CN213601854U - Fixing device for semiconductor wafer processing - Google Patents
Fixing device for semiconductor wafer processing Download PDFInfo
- Publication number
- CN213601854U CN213601854U CN202023203814.5U CN202023203814U CN213601854U CN 213601854 U CN213601854 U CN 213601854U CN 202023203814 U CN202023203814 U CN 202023203814U CN 213601854 U CN213601854 U CN 213601854U
- Authority
- CN
- China
- Prior art keywords
- fixed
- semiconductor wafer
- limiting
- frame
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a fixing device is used in processing of semiconductor wafer, including support frame, driving motor, control panel, loading board and first support, driving motor is installed to one side of support frame bottom, and one side on support frame top is fixed with the support round platform, and the support frame top of supporting round platform one side rotates and installs and rotate the main shaft, one side of rotating the main shaft top is fixed with the carousel, and the both sides of carousel bottom all install the gyro wheel, the bottom of gyro wheel and the top of supporting the round platform contact each other, one side on carousel top is fixed with the loading board, and the both sides on loading board top all are fixed with first support to the plummer is installed to one side on first support top. The utility model discloses not only effective hoisting device's work application scope improves the processingquality of device, still hoisting device's work piece machining efficiency.
Description
Technical Field
The utility model relates to a semiconductor wafer processing technology field specifically is a fixing device is used in semiconductor wafer processing.
Background
The semiconductor wafer refers to a silicon wafer used for manufacturing a silicon semiconductor circuit, the raw material of the silicon wafer is silicon, the main processing modes of the wafer are sheet processing and batch processing, i.e. 1 or more wafers are processed simultaneously, and the semiconductor wafer needs to be fixed in the processing process to prevent the wafer from shifting.
The fixing device for processing the semiconductor wafer on the market is various in types, can basically meet the use requirements of people, but still has certain defects, and has the following specific problems.
(1) The conventional fixing device for processing the semiconductor wafer is difficult to be suitable for semiconductor wafers of various specifications in the using process, so that the working application range of the device is reduced;
(2) the existing fixing device for processing the semiconductor wafer is easy to damage a semiconductor wafer workpiece due to high fixing strength in the using process, so that the processing quality of the semiconductor wafer is reduced;
(3) the position of the conventional fixing device for processing the semiconductor wafer is relatively determined after the fixing work of the semiconductor wafer workpiece is finished, and at the moment, when different positions of the semiconductor wafer workpiece are processed, the position of the workpiece can only be readjusted, so that time and labor are wasted in the operation process, and the processing efficiency of the semiconductor wafer is reduced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a fixing device is used in semiconductor wafer processing to the work application scope who provides the device among the above-mentioned background art is limited, processingquality is lower and the problem that machining efficiency is low.
In order to achieve the above object, the utility model provides a following technical scheme: a fixing device for processing a semiconductor wafer comprises a supporting frame, a driving motor, a control panel, a bearing plate and a first bracket, a driving motor is arranged at one side of the bottom of the supporting frame, a supporting round table is fixed at one side of the top end of the supporting frame, a rotating main shaft is rotatably arranged at the top end of the supporting frame at one side of the supporting round platform, a turntable is fixed at one side of the top end of the rotating main shaft, and both sides of the bottom end of the turntable are provided with rollers, the bottom ends of the rollers are contacted with the top end of the supporting round platform, a bearing plate is fixed on one side of the top end of the rotary table, first brackets are fixed on both sides of the top end of the bearing plate, and one side of the top end of the first bracket is provided with a bearing platform, one side of the top end of the bearing plate is provided with a second limiting plate, and a control panel is installed on one side of the surface of the supporting circular truncated cone, and the output end of a singlechip in the control panel is electrically connected with the input end of a driving motor.
Preferably, the output end of the driving motor is provided with a driving rotating shaft through a coupler, and a first synchronizing gear is fixed on one side of the top end of the driving rotating shaft.
Preferably, a second synchronizing gear is fixed to one side of the surface of the rotating main shaft, and the second synchronizing gear is meshed with the first synchronizing gear.
Preferably, both sides on loading board top all are fixed with spacing track, and one side slidable mounting on spacing track top has spacing slider to one side on spacing slider top is fixed with first limiting plate, be provided with stop gear on the inner wall of first limiting plate one side.
Preferably, the limiting mechanism is internally provided with a fixing frame, a first air cylinder, a fixing block, a limiting frame, a guide arm, a limiting spring, a sliding plate, a connecting arm and a clamping block in sequence, and the fixing frame is fixed on the inner wall of one side of the first limiting plate.
Preferably, the fixed block is fixed to one end, away from the first limiting plate, of the fixed frame, and the first cylinder is installed on one side of the top end of the fixed block.
Preferably, a limiting frame is fixed on one side of the bottom end of the first cylinder, guide arms are fixed on two sides of the top of the limiting frame, and a limiting spring is wound on one side of the surface of each guide arm.
Preferably, a sliding plate is slidably mounted on one side of the surface of the guide arm, a connecting arm is fixed on one side of the bottom end of the sliding plate, the bottom end of the connecting arm extends to the outside of the limiting frame, and a clamping block is fixed on one side of the bottom end of the connecting arm.
Preferably, a second cylinder is installed on the inner wall of one side of the first support, and one end of the second cylinder is fixedly connected with one end of the first limiting plate.
Compared with the prior art, the beneficial effects of the utility model are that: the fixing device for processing the semiconductor wafer not only effectively improves the working application range of the device, improves the processing quality of the device, but also improves the workpiece processing efficiency of the device;
(1) the semiconductor wafer workpiece is placed at the top end of the bearing table through the second air cylinder and the first limiting plate, then the second air cylinder is controlled by the control panel to work, the first limiting plate is pulled to move rightwards, the first limiting plate drives the limiting sliding block to slide on the surface of the limiting rail at the moment, namely the first limiting plate drives the limiting mechanism to move rightwards, and the second limiting plate is operated to move leftwards in a similar manner, so that the semiconductor wafer workpiece is fixed by the two groups of limiting mechanisms, the device can fix the semiconductor wafer workpieces with different specifications, and the working application range of the device is effectively enlarged;
(2) the clamping block and the sliding plate are arranged, the first air cylinder is controlled to work through the control panel, the first air cylinder pushes the limiting frame and the clamping block to move downwards, so that the lower surface of the clamping block is in contact with the upper surface of the semiconductor wafer workpiece, the first air cylinder gradually pushes the clamping block to move downwards at the moment, the clamping block can drive the connecting arm and the sliding plate to move upwards, the guide arm plays a role in limiting and supporting the sliding of the sliding plate, and the limiting spring is in a compressed state at the moment, so that the semiconductor wafer workpiece is prevented from being damaged due to overlarge pressure of the first air cylinder, and the processing quality of the device is improved;
(3) through being provided with drive pivot and carousel, when needing to add man-hour to the different positions of the semiconductor wafer work piece of centre gripping, accessible control panel operation driving motor carries out work, make it drive the drive pivot in proper order, first synchronous gear rotates, because first synchronous gear and second synchronous gear intermeshing, then second synchronous gear drives the rotation main shaft and rotates, the rotation main shaft drives the top rotation of carousel at the support round platform, the gyro wheel can play the effect of support to the carousel, bearing board and the semiconductor wafer work piece on carousel top can rotate, thereby adjust its machined position, save the position of frequent adjustment work piece, the work piece machining efficiency of hoisting device.
Drawings
Fig. 1 is a schematic view of the structure of the present invention;
fig. 2 is a schematic view of the front view cross-sectional structure of the present invention;
FIG. 3 is a schematic structural view of the limiting mechanism of the present invention;
fig. 4 is a schematic side view of the first limiting plate of the present invention;
fig. 5 is a schematic top view of the first synchronous gear of the present invention;
in the figure: 1. a support frame; 2. a drive motor; 3. a control panel; 4. a supporting circular table; 5. rotating the main shaft; 6. a roller; 7. a turntable; 8. a carrier plate; 9. a limiting mechanism; 901. a fixed mount; 902. a first cylinder; 903. a fixed block; 904. a limiting frame; 905. a guide arm; 906. a limiting spring; 907. a sliding plate; 908. a connecting arm; 909. a clamping block; 10. a first bracket; 11. a bearing table; 12. driving the rotating shaft; 13. a first synchronizing gear; 14. a second synchronizing gear; 15. a second limiting plate; 16. a limiting track; 17. a limiting slide block; 18. a first limit plate; 19. a second cylinder.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-5, the present invention provides an embodiment: a fixing device for processing a semiconductor wafer comprises a support frame 1, a driving motor 2, a control panel 3, a bearing plate 8 and a first support 10, wherein the driving motor 2 is installed on one side of the bottom of the support frame 1, the type of the driving motor 2 can be Y90S-2, a supporting circular truncated cone 4 is fixed on one side of the top end of the support frame 1, a rotating main shaft 5 is rotatably installed at the top end of the support frame 1 on one side of the supporting circular truncated cone 4, a rotary table 7 is fixed on one side of the top end of the rotating main shaft 5, rollers 6 are installed on two sides of the bottom end of the rotary table 7, the bottom end of each roller 6 is in contact with the top end of the supporting circular truncated cone 4, the bearing plate 8 is fixed on one side of the top end of the rotary table 7, the first support 10 is fixed on two sides of the top end of the bearing plate 8;
both sides of the top end of the bearing plate 8 are fixed with limiting rails 16, a limiting slide block 17 is slidably mounted on one side of the top end of the limiting rail 16, and a first limiting plate 18 is fixed on one side of the top end of the limiting slide block 17;
a second cylinder 19 is installed on the inner wall of one side of the first support 10, the type of the second cylinder 19 can be SC50X20, and one end of the second cylinder 19 is fixedly connected with one end of the first limit plate 18;
placing the semiconductor wafer workpiece on the top end of the bearing table 11, then controlling the second air cylinder 19 to work through the control panel 3, so that the first limiting plate 18 is pulled to move rightwards, at the moment, the first limiting plate 18 drives the limiting slide block 17 to slide on the surface of the limiting track 16, namely, the first limiting plate 18 drives the limiting mechanism 9 to move rightwards, and similarly, the second limiting plate 15 is operated to move leftwards, so that the semiconductor wafer workpiece is fixed by using the two groups of limiting mechanisms 9, the device can fix the semiconductor wafer workpieces with different specifications, and the working application range of the device is effectively improved;
the inner wall of one side of the first limit plate 18 is provided with a limit mechanism 9;
a fixed frame 901, a first cylinder 902, a fixed block 903, a limiting frame 904, a guide arm 905, a limiting spring 906, a sliding plate 907, a connecting arm 908 and a clamping block 909 are sequentially arranged in the limiting mechanism 9, the fixed frame 901 is fixed on the inner wall of one side of the first limiting plate 18, the fixed block 903 is fixed at one end, away from the first limiting plate 18, of the fixed frame 901, the first cylinder 902 is installed on one side of the top end of the fixed block 903, and the type of the first cylinder 902 can be SC50X 10;
a limiting frame 904 is fixed on one side of the bottom end of the first air cylinder 902, guide arms 905 are fixed on two sides of the top of the limiting frame 904, a limiting spring 906 is wound on one side of the surface of each guide arm 905, a sliding plate 907 is slidably mounted on one side of the surface of each guide arm 905, a connecting arm 908 is fixed on one side of the bottom end of each sliding plate 907, the bottom end of each connecting arm 908 extends to the outside of the limiting frame 904, and a clamping block 909 is fixed on one side of the bottom end of each connecting arm 908;
the first air cylinder 902 is controlled by the control panel 3 to work, so that the first air cylinder pushes the limit frame 904 and the clamping block 909 to move downwards, the lower surface of the clamping block 909 is contacted with the upper surface of the semiconductor wafer workpiece, at the moment, the first air cylinder 902 pushes the clamping block 909 to move downwards gradually, the clamping block 909 can drive the connecting arm 908 and the sliding plate 907 to move upwards, the guide arm 905 plays a role in limiting and supporting the sliding of the sliding plate 907, and at the moment, the limit spring 906 is in a compressed state, so that the semiconductor wafer workpiece is prevented from being damaged due to overlarge pressure of the first air cylinder 902, and the processing quality of the device is improved;
the output end of the driving motor 2 is provided with a driving rotating shaft 12 through a coupler, and a first synchronous gear 13 is fixed on one side of the top end of the driving rotating shaft 12;
a second synchronous gear 14 is fixed on one side of the surface of the rotating main shaft 5, and the second synchronous gear 14 is meshed with the first synchronous gear 13;
when different positions of a clamped semiconductor wafer workpiece need to be processed, the driving motor 2 can be operated to work through the control panel 3, so that the driving motor sequentially drives the driving rotating shaft 12 and the first synchronous gear 13 to rotate, because the first synchronous gear 13 and the second synchronous gear 14 are meshed with each other, the second synchronous gear 14 drives the rotating main shaft 5 to rotate, the rotating main shaft 5 drives the turntable 7 to rotate at the top end of the supporting circular table 4, the roller 6 can support the turntable 7, namely, the bearing plate 8 at the top end of the turntable 7 and the semiconductor wafer workpiece can rotate, so that the processing position of the workpiece can be adjusted, the position of the workpiece can be frequently adjusted, and the workpiece processing efficiency of the device can be improved;
the control panel 3 is installed on one side of the surface of the supporting circular truncated cone 4, the type of the control panel 3 can be AT89S51, and the output end of the single chip microcomputer in the control panel 3 is electrically connected with the input ends of the driving motor 2, the first air cylinder 902 and the second air cylinder 19 respectively.
The working principle is as follows: when the device is used, a semiconductor wafer workpiece is firstly placed at the top end of the bearing table 11, then the second cylinder 19 is controlled to work through the control panel 3, so that the first limiting plate 18 is pulled to move rightwards, at the moment, the first limiting plate 18 drives the limiting slide block 17 to slide on the surface of the limiting track 16, namely, the first limiting plate 18 drives the limiting mechanism 9 to move rightwards, the second limiting plate 15 is operated to move leftwards in the same way, so that the semiconductor wafer workpiece is fixed by using the two groups of limiting mechanisms 9, the device can fix semiconductor wafer workpieces with different specifications, the working application range of the device is effectively improved, then the first cylinder 902 is controlled to work through the control panel 3, the first cylinder 902 pushes the limiting frame 904 and the clamping block 909 to move downwards, so that the lower surface of the clamping block 909 is in contact with the upper surface 902 of the semiconductor wafer workpiece, at the moment, the first cylinder, the connecting arm 908 and the sliding plate 907 can be driven by the clamping block 909 to move upwards, the guide arm 905 plays a role in limiting and supporting the sliding of the sliding plate 907, and the limiting spring 906 is in a compressed state, so that damage to the semiconductor wafer workpiece caused by excessive pressure of the first cylinder 902 is avoided, the processing quality of the device is improved, when different positions of the clamped semiconductor wafer workpiece need to be processed, the driving motor 2 can be operated by the control panel 3 to work, so that the driving motor sequentially drives the driving rotating shaft 12 and the first synchronous gear 13 to rotate, because the first synchronous gear 13 and the second synchronous gear 14 are meshed with each other, the second synchronous gear 14 drives the rotating main shaft 5 to rotate, the rotating main shaft 5 drives the rotating disc 7 to rotate at the top end of the supporting circular table 4, the roller 6 can play a role in supporting the rotating disc 7, namely, the bearing plate 8 at the top end of the rotating disc 7 and the semiconductor wafer workpiece, therefore, the machining position of the device is adjusted, the position of the workpiece is not frequently adjusted, and the workpiece machining efficiency of the device is improved.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (9)
1. The utility model provides a fixing device is used in semiconductor wafer processing, includes support frame (1), driving motor (2), control panel (3), loading board (8) and first support (10), its characterized in that: the improved bearing device is characterized in that a driving motor (2) is installed on one side of the bottom of the support frame (1), a supporting circular truncated cone (4) is fixed on one side of the top of the support frame (1), a rotating main shaft (5) is installed on the top of the support frame (1) on one side of the supporting circular truncated cone (4) in a rotating mode, a turntable (7) is fixed on one side of the top of the rotating main shaft (5), rollers (6) are installed on two sides of the bottom of the turntable (7), the bottom of each roller (6) is in contact with the top of the supporting circular truncated cone (4), a bearing plate (8) is fixed on one side of the top of the turntable (7), first supports (10) are fixed on two sides of the top of the bearing plate (8), a bearing table (11) is installed on one side of the top of the first support (10), a second limiting plate (15) is arranged on one, the output end of the singlechip in the control panel (3) is electrically connected with the input end of the driving motor (2).
2. The fixture for semiconductor wafer processing as set forth in claim 1, wherein: the output end of the driving motor (2) is provided with a driving rotating shaft (12) through a coupler, and one side of the top end of the driving rotating shaft (12) is fixed with a first synchronizing gear (13).
3. The mounting apparatus of claim 2, wherein: and a second synchronizing gear (14) is fixed on one side of the surface of the rotating main shaft (5), and the second synchronizing gear (14) is meshed with the first synchronizing gear (13).
4. The fixture for semiconductor wafer processing as set forth in claim 1, wherein: both sides on loading board (8) top all are fixed with spacing track (16), and one side slidable mounting on spacing track (16) top has spacing slider (17) to one side on spacing slider (17) top is fixed with first limiting plate (18), be provided with stop gear (9) on the inner wall of first limiting plate (18) one side.
5. The mounting apparatus of claim 4, wherein: the inner part of the limiting mechanism (9) is sequentially provided with a fixing frame (901), a first air cylinder (902), a fixing block (903), a limiting frame (904), a guide arm (905), a limiting spring (906), a sliding plate (907), a connecting arm (908) and a clamping block (909), and the fixing frame (901) is fixed on the inner wall of one side of the first limiting plate (18).
6. The fixture for semiconductor wafer processing as set forth in claim 5, wherein: one end, far away from first limiting plate (18), of mount (901) is fixed with fixed block (903), and first cylinder (902) are installed to one side on fixed block (903) top.
7. The fixture for semiconductor wafer processing as set forth in claim 6, wherein: one side of first cylinder (902) bottom is fixed with spacing frame (904), and the both sides at spacing frame (904) top all are fixed with guide arm (905), and the winding of one side on guide arm (905) surface has spacing spring (906).
8. The fixture for semiconductor wafer processing as set forth in claim 7, wherein: a sliding plate (907) is slidably mounted on one side of the surface of the guide arm (905), a connecting arm (908) is fixed to one side of the bottom end of the sliding plate (907), the bottom end of the connecting arm (908) extends to the outside of the limiting frame (904), and a clamping block (909) is fixed to one side of the bottom end of the connecting arm (908).
9. The mounting apparatus of claim 4, wherein: and a second cylinder (19) is installed on the inner wall of one side of the first support (10), and one end of the second cylinder (19) is fixedly connected with one end of the first limiting plate (18).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023203814.5U CN213601854U (en) | 2020-12-25 | 2020-12-25 | Fixing device for semiconductor wafer processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023203814.5U CN213601854U (en) | 2020-12-25 | 2020-12-25 | Fixing device for semiconductor wafer processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213601854U true CN213601854U (en) | 2021-07-02 |
Family
ID=76598411
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023203814.5U Active CN213601854U (en) | 2020-12-25 | 2020-12-25 | Fixing device for semiconductor wafer processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213601854U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113524958A (en) * | 2021-07-27 | 2021-10-22 | 苏州东方模具科技股份有限公司 | Be applied to glyptic automation equipment of glass mold inner chamber |
| CN115483151A (en) * | 2022-08-01 | 2022-12-16 | 江苏卓玉智能科技有限公司 | Fixing device for semiconductor wafer processing |
-
2020
- 2020-12-25 CN CN202023203814.5U patent/CN213601854U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113524958A (en) * | 2021-07-27 | 2021-10-22 | 苏州东方模具科技股份有限公司 | Be applied to glyptic automation equipment of glass mold inner chamber |
| CN113524958B (en) * | 2021-07-27 | 2024-04-02 | 苏州东方模具科技股份有限公司 | Be applied to carved automation equipment of glass mould inner chamber |
| CN115483151A (en) * | 2022-08-01 | 2022-12-16 | 江苏卓玉智能科技有限公司 | Fixing device for semiconductor wafer processing |
| CN115483151B (en) * | 2022-08-01 | 2023-12-26 | 江苏卓玉智能科技有限公司 | Fixing device for semiconductor wafer processing |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN213601854U (en) | Fixing device for semiconductor wafer processing | |
| CN209097752U (en) | A kind of transmission control equipment for glass processing | |
| CN217072146U (en) | Gear is anchor clamps for part | |
| CN112108981A (en) | Full-automatic surface polishing equipment for plate processing and operation method thereof | |
| CN216464174U (en) | PCB board positioner | |
| CN218110436U (en) | Rotary clamp for finish machining of acrylic plate | |
| CN217575295U (en) | Steel frame transfer device for offshore platform construction | |
| CN219075114U (en) | Grinding mechanism for cylinder production | |
| CN218312752U (en) | Double-sided polishing device for mechanical part production | |
| CN219906511U (en) | Aramid fiber rope winding equipment | |
| CN220947110U (en) | Rotary disc type photovoltaic cell screen printing equipment | |
| CN217143404U (en) | A chamfer device for inferior gram force panel | |
| CN215036256U (en) | Ceramic block grinding machine for processing ceramic brush roll | |
| CN213917112U (en) | Machining clamping device of numerical control drilling and tapping machine | |
| CN216921263U (en) | Supporting platform for building construction | |
| CN212100933U (en) | Lens arrangement machine | |
| CN220094062U (en) | Metal edging positioning device | |
| CN218081422U (en) | Conveying equipment of double-sided milling machine | |
| CN217371407U (en) | Workpiece clamping device of numerical control drilling machine for printed circuit board | |
| CN214692676U (en) | Accurate transfer device of drum | |
| CN218614446U (en) | Cutting device | |
| CN219255059U (en) | PCB circuit board edge grinding device | |
| CN219925623U (en) | Surface polishing device for star wheel | |
| CN218927747U (en) | Automobile part overturning tool capable of realizing position adjustment | |
| CN117059552B (en) | Wafer pad pasting fixed station |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |