CN218120249U - Heat abstractor, air conditioning unit - Google Patents
Heat abstractor, air conditioning unit Download PDFInfo
- Publication number
- CN218120249U CN218120249U CN202222034762.6U CN202222034762U CN218120249U CN 218120249 U CN218120249 U CN 218120249U CN 202222034762 U CN202222034762 U CN 202222034762U CN 218120249 U CN218120249 U CN 218120249U
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- coolant
- heat dissipation
- heat
- plate body
- cold
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- 238000004378 air conditioning Methods 0.000 title claims abstract description 14
- 230000007246 mechanism Effects 0.000 claims abstract description 71
- 230000017525 heat dissipation Effects 0.000 claims abstract description 66
- 239000004065 semiconductor Substances 0.000 claims abstract description 55
- 239000002826 coolant Substances 0.000 claims abstract description 39
- 238000005057 refrigeration Methods 0.000 claims abstract description 35
- 239000003507 refrigerant Substances 0.000 claims abstract description 31
- 239000011232 storage material Substances 0.000 claims abstract description 11
- 238000001514 detection method Methods 0.000 claims description 17
- 238000001816 cooling Methods 0.000 claims description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 230000004044 response Effects 0.000 abstract description 11
- 230000005855 radiation Effects 0.000 abstract description 10
- 230000000694 effects Effects 0.000 abstract description 6
- 238000011084 recovery Methods 0.000 abstract description 3
- 238000009825 accumulation Methods 0.000 abstract description 2
- 239000013589 supplement Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- 230000008569 process Effects 0.000 description 4
- 230000033228 biological regulation Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/14—Thermal energy storage
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a heat abstractor, air conditioning unit. The heat dissipation device comprises a plate body, wherein a refrigerant flow path and a cold storage tank are formed in the plate body, a cold storage agent is filled in the cold storage tank, and the heat dissipation structure is arranged on the first side face of the plate body. The utility model provides a heat abstractor, air conditioning unit, adopt the coolant to carry out the cold-storage and preferentially treat heat radiation structure and dispel the heat when the coolant heat dissipation can't in time respond, thereby guarantee the radiating effect, effectual increase heat dissipation response, the coolant can be retrieved the radiating cold volume of coolant and is stored when shutting down, reduce the radiating loss of coolant, and keep away from one side of treating heat radiation structure with the cold accumulation groove setting in the coolant flow path, make the coolant in the coolant flow path play main heat dissipation, and the coolant only carries out the effect of supplementary heat dissipation and/or recovery cold volume, semiconductor refrigeration mechanism can supplement cold volume and/or directly treat heat radiation structure and dispel the heat to the coolant.
Description
Technical Field
The utility model relates to a temperature regulation equipment technical field, especially a heat abstractor, air conditioning unit.
Background
When a high-power frequency conversion power module is designed and researched, heat dissipation is a key link of operation of a frequency converter, and the heat dissipation performance directly determines whether the power module can exert the maximum capacity. At present, the existing heat dissipation device adopts a refrigerant heat dissipation mode, the internal structure mainly comprises a heat dissipation aluminum plate, a milling groove is formed in the heat dissipation aluminum plate to circulate the refrigerant or a pipeline is arranged in the heat dissipation aluminum plate to circulate the refrigerant, the refrigerant needs a certain time to reach the maximum refrigerating capacity when entering the heat dissipation aluminum plate, the heat dissipation of the heat dissipation aluminum plate is quick, and when the heat dissipation aluminum plate starts up or stops temporarily in the process of the equipment where the heat radiator is located, a heating element cannot be reliably dissipated, so that the problems of slow heat dissipation response and unreliable heat dissipation are caused.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem that the heat dissipation response of a heat dissipation device in the prior art is slow, the heat dissipation device and the air conditioning unit which adopt the coolant to refrigerate so as to improve the heat dissipation response are provided.
A cooling device comprises a plate body, wherein a refrigerant flow path and a cold storage tank are formed in the plate body, a cold storage agent is filled in the cold storage tank, a structure to be cooled is arranged on a first side face of the plate body, and the refrigerant flow path is arranged between the cold storage tank and the first side face.
The heat dissipation device further comprises a semiconductor refrigeration mechanism, the semiconductor refrigeration mechanism is arranged on the plate body, and the semiconductor refrigeration mechanism can cool coolant in the cold storage tank and/or the plate body.
The semiconductor refrigeration mechanism is arranged on the second side face of the plate body and is positioned in the projection range of the cold storage tank on the second side face.
The number of the semiconductor refrigeration mechanisms is multiple, and all the semiconductor refrigeration mechanisms are distributed on the second side face of the plate body in parallel.
The heat dissipation device further comprises a temperature detection mechanism, the temperature detection mechanism is arranged at the first side face of the plate body, and the temperature detection mechanism is electrically connected with the semiconductor refrigeration mechanism.
The heat dissipation device further comprises a control device, the control device is electrically connected with the temperature detection mechanism and the semiconductor refrigeration mechanism, and the control device can control the working state of the semiconductor refrigeration mechanism according to the temperature parameters acquired by the temperature detection mechanism.
The coolant comprises water or a refrigerant.
The control method of the heat dissipation device further includes a semiconductor refrigeration mechanism, the semiconductor refrigeration mechanism is disposed on the plate body, and the semiconductor refrigeration mechanism can cool coolant in the coolant storage tank and/or cool the plate body, and the control method includes:
s1, acquiring a real-time temperature t0 at a first side surface of a plate body, and comparing the real-time temperature t0 with a first preset temperature t 1;
and S2, if t0 is larger than t1, controlling the semiconductor refrigerating mechanism to start working.
After step S2, further comprising:
comparing the real-time temperature t0 with a second preset temperature t2, and if t0 is less than t2, reducing the refrigerating power of the semiconductor refrigerating mechanism or controlling the semiconductor refrigerating mechanism to stop working;
wherein t1 > t2.
An air conditioning unit comprises the heat dissipation device.
The utility model provides a heat abstractor, air conditioning unit, adopt the coolant to carry out the cold-storage and preferentially treat heat radiation structure and dispel the heat when the coolant heat dissipation can't the timely response, thereby guarantee the radiating effect, effectual improvement radiating response, the coolant can be retrieved the radiating cold volume of coolant and is stored when shutting down, reduce the radiating loss of coolant, and keep away from the one side of treating heat radiation structure with the cold accumulation groove setting in the coolant flow path, make the coolant in the coolant flow path play main heat dissipation, and the coolant only assists the effect of heat dissipation and/or recovery cold volume, semiconductor refrigeration mechanism can supplement cold volume and/or directly treat heat radiation structure and dispel the heat to the coolant, further improve the temperature control of treating heat radiation structure, make and treat that heat radiation structure can exert optimum ability.
Drawings
Fig. 1 is a schematic structural view of a heat dissipation device according to an embodiment of the present invention;
fig. 2 is another schematic structural diagram of a heat dissipation device according to an embodiment of the present invention;
fig. 3 is a flowchart of a control method of a heat dissipation device according to an embodiment of the present invention;
in the figure:
1. a plate body; 2. a refrigerant flow path; 3. a cold storage tank; 4. a structure to be heat-dissipated; 11. a first side surface; 5. a semiconductor refrigeration mechanism; 12. a second side surface; 6. a temperature detection mechanism; 7. and a control device.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.
The heat dissipation device shown in fig. 1 to 3 includes a plate body 1, a refrigerant flow path 2 and a cold storage tank 3 are formed in the plate body 1, the cold storage tank 3 is filled with a cold storage agent, a structure 4 to be dissipated is disposed on a first side surface 11 of the plate body 1, and the refrigerant flow path 2 is disposed between the cold storage tank 3 and the first side surface 11. Adopt the coolant to carry out the cold-storage and treat heat radiation structure 4 with priority and dispel the heat when the refrigerant heat dissipation can't respond to in time to guarantee the radiating effect, effectual increase heat dissipation response, the coolant can retrieve the radiating cold volume of refrigerant and save when shutting down, reduce the radiating loss of refrigerant, set up cold-storage tank 3 in refrigerant flow path 2 in addition and keep away from the one side of treating heat radiation structure 4, make the refrigerant in refrigerant flow path 2 play main heat dissipation, and the coolant only carries out the effect of supplementary heat dissipation and/or recovery cold volume. Preferably, the refrigerant flow path is provided with an electronic expansion valve for adjusting the flow rate of the refrigerant in the refrigerant flow path.
For example, the heat dissipation device is applied to an air conditioning unit, when the air conditioning unit is stopped and started within a period of time, the structure 4 to be dissipated heat, which is arranged on the plate body 1, starts to generate heat and needs to dissipate heat, a refrigerant cannot timely enter the refrigerant flow path 2 for cooling after throttling or stopping circulation, at the moment, cold energy in the coolant starts to dissipate heat for the structure 4 to be dissipated heat, then the refrigerant for heat dissipation in the air conditioning unit flows into the refrigerant flow path 2 along with the start of the compressor and gradually replaces the heat dissipation of the coolant, and the heat dissipation is always performed on the structure to be dissipated heat during the whole process, so that the problem that the structure 4 to be dissipated heat cannot dissipate heat at the moment when the air conditioning unit is started in the prior art is effectively solved, the heat dissipation response of the heat dissipation device is improved, and the service life of the structure 4 to be dissipated heat is also prolonged.
Preferably, the coolant comprises water or a refrigerant.
In order to keep the coolant capable of cooling, the heat dissipation device further comprises a semiconductor cooling mechanism 5, wherein the semiconductor cooling mechanism 5 is arranged on the plate body 1, and the semiconductor cooling mechanism 5 can cool the coolant in the coolant storage tank 3 and/or cool the plate body 1. The characteristic that the semiconductor refrigerating sheet is fast in response is fully utilized, and the problem that when the electronic expansion valve adjusts the flow of the refrigerant, the temperature response time of the upper surface of the plate body 1 is long can be solved.
When the semiconductor refrigerating mechanism 5 works, the semiconductor refrigerating mechanism 5 can directly refrigerate the cold storage agent, if the semiconductor refrigerating mechanism 5 is arranged on the second side face 12 of the plate body 1, the semiconductor refrigerating mechanism 5 is located in the projection range of the second side face 12 of the cold storage tank 3, the cold energy generated by the semiconductor refrigerating mechanism 5 is basically supplied to the cold storage agent for cold storage, the semiconductor refrigerating mechanism 5 can utilize low-power continuous refrigeration for a long time to uniformly cool the plate body 1 and enable the cold storage agent to store cold, when the structure 4 to be cooled starts to work, the cold energy in the uniformly cooled plate body 1 and the cold storage agent can directly dissipate heat for the structure 4 to be cooled, the heat dissipation response of the heat dissipating device is effectively increased, the problem that the structure 4 to be cooled does not have the refrigerant to dissipate heat at the moment of starting is solved, meanwhile, the electric power fluctuation of the semiconductor refrigerating mechanism 5 can be reduced, and the service stability and the service life of the semiconductor refrigerating mechanism 5 are ensured through slow input of weak electricity.
As another embodiment, when the semiconductor refrigeration mechanisms 5 work, part of the cold energy can be directly radiated to the structure 4 to be radiated according to the installation position, and part of the cold energy is stored by the cold storage agent, for example, if the number of the semiconductor refrigeration mechanisms 5 is multiple, all the semiconductor refrigeration mechanisms 5 are distributed in parallel on the second side 12 of the plate body 1. When the heat dissipation structure 4 starts to work, all the semiconductor refrigeration mechanisms 5 are adjusted to have higher power to refrigerate, so that the plate body 1 is accelerated to be cooled, the purpose of directly dissipating heat of the heat dissipation structure 4 to be treated is achieved, meanwhile, the cold storage agent also starts to store cold, preparation is made for next heat dissipation, the problem that the heat dissipation structure 4 to be treated is free of refrigerant at the moment of starting is solved, and the purpose of directly and quickly dissipating heat of the heat dissipation structure 4 to be treated is achieved.
The heat dissipation device further comprises a temperature detection mechanism 6, wherein the temperature detection mechanism 6 is arranged at the first side surface 11 of the plate body 1, and the temperature detection mechanism 6 is electrically connected with the semiconductor refrigeration mechanism 5. The temperature detection mechanism 6 is used for detecting the temperature of the structure 4 to be radiated and the surrounding thereof, judging whether the temperature of the structure 4 to be radiated reaches the set requirement or not, and controlling the semiconductor refrigeration mechanism 5 according to the temperature.
The heat dissipation device further comprises a control device 7, the control device 7 is electrically connected with the temperature detection mechanism 6 and the semiconductor refrigeration mechanism 5, and the control device 7 can control the working state of the semiconductor refrigeration mechanism 5 according to the temperature parameters acquired by the temperature detection mechanism 6.
As shown in fig. 3, another aspect of the present invention provides a control method for the above heat dissipation apparatus, the heat dissipation apparatus further includes a semiconductor refrigeration mechanism 5, the semiconductor refrigeration mechanism 5 is disposed on the plate body 1, and the semiconductor refrigeration mechanism 5 can cool the coolant in the coolant storage tank 3 and/or cool the plate body 1, wherein the heat dissipation apparatus is applied to the preset structure, and since the preset structure is powered on, the heat dissipation apparatus needs to wait for the charging of the frequency converter, and after the charging of the frequency converter is completed, the heat dissipation apparatus starts to output three-phase ac power in normal operation, and the compressor is gradually controlled to start, in this process, the heat dissipation structure 4 starts to work to generate heat, so the control method includes:
step S1, acquiring a real-time temperature t0 at a first side surface 11 of a plate body 1, and comparing the real-time temperature t0 with a first preset temperature t 1;
and S2, if t0 is larger than t1, the structure 4 to be cooled needs to be cooled at the moment, the semiconductor refrigerating mechanism 5 is controlled to start working, the plate body 1 is cooled and cold storage is carried out on the cold storage agent by the semiconductor refrigerating mechanism 5, so that the structure 4 to be cooled can be cooled, and the problem that the structure 4 to be cooled cannot be cooled in the process from power-on of a preset structure to starting of a compressor in the prior art is effectively solved.
After step S2, further comprising:
comparing the real-time temperature t0 with a second preset temperature t2, and if t0 is less than t2, indicating that the cooling medium cooling can meet the cooling requirement of the structure 4 to be cooled, reducing the cooling power of the semiconductor cooling mechanism 5 or controlling the semiconductor cooling mechanism 5 to stop working;
wherein t1 > t2.
An air conditioning unit comprises the heat dissipation device.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (8)
1. A heat dissipation device, characterized in that: the cooling plate comprises a plate body (1), wherein a refrigerant flow path (2) and a cold storage tank (3) are formed in the plate body (1), a cold storage agent is filled in the cold storage tank (3), a heat dissipation structure (4) is arranged on a first side face (11) of the plate body (1), and the refrigerant flow path (2) is arranged between the cold storage tank (3) and the first side face (11).
2. The heat dissipating device of claim 1, wherein: the heat dissipation device further comprises a semiconductor refrigeration mechanism (5), wherein the semiconductor refrigeration mechanism (5) is arranged on the plate body (1), and the semiconductor refrigeration mechanism (5) can cool a coolant in the cold storage tank (3) and/or cool the plate body (1).
3. The heat dissipating device of claim 2, wherein: the semiconductor refrigeration mechanism (5) is arranged on the second side surface (12) of the plate body (1), and the semiconductor refrigeration mechanism (5) is located in the projection range of the cold storage tank (3) on the second side surface (12).
4. The heat dissipating device of claim 2, wherein: the number of the semiconductor refrigerating mechanisms (5) is multiple, and all the semiconductor refrigerating mechanisms (5) are distributed on the second side face (12) of the plate body (1) in parallel.
5. The heat dissipating device of claim 2, wherein: the heat dissipation device further comprises a temperature detection mechanism (6), wherein the temperature detection mechanism (6) is arranged at the first side face (11) of the plate body (1), and the temperature detection mechanism (6) is electrically connected with the semiconductor refrigeration mechanism (5).
6. The heat dissipating device of claim 5, wherein: the heat dissipation device further comprises a control device (7), the control device (7) is electrically connected with the temperature detection mechanism (6) and the semiconductor refrigeration mechanism (5), and the control device (7) can control the working state of the semiconductor refrigeration mechanism (5) according to the temperature parameters acquired by the temperature detection mechanism (6).
7. The heat dissipating device of claim 1, wherein: the coolant comprises water or a refrigerant.
8. An air conditioning unit, its characterized in that: comprising the heat sink of any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222034762.6U CN218120249U (en) | 2022-08-03 | 2022-08-03 | Heat abstractor, air conditioning unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222034762.6U CN218120249U (en) | 2022-08-03 | 2022-08-03 | Heat abstractor, air conditioning unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218120249U true CN218120249U (en) | 2022-12-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222034762.6U Active CN218120249U (en) | 2022-08-03 | 2022-08-03 | Heat abstractor, air conditioning unit |
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| CN (1) | CN218120249U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115264990A (en) * | 2022-08-03 | 2022-11-01 | 珠海格力电器股份有限公司 | Heat dissipation device, control method thereof and air conditioning unit |
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- 2022-08-03 CN CN202222034762.6U patent/CN218120249U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115264990A (en) * | 2022-08-03 | 2022-11-01 | 珠海格力电器股份有限公司 | Heat dissipation device, control method thereof and air conditioning unit |
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