CN218059179U - Vertical film coating device - Google Patents

Abstract

The application provides a vertical coating device, relate to semiconductor preparation technical field, which comprises a base, coating mechanism and rotation set up the revolution mechanism on the base, be provided with the support plate at revolution mechanism's perisporium, it is provided with the rotation mechanism that is used for placing the plane base plate to rotate on the support plate, revolution mechanism's rotation plane is perpendicular with the rotation plane of rotation mechanism, coating mechanism sets up in the base and corresponds with the plane base plate, can change the distance of plane base plate surface position point and coating mechanism with this through the rotation, thereby balanced the differentiation of each position point distance, and then reduce the horizontal discrepancy of scattering of plane base plate surface coating film, improve homogeneity and the yield of product.

Description

Vertical film coating device

Technical Field

The application relates to the technical field of semiconductor preparation, in particular to a vertical film coating device.

Background

The magnetron sputtering coating technology is widely applied in the photoelectric field, and the principle is that under the vacuum state, ions impact a target under the action of an electric field, so that a target raw material is sputtered and deposited on the surface of a product to be coated, a film layer attached to the surface of the product is formed, and the characteristics of the film layer or the comprehensive characteristics of the film layer and the product can be used in related fields.

The vertical film coating device is a device adopting the above technology, and as shown in the plan view of fig. 1, the vertical film coating device is provided with a centrally-arranged rotating mechanism 010 and a magnetron sputtering mechanism 040 arranged around the rotating mechanism 010, a plurality of carrier plates 020 are arranged on the peripheral wall of the rotating mechanism 010, a plurality of planar substrates 030 are arranged on the carrier plates 020, and the planar substrates 030 can sequentially pass through a film coating area of the magnetron sputtering mechanism 040 by rotating around a central axis 012 of the vertical film coating device in fig. 1 along a rotating direction 011, so that a film product can be continuously and stably produced in large quantities.

However, as shown in fig. 2, when the planar substrate 030 placed on the rotation mechanism 010 is rotated circumferentially following the rotation mechanism 010, different positions of the surface of the planar substrate 030 in the rotation direction 011 approach the magnetron sputtering mechanism 040 at different distances, so that the difference in film thickness of the surface of the planar substrate 030 is large, which causes a so-called "lateral scattering", and this problem becomes more prominent as the size (lateral direction) of the substrate is increased, which seriously affects the uniformity of the product and lowers the yield.

SUMMERY OF THE UTILITY MODEL

In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a vertical film plating apparatus, which is provided with a rotation mechanism to solve the problem of lateral scattering caused by film plating on the surface of a planar substrate.

In order to achieve the above purpose, the embodiments of the present application adopt the following technical solutions:

in one aspect of the embodiment of the present application, a vertical film coating device is provided, including a base, a film coating mechanism, and a revolving mechanism rotatably disposed on the base, a support plate is disposed on a circumferential wall of the revolving mechanism, a rotating mechanism for placing a planar substrate is rotatably disposed on the support plate, a rotating plane of the revolving mechanism is perpendicular to a rotating plane of the rotating mechanism, and the film coating mechanism is disposed on the base and corresponds to the planar substrate.

Optionally, the rotation mechanism includes a first driving part, a rotating part and a clamp for clamping the planar substrate, the first driving part is arranged on the support plate, the clamp is arranged on the support plate through the rotating part, and the first driving part is in driving connection with the clamp through the rotating part and is used for driving the clamp to rotate so as to drive the planar substrate to rotate.

Optionally, the rotating part is a bearing, an outer ring of the bearing is fixedly connected with the carrier plate, an inner ring of the bearing is fixedly connected with the clamp, and the first driving part and the inner ring of the bearing are driven by a gear.

Optionally, a containing hole is formed in the carrier plate, the bearing is embedded in the containing hole, an outer ring of the bearing is fixedly connected with the inner wall of the containing hole, an inner ring of the bearing protrudes out of the containing hole, and a gear portion matched with the first driving member is arranged on the outer peripheral wall of the inner ring of the bearing protruding out of the containing hole.

Optionally, the revolution mechanism includes a second driving element and a barrel arranged on the base, the barrel is arranged on the base in a rotating manner around a central axis of the barrel, the support plate is arranged on a peripheral wall of the barrel, and the second driving element is in driving connection with the barrel and used for driving the barrel to drive the planar substrate to revolve.

Optionally, the cylinder is a prismatic cylinder, the carrier plates are multiple, and the carrier plates are distributed on the side wall of the prismatic cylinder in a one-to-one correspondence manner.

Optionally, the coating mechanism is a magnetron sputtering mechanism.

Optionally, the vertical film plating device further comprises a correction blade assembly arranged on the base, and the correction blade assembly is located between the film plating mechanism and the planar substrate and partially covers the film plating area of the film plating mechanism, and is used for correcting the uniformity of the film thickness of the surface of the planar substrate.

Optionally, the vertical film plating device comprises a group of correction blade assemblies, and the group of correction blade assemblies are distributed on one side of the film plating area; or the vertical film coating device comprises two groups of correction blade assemblies which are distributed on two opposite sides of the film coating area.

Optionally, the correction blade assembly includes a plurality of fingers arranged on the same plane, the plane on which the plurality of fingers are arranged is perpendicular to the rotation plane of the revolution mechanism, and the length of each finger increases progressively outwards along the rotation center of the rotation mechanism.

The beneficial effect of this application includes:

the application provides a vertical coating device, which comprises a base, coating mechanism and rotation set up the revolution mechanism on the base, be provided with the support plate at revolution mechanism's perisporium, it is provided with the rotation mechanism that is used for placing the plane base plate to rotate on the support plate, revolution mechanism's rotation plane is perpendicular with the rotation plane of rotation mechanism, coating mechanism sets up in the base and corresponds with the plane base plate, can change the distance of plane base plate surface position point and coating mechanism with this through the rotation, thereby balanced the differentiation of each position point distance, and then reduce the horizontal discrepancy of scattering of plane base plate surface coating film, improve homogeneity and the yield of product.

Drawings

To more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and those skilled in the art can also obtain other related drawings based on the drawings without inventive efforts.

FIG. 1 is a top view of a conventional vertical coating apparatus;

FIG. 2 is a schematic view illustrating the rotation of a planar substrate in a conventional vertical deposition apparatus;

fig. 3 is a schematic structural diagram of a vertical film coating apparatus according to an embodiment of the present disclosure;

fig. 4 is a schematic view of a planar substrate and a coating area according to an embodiment of the present disclosure;

FIG. 5 is a schematic view of a planar substrate coating according to an embodiment of the present disclosure;

fig. 6 is a cross-sectional view of a carrier plate provided with a rotation mechanism according to an embodiment of the present application;

fig. 7 is a second schematic view of a planar substrate and a coating area according to an embodiment of the present disclosure;

fig. 8 is a third schematic view of a planar substrate and a plating area according to an embodiment of the present disclosure;

FIG. 9 is a fourth schematic view of a planar substrate and a coating area according to an embodiment of the present disclosure;

fig. 10 is a second schematic view illustrating a planar substrate coating according to an embodiment of the present invention;

fig. 11 is a third schematic view illustrating a planar substrate coating according to an embodiment of the present disclosure.

Icon: 010-a rotating mechanism; 011-direction of rotation; 012. 101, 103-central axis; 020. 110-a carrier plate; 030. 120-a planar substrate; 040-magnetron sputtering mechanism; 100-revolution mechanism; 102. 104-direction of rotation; 130-a coating mechanism; 131-a film coating area; 141-outer ring of bearing; 142-the inner race of the bearing; 143-a drive gear; 150-a correction blade assembly; 160-a clamp.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. It should be noted that, in case of conflict, various features of the embodiments of the present application may be combined with each other, and the combined embodiments are still within the scope of the present application.

In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the application usually place when in use, and are used only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the devices or elements being referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

In the description of the present application, it should also be noted that, unless expressly stated or limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and can include, for example, fixed connections, detachable connections, or integral connections; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in this application will be understood to be a specific case for those of ordinary skill in the art.

In the conventional vertical film plating apparatus, as shown in a plan view in fig. 1, a centrally-located rotation mechanism 010 and a magnetron sputtering mechanism 040 arranged around the rotation mechanism 010 are arranged, a plurality of carrier plates 020 are provided on a circumferential wall of the rotation mechanism 010, a planar substrate 030 to be plated is provided on each carrier plate 020, and the rotation mechanism 010 rotates in a rotation direction 011 in fig. 1 about a central axis 012 thereof, so that the plurality of planar substrates 030 can sequentially pass through a film plating region of the magnetron sputtering mechanism 040, thereby realizing film plating on a surface of the planar substrate 030.

However, as shown in fig. 2, when the planar substrate 030 placed on the carrier plate 020 is rotated circularly along with the rotation mechanism 010, different positions on the surface of the planar substrate 030 along the rotation direction 011 approach the magnetron sputtering mechanism 040 at different distances, in other words, when the position points gradually move from the center point o to the edge point b or the edge point a on the planar substrate 030, the rotation radius of the position points gradually increases, for example, the rotation radius of the edge point b and the edge point a in fig. 2 is larger than that of the center point o, and thus, for the edge point a, the edge point b and the center point o, the edge point a and the edge point b are closer to the magnetron sputtering mechanism 040, so that the thickness of the coating layer at the edge point a and the edge point b is larger than that at the center point o during the coating process, so that the coating surface of the planar substrate 030 formed a wavy surface with thick thickness in the connecting direction of the edge point b, the center point o and the edge point a problem of the coating layer thickness difference on the surface of the planar substrate 030 is larger, that the so-called "lateral scattering yield" is greatly reduced, and the product size becomes more greatly reduced. For example, for an 8 inch 940nm narrowband filter product, the lateral dispersion may be close to 10nm, which is not desirable for subsequent packaging.

In one aspect of the embodiment of the present application, as shown in fig. 3, a vertical film coating apparatus is provided, which includes a base (not shown), a film coating mechanism 130, and a revolution mechanism 100, wherein the revolution mechanism 100 is rotatably disposed on the base, a carrier plate 110 is disposed on a circumferential wall of the revolution mechanism 100, a rotation mechanism (not shown) is rotatably disposed on the carrier plate 110, the rotation mechanism is used for placing a planar substrate 120, and the film coating mechanism 130 is disposed on the base and located at a periphery of the entire revolution mechanism 100, so that during the rotation of the revolution mechanism 100, the carrier plate 110 disposed on a sidewall of the revolution mechanism 100 drives the planar substrate 120 on the rotation mechanism to pass through a film coating region 131 of the film coating mechanism 130, thereby realizing the film coating of the planar substrate 120.

As shown in fig. 3, since the rotation mechanism and the carrier plate 110 are both provided on the revolution mechanism 100, and the revolution mechanism 100 can rotate relative to the susceptor, the planar substrate 120 provided on the rotation mechanism can firstly follow the revolution mechanism 100 to realize revolution, and on this basis, since the rotation mechanism can realize rotation relative to the carrier plate 110, and the carrier plate 110 is provided on the revolution mechanism 100, the planar substrate 120 provided on the rotation mechanism can also realize rotation following the rotation mechanism, and the rotation plane of the revolution mechanism 100 and the rotation plane of the rotation mechanism are set in a state of being perpendicular to each other, for example, in fig. 3, the revolution mechanism 100 rotates around its central axis 101 in the rotation direction 102, and the rotation mechanism rotates around its central axis 103 in the rotation direction 104. The planar substrate 120 is generally placed such that the center of the planar substrate 120 is located on the rotation axis of the rotation mechanism.

As shown in fig. 4, for convenience of understanding, the revolution of the planar substrate 120 may be planarized, so that when the planar substrate 120 revolves, the planar substrate 120 enters the plating region 131 from the left side of the plating region 131 and leaves the plating region 131 from the right side of the plating region 131, and when the planar substrate 120 revolves, it rotates (for example, rotates clockwise or counterclockwise around the point O in fig. 4), and when the revolving plane and the rotating plane of the revolution are perpendicular to each other, the same location point on the planar substrate 120 may rotate while moving from left to right in the plating region 131, so that a location point originally located on the surface of the planar substrate 120 and far from the plating mechanism 130 may move to a location closer to the plating mechanism 130 by rotating, and similarly, a location point originally located on the surface of the planar substrate 120 and near to the plating mechanism 130 may move to a location far from the plating mechanism 130 by rotating, for example, a location point originally located far from the plating mechanism 130 may move to a location point originally located at the plating mechanism 130 by rotating, so that the location point C originally located on the surface of the plating mechanism 130 may move to a location point originally far from the plating mechanism 130 by rotating, and thus the difference in the lateral distance of the plating mechanism may be increased, and the difference in the product may be increased by the difference in the product deposition yield of the product.

It should be understood that, by the aforementioned embodiment (i.e. rotation plus revolution), the coating difference between the positions of the planar substrate 120 distributed on the same circle with the rotation axis of the rotation mechanism as the center can be reduced, for example, as shown in fig. 4, the position point O, the position point a, the position point B and the position point C are all located on the surface of the planar substrate 120, wherein the position point a, the position point B and the position point C rotate around the position point O when rotating, and the position point a, the position point B and the position point C are located on the same circle with the position point O as the center, compared to the existing coating distribution of the planar substrate 120 surface coated only by revolution (the position point on the connecting line of the position point O and the position point C is farthest from the coating mechanism 130 and the film thickness is thinnest, the position point a and the position point B are closest to the coating mechanism 130 and the film thickness is thickest), therefore, the overall film thickness is formed by the connecting line direction of the position point B, the position point O and the position point C, and the coating mechanism 130 is thicker, and thus the coating difference between the positions of the position point a and the coating point C can be reduced, and the coating difference between the positions of the coating points on the circle can be reduced, and the existing substrate 120 can be reduced, and the uniformity of the same circle can be improved.

In some embodiments, the planar substrate 120 placed on the rotation mechanism in the present application may be a circular substrate, a square substrate, a triangular substrate, or the like, which is not limited in the present application.

To further describe the embodiments of the present application, please refer to fig. 5, taking the planar substrate 120 as a circular substrate as an example, where the position point a and the position point B are both edge points of the substrate and are both located on the same circumference with the position point O as a center, the spiral line in fig. 5 is a planarization motion track of the position point a during the rotation and revolution, when the width of the plating region 131 is L, the distance of OA is r, and L =2 tr, in (a) of fig. 5, the circular substrate rotates and takes the distance of 1 rotation of the exact position point O passing through L as a period, and in (B) of fig. 5, the circular substrate rotates and takes the distance of 2 rotation of the exact position point O passing through L as a period. When L is other values, it can be converted by the above-mentioned relationship.

As can be seen from (a) to (b) of fig. 5, as the rotation speed increases, the position point a can pass through the coating region 131 more times, so that the difference between the position points on the same circumference can be made smaller, thereby achieving more uniform deposition. Of course, if the rotation speed is too fast, the rotation speed will be affected negatively due to the stability of the mechanism, the vibration of the carrier 110, the bearing capacity of the rotation mechanism during rotation, the reliability of the film deposition and the planar substrate 120, and the like.

In some embodiments, as shown in fig. 6, the rotation mechanism includes a first driving element (not shown), a rotating element and a clamping element 160, wherein the clamping element 160 is rotatably disposed on the carrier 110 via the rotating element, and the first driving element is drivingly connected to the clamping element 160 via the rotating element, so that the rotating element is driven by the first driving element to rotate the clamping element 160 relative to the carrier 110, thereby achieving the rotation of the planar substrate 120 loaded on the clamping element 160. It should be understood that the clamping device 160 of the present application can achieve both clamping and dismounting of the planar substrate 120.

In some embodiments, with continued reference to fig. 6, the rotating member is a bearing, and the bearing may be a vacuum oilless bearing, so as to meet the requirement of vacuum coating. The outer ring 141 of the bearing is fixedly connected with the carrier plate 110, the inner ring 142 of the bearing is fixedly connected with the clamp 160, and the first driving member and the inner ring 142 of the bearing are in gear transmission, so that the first driving member can drive the planar substrate 120 on the clamp 160 to rotate stably through the bearing. It will be appreciated that the first drive member in this application may be a variable speed servo motor.

In some embodiments, please continue to refer to fig. 6, a containing hole is formed in the carrier plate 110, and the bearing can be embedded in the containing hole, so that the bearing can be contained by using the carrier plate 110, the effect can be achieved by performing a small improvement based on the existing vertical coating device, and the production cost is effectively reduced. Specifically, referring to fig. 6, the outer ring 141 of the bearing may be fixedly connected to the inner wall of the receiving hole, and in order to facilitate the driving connection of the first driving element to the inner ring 142 of the bearing, the inner ring 142 of the bearing may extend in the axial direction of the receiving hole, so that the inner ring 142 of the bearing protrudes out of the receiving hole, and thus, the outer peripheral wall of the protruding portion of the inner ring 142 of the bearing is exposed, and thus, a gear portion may be disposed on the outer peripheral wall of the receiving hole from which the inner ring of the bearing protrudes, and at the same time, a driving gear 143 may be disposed on the driving shaft of the first driving element, and the driving gear 143 is in meshing transmission with the gear portion.

In some embodiments, as shown in fig. 3, the revolution mechanism 100 includes a second driving member (not shown) disposed on the pedestal and a cylinder, the cylinder is disposed on the pedestal to rotate around its central axis 101, the carrier plate 110 is disposed on a peripheral wall of the cylinder, and the second driving member is drivingly connected to the cylinder, so that when the cylinder is driven by the second driving member to rotate around its central axis 101 along the rotation direction 102, the carrier plate 110 and the rotation mechanism drive the planar substrate 120 to revolve, that is, the rotation axis of the revolution of the planar substrate 120 is the central axis 101.

In some embodiments, the cylinder may be a cylindrical cylinder, a prismatic cylinder, or other forms, for example, as shown in fig. 3, the cylinder is a prismatic cylinder and a hexagonal cylinder, and since the peripheral wall of the cylinder has 6 side walls, the number of the carrier plates 110 may be 6, and the 6 carrier plates 110 are distributed on the side walls of the prismatic cylinder in a one-to-one correspondence manner, so that continuous, large-scale and stable production of film products is achieved through the foregoing embodiments.

In some embodiments, the coating mechanism 130 is a magnetron sputtering mechanism, an evaporation mechanism, or the like, and the magnetron sputtering mechanism may include a target head, a target material, a magnetic field, an electric field, and the like, so that the sputtering target material is deposited on the surface of the planar substrate 120 when electrons bombard the target material. It should be understood that the number of the coating mechanisms 130 is not limited in the present application, and may be distributed on the periphery of the revolution mechanism 100 in a plurality, so as to achieve a higher coating rate and improve the production efficiency.

Through the foregoing embodiment, the difference of the film coatings distributed on the same circumference with the rotation center as the center of the circle can be reduced, and the uniformity of the film layer on the surface of the existing planar substrate 120 is further improved, but the film layer uniformity of each position point on the same circumference is only improved in a targeted manner, and the improvement between each position point on adjacent circumferences is not obvious, so that the surface of the film layer of the planar substrate 120 coated with the film coating is in an inverted cone shape, for example, as shown in fig. 4, a concentric circle with the position point O as the center of the circle increases in radius, and the film thickness on the concentric circle is thicker, so that a surface of the film layer in the inverted cone shape is formed. The following is further described in conjunction with the accompanying drawings:

referring to fig. 3, 7 to 9, the vertical film plating apparatus further includes a correction blade assembly 150 disposed on the base, the correction blade assembly 150 is disposed between the film plating mechanism 130 and the planar substrate 120 and partially covers the film plating region 131 of the film plating mechanism 130, when the correction blade assembly 150 covers the film plating region 131, the correction blade assembly can be adjusted according to the thickness distribution of the film on the planar substrate 120, for example, a thicker position of the original film can cover more regions, and a thinner position of the original film can cover less regions, so as to correct the uniformity of the film thickness on the surface of the planar substrate 120.

For example, as shown in fig. 8, two concentric circles centered on the position point O on the surface of the planar substrate 120 respectively have a position point D and a position point E, the circumference having the position point D is correspondingly covered by the first finger 152, and the circumference having the position point E is correspondingly covered by the second finger 153, and since the circumference having the position point D is closer to the film coating mechanism 130 than the circumference having the position point E, the film thickness at the circumference having the position point D is greater than the film thickness at the circumference having the position point E, so that the length of the first finger 152 is greater than the length of the second finger 153, thereby reducing the difference between the film thickness at the circumference having the position point D and the film thickness at the circumference having the position point E, reducing the difference between the film thicknesses at different circumferences, further improving the uniformity of the surface of the planar substrate 120, and further flattening the film surface of the planar substrate 120, and improving the uniformity and yield of the product.

Referring to fig. 8, the correction blade assembly 150 includes a plurality of fingers arranged in a same plane, the plane of the plurality of fingers being perpendicular to the rotation plane of the revolution mechanism 100, and in view of the concentric circles centered on the position point O by the rotation of the planar substrate 120, the thickness of the film layer on the concentric circles is thicker as the radius increases, thereby forming a film layer surface in an inverted cone shape, and therefore, the length W of each finger may be made to increase sequentially outward along the rotation center of the rotation mechanism, in other words, the length W of the finger may increase as the radius increases centered on the position point O.

It should be understood that the width H of the fingers and the number of fingers can be adaptively set according to the uniformity of the final film, for example, the more the width H of the fingers is narrower, the more the number of fingers is, the better the uniformity of the thickness of the final film formed on the surface of the planar substrate 120 is.

Of course, the smaller the size of the planar substrate 120, the smaller the width H of the corresponding finger should be.

Referring to fig. 8 and 10, the position of a point D on the circumference when the planar substrate 120 travels is found to be a function of the radius r of the circumference by the formula of the cycloid curve, and the following is found by calculation: the path followed by point D (a, b) on the circumference when the circumference travels one revolution (i.e. circle center O passes 2 pi r) is 4 times the diameter of the circumference, i.e. 8 times r, where a = r (theta-sin theta) and b = (1-cos theta).

From this theoretical calculation, as shown in fig. 11, when any point except the center of the circle in the circular planar substrate 120 is regarded as a point on the concentric circle of the center of the circle, the path traveled by the point E is 8r _E And the path traveled by the point D is 8r _D Therefore, the correction blade set takes the straight line passing through the center O as the center axis of symmetry, and as shown in fig. 8, the length difference M between the first finger 152 corresponding to the point D and the second finger 153 corresponding to the point E is r _D ：r _E The rest of the points in the circle are analogized in turn. Similarly, other shapes of the planar substrate 120 may be processed similarly.

Optionally, as shown in fig. 7, the vertical film plating device includes a set of correction blade assemblies 150, and the set of correction blade assemblies 150 is distributed on one side of the film plating area 131.

Optionally, as shown in fig. 8, the vertical film plating device includes two sets of correction blade assemblies 150, and the two sets of correction blade assemblies 150 are distributed on two opposite sides of the film plating area 131.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made to the present application by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims (10)

1. A vertical film coating device is characterized by comprising a base, a film coating mechanism and a revolution mechanism which is rotatably arranged on the base, wherein a support plate is arranged on the peripheral wall of the revolution mechanism, a rotation mechanism used for placing a planar substrate is rotatably arranged on the support plate, the rotation plane of the revolution mechanism is vertical to the rotation plane of the rotation mechanism, and the film coating mechanism is arranged on the base and corresponds to the planar substrate.

2. The vertical plating device according to claim 1, wherein the rotation mechanism comprises a first driving member disposed on the carrier plate, a rotating member, and a clamp for clamping the planar substrate, the clamp is rotatably disposed on the carrier plate via the rotating member, and the first driving member is drivingly connected to the clamp via the rotating member for driving the clamp to rotate so as to rotate the planar substrate.

3. The vertical plating device according to claim 2, wherein the rotating member is a bearing, an outer race of the bearing is fixedly connected to the carrier plate, an inner race of the bearing is fixedly connected to the holder, and the first driving member and the inner race of the bearing are driven by gears.

4. The vertical plating device according to claim 3, wherein the carrier plate has a receiving hole, the bearing is inserted into the receiving hole, an outer ring of the bearing is fixedly connected to an inner wall of the receiving hole, an inner ring of the bearing protrudes from the receiving hole, and a gear portion engaged with the first driving member is disposed on an outer peripheral wall of the inner ring of the bearing protruding from the receiving hole.

5. The vertical plating device according to claim 1, wherein the revolution mechanism comprises a second driving member and a cylinder, the second driving member and the cylinder are disposed on the base, the cylinder is rotatably disposed on the base around a central axis thereof, the support plate is disposed on a peripheral wall of the cylinder, and the second driving member is drivingly connected to the cylinder for driving the cylinder to drive the planar substrate to revolve.

6. The vertical plating device according to claim 5, wherein the cylinder is a prism cylinder, the number of the support plates is plural, and the plurality of support plates are distributed on the side wall of the prism cylinder in a one-to-one correspondence manner.

7. The vertical coating device according to claim 1, wherein the coating mechanism is a magnetron sputtering mechanism.

8. The vertical plating device according to any one of claims 1 to 7, further comprising a correction blade assembly provided on the base, the correction blade assembly being positioned between the plating mechanism and the planar substrate and partially covering a plating area of the plating mechanism for correcting uniformity of film thickness on a surface of the planar substrate.

9. The vertical coating device according to claim 8, wherein the vertical coating device comprises a plurality of the correction blade assemblies, and a plurality of the correction blade assemblies are distributed on one side of the coating area; or the vertical film coating device comprises two groups of correction blade assemblies, and the two groups of correction blade assemblies are distributed on two opposite sides of the film coating area.

10. The vertical plating device according to claim 8, wherein the correction blade assembly comprises a plurality of fingers arranged in the same plane, the plane in which the plurality of fingers are arranged is perpendicular to the rotation plane of the revolution mechanism, and the length of each finger increases progressively outward along the rotation center of the rotation mechanism.

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