CN218069893U

CN218069893U - Mini LED small-sized element pad

Info

Publication number: CN218069893U
Application number: CN202222392186.2U
Authority: CN
Inventors: 肖安
Original assignee: Suzhou Yingan Electronic Technology Co ltd
Current assignee: Suzhou Yingan Electronic Technology Co ltd
Priority date: 2022-09-08
Filing date: 2022-09-08
Publication date: 2022-12-16
Anticipated expiration: 2032-09-08

Abstract

The utility model discloses a mini LED small-size component pad, including pad structure main part, its characterized in that: the upper surface of the pad structure main body is used for mounting LED parts, a lead is connected to the outer side of the pad structure main body, and one end of the lead is electrically connected with an electrode; in this miniature LED small-size component pad, respectively increase three leads at pad structure main part both ends, the lead wire is thinner, the pad length and width is great, keep great size difference, when can guaranteeing the reflow soldering operation, the tin cream is drawn the part to the correct position through surface tension effect, make the component position after the printed board surface welding less with theoretical value's deviation, promote the accuracy, the setting of three leads, can increase the gripping power of pad structure main part foot, guarantee again that three leads can provide sufficient push-and-pull power behind the reflow soldering operation, the part welding is more stable.

Description

Mini LED small-sized element pad

Technical Field

The utility model relates to a relevant technical field of pad specifically is a mini LED small-size component pad.

Background

The reflow soldering process is an important soldering process in the processing and manufacturing process of the PCB, the soldering pad is a basic constituent unit of surface mount assembly and is one of important indispensable units in the soldering process, and the soldering pad is an indispensable part in the processing and production of the circuit board of the LED or SMD element.

But the pad structure of LED that uses at present, the part if squints easily, and soldering tin operation can't provide enough pulling force for the part is difficult to resume normal position, thereby increases and produces defective products probability, and foot's gripping dynamics is not enough, bears the push-and-pull dynamics little, falls the piece easily when slight collision or buckle.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a mini LED small-size component pad to solve the pad structure of the LED of the present use that proposes in the above-mentioned background art, the part if squints easily, and the soldering tin operation can't provide sufficient pulling force, makes the part be difficult to the normal position that resumes, thereby increases and produces defective products probability, and foot's gripping dynamics is not enough, bears the push-and-pull dynamics for a short time, falls the piece easily when slight collision or buckle. .

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a mini LED small-size component pad, includes pad structure main body, its characterized in that: the upper surface of the pad structure main body is used for mounting LED parts, a lead is connected to the outer side of the pad structure main body, and one end of the lead is electrically connected with an electrode.

Preferably, three groups of leads and three groups of bonding pads are arranged between the leads and the bonding pad structure main body, wherein the leads and the bonding pads are manufactured by the same manufacturing process of the printed circuit board, and the leads are arranged on the surface of the bonding pad structure main body.

Preferably, the lead width is one quarter to two thirds of the width of the body of the pad structure, with a significant width difference.

Preferably, the lead is electrically connected with the electrode.

Compared with the prior art, the beneficial effects of the utility model are that:

this mini LED small-size component pad, respectively increase three leads at pad structure main part both ends, the lead wire is thinner, the pad length and width is great, keep great size difference, when can guaranteeing the reflow soldering operation, the solder paste is drawn the part to the correct position through surface tension effect, make the component less with the deviation of theoretical value in flexible printed board surface (or other printed board surface) postwelding position, promote the accuracy, the setting of three lead wires, can increase the gripping power of pad structure main part foot, guarantee again that three lead wires can provide sufficient push-and-pull force behind the reflow soldering operation, the part welding is more stable.

Drawings

FIG. 1 is a schematic view of the main structure of the pad structure of the present invention;

fig. 2 is a schematic diagram of the pad structure main body and the LED part (or other SMD parts) assembly structure of the present invention.

In the figure: 1. a pad structure body; 2. a lead; 3. and an electrode.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-2, the present invention provides a technical solution: a mini LED small component pad comprises a pad structure main body 1, wherein the upper surface of the pad structure main body 1 is used for mounting LED parts, the outer side of the pad structure main body 1 is connected with a lead 2, one end of the lead 2 is electrically connected with an electrode 3, the pad structure main body 1 and the lead 2 are integrated, and the mini LED small component pad is manufactured through an etching process;

three groups of leads 2 are arranged on the surface of the pad structure main body 1, so that the gripping force of the foot part of the pad structure main body 1 can be increased, the three leads 2 can provide enough push-pull force after reflow soldering operation, and parts are more stably welded;

the width of the lead 2 is one fourth to two thirds of the width of the pad structure main body 1, and the lead 2 has obvious width difference, is thin, has larger length and width of the pad, keeps larger size difference, and can ensure that a part is pulled to a correct position by solder paste under the action of surface tension during reflow soldering operation, so that the deviation between the position of an element welded on the surface of a flexible printed board or other printed boards and a theoretical value is smaller, and the accuracy is improved;

the lead 2 is electrically connected with the electrode 3, and the electrode 3 is respectively connected with the anode and the cathode.

The working principle is as follows: firstly, copper raw materials are coated on a printed circuit board, a flexible printed board is printed with tin paste, parts are pasted on the flexible printed board, then the flexible printed board is welded through a reflow oven, ink or a covering film is coated on a position outside the welding, after the tin paste is printed, three leads 2 are respectively added at two ends of a pad structure main body 1, namely, when reflow soldering operation is guaranteed, the tin paste has enough force to pull the deviated parts back to normal positions, and the three leads 2 can provide enough push-pull force after the reflow soldering operation, so that LED parts or other SMD parts are welded more stably, and the use process of the whole mini LED small-sized element pad is completed.

Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A mini LED small component pad comprises a pad structure body (1), and is characterized in that: the upper surface of the pad structure main body (1) is used for mounting LED parts, the outer side of the pad structure main body (1) is connected with a lead (2), and one end of the lead (2) is electrically connected with an electrode (3).

2. A mini LED micro component pad as recited in claim 1, wherein: and three groups of leads (2) are arranged on the surface of the pad structure main body (1).

3. The mini LED miniature component pad of claim 1, wherein: the width of the lead (2) is one quarter to two thirds of the width of the pad structure body (1), and the width difference is obvious.

4. The mini LED miniature component pad of claim 1, wherein: the lead (2) is electrically connected with the electrode (3).