CN218135579U

CN218135579U - Auxiliary tool for rapidly realizing residual welding column and soldering tin removal of welding pad of CCGA (ceramic column grid array) device

Info

Publication number: CN218135579U
Application number: CN202222397706.9U
Authority: CN
Inventors: 胡猛; 谢凯培; 杨国瑞
Original assignee: State Run Wuhu Machinery Factory
Current assignee: State Run Wuhu Machinery Factory
Priority date: 2022-09-09
Filing date: 2022-09-09
Publication date: 2022-12-27
Anticipated expiration: 2032-09-09

Abstract

The utility model relates to a soldering tin remains and clears away technical field, specifically is a realize fast that CCGA device pad remains auxiliary fixtures that weld column and soldering tin clear away, including the frock base, be provided with the device standing groove on the frock base, the side of device standing groove is provided with the device briquetting, the both ends correspondence that the device standing groove is relative is provided with soldering tin and clears away wind gap, weld column and soldering tin collection box, seted up on the lateral wall of frock base with the air source interface that wind gap intercommunication was clear away to soldering tin. The utility model discloses an aspect can accomplish the fixed of CCGA device through the device briquetting that sets up and device standing groove, can not rock about the CCGA device in the clearance process, especially is better to the non-smooth result of use of CCGA device body; on the other hand, the compressed nitrogen is adopted to remove the soldering tin on the surface of the CCGA device, so that the damage to the soldering pad caused by directly removing the high Wen Laotie is avoided, and the success rate of operation is improved.

Description

Auxiliary tool for rapidly realizing residual welding column and soldering tin removal of welding pad of CCGA (ceramic column grid array) device

Technical Field

The utility model relates to a soldering tin is remained and is clear away technical field, specifically is a realize fast that CCGA device pad remains auxiliary fixtures that weld column and soldering tin clear away.

Background

The airborne electronic product has the properties of small quantity, multiple varieties, high value, high working reliability and the like, and along with the development of the electronic product towards multifunction and high reliability, a Ceramic Column Grid Array (CCGA) packaging device is widely applied to weaponry and aerospace electronic products. For airborne electronic products with higher value, the maintenance of fault modules often encounters the problem that most welding points in a fault mode of a circuit board of a CCGA type packaging device are in failure welding, fault elimination needs to be completed through re-welding, in the re-welding process, the requirement on the maintenance process for cleaning a detached CCGA device welding pad is higher, and the welding pad is easily damaged due to improper operation, so that the device is scrapped.

The CCGA device welding point consists of a high-temperature alloy 90Pb10Sn welding column and 60Sn37Pb eutectic welding flux, wherein the melting point of the welding flux is higher than 300 ℃, the melting point of the welding flux is 183 ℃, the welding column can not be melted in the whole electric fitting process, therefore, when the CCGA device is dismounted from the PCBA assembly, part of the welding column and the eutectic welding flux are remained on the surface of the welding pad, and the height of the welding column is 1.27mm or 2.2mm. Because the solder columns on the surface of the solder pad are uneven, according to the existing maintenance process, the limited contact between the solder columns and the solder joints is difficult to be fully completed only by using the solder absorbing tape and the soldering iron, the heat transfer is influenced, and the cleaning effect is influenced because the device cannot be fixed in operation and can be shaken left and right. In addition, the melting point of the welding column is 300 ℃, if the welding column needs to be cleaned by the existing maintenance process, a higher soldering iron temperature is needed, the welding disc is easily damaged or falls off, and the maintenance task of the circuit board cannot be completed.

Disclosure of Invention

In order to solve the technical problem, the utility model provides a realize CCGA device pad fast and remain auxiliary fixtures that weld column and soldering tin clear away.

The utility model discloses the technical problem that will solve adopts following technical scheme to realize:

the utility model provides a realize fast that CCGA device pad remains auxiliary fixtures that weld column and soldering tin clear away, includes fixture base, the last device standing groove that is provided with of fixture base, the side of device standing groove is provided with the device briquetting, the both ends correspondence that the device standing groove is relative is provided with soldering tin and clears away wind gap, weld column and soldering tin collection box, seted up on fixture base's the lateral wall with soldering tin clears away the air source interface of wind gap intercommunication.

As a further improvement, the tooling base is of a rectangular structure, and the length, width and height of the tooling base correspond to 200mm, 200mm and 30mm.

As a further improvement of the utility model, the bottom in wind gap is clear away to soldering tin is the inclined plane structure, and inclined plane length is 30mm.

As a further improvement, the height dimension of the air port is cleared away by the soldering tin and is 5mm, and the width dimension is 50mm.

As a further improvement, the length, width and height of the welding column and the soldering tin collecting box correspond to 100mm, 10mm and 30mm.

As a further improvement, the device pressing block is rotatably installed on the tool base, and the height can be adjusted.

As a further improvement, the length, width and depth of the device placing groove correspond to 50mm, 50mm and 3mm.

As a further improvement of the utility model, the air pressure range of the air source interface is 0.8-1.2 Mpa.

The utility model has the advantages that:

compared with the existing manual maintenance operation for removing residual welding columns and soldering tin on the welding disc of the CCGA device, on one hand, the utility model can complete the fixation of the CCGA device through the arranged device pressing block and the device placing groove, and can not shake left and right during the cleaning process of the CCGA device, and especially has better non-flat use effect on the body of the CCGA device; on the other hand, the compressed nitrogen is adopted to remove the soldering tin on the surface of the CCGA device, so that the damage to the soldering pad caused by directly removing the high Wen Laotie is avoided, and the success rate of operation is improved.

Drawings

The invention will be further described with reference to the following figures and examples:

fig. 1 is a schematic structural diagram of the present invention.

In the figure: 1. a tooling base; 2. soldering tin to clear the tuyere; 3. welding columns and a soldering tin collecting box; 4. pressing the device block; 5. a device placement groove; 6. and an air source interface.

Detailed Description

In order to make the technical means, creation features, achievement purposes and effects of the present invention easy to understand, the present invention will be further explained with reference to the accompanying drawings and embodiments.

As shown in figure 1, the auxiliary tool for rapidly removing residual welding columns and soldering tin on the welding pad of the CCGA device consists of a tool base 1, a soldering tin removing air port 2, a welding column and soldering tin collecting box 3, a device pressing block 4, a device placing groove 5 and an air source interface 6. The utility model discloses a welding fixture, including frock base 1, device briquetting 4, soldering tin collection box 3, welding column and soldering tin collection box 3, device standing groove 5 sets up on the frock base 1, device briquetting 4 is provided with two, and the symmetric distribution is in 5 left and right sides of device standing groove, soldering tin is clear away wind gap 2 and is located on the frock base 1 and is located the front side of device standing groove 5, soldering tin is clear away wind gap 2 with device standing groove 5 is linked together, welding column and soldering tin collection box 3 set up on the preceding lateral wall of frock base 1, air source 6 with soldering tin is clear away wind gap 2 and is linked together. And the gas source interface 6 is connected with gas and blows out the gas through the soldering tin removing air port 2 to blow off residual soldering tin and welding columns on the surface of the CCGA device in the device placing groove 5.

Specifically, the whole aluminum material that adopts of frock, wherein, the length, width, the height of frock base 1 are 200mm 30mm respectively, and this size can be comparatively convenient put at table surface so that manual operation. The design of soldering tin clear wind gap 2 is the inclined plane, is favorable to the wind direction to flow towards the device direction, and slope length is 30mm, soldering tin clear wind gap 2 is a little higher than the height of the high lead weld post on the CCGA device surface, soldering tin clear wind gap 2 highly is 5mm, and the width is 50mm, can satisfy the size of conventional CCGA device. The size of the solder columns and the solder tin collecting box 3 is 100mm 10mm 30mm, the size can ensure that the solder columns and the solder tin cannot be scattered outside the collector, and the solder columns and the solder tin collecting box 3 can be taken down from the base. The device pressing block 4 can be adjusted in height and can rotate in the pressing block direction, in addition, the length of the pressing block can be adjusted back and forth, and the length is 10mm. The size of device standing groove 5 is 50mm 3mm, can satisfy placing of conventional CCGA device, and only guarantee that the pad leaks the surface of frock base 1. The gas source interface 6 can be communicated with nitrogen, and the air pressure is controlled to be about 0.8-1.2 Mpa, so that the residual welding columns and the soldering tin on the surface of the welding pad are blown away from the welding pad by the nitrogen and enter the welding columns and the soldering tin collecting box 3.

The utility model discloses a theory of operation and use flow:

when the device pressing block is used, a CCGA device needing to be cleaned of residual welding columns and soldering tin is placed in the device placing groove 5, then the height and the length of the device pressing block 4 are adjusted to tightly press the CCGA device in the device placing groove 5, the device pressing block 4 only needs to be pressed to the periphery of a welding point and cannot contact the welding point, and the pressure is not too high to damage the surface of the device; then, a layer of high-temperature adhesive tape is pasted on the inner surfaces of the welding columns and the soldering tin collecting box 3 and the corresponding parts corresponding to the tool base 1, so that the residual welding columns and the soldering tin can be directly removed; adjusting the temperature of a handheld hot air gun to 200 ℃, heating a bonding pad of a CCGA (ceramic chip grid array) device, observing that 60Sn37Pb eutectic solder is completely melted, turning on an external compressed nitrogen switch, and using an air source with a foot control switch; the welding columns and the soldering tin on the surface of the welding disk of the CCGA device are blown into the welding columns and the soldering tin collecting box 3 under the action of compressed air; and taking out the CCGA device to clean the residual trace soldering tin, and using a tin absorption belt to clean the residual soldering columns and soldering tin of the device, and checking the cleaning effect.

The foregoing shows and describes the basic principles, essential features, and advantages of the invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments, and the above embodiments and what is described in the specification are the principles of the present invention, and that various changes and modifications may be made without departing from the spirit and scope of the present invention, and these changes and modifications are intended to fall within the scope of the present invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a realize fast that CCGA device pad remains auxiliary fixtures that solder column and soldering tin clear away which characterized in that: including fixture base (1), be provided with device standing groove (5) on fixture base (1), the side of device standing groove (5) is provided with device briquetting (4), the both ends that device standing groove (5) is relative correspond and are provided with soldering tin and clear away wind gap (2), weld column and soldering tin collection box (3), seted up on the lateral wall of fixture base (1) with soldering tin clears away air supply interface (6) of wind gap (2) intercommunication.

2. The auxiliary tool for rapidly realizing residual solder columns and solder removal of the CCGA device pad as claimed in claim 1, wherein the auxiliary tool comprises: the tool base (1) is of a rectangular structure, and the length, width and height of the tool base (1) correspond to 200mm, 200mm and 30mm.

3. The auxiliary tool for rapidly realizing residual solder columns and solder removal of the CCGA device bonding pad according to claim 1, which is characterized in that: the bottom of the soldering tin clearing air port (2) is of an inclined plane structure, and the length of the inclined plane is 30mm.

4. The auxiliary tool for rapidly realizing residual solder columns and solder removal of the CCGA device bonding pad according to claim 3, wherein the auxiliary tool comprises: the height dimension of the soldering tin clearing air opening (2) is 5mm, and the width dimension is 50mm.

5. The auxiliary tool for rapidly realizing residual solder columns and solder removal of the CCGA device bonding pad according to claim 1, which is characterized in that: the length, width and height of the welding column and the soldering tin collecting box (3) are respectively 100mm, 10mm and 30mm.

6. The auxiliary tool for rapidly realizing residual solder columns and solder removal of the CCGA device bonding pad according to claim 1, which is characterized in that: the device pressing block (4) is rotatably installed on the tool base (1) and can be adjusted in height.

7. The auxiliary tool for rapidly realizing residual solder columns and solder removal of the CCGA device bonding pad according to claim 1, which is characterized in that: the length, width and depth of the device placing groove (5) are 50mm, 50mm and 3mm correspondingly.

8. The auxiliary tool for rapidly realizing residual solder columns and solder removal of the CCGA device bonding pad according to claim 1, which is characterized in that: the air pressure range of the air source interface (6) is 0.8-1.2 Mpa.