CN208091010U - A kind of direct-cooled device of semiconductor chilling plate fluid - Google Patents
A kind of direct-cooled device of semiconductor chilling plate fluid Download PDFInfo
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- CN208091010U CN208091010U CN201820311954.8U CN201820311954U CN208091010U CN 208091010 U CN208091010 U CN 208091010U CN 201820311954 U CN201820311954 U CN 201820311954U CN 208091010 U CN208091010 U CN 208091010U
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Abstract
The utility model provides a kind of direct-cooled device of semiconductor chilling plate fluid, including semiconductor chilling plate, and semiconductor chilling plate includes a pair of opposite ceramic plane, i.e. the first ceramic plane and the second ceramic plane；Cold end container and hot junction container, semiconductor chilling plate are placed between cold end container and hot junction container, and the first ceramic plane is in contact with the cold fluid in cold end container；Second ceramic plane is in contact with the hot fluid in the container of hot junction；A part of the first Room for forming relative closure that cold end container is contacted with the first ceramic plane, the first Room include that the first Room import and the first Room export；Cold fluid in cold end container, which enters to export from the first Room from the first Room import, to flow out, and circulates.The utility model directly carries out heat exchange in the ceramic surface of cooling piece using fluid itself, intermediate other indirect conduction and transfer process, refrigerating efficiency higher, structure are not simpler, also it solves very well when system does not work, heat penetrates the problem of cooling piece conduction is lost in.
Description
Technical field
The utility model is related to a kind of technical field of semiconductors, more particularly to a kind of direct-cooled dress of semiconductor chilling plate fluid
It sets.
Background technology
Semiconductor chilling plate has light small and exquisite, simple in structure, no mechanical friction, noiseless, the characteristics such as long lifespan.Its table
The potsherd in face has chemical stability good, corrosion resistant characteristic, and has higher mechanical strength.Semiconductor chilling plate is
A kind of heat pump.Its principle is：Have when in the thermocouple pair that one piece of N-type semiconductor material and one piece of p-type semiconductor material are coupled to
Electric current by when, heat transfer is just will produce between both ends, heat will be transferred to the other end from one end, to generate temperature difference shape
At hot and cold side.Using this Peltier (Peltier) effect of semi-conducting material, when direct current passes through two kinds of different semiconductor materials
When expecting the galvanic couple being connected into, heat can be absorbed respectively at the both ends of galvanic couple and releases heat, the purpose of refrigeration may be implemented.
Semiconductor chilling plate has light small and exquisite, simple in structure, no mechanical friction, noiseless, the characteristics such as long lifespan.Its table
The potsherd at the cold and hot both ends in face has chemical stability good, corrosion resistant characteristic, and has higher mechanical strength.But it is unfavorable
, the heat between cold and hot both ends also can occur reverse penetration by semi-conducting material and transmit, and as the temperature difference increases, inversely
Heat transference efficiency gradually rises.When hot and cold side reaches certain temperature difference, and the amount that this positive and reverse heat is transmitted is equal, just reverse heat
Transmission is cancelled out each other, and an equalization point is finally reached, and the temperature of hot and cold side would not continue to change at this time.I.e.：With cold
The increasing of warm end temperature difference, electrical power input efficiency gradually go to zero.In order to which cold end reaches lower temperature, usually take in heat
The mode of end rapid cooling persistently reduces the temperature in hot junction to realize；It is opposite, in order to which hot junction reaches higher temperature, then be
Cold end takes the mode of quick cold scattering persistently to increase the temperature of cold end to realize.For these reasons, using semiconductor chilling plate
Solutions for refrigeration, improve the key point of its practical practical application, in that how to improve the heat dissipation of hot and cold side, and drop simultaneously
The cost that low scheme is realized.
Semiconductor chilling plate is typically to use heat-conducting metal such as at cold and hot both ends in the application of refrigerating field in the prior art
Copper and aluminium absorb heat and try quickly and efficiently to be conducted to air-liquid medium realization heat dissipation, cold scattering.Its hot and cold amount conductive process
It is：Semiconductor cold, hot end → heat-conducting metal → air-liquid fluid.It is common, in order to improve semiconductor cold, hot end → heat-conducting metal
Conductive process and efficiency, improve the efficiency of manufacturing process and reduce cost, can therebetween use heat conducting pipe silicone grease.In this way
Hot and cold amount conductive process is exactly：Semiconductor cold, hot end → heat-conducting silicone grease → heat-conducting metal → air-liquid fluid.The group of this scheme
It is higher at infrastructure cost, and intermediate thermal conductivity process is complicated and indirect.In general, semiconductor chilling plate is used in the application of refrigerating field
First pass through such as copper aluminium metal conduction, then indirectly with water or air exchange heat with achieve the purpose that collection it is cold/heat dissipation, structure
It is complicated and indirect with intermediate thermal conductivity process.
Utility model content
To solve the above-mentioned problems, it includes partly leading that the utility model, which provides a kind of direct-cooled device of semiconductor chilling plate fluid,
Body cooling piece, semiconductor chilling plate include a pair of of ceramic plane, i.e. the first ceramic plane and the second ceramic plane；
Cold end container and hot junction container, semiconductor chilling plate are placed between cold end container and hot junction container, the first ceramic plane
It is in contact with the cold fluid in cold end container；Second ceramic plane is in contact with the hot fluid in the container of hot junction；Cold end container and
A part of the first Room for forming relative closure of one ceramic plane contact, the first Room include that the first Room import and the first Room export；
Cold fluid in cold end container, which enters to export from the first Room from the first Room import, to flow out, and circulates；
First pump, is set to cold end external container；Cold end container is provided with cold end vessel inlet；First pump by pipeline with
Cold end vessel inlet and the outlet of the first Room are connected；The fluid flowed out from the outlet of the first Room is by the first pumped back cold end container；The
One Room import faces the first ceramic plane so that the fluid pumped out from the first Room import washes away the first ceramic plane with given pace.
Preferably, a part of second Room for forming relative closure that hot junction container is contacted with the second ceramic plane, second Room packet
Include second Room import and second Room outlet；Hot fluid in the container of hot junction enters from second Room import from second Room outlet stream
Go out, circulates.
Further, further include：Second pump, is set to hot junction external container；Hot junction container is provided with hot junction vessel inlet；The
Two pumps are connected by pipeline with hot junction vessel inlet and second Room outlet；After the fluid of second Room outlet outflow is pumped by second
Send hot junction container back to.
Preferably, second Room import faces the second ceramic plane so that the fluid pumped out from second Room import is with a constant speed
Rate washes away the second ceramic plane.
Further, when semiconductor chilling plate powers off, the movement rate of cold fluid and hot fluid goes to zero, and forms isolation effect
It answers, the heat that can slow down cold end container and hot junction fluid in container is swapped by semiconductor chilling plate.
Preferably, fluid is liquid or gas.
Preferably, cold end container and hot junction container are open or closed.
The direct-cooled device of fluid of the utility model the advantage is that directly the ceramic surface of cooling piece using fluid itself into
Row heat exchange, intermediate other indirect conduction and transfer process, refrigerating efficiency higher, structure are not simpler.Meanwhile also very
It solves well when system does not work, heat penetrates the problem of cooling piece conduction is lost in.
Description of the drawings
Fig. 1 is the structural schematic diagram of the direct-cooled device of fluid of a preferred embodiment of the utility model；
Fig. 2 is the structural schematic diagram of the direct-cooled device of fluid of another preferred embodiment of the utility model.
Specific implementation mode
A preferred embodiment of the utility model is introduced below with reference to Figure of description, citing proves that the utility model can
To implement, its technology contents can be kept more clear and be convenient for those of skill in the art's complete description the utility model
Understand.The utility model can be emerged from by many various forms of embodiments, and protection domain is not limited only to text
In the embodiment mentioned, figures and description herein substantially illustrates rather than limitation the utility model.In the accompanying drawings,
The identical component of structure indicates that the similar component of structure or function is indicated with like numeral label everywhere with same numbers label.
Embodiment one
As shown in Figure 1, a preferred embodiment of the utility model provides a kind of direct-cooled dress of semiconductor chilling plate fluid
It sets, including semiconductor chilling plate c, semiconductor chilling plate c includes a pair of of ceramic plane, i.e. the first ceramic plane c1 and the second ceramic plane
C2, including cold end container a and hot junction container b, semiconductor chilling plate are placed between cold end container a and hot junction container b, the first ceramics
Face c1 is in contact with the cold fluid in cold end container a；Second ceramic plane c2 is in contact with the hot fluid in the container b of hot junction；Partly lead
Body cooling piece c is powered, and the first ceramic plane c1 and the second ceramic plane c2 are constantly come from cold end container a simultaneously with certain
Rushing for the hot fluid with given pace and flow in the container b of hot junction is washed away and come to rate and the cold fluid of flow
Brush so that the hot fluid in the container b of hot junction gradually cools down, and the cold fluid in cold end container a gradually heats up.
When fluid have certain flow and rate, be directly washed into ceramic plane c1, c2 of cooling piece c, can be quick
Exchange simultaneously heat transfer.
A part of the first Room d for forming relative closure of cold end container a and the first ceramic plane contact c1, the first Room d include
First Room import f and the first Room export j1；Cold fluid in cold end container a, which enters from the first Room import f from the first Room, to be exported
J1 is flowed out, is circulated.Further include：First pump j, is set to outside cold end container a；Cold end container a be provided with cold end container into
Mouth j2；First pump j exports f with cold end vessel inlet j2 and the first Room by pipeline and is connected；The stream that f flows out from the outlet of the first Room
Body sends cold end container a back to by the first pump j.First Room import f faces the first ceramic plane c1 so that is pumped out from the first Room import f
Fluid the first ceramic plane c1 is washed away with given pace.
The a part of second Room e for forming relative closure that hot junction container b is contacted with the second ceramic plane c2, second Room e include
Second Room import g and second Room export k1；Hot fluid in the container b of hot junction, which enters from second Room import g from second Room, to be exported
K1 flows out, and circulates.Further include：Second pump k, is set to outside the container b of hot junction；Hot junction container b be provided with hot junction container into
Mouth k2；Second pump k exports k1 with hot junction vessel inlet k2 and second Room by pipeline and is connected；From second Room outlet, k1 flows out
Fluid sends hot junction container b back to by the second pump k.Second Room import g faces the second ceramic plane c2 so that is pumped from second Room import g
The fluid gone out washes away the second ceramic plane c2 with given pace.
In the above process, semiconductor chilling plate c connection positive and negative power supplies, while the first pump j and the second pump k are powered and operate.
In the first Room d of cold end container a, fluid is constantly sucked out by the first pump j, and a negative pressure is formed in the first Room d,
Fluid is sucked via at the first Room import f, and fluid obtains certain flow and flow rate, is formed fluid column h, is constantly washed away system
The cold end ceramic plane c1 of cold c is done directly heat exchange in ceramic surface c1, and heat is transferred to ceramic surface c1 and passes through refrigeration
Piece c removes heat, and the relatively cold fluid that the first pump j is sucked out flows back into cold end container a, constantly recycles this process, make in container a
Fluid gradually cools down.Corresponding, in second Room e, fluid is constantly sucked out by the second pump k, forms one in second Room e and bears
Pressure, fluid are sucked via at second Room import g, and fluid obtains certain flow and flow rate, are formed fluid column i, are constantly rushed
The hot junction ceramic plane c2 of brush cooling piece c is done directly heat exchange in ceramic surface c2, and the heat that cooling piece c is brought is from ceramic watch
Face c2 is transferred to fluid, and the hotter fluid that pump k is sucked out flows back into hot junction and holds in b devices, constantly recycles this process, make in container b
Fluid gradually heats up.
When semiconductor chilling plate c is powered off, the first pump j, the second pump k be controlled to be stopped and cooling piece c power-off stops work
Make, the movement rate of cold fluid and hot fluid goes to zero, and forms blanketing effect, can slow down in cold end container a and hot junction container b
The heat of fluid is swapped by semiconductor chilling plate c.
Embodiment two
As shown in Fig. 2, to provide a kind of semiconductor chilling plate fluid direct-cooled for second preferred embodiment of the utility model
Device, including semiconductor chilling plate c, semiconductor chilling plate c include a pair of of ceramic plane, i.e. the first ceramic plane c1 and the second ceramic plane
C2, including cold end container a and hot junction container b, semiconductor chilling plate are placed between cold end container a and hot junction container b, the first ceramics
Face c1 is in contact with the cold fluid in cold end container a；Second ceramic plane c2 is in contact with the hot fluid in the container b of hot junction；Partly lead
Body cooling piece c is powered, and the first ceramic plane c1 and the second ceramic plane c2 are constantly come from cold end container a simultaneously with certain
Rushing for the hot fluid with given pace and flow in the container b of hot junction is washed away and come to rate and the cold fluid of flow
Brush so that the hot fluid in the container b of hot junction gradually cools down, and the cold fluid in cold end container a gradually heats up.
When fluid have certain flow and rate, be directly washed into ceramic plane c1, c2 of cooling piece c, can be quick
Exchange simultaneously heat transfer.
A part of the first Room d for forming relative closure of cold end container a and the first ceramic plane contact c1, the first Room d include
First Room import f and the first Room export j1；Cold fluid in cold end container a, which enters from the first Room import f from the first Room, to be exported
J1 is flowed out, is circulated.Further include：First pump j, is set to outside cold end container a；Cold end container a be provided with cold end container into
Mouth j2；First pump j exports f with cold end vessel inlet j2 and the first Room by pipeline and is connected；The stream that f flows out from the outlet of the first Room
Body sends cold end container a back to by the first pump j.First Room import f faces the first ceramic plane c1 so that is pumped out from the first Room import f
Fluid the first ceramic plane c1 is washed away with given pace.
Hot junction container b is a closed space.
In the above process, semiconductor chilling plate c connection positive and negative power supplies, while the first pump j and the second pump k are powered and operate.
In the first Room d of cold end container a, fluid is constantly sucked out by the first pump j, and a negative pressure is formed in the first Room d,
Fluid is sucked via at the first Room import f, and fluid obtains certain flow and flow rate, is formed fluid column h, is constantly washed away system
The cold end ceramic plane c1 of cold c is done directly heat exchange in ceramic surface c1, and heat is transferred to ceramic surface c1 and passes through refrigeration
Piece c removes heat, is done directly heat exchange in ceramic surface c2, the heat that cooling piece c is brought is transferred to stream from ceramic surface c2
Body constantly recycles this process, and the fluid in container b is made gradually to heat up.
When semiconductor chilling plate c is powered off, the first pump j is controlled to be stopped and cooling piece c power-off is stopped, cold fluid
It goes to zero with the movement rate of hot fluid, forms blanketing effect, the heat of fluid in cold end container a and hot junction container b can be slowed down
Amount is swapped by semiconductor chilling plate c.
In the present embodiment, fluid is gas.
Embodiment three
The third preferred embodiment of the utility model provides a kind of direct-cooled device of semiconductor chilling plate fluid, and above-mentioned
Embodiment the difference is that, cold end container a and hot junction container b are open.
The direct-cooled device of fluid of the utility model the advantage is that directly the ceramic surface of cooling piece using fluid itself into
Row heat exchange, intermediate other indirect conduction and transfer process, refrigerating efficiency higher, structure are not simpler.Meanwhile also very
It solves well when system does not work, heat penetrates the problem of cooling piece conduction is lost in.
It the above is only the preferred embodiment of the utility model, it is noted that for those skilled in the art,
Without departing from the principle of this utility model, several improvements and modifications can also be made, these improvements and modifications should also regard
For the scope of protection of the utility model.
Claims (7)
1. a kind of direct-cooled device of semiconductor chilling plate fluid, which is characterized in that including：
Semiconductor chilling plate, semiconductor chilling plate include a pair of opposite ceramic plane, i.e. the first ceramic plane and the second ceramic plane；
Cold end container and hot junction container, semiconductor chilling plate are placed between cold end container and hot junction container, the first ceramic plane with it is cold
Cold fluid in the container of end is in contact；Second ceramic plane is in contact with the hot fluid in the container of hot junction；Cold end container and the first pottery
A part of the first Room for forming relative closure of porcelain facing contact, the first Room include that the first Room import and the first Room export；Cold end
Cold fluid in container, which enters to export from the first Room from the first Room import, to flow out, and circulates；
First pump, is set to cold end external container；Cold end container is provided with cold end vessel inlet；First pump passes through pipeline and cold end
Vessel inlet and the outlet of the first Room are connected；The fluid flowed out from the outlet of the first Room is by the first pumped back cold end container；First Room
Import faces the first ceramic plane so that the fluid pumped out from the first Room import washes away the first ceramic plane with given pace.
2. the direct-cooled device of fluid as claimed in claim 1, which is characterized in that a part of shape that hot junction container is contacted with the second ceramic plane
At the second Room of relative closure, second Room includes second Room import and second Room outlet；Hot fluid in the container of hot junction is from
Two Room imports, which enter to export from second Room, flows out, and circulates.
3. the direct-cooled device of fluid as claimed in claim 2, which is characterized in that further include：Second pump, is set to hot junction external container；
Hot junction container is provided with hot junction vessel inlet；Second pump is connected by pipeline with hot junction vessel inlet and second Room outlet；From
The fluid of second Room outlet outflow is sent back to hot junction container after the second pump.
4. the direct-cooled device of fluid as claimed in claim 3, which is characterized in that second Room import faces the second ceramic plane so that from
The fluid that second Room import pumps out washes away the second ceramic plane with given pace.
5. the direct-cooled device of fluid as claimed in claim 1, which is characterized in that semiconductor chilling plate connects positive and negative power supply.
6. such as the direct-cooled device of fluid of any claim in claim 1-5, which is characterized in that fluid is liquid or gas.
7. the direct-cooled device of fluid as claimed in claim 1, which is characterized in that cold end container and hot junction container are open or close
's.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820311954.8U CN208091010U (en) | 2018-03-07 | 2018-03-07 | A kind of direct-cooled device of semiconductor chilling plate fluid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820311954.8U CN208091010U (en) | 2018-03-07 | 2018-03-07 | A kind of direct-cooled device of semiconductor chilling plate fluid |
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| Publication Number | Publication Date |
|---|---|
| CN208091010U true CN208091010U (en) | 2018-11-13 |
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| CN201820311954.8U Active CN208091010U (en) | 2018-03-07 | 2018-03-07 | A kind of direct-cooled device of semiconductor chilling plate fluid |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108387028A (en) * | 2018-03-07 | 2018-08-10 | 上海滢致节能电器有限公司 | A kind of direct-cooled device of semiconductor chilling plate fluid |
| CN111811190A (en) * | 2020-06-15 | 2020-10-23 | 中国科学院空间应用工程与技术中心 | Semiconductor refrigeration module, space air-cooled heat dissipation device and space equipment |
-
2018
- 2018-03-07 CN CN201820311954.8U patent/CN208091010U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108387028A (en) * | 2018-03-07 | 2018-08-10 | 上海滢致节能电器有限公司 | A kind of direct-cooled device of semiconductor chilling plate fluid |
| CN111811190A (en) * | 2020-06-15 | 2020-10-23 | 中国科学院空间应用工程与技术中心 | Semiconductor refrigeration module, space air-cooled heat dissipation device and space equipment |
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Address after: Jiading District Anting Town, Cao Lian Lu, Shanghai No. 66 building 3 201804 Patentee after: Shanghai artificial energy saving electric appliance Co.,Ltd. Address before: Jiading District Anting Town, Cao Lian Lu, Shanghai No. 66 building 3 201804 Patentee before: ENZNE ENERGY EFFICIENT APPLIANCES Co.,Ltd. |