CN218042229U - Power module with cooling and heat conducting functions - Google Patents

Abstract

The utility model discloses a power module who possesses cooling heat conduction function, comprising a base plate, the upper end of bottom plate is symmetry fixed mounting and has two sets of heat-conducting plates, and two sets of the equal a plurality of radiating fin of fixedly connected with in opposite one side of heat-conducting plate, through placing power module between two sets of heat-conducting plates, a plurality of radiating fin cooperation of group through two sets of heat-conducting plates and its one side setting, carry out the heat conduction to power module's both sides and give off, cooling assembly cooperation in the heating panel through two sets of heat-conducting plate tops demountable installation, be convenient for carry out the dismouting to the heating panel, and then be convenient for maintain cooling assembly on the heating panel, absorb the heat that power module produced and refrigerate the cooling to power module through semiconductor refrigeration piece in the cooling assembly, reduce power module's surface temperature fast, give off the heat through two sets of radiator fan cooperations, avoid a large amount of heat to pile up the condition that leads to power module to damage and take place.

Description

Power module with cooling and heat conducting functions

Technical Field

The utility model relates to a power module heat dissipation technical field specifically is a power module who possesses cooling heat conduction function.

Background

Nowadays in the information-based society, the integrated power supply module is widely applied, such as aerospace and daily household electrical appliances, all devices using electricity, especially some high-precision automatic devices, and because the size required by the power supply is divided into a high-voltage power supply module and a low-voltage power supply module, the number of the power supply modules supplying power at low voltage in normal production and life is large.

Power module is because work is required, need long-time operation, under the normal operating condition, the inside components and parts of power module can produce high temperature because long-time operation, current power module radiating efficiency is slower, because current power module generally is the totally enclosed form, it is passive radiating mode mostly, and can produce a large amount of heats in the power module course of operation, passive radiating mode, can cause a large amount of heats to pile up, so lead to power module's damage easily for a long time, therefore we need to propose a power module who possesses cooling heat conduction function.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a power module who possesses cooling heat conduction function sets up heat-conducting plate and radiating fin cooperation through the both sides at power module, carries out the heat conduction to its self production and gives off, semiconductor refrigeration piece and radiator fan cooperation in the cooling subassembly that sets up through the power module top, refrigerates the cooling to power module, avoids a large amount of heats to pile up the condition that leads to power module to damage and takes place to solve the problem that proposes in the above-mentioned background art.

In order to achieve the above purpose, the utility model provides a following technical scheme:

a power module with a cooling and heat conducting function comprises a bottom plate, wherein two groups of heat conducting plates are symmetrically and fixedly mounted at the upper end of the bottom plate, a plurality of groups of radiating fins are fixedly connected to opposite sides of the two groups of heat conducting plates, a power module is arranged between the two groups of heat conducting plates, a radiating plate is detachably mounted at the tops of the two groups of heat conducting plates through bolts, a through groove is formed in the top of the radiating plate, and a cooling assembly is arranged inside the through groove;

the cooling subassembly includes semiconductor refrigeration piece and radiator fan, the fixed inside of inlaying in logical groove of semiconductor refrigeration piece, the bottom of semiconductor refrigeration piece and power module's top laminating, radiator fan is the symmetry and is provided with two sets ofly, and is two sets of radiator fan passes through connecting rod fixed mounting in the inside department placed in the middle of logical groove, and is two sets of radiator fan is located the top of semiconductor refrigeration piece.

Preferably, the through groove is located two sets of radiator fan's top fixed mounting has a dust screen, the upper end of dust screen and the top of heating panel are located same water flat line.

Preferably, two groups of inserting blocks are symmetrically installed at the tops of the two groups of heat conducting plates, four groups of inserting holes corresponding to the inserting blocks are symmetrically formed in the bottom of the heat radiating plate, and the inserting blocks are inserted into the inserting holes.

Preferably, threaded blind holes are formed in one sides of the four groups of the inserting blocks, four groups of counter bores communicated with the inserting holes are symmetrically formed in the two ends of the heat dissipation plate, the counter bores and the threaded blind holes are correspondingly arranged, and one end of each bolt penetrates through the counter bores and is connected to the inside of the threaded blind hole in a threaded mode.

Preferably, the upper sides of the two ends of the heat conducting plate are fixedly provided with limit blocks, and the limit blocks are respectively arranged at the front end and the rear end of the power module.

Preferably, four groups of threaded mounting holes are symmetrically formed in the bottom plate and are respectively located at four corners of the bottom plate.

Compared with the prior art, the beneficial effects of the utility model are that:

the utility model discloses a place power module between two sets of heat-conducting plates, a plurality of groups radiating fin cooperation through two sets of heat-conducting plates and its one side setting, carry out heat conduction to power module's both sides and give off, cooling component cooperation in the heating panel through two sets of heat-conducting plate top demountable installation, be convenient for carry out the dismouting to the heating panel, and then be convenient for maintain cooling component on the heating panel, through semiconductor refrigeration piece absorption power module production heat and to power module carry out the cooling that refrigerates in the cooling component, reduce power module's surface temperature fast, give off the heat through two sets of radiator fan cooperations, avoid a large amount of heats to pile up the condition that leads to power module to damage and take place.

Drawings

FIG. 1 is a schematic sectional view of the present invention;

FIG. 2 is an enlarged schematic view of the structure of FIG. 1;

fig. 3 is a schematic view of an axial measurement structure of the heat-conducting plate of the present invention;

fig. 4 is a schematic view of the axial measurement structure of the heat dissipation plate of the present invention.

In the figure: 1. a base plate; 2. a heat conducting plate; 3. a heat dissipating fin; 4. a power supply module; 5. a heat dissipation plate; 6. inserting a block; 7. a jack; 8. a bolt; 9. a threaded blind hole; 10. countersinking; 11. a through groove; 12. a semiconductor refrigerating sheet; 13. a connecting rod; 14. a heat-dissipating fan; 15. a dust screen; 16. a limiting block; 17. and (4) a threaded mounting hole.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution:

a power module with a cooling and heat conducting function comprises a bottom plate 1, wherein two groups of heat conducting plates 2 are symmetrically and fixedly mounted at the upper end of the bottom plate 1, a plurality of groups of radiating fins 3 are fixedly connected to opposite sides of the two groups of heat conducting plates 2, a power module 4 is arranged between the two groups of heat conducting plates 2, the two groups of heat conducting plates 2 are matched with the plurality of groups of radiating fins 3 arranged on one side of the heat conducting plates, heat conducting radiation is conducted on two sides of the power module 4, limiting blocks 16 are fixedly mounted on the upper sides of two ends of each heat conducting plate 2, the two groups of limiting blocks 16 are respectively positioned at the front end and the rear end of the power module 4, the power module 4 is convenient to be limited through the limiting blocks 16, four groups of threaded mounting holes 17 are symmetrically formed in the bottom plate 1, the four groups of threaded mounting holes 17 are respectively positioned at four corners of the bottom plate 1, and the bottom plate 1 is convenient to be mounted and fixed through the matching of the four groups of threaded mounting holes 17;

the top of the two groups of heat conducting plates 2 is detachably provided with a heat radiating plate 5 through a bolt 8, the top of each of the two groups of heat conducting plates 2 is symmetrically provided with two groups of insert blocks 6, the bottom of each heat radiating plate 5 is symmetrically provided with four groups of jacks 7 corresponding to the insert blocks 6, the insert blocks 6 are inserted into the jacks 7, one sides of the four groups of insert blocks 6 are respectively provided with a threaded blind hole 9, two ends of each heat radiating plate 5 are symmetrically provided with four groups of counter bores 10 respectively communicated with the jacks 7, the counter bores 10 and the threaded blind holes 9 are arranged correspondingly, one end of the bolt 8 penetrates through the counter bores 10 and is in threaded connection with the threaded blind holes 9, the bolt 8 is convenient to disassemble and assemble the heat radiating plate 5, so that a cooling assembly on the heat radiating plate 5 can be maintained, the top of the heat radiating plate 5 is provided with a through groove 11, and the cooling assembly is arranged inside the through groove 11;

the cooling subassembly includes semiconductor refrigeration piece 12 and radiator fan 14, semiconductor refrigeration piece 12 is fixed to be inlayed and is installed in the inside that leads to groove 11, the bottom of semiconductor refrigeration piece 12 and the top laminating of power module 4, radiator fan 14 is the symmetry and is provided with two sets ofly, two sets of radiator fan 14 pass through connecting rod 13 fixed mounting in the inside department placed in the middle that leads to groove 11, and two sets of radiator fan 14 are located the top of semiconductor refrigeration piece 12, the top fixed mounting who leads to groove 11 to be located two sets of radiator fan 14 has dust screen 15, the upper end of dust screen 15 and the top of radiator plate 5 are located same water flat line, be convenient for absorb the heat that power module 4 produced and carry out refrigeration cooling to power module 4 through semiconductor refrigeration piece 12 in the cooling subassembly, the surface temperature of fast reduction power module 4, give off the heat through the cooperation of two sets of radiator fan 14, avoid a large amount of heat to pile up the condition that leads to power module 4 to damage to take place.

The utility model discloses place power module 4 between two sets of heat-conducting plates 2 during the use, a plurality of groups radiating fin 3 cooperation through setting up of two sets of heat-conducting plates 2 and its one side, carry out the heat conduction to power module 4's both sides and give off, cooling module cooperation in heating panel 5 through 2 top demountable installation of two sets of heat-conducting plates, be convenient for carry out the dismouting to heating panel 5, and then be convenient for maintain cooling module on heating panel 5, semiconductor refrigeration piece 12 absorbs the heat that power module 4 produced and refrigerates cooling to power module 4 in the cooling module, reduce power module 4's surface temperature fast, give off the heat through the cooperation of two sets of radiator fan 14, avoid a large amount of heats to pile up the condition emergence that leads to power module 4 to damage.

The same reference numbers in different drawings identify the same or similar elements; it should be further understood that terms such as "first," "second," "third," "upper," "lower," "front," "rear," "inner," "outer," "end," "portion," "section," "width," "thickness," "zone," and the like are used herein only for convenience in reference to the figures and to merely aid in describing the invention, and are not intended to limit the invention.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. The utility model provides a power module that possesses cooling heat conduction function, includes bottom plate (1), its characterized in that: the upper end of the bottom plate (1) is symmetrically and fixedly provided with two groups of heat-conducting plates (2), a plurality of groups of radiating fins (3) are fixedly connected to the opposite sides of the two groups of heat-conducting plates (2), a power supply module (4) is arranged between the two groups of heat-conducting plates (2), the tops of the two groups of heat-conducting plates (2) are detachably provided with radiating plates (5) through bolts (8), the tops of the radiating plates (5) are provided with through grooves (11), and cooling components are arranged inside the through grooves (11);

the cooling subassembly includes semiconductor refrigeration piece (12) and radiator fan (14), semiconductor refrigeration piece (12) fixed the inlaying in the inside that leads to groove (11), the bottom of semiconductor refrigeration piece (12) and the top laminating of power module (4), radiator fan (14) are the symmetry and are provided with two sets ofly, two sets of radiator fan (14) are located between two parties in the inside that leads to groove (11) through connecting rod (13) fixed mounting, and two sets of radiator fan (14) are located the top of semiconductor refrigeration piece (12).

2. The power module with cooling and heat conducting functions as claimed in claim 1, wherein: the dustproof net (15) is fixedly mounted above the two groups of radiating fans (14) of the through groove (11), and the upper end of the dustproof net (15) and the top of the radiating plate (5) are located on the same horizontal line.

3. The power module with cooling and heat conducting functions as claimed in claim 1, wherein: two groups of inserting blocks (6) are symmetrically installed at the tops of the two groups of heat conducting plates (2), four groups of inserting holes (7) corresponding to the inserting blocks (6) are symmetrically formed in the bottom of the heat radiating plate (5), and the inserting blocks (6) are inserted into the inserting holes (7).

4. The power module with cooling and heat conducting functions as claimed in claim 3, wherein: threaded blind holes (9) are formed in one sides of the four groups of inserting blocks (6), four groups of counter bores (10) communicated with the inserting holes (7) are symmetrically formed in the two ends of the heat dissipation plate (5), the counter bores (10) and the threaded blind holes (9) are arranged correspondingly, and one end of each bolt (8) penetrates through the counter bores (10) and is connected to the inside of the threaded blind holes (9) in a threaded mode.

5. The power module with cooling and heat conducting functions as claimed in claim 1, wherein: the heat-conducting plate (2) is characterized in that limit blocks (16) are fixedly mounted on the upper sides of the two ends of the heat-conducting plate (2), and the limit blocks (16) are located at the front end and the rear end of the power module (4) respectively.

6. The power module with cooling and heat conducting functions as claimed in claim 1, wherein: four groups of thread mounting holes (17) are symmetrically formed in the bottom plate (1), and the four groups of thread mounting holes (17) are respectively located at four corners of the bottom plate (1).

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