CN218069781U - Semiconductor UV membrane packaging device - Google Patents
Semiconductor UV membrane packaging device Download PDFInfo
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- CN218069781U CN218069781U CN202220817857.2U CN202220817857U CN218069781U CN 218069781 U CN218069781 U CN 218069781U CN 202220817857 U CN202220817857 U CN 202220817857U CN 218069781 U CN218069781 U CN 218069781U
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- dust cover
- semiconductor
- slider
- spout
- cabinet body
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Abstract
The utility model discloses a semiconductor UV membrane encapsulation device, including the cabinet body, backup pad and dust cover, the bottom fixedly connected with landing leg of the cabinet body, the front end of backup pad is provided with the controller, the left and right sides of dust cover is connected with the slider, the spout has been seted up with the contact position of backup pad to the slider, the bottom of slider is connected with electric telescopic handle, the bottom of dust cover is provided with the workstation. The utility model discloses a setting of dust cover can avoid outside dust to get into inside the packaging hardware through the dust cover to on the effectual dust that prevents deposits the packaging hardware, and then influence encapsulation efficiency, can effectively improve semiconductor package's work efficiency, improved holistic practicality.
Description
Technical Field
The utility model relates to a semiconductor package equipment technical field, concretely relates to semiconductor UV membrane packaging hardware.
Background
The semiconductor refers to a material with electric conductivity between a semiconductor and an insulator at normal temperature, and in the production flow of the semiconductor, the semiconductor is often subjected to UV film packaging, so that the semiconductor is isolated from the outside on one hand, and the electric performance reduction caused by the corrosion of impurities in the air to a semiconductor circuit is prevented; on the other hand, the packaged semiconductor is also more convenient to install and transport.
The existing semiconductor UV film packaging device does not have a dustproof effect in use, for example, the semiconductor packaging device disclosed in application No. CN202122115821.8 has a poor dustproof effect, dust is easily deposited on the packaging device, the dust easily affects the packaging of the semiconductor, and the service life of the packaging device is reduced.
Therefore, it is necessary to invent a semiconductor UV film encapsulation apparatus to solve the above problems.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a semiconductor UV membrane packaging hardware to do not possess the problem of dustproof effect in the solution technology, current packaging hardware dustproof effect is relatively poor, the last easy deposit dust of packaging hardware, the dust causes the influence to the encapsulation of semiconductor easily, packaging hardware's life has been reduced, current packaging hardware can produce powerful pressure when carrying out UV membrane encapsulation to the semiconductor simultaneously, lead to the phenomenon that the semiconductor can take place to warp, cause the fracture of semiconductor, thereby cause the inefficacy of product function.
In order to achieve the above object, the present invention provides the following technical solutions: the utility model provides a semiconductor UV membrane packaging hardware, includes the cabinet body, backup pad and dust cover, the bottom fixedly connected with landing leg of the cabinet body, the front end of backup pad is provided with the controller, the left and right sides of dust cover is connected with the slider, the spout has been seted up with the contact position of backup pad to the slider, the bottom of slider is connected with electric telescopic handle, the bottom of dust cover is provided with the workstation.
Preferably, the landing leg is provided with 4, mutually perpendicular between landing leg and the cabinet body, both sides are connected with the backup pad about the top of the cabinet body for the landing leg can stabilize and support packaging hardware.
Preferably, the backup pad is provided with 2, the backup pad is the design of rectangle structure and forms, mutually perpendicular between backup pad and the cabinet body for the backup pad can stabilize and support the dust cover.
Preferably, a dust cover is arranged between the two supporting plates, the dust cover is designed in an inverted U-shaped structure, and the length of the dust cover is smaller than the distance between the two supporting plates, so that external dust can be prevented from entering the inside of the packaging device.
Preferably, be sliding connection between slider and the spout, slider and spout are provided with 2, the external diameter of slider is less than the internal diameter of spout, slider and spout are central symmetry about each other between the dust cover for slider and spout can drive the dust cover and slide from top to bottom.
Preferably, the inside of spout is provided with electric telescopic handle, electric telescopic handle is provided with 2, electric telescopic handle is central symmetry about each other between the dust cover for electric telescopic handle can control the up-and-down motion of dust cover.
Preferably, the workstation is the design of rectangle structure and forms, the external diameter of workstation is less than the internal diameter of dust cover, the top of workstation is provided with the elasticity foam-rubber cushion for the workstation can stabilize and support placing of semiconductor.
Preferably, the elastic sponge pad is designed to be of a disc-shaped structure, the elastic sponge pad is arranged at the center of the lower portion of the dust cover and is perpendicular to the workbench, so that the bottom concave-convex structure of the semiconductor can be sunk into the elastic sponge pad by the elastic sponge pad, and the semiconductor is prevented from deforming when packaged.
In the technical scheme, the utility model provides a technological effect and advantage:
1. through the arrangement of the dust cover, external dust can be prevented from entering the packaging device through the dust cover, so that the dust is effectively prevented from being deposited on the packaging device, the packaging efficiency is further influenced, the working efficiency of semiconductor packaging can be effectively improved, and the overall practicability is improved;
2. through the setting of elasticity foam-rubber cushion, will treat that the semiconductor of encapsulation is placed on elasticity foam-rubber cushion, and the unsmooth structure in semiconductor bottom is absorbed in elasticity foam-rubber cushion, prevents that the phenomenon of deformation from appearing in the semiconductor when the encapsulation, the effectual fracture of avoiding the semiconductor.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic perspective view of the dust cover of the present invention;
FIG. 3 is a schematic cross-sectional three-dimensional structure of the support plate and the dust cover of the present invention;
FIG. 4 is a schematic view of the three-dimensional structure of the sliding block and the sliding groove of the present invention;
fig. 5 is a schematic view of the three-dimensional structure of the workbench and the elastic sponge mat of the present invention.
Description of the reference numerals:
1. a cabinet body; 2. a support leg; 3. a support plate; 4. a controller; 5. a dust cover; 6. a slider; 7. a chute; 8. an electric telescopic rod; 9. a work table; 10. an elastic sponge cushion.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the present invention will be further described in detail with reference to the attached drawings.
The utility model provides a as shown in fig. 1-5 semiconductor UV membrane packaging hardware, including the cabinet body 1, backup pad 3 and dust cover 5, the bottom fixedly connected with landing leg 2 of the cabinet body 1, the front end of backup pad 3 is provided with controller 4, and the left and right sides of dust cover 5 is connected with slider 6, and slider 6 has seted up spout 7 with the contact position of backup pad 3, and the bottom of slider 6 is connected with electric telescopic handle 8, and the bottom of dust cover 5 is provided with workstation 9.
Landing leg 2 is provided with 4, mutually perpendicular between landing leg 2 and the cabinet body 1, and the top left and right sides of the cabinet body 1 is connected with backup pad 3, and backup pad 3 is provided with 2, and backup pad 3 is the rectangle structural design and forms, mutually perpendicular between backup pad 3 and the cabinet body 1 is provided with dust cover 5 between two backup pads 3, and dust cover 5 is down "U" font structural design and forms, and the length of dust cover 5 is less than the interval between two backup pads 3.
For sliding connection between slider 6 and the spout 7, slider 6 and spout 7 are provided with 2, and the external diameter of slider 6 is less than the internal diameter of spout 7, and slider 6 and spout 7 are central symmetry each other between about dust cover 5, and the inside of spout 7 is provided with electric telescopic handle 8, and electric telescopic handle 8 is provided with 2, and electric telescopic handle 8 is central symmetry each other between about dust cover 5.
This practical theory of operation:
referring to the attached drawings 1-5 of the specification, when the device is used, firstly, the packaging device is stably placed at a proper position through the supporting legs 2, a power supply is connected, the packaging device starts to package a semiconductor, the controller 4 can control the electric telescopic rod 8 to perform lifting motion, so that the controller 4 opens the electric telescopic rod 8, the electric telescopic rod 8 drives the sliding block 6 connected to the top to slide upwards, the sliding block 6 can drive the dust cover 5 to move upwards, and therefore the semiconductor to be packaged can be placed on the elastic sponge cushion 10 to be packaged;
referring to the attached drawings 1-5 of the specification, when the device is used, when a semiconductor is stably placed on the elastic sponge cushion 10, the dust cover 5 can be driven to be closed downwards through the electric telescopic rod 8, then the semiconductor can be packaged with a UV film, external dust can be prevented from entering the packaging device through the dust cover 5, dust can be effectively prevented from being deposited on the packaging device, the packaging efficiency can be further influenced, the working efficiency of semiconductor packaging can be effectively improved, due to the uneven structure at the bottom of the semiconductor, when the semiconductor is packaged, the semiconductor can be placed on the elastic sponge cushion 10 through the elastic effect, the semiconductor can be sunk into the elastic sponge cushion 10, the semiconductor is prevented from deforming during packaging, and the semiconductor is effectively prevented from being broken.
Claims (8)
1. The utility model provides a semiconductor UV membrane packaging hardware, includes the cabinet body (1), backup pad (3) and dust cover (5), its characterized in that: the utility model discloses a cabinet, including the cabinet body, the bottom fixedly connected with landing leg (2) of the cabinet body (1), the front end of backup pad (3) is provided with controller (4), the left and right sides of dust cover (5) is connected with slider (6), spout (7) have been seted up with the contact position of backup pad (3) in slider (6), the bottom of slider (6) is connected with electric telescopic handle (8), the bottom of dust cover (5) is provided with workstation (9).
2. The semiconductor UV film packaging apparatus according to claim 1, wherein: the support leg (2) is provided with 4, mutually perpendicular between the support leg (2) and the cabinet body (1), both sides are connected with backup pad (3) about the top of the cabinet body (1).
3. The semiconductor UV film packaging apparatus according to claim 2, wherein: the cabinet is characterized in that the number of the supporting plates (3) is 2, the supporting plates (3) are designed to be of a rectangular structure, and the supporting plates (3) are perpendicular to the cabinet body (1).
4. The semiconductor UV film packaging apparatus according to claim 3, wherein: a dust cover (5) is arranged between the two supporting plates (3), the dust cover (5) is designed in an inverted U-shaped structure, and the length of the dust cover (5) is smaller than the distance between the two supporting plates (3).
5. The semiconductor UV film packaging apparatus according to claim 1, wherein: be sliding connection between slider (6) and spout (7), slider (6) and spout (7) are provided with 2, the external diameter of slider (6) is less than the internal diameter of spout (7), slider (6) and spout (7) are central symmetry about each other between dust cover (5).
6. The semiconductor UV film packaging apparatus according to claim 5, wherein: the inside of spout (7) is provided with electric telescopic handle (8), electric telescopic handle (8) are provided with 2, electric telescopic handle (8) are about mutual central symmetry between dust cover (5).
7. The semiconductor UV film packaging apparatus according to claim 1, wherein: workstation (9) are the design of rectangle structure and form, the external diameter of workstation (9) is less than the internal diameter of dust cover (5), the top of workstation (9) is provided with elasticity foam-rubber cushion (10).
8. The semiconductor UV film packaging apparatus according to claim 7, wherein: the elastic spongy cushion (10) is designed into a disc-shaped structure, the elastic spongy cushion (10) is arranged at the center of the lower portion of the dust cover (5), and the elastic spongy cushion (10) is perpendicular to the workbench (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220817857.2U CN218069781U (en) | 2022-04-01 | 2022-04-01 | Semiconductor UV membrane packaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220817857.2U CN218069781U (en) | 2022-04-01 | 2022-04-01 | Semiconductor UV membrane packaging device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218069781U true CN218069781U (en) | 2022-12-16 |
Family
ID=84416083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220817857.2U Active CN218069781U (en) | 2022-04-01 | 2022-04-01 | Semiconductor UV membrane packaging device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218069781U (en) |
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2022
- 2022-04-01 CN CN202220817857.2U patent/CN218069781U/en active Active
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