CN111811190A - Semiconductor refrigeration module, space air-cooled heat dissipation device and space equipment - Google Patents
Semiconductor refrigeration module, space air-cooled heat dissipation device and space equipment Download PDFInfo
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- CN111811190A CN111811190A CN202010542591.0A CN202010542591A CN111811190A CN 111811190 A CN111811190 A CN 111811190A CN 202010542591 A CN202010542591 A CN 202010542591A CN 111811190 A CN111811190 A CN 111811190A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D15/00—Devices not covered by group F25D11/00 or F25D13/00, e.g. non-self-contained movable devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
- F25D17/02—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating liquids, e.g. brine
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
- F25D17/04—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection
- F25D17/06—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection by forced circulation
Abstract
The invention discloses a semiconductor refrigeration module, a space air-cooling heat dissipation device and space equipment, and relates to the field of aerospace. The semiconductor refrigeration module includes: the cold plate is communicated with a liquid loop and used for enabling liquid in the liquid loop to exchange heat with the hot end of the semiconductor refrigerator; the cold end of the semiconductor refrigerator is in contact with the air cooling heat exchanger, and the air cooling heat exchanger is communicated with the gas loop and used for enabling gas in the gas loop to exchange heat with the cold end of the semiconductor refrigerator. The semiconductor refrigeration system can realize stable and safe refrigeration in a space environment, and has the characteristics of simple structure, small volume, light weight, short response time and strong controllability, and the thermal control temperature range is larger, so the semiconductor refrigeration system has stronger practicability and can meet the refrigeration requirement in the space environment.
Description
Technical Field
The invention relates to the field of aerospace, in particular to a semiconductor refrigeration module, a space air-cooling heat dissipation device and space equipment.
Background
At present, for ground refrigeration, a relatively mature vapor compression refrigeration system is generally used, as shown in fig. 3, a refrigeration compressor sucks low-pressure and low-temperature refrigerant vapor flowing from an evaporator, the low-pressure and low-temperature refrigerant vapor is compressed into high-pressure and high-temperature vapor by the compressor and is discharged, heat is released in a condenser and is transferred to a medium around the condenser, so that the refrigerant vapor is gradually condensed into liquid, and the refrigerant liquid flowing out of the condenser is decompressed to evaporation pressure by an expansion valve and is continuously circulated to the evaporator.
However, for space environments, conventional floor cooling solutions are no longer suitable. The reasons are mainly as follows: 1. under normal gravity conditions, gravity causes lubricating oil to flow into an oil sump of the compressor, while in a microgravity environment, if a large amount of lubricating oil leaves the oil sump and enters the cylinder, the compressor cannot be lubricated, which leads to increase of leakage and friction, which in turn causes problems of high power consumption, reduction of the service life of the compressor, and the like; 2. under the condition of the ground normal gravity environment, the gas-liquid mixture is naturally layered due to the density difference of gas-liquid phases. Under the condition of microgravity, the separation is realized by a gas-liquid separation technology, the existing gas-liquid separation can only achieve the purpose of separating no visible liquid drops in gas, and the liquid flowing into the compressor can damage the compressor; 3. the evaporator and the condenser are two key parts of vapor compression refrigeration, and the formed bubbles and liquid films cannot leave the wall surface in time under the microgravity condition, so that the heat exchange of the heat exchanger is deteriorated.
At present, a liquid cooling loop is adopted for refrigeration in an international space station to solve the problems, as shown in fig. 4, liquid is cooled through an external cold source, enters a gas-liquid heat exchanger through the driving of a circulating pump, high-temperature gas and low-temperature liquid exchange heat through the gas-liquid heat exchanger to cool the high-temperature gas, however, the lowest inlet gas temperature of load side circulation is limited by the temperature of a coolant on the cold side of the gas-liquid heat exchanger, and the thermal control temperature range is smaller. In the limit state, the lowest inlet temperature of the heat load is equal to the temperature of the liquid side inlet working medium in the liquid cooling loop, so that the actual requirement is difficult to meet.
Disclosure of Invention
The technical problem to be solved by the invention is to provide a semiconductor refrigeration module, a space air-cooling heat dissipation device and space equipment aiming at the defects of the prior art, wherein the semiconductor refrigeration module has the characteristics of simple structure, small volume, light weight, short response time and strong controllability, and the microgravity has little influence on the semiconductor refrigeration module and can be suitable for the space environment.
The technical scheme for solving the technical problems is as follows:
a semiconductor refrigeration module comprising: the heat exchanger comprises a cold plate, a semiconductor refrigerator and an air cooling heat exchanger, wherein the hot end of the semiconductor refrigerator is in contact with the cold plate, and the cold plate is communicated with a liquid loop and used for enabling liquid in the liquid loop to exchange heat with the hot end of the semiconductor refrigerator; the cold end of the semiconductor refrigerator is in contact with the air cooling heat exchanger, and the air cooling heat exchanger is communicated with a gas loop and used for enabling gas in the gas loop to exchange heat with the cold end of the semiconductor refrigerator.
Another technical solution of the present invention for solving the above technical problems is as follows:
a space air-cooled heat dissipation device based on a semiconductor refrigeration module comprises: semiconductor refrigeration module, liquid return circuit and gaseous return circuit, the semiconductor refrigeration module includes: cold plate, semiconductor cooler and air cooling heat exchanger, wherein:
the hot end of the semiconductor refrigerator is in contact with the cold plate, and the cold plate is communicated with the liquid loop and used for enabling liquid in the liquid loop to exchange heat with the hot end of the semiconductor refrigerator; the cold end of the semiconductor refrigerator is in contact with the air cooling heat exchanger, and the air cooling heat exchanger is communicated with the gas loop and used for enabling gas in the gas loop to exchange heat with the cold end of the semiconductor refrigerator.
Another technical solution of the present invention for solving the above technical problems is as follows:
a space apparatus, comprising: the semiconductor refrigeration module according to the above technical solution, or the space air-cooled heat dissipation device according to the above technical solution.
The invention has the beneficial effects that: according to the invention, the semiconductor refrigerator is used for refrigerating, the cold end is in contact with the air-cooled heat exchanger, the high-temperature gas is cooled by the air-cooled heat exchanger, and the hot end of the semiconductor refrigerator is cooled by the cold plate, so that the medium needing heat exchange is physically isolated by the semiconductor refrigerator, and no contact is generated, thereby avoiding gas-liquid mixed flow under the microgravity condition, realizing stable and safe refrigeration under the space environment, and because the semiconductor refrigerator has the characteristics of simple structure, small volume, light weight, short response time and strong controllability, and the thermal control temperature range is large, the practicability is stronger, and the refrigeration requirement under the space environment can be met.
Advantages of additional aspects of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
FIG. 1 is a schematic structural diagram of a semiconductor refrigeration module according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a space air-cooled heat sink according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a prior art vapor compression refrigeration system;
fig. 4 is a schematic structural diagram of a conventional liquid cooling circuit refrigeration system.
Detailed Description
The principles and features of this invention are described below in conjunction with the following drawings, which are set forth to illustrate, but are not to be construed to limit the scope of the invention.
The conventional ground refrigeration system is generally a vapor compression refrigeration system, and the structure of the conventional ground refrigeration system is shown in fig. 3, and the conventional ground refrigeration system mainly comprises a condenser, an expansion valve, an evaporator and a compressor.
However, the current solution generally adopts a liquid cooling loop refrigeration system, and the structure of the liquid cooling loop refrigeration system is shown in fig. 4, and the liquid cooling loop refrigeration system mainly comprises a gas-liquid heat exchanger, a circulating pump and an external cold source, however, the lowest inlet gas temperature of the load side circulation is restricted by the cold side coolant temperature of the gas-liquid heat exchanger, and the thermal control temperature range is small.
Based on this, the invention discloses a semiconductor refrigeration module realized by a semiconductor refrigerator, a system for realizing refrigeration by the semiconductor refrigeration module, namely a space air-cooling heat dissipation device, and space equipment for refrigerating by using the semiconductor refrigeration module or the space air-cooling heat dissipation device, which are described in detail below.
As shown in fig. 1, a schematic structural diagram is provided for an embodiment of a semiconductor refrigeration module of the present invention, in which arrows indicate a flow direction of a gas or a liquid, and the semiconductor refrigeration module is suitable for refrigeration in a space microgravity environment, and includes: the device comprises a cold plate 1, a semiconductor refrigerator 2 and an air cooling heat exchanger 3, wherein the hot end of the semiconductor refrigerator 2 is in contact with the cold plate 1, and the cold plate 1 is communicated with a liquid loop 4 for enabling liquid in the liquid loop 4 to exchange heat with the hot end of the semiconductor refrigerator 2; the cold end of the semiconductor refrigerator 2 is in contact with the air-cooled heat exchanger 3, and the air-cooled heat exchanger 3 is communicated with a gas loop 5 and used for enabling gas in the gas loop 5 to exchange heat with the cold end of the semiconductor refrigerator 2.
It should be understood that the semiconductor refrigerator 2 is a device for generating cold by using the thermo-electric effect of semiconductors, and the principle thereof is that when two different metals are connected by a conductor and direct current is conducted, the temperature at one junction is lowered and the temperature at the other junction is raised. After the power supply is switched on, electron hole pairs are generated near the upper contact, the internal energy is reduced, the temperature is reduced, and heat is absorbed to the outside, namely the cold end. The other end is called hot end because the electron hole pair is compounded, the internal energy is increased, the temperature is raised, and heat is released to the environment.
Preferably, as shown in fig. 1, the cold plate 1 may be configured in a long bar shape, and include a plurality of vertically arranged liquid passages therein to increase a contact area with the semiconductor cooler 2. The air-cooled heat exchanger 3 can also be set into a long strip shape, and fins which are transversely arranged are arranged in the air-cooled heat exchanger to increase the contact area of air and the fins, so that the heat exchange efficiency is improved.
It will be appreciated that for optimal heat transfer, the cold plate 1 may be placed against the hot end of the semiconductor cooler 2 and the air-cooled heat exchanger 3 may be placed against the cold end of the semiconductor cooler 2.
In order to guarantee to hug closely, can encapsulate into the module through the shell cold drawing 1, semiconductor cooler 2 and air cooling heat exchanger 3, improve its integrated level, the installation of being convenient for is dismantled, also can be through outer lane support with the laminating of three, and the technical staff in the art also can be fixed the three through other existing means, no longer gives unnecessary details one by one here.
Preferably, the semiconductor refrigerator 2 may be of a model FPH1-16104T1, and as shown in fig. 1, multiple chips may be used in series/parallel. The plate-fin heat exchanger with the heat exchange capacity of more than or equal to 400W can be selected as the heat exchange capacity of the cold plate 1, and has the advantages of high compactness, high heat exchange efficiency and high pressure bearing capacity, and is more suitable for the space microgravity environment. The air-cooled heat exchanger 3 can select a plate-fin heat exchanger with the heat exchange quantity of more than or equal to 250W.
This embodiment refrigerates through semiconductor cooler 2, contact cold junction and air cooling heat exchanger 3, cool down high-temperature gas through air cooling heat exchanger 3, cool off semiconductor cooler 2's hot junction through cold drawing 1, just so carried out physical isolation to the medium that needs carry out the heat exchange through semiconductor cooler 2, can not produce the contact, thereby gas-liquid mixed flow under the microgravity condition has been avoided, thereby can realize stable safe refrigeration under space environment, and because semiconductor refrigeration itself has simple structure, small, light in weight, response time is short, the strong characteristics of controllability, and the thermal control temperature range is great, therefore the practicality is stronger, can satisfy the refrigeration demand under the space environment.
It will be appreciated that some optional modifications to the gas circuit 5 and the liquid circuit 4 are described below in order to achieve a better and more stable refrigeration effect.
Alternatively, in some possible embodiments, a fan 51 and a thermal load 52 are disposed in the gas circuit 5, and the fan 51 is used for driving the gas in the gas circuit 5 to circulate in the gas circuit 5 and blowing the gas cooled by the air-cooled heat exchanger 3 in the gas circuit 5 to the thermal load 52.
As shown in fig. 2, after the gas comes out of the air-cooled heat exchanger 3, the gas passes through the heat load 52 and the fan 51 in sequence, the high-temperature gas entering the air-cooled heat exchanger 3 exchanges heat with the fins and is reduced to a lower temperature, the fan 51 sends the gas into the air-cooled heater, the low-temperature gas exchanges heat with the heat load 52 under the driving of the fan 51, and the gas with the temperature increased again enters the air-cooled heat exchanger 3 to complete a refrigeration cycle.
Preferably, the fan 51 may be an EBM axial fan in germany.
Optionally, in some possible embodiments, a temperature sensor 53 is further disposed in the gas loop 5 between the air outlet of the air-cooled heat exchanger 3 and the heat load 52, the temperature sensor 53 is configured to detect the temperature of the gas cooled by the air-cooled heat exchanger 3, and the semiconductor refrigerator 2 is further configured to adjust the input power according to the temperature.
By monitoring the temperature sensor 53 to adjust the input power to the refrigerator, it is ensured that the heat load 52 is maintained within a reasonable temperature range.
Optionally, in some possible embodiments, a first valve 54 is further provided in the gas circuit 5 for controlling the flow of gas in the gas circuit 5.
As shown in fig. 2, a first valve 54 may be provided in the gas circuit 5 between the fan 51 and the air-cooled heat exchanger 3 inlet.
Optionally, in some possible embodiments, a circulation pump 41 is provided in the liquid circuit 4, and the circulation pump 41 is used for driving the liquid in the liquid circuit 4 to circulate in the liquid circuit 4.
As shown in fig. 2, the hot end of the semiconductor refrigerator 2 contacts the cold plate 1, the liquid working medium is driven by the circulating pump 41, and enters the cold plate 1 to take away the heat generated by the hot end of the refrigerator, so as to ensure the long-term stable operation of the semiconductor refrigerator 2, and the working medium absorbs heat and heats up and then dissipates the heat to the space through the system cold end device 44.
Optionally, in some possible embodiments, a flow meter 42 and a second valve 43 are disposed in the liquid circuit 4, the flow meter 42 is used for detecting a flow value of the liquid in the liquid circuit 4, and the second valve 43 is used for controlling the flow of the liquid in the liquid circuit 4 according to the flow value.
The flow of the liquid in the liquid circuit 4 is monitored by the flow meter 42, and the flow of the liquid in the liquid circuit 4 is controlled by the flow regulating valve, so that the cooling efficiency of the liquid circuit 4 can be matched with the heating efficiency of the gas circuit 5, and stable and high-precision refrigeration can be realized.
Optionally, in some possible embodiments, a system cold end device 44 is disposed in the liquid circuit 4, and the system cold end device 44 is used for dissipating heat of the liquid heated by the cold plate 1.
Preferably, the system cold end device 44 may be a liquid-to-liquid heat exchanger or a space radiator.
Optionally, in some possible embodiments, an accumulator 45 is further provided within the fluid circuit 4, the accumulator 45 being used to stabilize the pressure within the fluid circuit 4.
It is to be understood that some or all of the various embodiments described above may be included in some embodiments.
As shown in fig. 2, a schematic structural diagram provided in an embodiment of the space air-cooled heat dissipation apparatus of the present invention is implemented based on a semiconductor refrigeration module, and is suitable for refrigeration in a space microgravity environment, and includes: semiconductor refrigeration module, liquid return circuit 4 and gaseous return circuit 5, the semiconductor refrigeration module includes: cold plate 1, semiconductor cooler 2 and air cooling heat exchanger 3, wherein:
the hot end of the semiconductor refrigerator 2 is contacted with the cold plate 1, and the cold plate 1 is communicated with the liquid loop 4 and is used for enabling the liquid in the liquid loop 4 to exchange heat with the hot end of the semiconductor refrigerator 2; the cold end of the semiconductor refrigerator 2 is in contact with the air-cooled heat exchanger 3, and the air-cooled heat exchanger 3 is communicated with the gas loop 5 and used for enabling gas in the gas loop 5 to exchange heat with the cold end of the semiconductor refrigerator 2.
It should be understood that the semiconductor refrigerator 2 is a device for generating cold by using the thermo-electric effect of semiconductors, and the principle thereof is that when two different metals are connected by a conductor and direct current is conducted, the temperature at one junction is lowered and the temperature at the other junction is raised. After the power supply is switched on, electron hole pairs are generated near the upper contact, the internal energy is reduced, the temperature is reduced, and heat is absorbed to the outside, namely the cold end. The other end is called hot end because the electron hole pair is compounded, the internal energy is increased, the temperature is raised, and heat is released to the environment.
Preferably, as shown in fig. 2, the cold plate 1 may be configured in a long bar shape, and include a plurality of vertically arranged liquid passages therein to increase a contact area with the semiconductor cooler 2. The air-cooled heat exchanger 3 can also be set into a long strip shape, and fins which are transversely arranged are arranged in the air-cooled heat exchanger to increase the contact area of air and the fins, so that the heat exchange efficiency is improved.
It will be appreciated that for optimal heat transfer, the cold plate 1 may be placed against the hot end of the semiconductor cooler 2 and the air-cooled heat exchanger 3 may be placed against the cold end of the semiconductor cooler 2.
In order to guarantee to hug closely, can encapsulate into the module through the shell cold drawing 1, semiconductor cooler 2 and air cooling heat exchanger 3, improve its integrated level, the installation of being convenient for is dismantled, also can be through outer lane support with the laminating of three, and the technical staff in the art also can be fixed the three through other existing means, no longer gives unnecessary details one by one here.
Preferably, the semiconductor refrigerator 2 may be of a model FPH1-16104T1, and as shown in fig. 1, multiple chips may be used in series/parallel. The plate-fin heat exchanger with the heat exchange capacity of more than or equal to 400W can be selected as the heat exchange capacity of the cold plate 1, and has the advantages of high compactness, high heat exchange efficiency and high pressure bearing capacity, and is more suitable for the space microgravity environment. The air-cooled heat exchanger 3 can select a plate-fin heat exchanger with the heat exchange quantity of more than or equal to 250W.
This embodiment refrigerates through semiconductor cooler 2, contact cold junction and air cooling heat exchanger 3, cool down high-temperature gas through air cooling heat exchanger 3, cool off semiconductor cooler 2's hot junction through cold drawing 1, just so carried out physical isolation to the medium that needs carry out the heat exchange through semiconductor cooler 2, can not produce the contact, thereby gas-liquid mixed flow under the microgravity condition has been avoided, thereby can realize stable safe refrigeration under space environment, and because semiconductor refrigeration itself has simple structure, small, light in weight, response time is short, the strong characteristics of controllability, and the thermal control temperature range is great, therefore the practicality is stronger, can satisfy the refrigeration demand under the space environment.
It will be appreciated that in order to achieve a better and more stable refrigeration effect, some optional improvements on the gas circuit 5 and the liquid circuit 4 are described below in connection with fig. 2.
Alternatively, in some possible embodiments, a fan 51 and a thermal load 52 are disposed in the gas circuit 5, and the fan 51 is used for driving the gas in the gas circuit 5 to circulate in the gas circuit 5 and blowing the gas cooled by the air-cooled heat exchanger 3 in the gas circuit 5 to the thermal load 52.
As shown in fig. 2, after the gas comes out of the air-cooled heat exchanger 3, the gas passes through the heat load 52 and the fan 51 in sequence, the high-temperature gas entering the air-cooled heat exchanger 3 exchanges heat with the fins and is reduced to a lower temperature, the fan 51 sends the gas into the air-cooled heater, the low-temperature gas exchanges heat with the heat load 52 under the driving of the fan 51, and the gas with the temperature increased again enters the air-cooled heat exchanger 3 to complete a refrigeration cycle.
Preferably, the fan 51 may be an EBM axial fan in germany.
Optionally, in some possible embodiments, a temperature sensor 53 is further disposed in the gas loop 5 between the air outlet of the air-cooled heat exchanger 3 and the heat load 52, the temperature sensor 53 is configured to detect the temperature of the gas cooled by the air-cooled heat exchanger 3, and the semiconductor refrigerator 2 is further configured to adjust the input power according to the temperature.
By monitoring the temperature sensor 53 to adjust the input power to the refrigerator, it is ensured that the heat load 52 is maintained within a reasonable temperature range.
Optionally, in some possible embodiments, a first valve 54 is further provided in the gas circuit 5 for controlling the flow of gas in the gas circuit 5.
As shown in fig. 2, a first valve 54 may be provided in the gas circuit 5 between the fan 51 and the air-cooled heat exchanger 3 inlet.
Optionally, in some possible embodiments, a circulation pump 41 is provided in the liquid circuit 4, and the circulation pump 41 is used for driving the liquid in the liquid circuit 4 to circulate in the liquid circuit 4.
As shown in fig. 2, the hot end of the semiconductor refrigerator 2 contacts the cold plate 1, the liquid working medium is driven by the circulating pump 41, and enters the cold plate 1 to take away the heat generated by the hot end of the refrigerator, so as to ensure the long-term stable operation of the semiconductor refrigerator 2, and the working medium absorbs heat and heats up and then dissipates the heat to the space through the system cold end device 44.
Optionally, in some possible embodiments, a flow meter 42 and a second valve 43 are disposed in the liquid circuit 4, the flow meter 42 is used for detecting a flow value of the liquid in the liquid circuit 4, and the second valve 43 is used for controlling the flow of the liquid in the liquid circuit 4 according to the flow value.
The flow of the liquid in the liquid circuit 4 is monitored by the flow meter 42, and the flow of the liquid in the liquid circuit 4 is controlled by the flow regulating valve, so that the cooling efficiency of the liquid circuit 4 can be matched with the heating efficiency of the gas circuit 5, and stable and high-precision refrigeration can be realized.
Optionally, in some possible embodiments, a system cold end device 44 is disposed in the liquid circuit 4, and the system cold end device 44 is used for dissipating heat of the liquid heated by the cold plate 1.
Preferably, the system cold end device 44 may be a liquid-to-liquid heat exchanger or a space radiator.
Optionally, in some possible embodiments, an accumulator 45 is further provided within the fluid circuit 4, the accumulator 45 being used to stabilize the pressure within the fluid circuit 4.
It is to be understood that some or all of the various embodiments described above may be included in some embodiments.
The present invention also provides a space apparatus comprising: the semiconductor refrigeration module according to any of the above embodiments, or the space air-cooled heat sink according to any of the above embodiments.
The space equipment may be equipment used in a space environment such as a spacecraft or a space station, and equipment such as an instrument, a laboratory apparatus, or a controller that requires temperature reduction is mounted in the equipment.
It should be understood that space equipment on the ground, or other ground equipment, water equipment and the like comprising the semiconductor refrigeration module or the space air-cooled heat sink provided by any of the above embodiments, or equipment for refrigerating by using the semiconductor refrigeration module or the space air-cooled heat sink provided by any of the above embodiments, should also be included in the protection scope of the present invention.
The reader should understand that in the description of this specification, reference to the description of the terms "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
While the invention has been described with reference to specific embodiments, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A semiconductor refrigeration module, comprising: the heat exchanger comprises a cold plate, a semiconductor refrigerator and an air cooling heat exchanger, wherein the hot end of the semiconductor refrigerator is in contact with the cold plate, and the cold plate is communicated with a liquid loop and used for enabling liquid in the liquid loop to exchange heat with the hot end of the semiconductor refrigerator; the cold end of the semiconductor refrigerator is in contact with the air cooling heat exchanger, and the air cooling heat exchanger is communicated with a gas loop and used for enabling gas in the gas loop to exchange heat with the cold end of the semiconductor refrigerator.
2. The utility model provides a space forced air cooling heat abstractor based on semiconductor refrigeration module which characterized in that includes: semiconductor refrigeration module, liquid return circuit and gaseous return circuit, the semiconductor refrigeration module includes: cold plate, semiconductor cooler and air cooling heat exchanger, wherein:
the hot end of the semiconductor refrigerator is in contact with the cold plate, and the cold plate is communicated with the liquid loop and used for enabling liquid in the liquid loop to exchange heat with the hot end of the semiconductor refrigerator; the cold end of the semiconductor refrigerator is in contact with the air cooling heat exchanger, and the air cooling heat exchanger is communicated with the gas loop and used for enabling gas in the gas loop to exchange heat with the cold end of the semiconductor refrigerator.
3. The semiconductor refrigeration module-based space air-cooled heat dissipation device as claimed in claim 2, wherein a fan and a thermal load are arranged in the gas loop, the fan is used for driving gas in the gas loop to circulate in the gas loop, and the gas cooled by the air-cooled heat exchanger in the gas loop is blown to the thermal load.
4. The semiconductor refrigeration module-based space air-cooled heat dissipation device as claimed in claim 2, wherein a temperature sensor is further disposed in a gas loop between the air outlet of the air-cooled heat exchanger and the heat load, the temperature sensor is configured to detect a temperature of the gas cooled by the air-cooled heat exchanger, and the semiconductor refrigerator is further configured to adjust input power according to the temperature.
5. The semiconductor refrigeration module-based space air-cooled heat sink according to any one of claims 2 to 4, wherein a first valve is further disposed in the gas loop for controlling the flow rate of the gas in the gas loop.
6. The semiconductor refrigeration module-based space air-cooled heat dissipation device as defined in claim 2, wherein a circulation pump is disposed in the liquid loop, and the circulation pump is configured to drive the liquid in the liquid loop to circulate in the liquid loop.
7. The semiconductor refrigeration module-based space air-cooled heat sink according to claim 2, wherein a flow meter and a second valve are arranged in the liquid circuit, the flow meter is used for detecting a flow value of the liquid in the liquid circuit, and the second valve is used for controlling the flow of the liquid in the liquid circuit according to the flow value.
8. The semiconductor refrigeration module-based space air-cooled heat dissipation device of claim 2, wherein a system cold end device is disposed in the liquid loop, and the system cold end device is configured to dissipate heat of the liquid warmed by the cold plate.
9. The semiconductor refrigeration module based space air-cooled heat sink according to any one of claims 6 to 8, wherein an accumulator is further provided in the liquid circuit for stabilizing the pressure in the liquid circuit.
10. A space apparatus, comprising: a semiconductor refrigeration module according to claim 1, or a space air-cooled heat sink according to any of claims 2 to 9.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113660838A (en) * | 2021-08-20 | 2021-11-16 | 江苏中科新源半导体科技有限公司 | Semiconductor thermopile precision temperature control liquid cold source system |
| CN115451638A (en) * | 2022-09-29 | 2022-12-09 | 季华实验室 | Refrigeration control method, device, equipment and readable storage medium |
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| CN116056422B (en) * | 2022-12-30 | 2023-08-25 | 中国科学院空间应用工程与技术中心 | Detachable cold plate of online cabinet operation box and operation box liquid cooling system |
| CN116560328A (en) * | 2023-07-10 | 2023-08-08 | 江苏晨达半导体科技有限公司 | Optimization method and system for semiconductor equipment control system |
| CN116560328B (en) * | 2023-07-10 | 2023-10-13 | 江苏晨达半导体科技有限公司 | Optimization method and system for semiconductor equipment control system |
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