CN218101225U - Laser processing device for semiconductor wafer - Google Patents

Abstract

The utility model discloses a laser processing device for semiconductor wafers, which comprises a processing frame and a laser processing head, wherein a ball screw capable of moving horizontally is arranged at the inner bottom of the processing frame, the screw of the ball screw is set as a bidirectional screw, and two groups of fixed brackets are assembled on the bidirectional screw through threads, and the fixed brackets are provided with semicircular supporting plates capable of being adjusted in a lifting way through telescopic push rods; the utility model provides a two sets of semicircle layer boards on the two-way lead screw merge into the tray of whole circle under ball screw's drive in the utility model, telescopic rod on two kinds of fixed bolsters sets up to synchronous push rod, then two sets of telescopic rod when synchronous propulsive two sets of semicircle layer boards keep waiting high, can treat the wafer of processing on the tray after the tray that the semicircle layer board merges into the whole circle merges bears, then propulsion drive through the location cylinder then accessible multiunit arc splint from the side fix a position the wafer, this laser beam machining device is applicable in the processing of multiple size wafer, and the suitability is strong.

Description

Laser processing device for semiconductor wafer

Technical Field

The utility model relates to a semiconductor wafer laser beam machining technical field specifically is a laser beam machining device for semiconductor wafer.

Background

The wafer is a silicon wafer used for manufacturing a silicon semiconductor circuit, the raw material of the wafer is silicon, high-purity polycrystalline silicon is doped into a silicon crystal seed crystal after being dissolved and then is slowly pulled out to form cylindrical monocrystalline silicon, and a silicon crystal rod forms a silicon wafer after being ground, polished and sliced; the semiconductor wafer is required to be processed through laser, the sizes of the semiconductor wafer have certain difference in different production requirements, a conventional laser processing device is usually only adapted to the wafer with a single size, and the wafers with different sizes can not be conveniently and quickly adapted and limited so as to be convenient for laser processing.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a laser beam machining device for semiconductor wafer to solve the problem that proposes in the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

the utility model provides a laser beam machining device for semiconductor wafer, includes processing frame and laser beam machining head, but horizontal migration's ball screw is installed to the interior bottom of processing frame, ball screw's lead screw sets up to two-way lead screw and two-way lead screw on the screw thread be equipped with two sets of fixed bolsters, the semicircle layer board that telescopic push rod and liftable were adjusted is installed through telescopic push rod is installed to the interior bottom of fixed bolster, the upper portion of semicircle layer board is provided with two sets of arc splint, rotates through fixed rotating shaft between two sets of arc splint to be connected and fixed rotating shaft connects in the upper surface of semicircle layer board, the location cylinder that is used for promoting arc splint to the inboard is installed to the semicircle layer board, and the bottom fixedly connected with butt joint slot of one of them set of semicircle layer board on two sets of fixed bolsters, the butt joint inserted block that the bottom fixedly connected with of another set of semicircle layer board corresponds with the butt joint slot.

Preferably, the top of processing frame is installed and is adjusted the push rod, adjust the piston rod bottom fixed connection of push rod in the top of mount pad, the laser beam machining head is installed in the bottom of mount pad.

Preferably, two sets of adjusting slide rails are installed at the inner bottom of the processing rack, two ends of the bottom of the ball screw are installed on the processing rack through the two sets of adjusting slide rails respectively, and the adjusting slide rails are set to be slide rails with damping effects.

Preferably, the internally mounted of fixed bolster has the locating lever that is vertical setting, sliding sleeve is equipped with the location slider on the locating lever, the lateral part of semicircle layer board passes through connecting block fixed connection in location slider.

Preferably, the side part of the semicircular supporting plate is fixedly connected with a cylinder base used for installing a positioning cylinder, and the positioning cylinder is a stepping cylinder.

Preferably, the arc splint set up to curved elastic splint, the piston rod fixed connection of location cylinder is on the splint lateral surface of arc splint.

Compared with the prior art, the beneficial effects of the utility model are that:

through adjusting the slide rail, ball screw, the fixed bolster, semicircle layer board and carry out the design of the tight arc splint isotructure of drive clamp through telescopic push rod, two sets of semicircle layer boards on the two-way lead screw merge into the tray of whole circle under ball screw's drive, telescopic push rod on two kinds of fixed bolsters sets up to synchronous push rod, then two sets of telescopic push rod keep equal altitude in two sets of semicircle layer boards in synchronous propulsive, the wafer that processing can be treated on the tray after the tray that the semicircle layer board merges into whole circle merges bears, then propulsion drive through the location cylinder then accessible multiunit arc splint edgewise fix a position the wafer, this laser processing device is applicable in the processing of multiple size wafer, and the suitability is strong.

Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and drawings.

Drawings

FIG. 1 is a schematic view of the present invention;

fig. 2 is a front schematic view of the fixing bracket, the semicircular supporting plate, the arc-shaped clamping plate and other structures of the present invention;

fig. 3 is a schematic top view of the fixing bracket, the semicircular supporting plate, the arc-shaped clamping plate and the like of the present invention;

fig. 4 is a schematic view of the semi-circular supporting plate and the arc-shaped clamping plate according to the present invention shown in fig. 2.

In the figure: 1. processing the frame; 2. a mounting seat; 3. adjusting the push rod; 4. adjusting the slide rail; 5. a ball screw; 6. a laser processing head; 7. fixing a bracket; 8. a telescopic push rod; 9. positioning a rod; 10. a semicircular supporting plate; 11. an arc-shaped splint; 12. positioning the air cylinder; 13. positioning the sliding block; 14. connecting blocks; 15. fixing the rotating shaft; 16. a cylinder base; 17. butting slots; 18. and butting the inserting blocks.

Detailed Description

The same reference numbers in different drawings identify the same or similar elements; it should be further understood that terms such as "first," "second," "third," "upper," "lower," "front," "rear," "inner," "outer," "end," "portion," "section," "width," "thickness," "zone," and the like are used herein only for convenience in reference to the figures and to merely aid in describing the invention, and are not intended to limit the invention.

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides an embodiment:

the utility model provides a laser beam machining device for semiconductor wafer, is including processing frame 1 and laser beam machining head 6, but horizontal migration's ball screw 5 is installed to the interior bottom of processing frame 1, the lead screw of ball screw 5 sets up to two-way lead screw and two-way lead screw upper thread and is equipped with two sets of fixed bolster 7, telescopic rod 8 is installed and the semicircle layer board 10 of liftable regulation is installed through telescopic rod 8 to the interior bottom of fixed bolster 7, the upper portion of semicircle layer board 10 is provided with two sets of arc splint 11, rotates through fixed rotating shaft 15 between two sets of arc splint 11 and connects and fixed rotating shaft 15 connects in the upper surface of semicircle layer board 10, semicircle layer board 10 installs the location cylinder 12 that is used for promoting arc splint 11 to the inboard, and one of them bottom fixedly connected with of a set of semicircle layer board 10 docks slot 17 on two sets of fixed bolster 7, and the butt joint inserted block 18 that the bottom fixedly connected with of another set of semicircle layer board 10 corresponds with butt joint slot 17.

The top of the processing rack 1 is provided with an adjusting push rod 3, the bottom of a piston rod of the adjusting push rod 3 is fixedly connected to the top of the mounting seat 2, and the laser processing head 6 is arranged at the bottom of the mounting seat 2; two groups of adjusting slide rails 4 are mounted at the inner bottom of the processing rack 1, two ends of the bottom of the ball screw 5 are respectively mounted on the processing rack 1 through the two groups of adjusting slide rails 4, and the adjusting slide rails 4 are slide rails with a damping effect;

specifically, as shown in fig. 1, the mounting base 2 is composed of an electric slide rail in the X-axis direction and an electric slide rail in the Y-axis direction, so that when the laser processing head 6 is mounted at the bottom of the mounting base 2, the laser processing head 6 can be finely adjusted in the XY-axis direction to a certain extent, further, the adjusting push rod 3, the ball screw 5 and the driving motor of the positioning cylinder 12 are all adaptively adjusted, the control precision is high, and damage to the wafer during clamping and limiting due to excessive clamping force in the actual use process is prevented;

a positioning rod 9 which is vertically arranged is installed inside the fixed support 7, a positioning slide block 13 is slidably sleeved on the positioning rod 9, and the side part of the semicircular supporting plate 10 is fixedly connected to the positioning slide block 13 through a connecting block 14; the side part of the semicircular supporting plate 10 is fixedly connected with a cylinder base 16 for installing a positioning cylinder 12, and the positioning cylinder 12 is a stepping cylinder; the arc-shaped clamping plate 11 is an arc-shaped elastic clamping plate, and a piston rod of the positioning cylinder 12 is fixedly connected to the outer side surface of the arc-shaped clamping plate 11; actually carry out laser beam machining to the wafer and add man-hour, through adjusting slide rail 4, ball screw 5, fixed bolster 7, semicircle layer board 10 and carry out the design of the tight arc splint 11 isotructure of drive clamp through telescopic push rod 8, two sets of semicircle layer boards 10 on the two-way lead screw merge into the tray of whole circle under ball screw 5's drive, telescopic push rod 8 on two kinds of fixed bolster 7 sets up to synchronous push rod, then two sets of telescopic push rod 8 keep equal altitude in two sets of semicircle layer boards 10 when synchronous propulsion, can treat the wafer of processing on the tray after semicircle layer board 10 merges into the tray of whole circle and bear, then propulsion drive through location cylinder 12 is then accessible multiunit arc splint 11 edgeways fixes a position the wafer, the applicable processing in multiple size wafer of this laser beam machining device, the suitability is strong.

The control mode of the present application document is automatically controlled by a controller, and the control circuit of the controller can be realized by simple programming of a person skilled in the art, which belongs to the common knowledge in the field, and the present application document is mainly used for protecting a mechanical device, so the present application document does not explain the control mode and the circuit connection in detail, and the device supplies power by an internal power supply or an external power supply.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. A laser processing device for semiconductor wafers, comprising a processing frame (1) and a laser processing head (6), characterized in that: but horizontal migration's ball screw (5) are installed to the interior bottom of processing frame (1), the lead screw of ball screw (5) sets up to two-way lead screw and two-way lead screw on the screw thread be equipped with two sets of fixed bolster (7), telescopic rod (8) are installed and semicircle layer board (10) of liftable regulation are installed through telescopic rod (8) to the interior bottom of fixed bolster (7), the upper portion of semicircle layer board (10) is provided with two sets of arc splint (11), rotates through fixed rotating shaft (15) between two sets of arc splint (11) and connects and fixed rotating shaft (15) connect in the upper surface of semicircle layer board (10), semicircle layer board (10) are installed and are used for promoting location cylinder (12) of arc splint (11) to the inboard, and wherein the bottom fixedly connected with butt joint slot (17) of a set of semicircle layer board (10) on two sets of fixed bolster (7), and butt joint inserted block (18) that the bottom fixedly connected with of another set of semicircle layer board (10) correspond with butt joint slot (17).

2. A laser processing apparatus for semiconductor wafers as claimed in claim 1, wherein: adjusting push rod (3) are installed at the top of processing frame (1), the piston rod bottom fixed connection of adjusting push rod (3) is in the top of mount pad (2), laser processing head (6) are installed in the bottom of mount pad (2).

3. A laser processing apparatus for semiconductor wafers as claimed in claim 2, characterized in that: two sets of regulation slide rails (4) are installed to the interior bottom of processing frame (1), install on processing frame (1) through two sets of regulation slide rails (4) respectively at the bottom both ends of ball screw (5), adjust slide rail (4) and set up the slide rail that sets up to have the damping effect.

4. A laser processing apparatus for semiconductor wafers as claimed in claim 1, wherein: the internally mounted of fixed bolster (7) has locating lever (9) that is vertical setting, sliding sleeve is equipped with location slider (13) on locating lever (9), the lateral part of semicircle layer board (10) passes through connecting block (14) fixed connection in location slider (13).

5. A laser processing apparatus for semiconductor wafers as claimed in claim 1, wherein: the side part of the semicircular supporting plate (10) is fixedly connected with a cylinder base (16) used for installing a positioning cylinder (12), and the positioning cylinder (12) is a stepping cylinder.

6. A laser processing apparatus for semiconductor wafers as claimed in claim 1, characterized in that: arc splint (11) set up to curved elastic splint, the piston rod fixed connection of location cylinder (12) is on the splint lateral surface of arc splint (11).

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