CN214842696U - High-efficiency cooling back plate device for liquid crystal semiconductor film forming - Google Patents
High-efficiency cooling back plate device for liquid crystal semiconductor film forming Download PDFInfo
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- CN214842696U CN214842696U CN202120639579.1U CN202120639579U CN214842696U CN 214842696 U CN214842696 U CN 214842696U CN 202120639579 U CN202120639579 U CN 202120639579U CN 214842696 U CN214842696 U CN 214842696U
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Abstract
The utility model discloses a high-efficiency cooling back plate device for liquid crystal semiconductor film forming in the technical field of semiconductor production, which comprises a cooling back plate and a cooling box, wherein a target material is arranged above the cooling back plate, the cooling back plate is arranged above the cooling box, the left end surface of the cooling box is fixedly connected with a water inlet pipeline communicated with an inner cavity, the pipe orifice of the water inlet pipeline is fixedly connected with a water inlet flange plate, the right end surface of the cooling box is fixedly connected with a water outlet pipeline communicated with the inner cavity, the pipe orifice of the water outlet pipeline is fixedly connected with a water outlet flange plate, the cooling box comprises a plurality of groups of mounting grooves, each group of mounting grooves comprises a placing plate, each group of placing plates is provided with a permanent magnet, the placing plates are movably connected with the permanent magnets, the permanent magnets are contacted with the cooling back plate, two groups of monitoring chips are arranged in the cooling box, be provided with multiunit vortex mechanism in the cooler bin, the utility model discloses aim at solving the target and meet the problem of high temperature easy damage.
Description
Technical Field
The utility model relates to a semiconductor production technical field specifically is a high efficiency cooling backplate device for liquid crystal semiconductor film forming.
Background
The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, and has applications in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, for example, a diode is a device made of the semiconductor, the importance of the semiconductor is very great from the viewpoint of science and technology or economic development, most electronic products, such as computers, mobile phones or digital recorders, have very close association with the semiconductor, common semiconductor materials include silicon, germanium, gallium arsenide and the like, silicon is the most influential one of various semiconductor material applications, and in the process of forming a liquid crystal semiconductor film, a target is continuously bombarded by high-speed charged energy particles, high temperature is generated, the target is easily damaged, and heat is not led out in time, the sputtering is adversely affected, and the quality of the coating film is affected.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high efficiency cooling backplate device for liquid crystal semiconductor film forming to the target that proposes meets the easy problem of damaging of high temperature in solving above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a high-efficiency cooling back plate device for liquid crystal semiconductor film forming comprises a cooling back plate and a cooling box, wherein a target is arranged above the cooling back plate and is movably connected with the cooling back plate, the cooling back plate is arranged above the cooling box and is movably connected with the cooling box, the left end face of the cooling box is fixedly connected with a water inlet pipeline communicated with an inner cavity, the pipe orifice of the water inlet pipeline is fixedly connected with a water inlet flange, the right end face of the cooling box is fixedly connected with a water outlet pipeline communicated with the inner cavity, the pipe orifice of the water outlet pipeline is fixedly connected with a water outlet flange, the cooling box comprises a plurality of groups of mounting grooves, each group of mounting grooves comprises a placing plate, each group of placing plates is provided with a permanent magnet, the placing plates are movably connected with the permanent magnets, the permanent magnets are in contact with the cooling back plate, and the cooling box is internally provided with two groups of monitoring chips, and a plurality of groups of turbulence mechanisms are arranged in the cooling box.
Preferably, vortex mechanism includes the box, the bottom inner wall fixed connection of box and cooler bin, the inner chamber of box is provided with the motor, motor and box bottom inner wall fixed connection, the motor includes motor shaft, be provided with the movable rod on the box, the movable rod runs through the inner chamber of box to box, the movable rod is connected with the box bearing, be provided with swing joint's shaft coupling between movable rod, the motor shaft, be provided with rabbling mechanism on the movable rod.
Preferably, the cooling back plate comprises a heat conduction layer and a super permalloy layer, the heat conduction layer and the super permalloy layer are arranged at intervals, the super permalloy layer is matched with the permanent magnet in position, a limiting groove is arranged below the super permalloy layer, and the permanent magnet extends into the limiting groove.
Preferably, the stirring mechanism comprises a plurality of groups of connecting sleeves, the connecting sleeves are sleeved on the outer wall of the movable rod and are fixedly connected with the movable rod, and stirring blades are fixedly connected to the end surfaces of the two sides of each group of connecting sleeves.
Preferably, a fixed sleeve is arranged above the coupler, the fixed sleeve is sleeved on the outer wall of the movable rod and is connected with a bearing of the movable rod, fixed rods are fixedly connected to two side ends of the fixed sleeve, and the fixed rods are fixedly connected with the inner wall of the box body.
Preferably, the top inner wall of cooling box evenly is provided with multiunit fin two, fin two and cooling box fixed connection, the inner wall of cooling box evenly is provided with multiunit fin one with permanent magnet position matching department, fin one and cooling box fixed connection.
Preferably, the monitoring chip comprises a temperature monitoring unit and a PLC control unit, and the PLC control unit is electrically connected with the multiple groups of motors.
Compared with the prior art, the beneficial effects of the utility model are that:
1. can effectually with the heat transfer that the striking produced to the cooler bin in through the cooling backplate that sets up, then can effectually carry out the heat transfer, and outlet conduit, the inlet channel that the cooler bin set up can be effectual make things convenient for the continuous leading-in to the cooler bin in of cooling water source, and the water after also can conveniently being heated is derived moreover, then can effectual improvement radiating efficiency.
2. Through the vortex mechanism that sets up, can effectually carry out the disturbance to the water in the cooler bin, then can effectually carry out the disturbance with the cooling water of bottom in the cooler bin, then can effectively improve the efficiency of heat transfer, then can effectual improvement target radiating efficiency, improved the life of target greatly.
3. The monitoring chip can be used for effectively monitoring the water in the cooling box, when the temperature is abnormal, the feedback can be effectively carried out, meanwhile, the flow of the cooling water can be conveniently accelerated, then the heat dissipation effect can be improved, the turbulence mechanism can also be used for carrying out high-power work through the monitoring chip, then the heat exchange effect can be effectively improved, and then the heat dissipation of the target can be effectively facilitated.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the cooling back plate of the present invention;
FIG. 3 is a schematic diagram of the monitoring chip structure of the present invention;
fig. 4 is a schematic structural view of the turbulent flow mechanism of the present invention.
In the figure: 1. a first fin; 2. a second fin; 3. mounting grooves; 4. a target material; 5. a permanent magnet; 6. cooling the back plate; 61. a heat conductive layer; 62. a layer of a super permalloy; 63. a limiting groove; 7. a cooling tank; 8. a water inlet flange plate; 9. a water inlet pipe; 10. monitoring the chip; 101. a temperature monitoring unit; a PLC control unit; 11. placing the plate; 12. a flow disturbing mechanism; 121. a box body; 122. a motor; 1221. a motor shaft; 123. a coupling; 124. fixing the rod; 125. fixing the sleeve; 126. a movable rod; 127. connecting a sleeve; 128. stirring blades; 13. a water outlet flange plate; 14. a water outlet pipeline.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example 1:
referring to fig. 1-4, the present invention provides a technical solution: a high efficiency cooling backplate device for liquid crystal semiconductor film forming, please refer to fig. 1, including cooling backplate 6 and cooling tank 7, the top of cooling backplate 6 is provided with target 4, target 4 and cooling backplate 6 swing joint, through the cooperation between the cooling backplate 6 that sets up and the target 4, can effectually transmit the heat on the target 4, then can effectually make things convenient for target 4 to dispel the heat.
Please refer to fig. 1, the cooling back plate 6 is arranged above the cooling box 7, the cooling back plate 6 is movably connected with the cooling box 7, the cooling box 7 can effectively facilitate the storage of cooling water, and then can effectively exchange heat, and then can effectively facilitate the heat dissipation of the target 4, and then can effectively improve the service life of the target 4.
Please refer to fig. 1, the inlet channel 9 of cooler bin 7 left side terminal surface fixedly connected with inner chamber intercommunication, the mouth of pipe department fixedly connected with water inlet flange 8 of inlet channel 9, the outlet conduit 14 of the right side terminal surface fixedly connected with inner chamber intercommunication of cooler bin 7, the mouth of pipe department fixedly connected with water outlet flange 13 of outlet conduit 14, through inlet channel 9, outlet conduit 14, can effectually conveniently supply water and the drainage, then can effectually make cooling water circulate in the cooler bin 7, then can effectually carry out the heat transfer that lasts.
Referring to fig. 1, the cooling box 7 includes a plurality of sets of mounting grooves 3, each set of mounting grooves 3 includes a placing plate 11, each set of placing plates 11 is provided with a permanent magnet 5, the placing plates 11 are movably connected with the permanent magnets 5, the permanent magnets 5 are in contact with the cooling back plate 6, and the coating work can be conveniently performed through the permanent magnets 5.
Please refer to fig. 1, two sets of monitoring chips 10 are disposed in the cooling box 7, a plurality of sets of turbulence mechanisms 12 are disposed in the cooling box 7, the turbulence mechanisms 12 can effectively disturb the cooling water in the cooling box 7, and then the heat exchange efficiency can be effectively improved, and the monitoring chips 10 can effectively monitor the temperature in the cooling box 7, and can effectively feed back when the temperature in the cooling box 7 is too high.
Referring to fig. 1 and 4, the turbulent flow mechanism 12 includes a box 121, the box 121 is fixedly connected to the inner wall of the bottom end of the cooling box 7, a motor 122 is disposed in the inner cavity of the box 121, the motor 122 is fixedly connected to the inner wall of the bottom end of the box 121, the motor 122 includes a motor shaft 1221, a movable rod 126 is disposed on the box 121, the movable rod 126 penetrates through the box 121 to the inner cavity of the box 121, the movable rod 126 is in bearing connection with the box 121, a movably connected coupler 123 is disposed between the movable rod 126 and the motor shaft 1221, a stirring mechanism is disposed on the movable rod 126, the movable rod 126 can be effectively driven to rotate by the disposed motor 122, and then the stirring mechanism can be effectively driven to rotate, so as to effectively disturb water in the cooling box 7, and then effectively and conveniently mix water with too high temperature with water with too low temperature, and thus effectively improve heat exchange efficiency, and then the radiating efficiency can be effectively improved.
Referring to fig. 1 and 2, the cooling back plate 6 includes a heat conducting layer 61 and a super-permalloy layer 62, the heat conducting layer 61 and the super-permalloy layer 62 are arranged at intervals, the super-permalloy layer 62 is matched with the permanent magnet 5 in position, a limiting groove 63 is arranged below the super-permalloy layer 62, the permanent magnet 5 extends into the limiting groove 63, the arranged super-permalloy layer 62 can effectively conduct magnetism, and then the quality of a coating film can be effectively improved, and the arranged heat conducting layer 61 can effectively transfer heat on the target 4 to the cooling box 7, and then the heat exchange efficiency can be effectively improved.
Please refer to fig. 1 and 4, the stirring mechanism includes a plurality of sets of connection sleeves 127, the connection sleeves 127 are sleeved on the outer wall of the movable rod 126, the connection sleeves 127 are fixedly connected with the movable rod 126, the end surfaces of both sides of each set of connection sleeves 127 are fixedly connected with stirring blades 128, the stirring blades 128 can effectively disturb the water, and then the water with too high temperature and the water with too low temperature can be effectively and conveniently mixed.
Example 2:
as shown in fig. 4, different from the previous embodiment 1, a fixed sleeve 125 is disposed above the coupling 123, the fixed sleeve 125 is sleeved on the outer wall of the movable rod 126, the fixed sleeve 125 is in bearing connection with the movable rod 126, the two side ends of the fixed sleeve 125 are both fixedly connected with fixed rods 124, the fixed rods 124 are fixedly connected with the inner wall of the box 121, and through the cooperation between the fixed rods 124 and the fixed sleeve 125, the stability of the movable rod 126 can be effectively increased, and then the stirring mechanism can be effectively guaranteed to perform stable work.
As shown in fig. 1, the top inner wall of cooling box 7 evenly is provided with two 2, two 2 and 7 fixed connection of fin, the inner wall of cooling box 7 evenly is provided with a multiunit fin 1 with 5 position matching departments of permanent magnet, fin 1 and 7 fixed connection, through the cooperation between fin 1, fin two 2, can effectual increase area of contact, then can effectual improvement heat transfer efficiency.
As shown in fig. 3, the monitoring chip 10 includes a temperature monitoring unit 101, a PLC control unit 102, the PLC control unit 102 is electrically connected to the plurality of sets of motors 122, the temperature monitoring unit 101 through the setting can effectively control the temperature of the water in the cooling box 7, when the temperature is abnormal, the PLC control unit 102 can effectively control the plurality of sets of motors 122 to increase the power to work, and then the efficiency of mixing cold water and hot water can be effectively improved, and then the efficiency of heat exchange can be effectively improved.
Wherein the content of the first and second substances,
the working principle is as follows: before heat dissipation, the water inlet pipe 9 and the water outlet pipe 14 can be effectively connected with an external water supply pipe through the water inlet flange 8 and the water outlet flange 13, when heat dissipation is performed, the water supply pipe supplies cooling water to the cooling box 7, heat can be effectively transferred to the cooling box 7 through the arranged cooling back plate 6, heat can be effectively exchanged through circulating flowing cooling water, heat dissipation can be effectively performed, water with overhigh temperature in the cooling box 7 can be effectively mixed with water with overhigh temperature through the arranged turbulence mechanism 12, heat exchange efficiency can be effectively improved, heat dissipation efficiency can be effectively improved, contact area can be effectively increased through the matching between the arranged first fin 1 and the second fin 2, heat exchange efficiency can be effectively improved, and the arranged monitoring chip 10, when the temperature is abnormal, the PLC control unit 102 can effectively control the motors 122 to increase power to work, so that the cold water and hot water mixing efficiency can be effectively improved, and the heat exchange efficiency can be effectively improved.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. A high efficiency cooling backplate device for liquid crystal semiconductor film forming, including cooling backplate (6) and cooling tank (7), its characterized in that: the target material (4) is arranged above the cooling back plate (6), the target material (4) is movably connected with the cooling back plate (6), the cooling back plate (6) is arranged above the cooling box (7), the cooling back plate (6) is movably connected with the cooling box (7), the left end face of the cooling box (7) is fixedly connected with a water inlet pipeline (9) communicated with an inner cavity, the pipe orifice of the water inlet pipeline (9) is fixedly connected with a water inlet flange plate (8), the right end face of the cooling box (7) is fixedly connected with a water outlet pipeline (14) communicated with the inner cavity, the pipe orifice of the water outlet pipeline (14) is fixedly connected with a water outlet flange plate (13), the cooling box (7) comprises a plurality of groups of mounting grooves (3), each group of mounting grooves (3) comprises a placing plate (11), and each group of placing plates (11) is provided with a permanent magnet (5), the novel cooling device is characterized in that the placing plate (11) is movably connected with the permanent magnet (5), the permanent magnet (5) is in contact with the cooling back plate (6), two groups of monitoring chips (10) are arranged in the cooling box (7), and a plurality of groups of turbulence mechanisms (12) are arranged in the cooling box (7).
2. The high-efficiency cooling back plate device for liquid crystal semiconductor film formation according to claim 1, wherein: turbulence mechanism (12) are including box (121), the bottom inner wall fixed connection of box (121) and cooler bin (7), the inner chamber of box (121) is provided with motor (122), motor (122) and box (121) bottom inner wall fixed connection, motor (122) are including motor shaft (1221), be provided with movable rod (126) on box (121), movable rod (126) run through the inner chamber of box (121) to box (121), movable rod (126) are connected with box (121) bearing, be provided with swing joint's shaft coupling (123) between movable rod (126), motor shaft (1221), be provided with rabbling mechanism on movable rod (126).
3. The high-efficiency cooling back plate device for liquid crystal semiconductor film formation according to claim 1, wherein: the cooling back plate (6) comprises a heat conduction layer (61) and a super permalloy layer (62), the heat conduction layer (61) and the super permalloy layer (62) are arranged at intervals, the super permalloy layer (62) is matched with the permanent magnet (5) in position, a limiting groove (63) is arranged below the super permalloy layer (62), and the permanent magnet (5) extends into the limiting groove (63).
4. The high-efficiency cooling back plate device for liquid crystal semiconductor film formation according to claim 2, wherein: the stirring mechanism comprises a plurality of groups of connecting sleeves (127), the connecting sleeves (127) are sleeved on the outer wall of the movable rod (126), the connecting sleeves (127) are fixedly connected with the movable rod (126), and stirring blades (128) are fixedly connected to the end faces of the two sides of each group of connecting sleeves (127).
5. The high-efficiency cooling back plate device for liquid crystal semiconductor film formation according to claim 2, wherein: the upper portion of shaft coupling (123) is provided with fixed sleeve pipe (125), fixed sleeve pipe (125) cup joint the outer wall at movable rod (126), fixed sleeve pipe (125) are connected with movable rod (126) bearing, the equal fixedly connected with dead lever (124) of both sides end of fixed sleeve pipe (125), dead lever (124) and box (121) inner wall fixed connection.
6. The high-efficiency cooling back plate device for liquid crystal semiconductor film formation according to claim 1, wherein: the top inner wall of cooler bin (7) evenly is provided with multiunit fin two (2), fin two (2) and cooler bin (7) fixed connection, the inner wall of cooler bin (7) evenly is provided with multiunit fin one (1) with permanent magnet (5) position matching department, fin one (1) and cooler bin (7) fixed connection.
7. The high-efficiency cooling back plate device for liquid crystal semiconductor film formation according to claim 2, wherein: the monitoring chip (10) comprises a temperature monitoring unit (101) and a PLC control unit (102), wherein the PLC control unit (102) is electrically connected with a plurality of groups of motors (122).
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| CN202120639579.1U CN214842696U (en) | 2021-03-29 | 2021-03-29 | High-efficiency cooling back plate device for liquid crystal semiconductor film forming |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112985153A (en) * | 2021-03-29 | 2021-06-18 | 京浜乐梦金属科技（苏州）有限公司 | High-efficiency cooling back plate device for liquid crystal semiconductor film forming |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112985153A (en) * | 2021-03-29 | 2021-06-18 | 京浜乐梦金属科技（苏州）有限公司 | High-efficiency cooling back plate device for liquid crystal semiconductor film forming |
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