CN218039259U

CN218039259U - Diode packaging structure

Info

Publication number: CN218039259U
Application number: CN202221783125.2U
Authority: CN
Inventors: 钟平权; 王焦; 钟剑锋
Original assignee: Foshan Tongke Electronics Co ltd
Current assignee: Foshan Tongke Electronics Co ltd
Priority date: 2022-07-12
Filing date: 2022-07-12
Publication date: 2022-12-13
Anticipated expiration: 2032-07-12

Abstract

The utility model discloses a diode packaging structure, which relates to the technical field of diode packaging and solves the problem that the space between an epoxy resin sleeve and a packaging fixing frame is easy to break in the prior art, and comprises a packaging fixing frame, wherein the top end of the packaging fixing frame is fixedly connected with the epoxy resin sleeve, and a lens is arranged in the epoxy resin sleeve; still include two sets of and epoxy cover swing joint's semicircle snap ring, the draw-in groove with semicircle snap ring looks adaptation is seted up to the surface of epoxy cover, this diode packaging structure, through being provided with reinforcing component, and then strengthen the effect of cover with the second through the first reinforcing in the reinforcing component and advance the draw-in groove with the semicircle snap ring card, the effect through thread groove on the spliced pole and fixed screw is fixed with first reinforcing cover and second reinforcing cover this moment, consequently, consolidate the connection between epoxy cover and the encapsulation mount, and then solved among the prior art easy cracked problem between epoxy cover and the encapsulation mount.

Description

Diode packaging structure

Technical Field

The utility model relates to a diode packaging technology field specifically is a diode packaging structure.

Background

In electronics, it not only plays a role in mounting, fixing, sealing, protecting the chip and enhancing the electrothermal performance, but also is connected to the pins of the package housing by wires through the contacts on the chip, and these pins are connected to other devices by wires on the printed circuit board, thereby realizing the connection of the internal chip with the external circuit.

At present, the encapsulation of a diode generally comprises an encapsulation fixing frame, an epoxy resin sleeve and a lens, a luminous body of the diode is installed in the lens, and a pin extends to the bottom end of the encapsulation fixing frame, and as the connection of the epoxy resin sleeve between the fixing frames is generally formed by adhesive bonding or the epoxy resin is directly bonded on the encapsulation fixing frames in a hot melting mode, the epoxy resin sleeve is easily broken between the encapsulation fixing frames, so that the encapsulation performance of the encapsulation is damaged, and the diode can be damaged and cannot be used, therefore, a diode encapsulation structure is provided.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a be favorable to consolidating the life's that avoids the fracture to improve the diode packaging structure to being connected between epoxy cover and the encapsulation mount to solve the problem of proposing among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a diode packaging structure comprises a packaging fixing frame, wherein the top end of the packaging fixing frame is fixedly connected with an epoxy resin sleeve, and a lens is arranged in the epoxy resin sleeve; the clamping groove is matched with the semicircular clamping ring; the reinforcing component is arranged on the outer surface of the packaging fixing frame and is connected with the semicircular clamping ring; and the protection assembly is used for protecting the positive and negative electrode pins of the diode and is connected with the packaging fixing frame, so that the connection between the epoxy resin sleeve and the packaging fixing frame is reinforced, the fracture is avoided, and the service life of the diode is prolonged.

Preferably, consolidate the subassembly including install in the first cover and the second that consolidates of encapsulation mount surface reinforce the cover, first reinforce the cover with the second reinforce the cover respectively with two sets of semicircle snap ring fixed connection, and the first inner wall fixedly connected with that reinforces the cover with encapsulation mount swing joint's spliced pole, the thread groove has been seted up to the one end of spliced pole, just the through-hole has been seted up on the second reinforcement cover, install in the through-hole with thread groove threaded connection's fixed screw is favorable to consolidating the connection between epoxy cover and the encapsulation mount.

Preferably, the protection component comprises a connecting sheet movably connected with the packaging fixing frame, the outer surface of the connecting sheet is fixedly connected with a rubber ring movably connected with the packaging fixing frame, a groove matched with the rubber ring is formed in the packaging fixing frame, and one end of the connecting sheet is fixedly connected with a protective sleeve matched with the positive pin and the negative pin of the diode, so that the positive pin and the negative pin of the diode can be protected.

Preferably, one end of the fixing screw is tapered, so that the fixing screw can be conveniently inserted into the thread groove at one end of the connecting column.

Preferably, the first reinforcing sleeve, the second reinforcing sleeve and the semicircular clamping ring are made of transparent plastic materials in an equal position, and influence on light emitting of the diode is avoided.

Preferably, the connecting column penetrates through a lamp holder of the diode and is positioned at the bottom end of the diode light-emitting source, so that the influence on the light emission of the diode light-emitting body is avoided.

Compared with the prior art, the beneficial effects of the utility model are that:

the utility model discloses a be provided with the reinforcement subassembly, and then strengthen the effect of cover through the first reinforcement cover in the reinforcement subassembly and the second and strengthen in advancing the draw-in groove with the semicircle snap ring card, the effect through thread groove on the spliced pole and fixed screw is fixed first reinforcement cover and second reinforcement cover this moment, consequently consolidates the connection between epoxy cover and the encapsulation mount, and then has solved among the prior art easy cracked problem between epoxy cover and the encapsulation mount.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of the overall split structure of the present invention;

FIG. 3 is a schematic view of the structure of the area A in FIG. 2 according to the present invention;

FIG. 4 is a schematic view of the partial cross-sectional structure of the present invention;

fig. 5 is a schematic view of the structure of the region B in fig. 4 according to the present invention.

In the figure: 1-packaging the fixing frame; 2-epoxy resin sleeve; 3-a lens; 4-semicircular snap ring; 5-a clamping groove; 6-a reinforcement component; 7-a protective component; 8-a first reinforcing sleeve; 9-a second reinforcing sleeve; 10-connecting column; 11-thread groove; 12-a through hole; 13-a set screw; 14-connecting pieces; 15-rubber ring; 16-a groove; 17-protective sheath.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Example 1

Referring to fig. 1 and fig. 2 for describing embodiment 1, a diode package structure in the figure includes a package fixing frame 1, an epoxy resin sleeve 2 is fixedly connected to a top end of the package fixing frame 1, and a lens 3 is installed in the epoxy resin sleeve 2; the epoxy resin sleeve is characterized by also comprising two groups of semicircular clamping rings 4 movably connected with the epoxy resin sleeve 2, wherein the outer surface of the epoxy resin sleeve 2 is provided with clamping grooves 5 matched with the semicircular clamping rings 4; the reinforcing component 6 is arranged on the outer surface of the packaging fixing frame 1 and is connected with the semicircular clamping ring 4, and the reinforcing component 6 is used for reinforcing the connection between the packaging fixing frame 1 and the epoxy resin sleeve 2 under the action of the semicircular clamping ring 4 and the clamping ring; and the protection assembly 7 is used for protecting the positive and negative pins of the diode, and the protection assembly 7 is connected with the encapsulation fixing frame 1.

Please refer to fig. 2, fig. 4 and fig. 5, the reinforcing assembly 6 in the figure includes a first reinforcing sleeve 8 and a second reinforcing sleeve 9 installed on the outer surface of the package fixing frame 1, the first reinforcing sleeve 8 and the second reinforcing sleeve 9 are respectively fixedly connected with two sets of semicircular snap rings 4, the inner wall of the first reinforcing sleeve 8 is fixedly connected with a connecting column 10 movably connected with the package fixing frame 1, one end of the connecting column 10 is provided with a thread groove 11, the second reinforcing sleeve 9 is provided with a through hole 12, and a fixing screw 13 in threaded connection with the thread groove 11 is installed in the through hole 12.

Referring to fig. 2 and 3, the protection assembly 7 shown in the figure includes a connection sheet 14 movably connected to the package fixing frame 1, a rubber ring 15 movably connected to the package fixing frame 1 is fixedly connected to an outer surface of the connection sheet 14, a groove 16 adapted to the rubber ring 15 is formed in the package fixing frame 1, and a protection sleeve 17 adapted to positive and negative pins of the diode is fixedly connected to one end of the connection sheet 14.

In this embodiment, when strengthening the packaging structure, this moment through with first reinforcement cover 8 and second reinforcement cover 9 together, two sets of semicircle snap rings 4 will block into draw-in groove 5 this moment, set up the effect of screw thread groove 11 that has on fixed screw 13 and the spliced pole 10 this moment, and then it is fixed in encapsulation mount 1 with first reinforcement cover 8 and second reinforcement cover 9, and then through the effect of snap ring and draw-in groove 5, and then be convenient for increase the stability of being connected between epoxy cover 2 and the encapsulation mount 1, avoid epoxy cover 2 in the connection fracture between encapsulation mount 1, and protect the positive and negative pin of diode through protective sheath 17 that sets up, avoid positive and negative pin rupture to influence the use of diode.

Example 2

Referring to fig. 1 and 2 for describing the embodiment 2, the embodiment further describes the embodiment 1, in which one end of the fixing screw 13 is tapered, the first reinforcing sleeve 8, the second reinforcing sleeve 9 and the semicircular clamping ring 4 are made of transparent plastic material, and the connecting column 10 penetrates through the lamp holder of the diode and is located at the bottom end of the light emitting source of the diode.

In the embodiment, because one end of the fixing screw 13 is conical, the fixing screw 13 can be conveniently inserted into the thread groove 11, because the first reinforcing sleeve 8, the second reinforcing sleeve 9 and the semicircular clamping ring 4 are made of transparent plastic materials, the light emission of the diode is not affected, and because the connecting column 10 penetrates through the lamp holder of the diode and is positioned at the bottom end of the light emitting source of the diode, the connecting column 10 is prevented from shielding the light emitting body of the diode to influence the light emission.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A diode package structure, comprising:

the packaging device comprises a packaging fixing frame (1), wherein the top end of the packaging fixing frame (1) is fixedly connected with an epoxy resin sleeve (2), and a lens (3) is arranged in the epoxy resin sleeve (2);

it is characterized by also comprising:

two groups of semicircular clamping rings (4) are movably connected with the epoxy resin sleeve (2), and the outer surface of the epoxy resin sleeve (2) is provided with clamping grooves (5) matched with the semicircular clamping rings (4);

the reinforcing component (6) is arranged on the outer surface of the packaging fixing frame (1) and is connected with the semicircular clamping ring (4), and the reinforcing component (6) used for reinforcing the connection between the packaging fixing frame (1) and the epoxy resin sleeve (2) through the action of the semicircular clamping ring (4) and the clamping ring;

and the protection assembly (7) is used for protecting the positive and negative pins of the diode, and the protection assembly (7) is connected with the packaging fixing frame (1).

2. The diode package structure of claim 1, wherein: consolidate subassembly (6) including install in the first cover (8) and the second of consolidating of encapsulation mount (1) surface consolidate set (9), first consolidate set (8) with the second consolidate set (9) respectively with two sets of semicircle snap ring (4) fixed connection, and the first inner wall fixedly connected with that consolidate set (8) with encapsulation mount (1) swing joint's spliced pole (10), thread groove (11) have been seted up to the one end of spliced pole (10), just through-hole (12) have been seted up on the second consolidate set (9), install in through-hole (12) with thread groove (11) threaded connection's fixed screw (13).

3. The diode package structure of claim 1, wherein: the protection component (7) comprises a connecting piece (14) movably connected with the packaging fixing frame (1), the outer surface of the connecting piece (14) is fixedly connected with a rubber ring (15) movably connected with the packaging fixing frame (1), a groove (16) matched with the rubber ring (15) is formed in the packaging fixing frame (1), and a protective sleeve (17) matched with a positive pin and a negative pin of a diode is fixedly connected with one end of the connecting piece (14).

4. The diode package structure of claim 2, wherein: one end of the fixing screw (13) is conical.

5. The diode package structure of claim 2, wherein: the first reinforcing sleeve (8), the second reinforcing sleeve (9) and the semicircular clamping ring (4) are all made of transparent plastic materials.

6. The diode package structure of claim 2, wherein: the connecting column (10) penetrates through the lamp holder of the diode and is positioned at the bottom end of the diode light-emitting source.