causing the problem that the chip displacement appears.
The purpose of the utility model can be realized by the following technical proposal:
the utility model provides a carborundum chip encapsulation is with manipulator with adjustable, includes the base, the last surface mounting of base has the transport structure who is used for removing the chip, and the base upper surface all installs the drive structure near transport structure's both sides, the removal frame is installed in the outside of drive structure, remove the first cylinder of the equal fixedly connected with in both sides of frame inside, and remove the frame inside and be located fixedly connected with second cylinder between two sets of first cylinders, it is two sets of the equal fixedly connected with gripper of output of first cylinder, it is two sets of the reinforcement frame in the removal frame outside fixedly connected with of gripper slides for increase the stability of gripper when removing, the output fixedly connected with locating rack of second cylinder is two sets of bottom sprag structure is all installed to the lower surface of gripper.
As a further aspect of the present invention: and the bottom supporting structure and the two groups of mechanical claws are respectively provided with an anti-static wire for reducing static in the device and preventing the chip from being damaged.
As a further aspect of the present invention: the driving structure comprises a screw rod component and a slide rod component which are distributed on two sides of the base, one end of the moving frame is in threaded connection with a screw rod of the screw rod component, and the other end of the moving frame is in sliding connection with the slide rod component.
As a further aspect of the present invention: the outer sides of the two ends of the moving frame are fixedly connected with rollers abutted to the surface of the driving structure, and the rollers are used for supporting the moving frame and reducing friction force when the moving frame moves.
As a further aspect of the present invention: the bottom supporting structure comprises a third air cylinder and a fourth air cylinder, the third air cylinder and the fourth air cylinder are respectively and fixedly connected with the two groups of mechanical claws, and the third air cylinder and the fourth air cylinder are located at the same horizontal height.
As a further aspect of the present invention: the output end of the third cylinder is fixedly connected with a supporting plate, a base plate is arranged on the upper surface of the supporting plate, and a plurality of elastic reset pieces are fixedly connected between the supporting plate and the base plate.
As a further aspect of the present invention: the upper surface of backing plate fixedly connected with insulating pad for when the chip removes, contact its bottom to protect it.
As a further aspect of the present invention: the backup pad has seted up the spout towards one side of fourth cylinder, the output fixedly connected with of fourth cylinder is used for extending to the inside circular arc board of spout, and the circular arc board is removing to the inside back of spout, resets the bottom of piece jack-up to the chip through tensile elasticity with the insulating pad.
The utility model has the advantages that:
the moving frame in the utility model is provided with the second cylinder and the positioning frame, and before the chip is clamped by the mechanical claw, the second cylinder can drive the positioning frame to descend, so that the chip can be fixed, the problem of movement of the chip during clamping is prevented, and the clamping quality of the chip can be improved;
on the other hand, after two sets of gripper carry out the centre gripping with the chip, bottom sprag structure can support and protect the lower surface of chip, compares in prior art, and its guard area is bigger to can avoid the chip when shifting, the surface is damaged.
Drawings
The present invention will be further described with reference to the accompanying drawings.
FIG. 1 is a schematic diagram of a prior art configuration;
fig. 2 is a partial top view of the present invention;
fig. 3 is a side view of the present invention;
FIG. 4 is a partial cross-sectional view of a gripper according to the present invention;
fig. 5 is a connection structure diagram of the middle supporting plate of the present invention.
In the figure: 1. a base; 2. a drive structure; 3. a movable frame; 4. a first cylinder; 5. a gripper; 6. a reinforcing frame; 7. a second cylinder; 8. a positioning frame; 9. a bottom support structure; 10. a conveying structure; 11. a roller; 91. a third cylinder; 92. a fourth cylinder; 93. a support plate; 94. an elastic restoring member; 95. a base plate; 96. a circular arc plate; 97. a chute; 98. an insulating pad.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
Please refer to fig. 2-3, the utility model relates to a manipulator for silicon carbide chip encapsulation with adjustable, including base 1, the last surface mounting of base 1 has a transport structure 10 that is used for removing the chip, and the both sides that the upper surface of base 1 is close to transport structure 10 all install drive structure 2, drive structure 2's outside is installed and is removed frame 3, drive structure 2 is including lead screw component and the slide bar component that distributes in base 1 both sides, the one end of removing frame 3 and the lead screw threaded connection of lead screw component, and remove the other end and the slide bar component sliding connection of frame 3, the equal fixedly connected with in both ends outside of removing frame 3 and the gyro wheel 11 of drive structure 2 surface butt, be used for supporting removing frame 3, and reduce its frictional force when removing, the equal fixedly connected with first cylinder 4 in both sides of removing frame 3 inside, and remove the inside fixedly connected with second cylinder 7 that lies in between two sets of first cylinder 4 of frame 3, the equal fixedly connected with gripper 5 in the output of two sets of first cylinder 4, the outside fixedly connected with gripper 5 of two sets of gripper 5 slides in removing frame 3, be used for increasing the stationary fixed on the stationary connection of two sets of first cylinder 4, the stationary gripper 5 when removing, the stationary gripper 5, the stationary mounting is used for preventing the bottom of chip from damage of the stationary mounting structure and the structure, 9, the bottom of the stationary mounting of the structure that the chip is used for preventing the chip, 9 is used for preventing the chip, the electrostatic discharge end of the stationary mounting structure from damage of the electrostatic discharge.
Referring to fig. 4-5, the bottom supporting structure 9 includes a third cylinder 91 and a fourth cylinder 92, the third cylinder 91 and the fourth cylinder 92 are respectively fixedly connected to the two sets of gripper 5, and the third cylinder 91 and the fourth cylinder 92 are at the same horizontal height. The output end of the third cylinder 91 is fixedly connected with a supporting plate 93, the upper surface of the supporting plate 93 is provided with a backing plate 95, and a plurality of elastic resetting pieces 94 are fixedly connected between the supporting plate 93 and the backing plate 95.
An insulating pad 98 is fixedly attached to the upper surface of the pad plate 95 for contacting the bottom of the chip and protecting it when the chip is moved.
The supporting plate 93 has been seted up towards one side of fourth cylinder 92 spout 97, and the output fixedly connected with of fourth cylinder 92 is used for extending to the inside circular arc board 96 of spout 97, and circular arc board 96 is removing to the inside back of spout 97, resets the bottom of piece 94 jack-up to the chip with insulating pad 98 through tensile elasticity.
The utility model discloses a theory of operation:
starting a screw rod component in the driving structure 2, namely driving the moving frame 3 to horizontally move along a slide rod component in the driving structure 2, stopping the driving structure 2 after the moving frame 3 moves to a proper position, then starting the second air cylinder 7, pressing the positioning frame 8 to the upper side of the chip, starting the first air cylinder 4, moving the mechanical claw 5 to a proper height, and driving the reinforcing frame 6 to slide along the moving frame 3 when the mechanical claw 5 moves, so that the stability of the mechanical claw 5 during moving is kept;
the mechanical claw 5 is started, the side face of the chip is clamped, the second air cylinder 7 is started subsequently, the positioning frame 8 is moved away from the chip, the two groups of first air cylinders 4 are started subsequently, the chip is moved away from the upper side of the conveying structure 10, the third air cylinder 91 and the fourth air cylinder 92 in the bottom supporting structure 9 are started, the third air cylinder 91 drives the supporting plate 93 to move, the fourth air cylinder 92 drives the arc plate 96 to move, when the supporting plate 93 and the arc plate 96 move, the arc plate 96 moves into the sliding groove 97 of the supporting plate 93, the insulating pad 98 and the backing plate 95 are lifted through the elastic resetting piece 94, after the insulating pad 98 is attached to the lower side of the chip, the third air cylinder 91 and the fourth air cylinder 92 stop moving, and through the elastic resetting piece 94, the moving allowance of the insulating pad 98 can be kept after the insulating pad is attached to the chip, and the damage to the chip caused by overlarge pressure can be prevented.
In the description of the present invention, it should be understood that the terms "upper", "lower", "left", "right", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, only for convenience of description and simplification of description, but not for indicating or implying that the referred device or element must have a specific orientation and a specific orientation configuration and operation, and thus, should not be construed as limiting the present invention. Furthermore, "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate member, or they may be connected through two or more elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
While one embodiment of the present invention has been described in detail, the description is only a preferred embodiment of the present invention, and should not be considered as limiting the scope of the present invention. All the equivalent changes and improvements made according to the application scope of the present invention should still fall within the patent coverage of the present invention.
Claims (6)
1. The utility model provides a manipulator is used in encapsulation of carborundum chip with adjustable, includes base (1), the last surface mounting of base (1) has transport structure (10) that are used for removing the chip, its characterized in that, drive structure (2) are all installed to the both sides that base (1) upper surface is close to transport structure (10), the outside of drive structure (2) is installed and is removed frame (3), remove the first cylinder (4) of the equal fixedly connected with in both sides of frame (3) inside, and remove frame (3) inside be located fixedly connected with second cylinder (7) between two sets of first cylinder (4), it is two sets of the equal fixedly connected with gripper (5) of output of first cylinder (4), it is two sets of the outside fixedly connected with of gripper (5) slides at reinforcement frame (6) that remove frame (3) the outside, the output fixedly connected with locating rack (8) of second cylinder (7), it is two sets of bottom sprag structure (9) are all installed to the lower surface of gripper (5).
2. The adjustable manipulator for silicon carbide chip packaging according to claim 1, wherein the driving structure (2) comprises a screw rod member and a slide rod member distributed on two sides of the base (1), one end of the moving frame (3) is in threaded connection with the screw rod of the screw rod member, and the other end of the moving frame (3) is in sliding connection with the slide rod member.
3. The adjustable manipulator for silicon carbide chip packaging according to claim 1, wherein the bottom support structure (9) comprises a third air cylinder (91) and a fourth air cylinder (92), the third air cylinder (91) and the fourth air cylinder (92) are respectively fixedly connected with the two sets of gripper fingers (5), and the third air cylinder (91) and the fourth air cylinder (92) are at the same horizontal height.
4. The adjustable manipulator for silicon carbide chip packaging according to claim 3, wherein a support plate (93) is fixedly connected to an output end of the third cylinder (91), a base plate (95) is arranged on an upper surface of the support plate (93), and a plurality of elastic resetting pieces (94) are fixedly connected between the support plate (93) and the base plate (95).
5. The adjustable manipulator for silicon carbide chip packaging according to claim 4, wherein an insulating pad (98) is fixedly connected to the upper surface of the pad plate (95).
6. The adjustable manipulator for silicon carbide chip packaging according to claim 5, wherein a chute (97) is formed in one side of the support plate (93) facing the fourth cylinder (92), and an arc plate (96) extending into the chute (97) is fixedly connected to an output end of the fourth cylinder (92).
Priority Applications (1)
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CN202222153948.3U CN218137508U (en) | 2022-08-16 | 2022-08-16 | Manipulator is used in carborundum chip encapsulation with adjustable |
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CN202222153948.3U CN218137508U (en) | 2022-08-16 | 2022-08-16 | Manipulator is used in carborundum chip encapsulation with adjustable |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116619179A (en) * | 2023-07-24 | 2023-08-22 | 泰州水冶新材料科技有限公司 | Ceramic repair equipment |
CN117080154A (en) * | 2023-10-13 | 2023-11-17 | 江苏华芯智造半导体有限公司 | Semiconductor chip clamping mechanical claw |
-
2022
- 2022-08-16 CN CN202222153948.3U patent/CN218137508U/en active Active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116619179A (en) * | 2023-07-24 | 2023-08-22 | 泰州水冶新材料科技有限公司 | Ceramic repair equipment |
CN116619179B (en) * | 2023-07-24 | 2023-10-10 | 泰州水冶新材料科技有限公司 | Ceramic repair equipment |
CN117080154A (en) * | 2023-10-13 | 2023-11-17 | 江苏华芯智造半导体有限公司 | Semiconductor chip clamping mechanical claw |
CN117080154B (en) * | 2023-10-13 | 2024-01-23 | 江苏华芯智造半导体有限公司 | Semiconductor chip clamping mechanical claw |
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