CN218033275U - High-efficient heat abstractor of integrated kitchen circuit board - Google Patents
High-efficient heat abstractor of integrated kitchen circuit board Download PDFInfo
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- CN218033275U CN218033275U CN202221640228.3U CN202221640228U CN218033275U CN 218033275 U CN218033275 U CN 218033275U CN 202221640228 U CN202221640228 U CN 202221640228U CN 218033275 U CN218033275 U CN 218033275U
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- circuit board
- casing
- kuppe
- board main
- heat dissipation
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Abstract
The utility model provides a high-efficient heat abstractor of integrated kitchen circuit board, a water conservancy diversion part is installed respectively on casing upper surface left side, right side, the water conservancy diversion part includes kuppe, bellows and radiator fan device, the kuppe is installed on casing upper surface left side, right side, each the kuppe all is connected with radiator fan device through a bellows, installs on the integrated kitchen shell radiator fan device, the casing downside is equipped with a plurality of cooling parts, compares with prior art, the utility model discloses following beneficial effect has: through setting up radiator unit, replace traditional fin mode to dispel the heat, water conservancy diversion part and cooling part's design for whole radiator unit's radiating effect promotes greatly, can be fast with the heat absorption in the circuit board main part or utilize the air to derive integrated kitchen with the heat fast, reinforcing radiating effect, extension circuit board main part life.
Description
Technical Field
The utility model belongs to the technical field of the heat dissipation of integrated kitchen, in particular to high-efficient heat abstractor of integrated kitchen circuit board.
Background
Chinese patent No. CN212227142U mentions an efficient heat dissipation device for an integrated cooker, and in the background art, "the circuit board inside the conventional integrated cooker mostly just dissipates heat through a heat dissipation fin, and the heat dissipation effect is not good, so that the service life of the circuit board of the integrated cooker is seriously affected", and therefore, an efficient heat dissipation device for a circuit board of an integrated cooker is urgently needed to solve the above problems.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a high-efficient heat abstractor of integrated kitchen circuit board, the problem of proposing in the above-mentioned background art is solved to not enough that exist to prior art.
The utility model discloses a following technical scheme realizes: the utility model provides a high-efficient heat abstractor of integrated kitchen circuit board, includes: circuit board main part, fixed subassembly and radiator unit, circuit board main part movable mounting is inside fixed subassembly, radiator unit installs at the fixed subassembly upside, radiator unit includes casing, guiding component and cooling part, and the filler sets up casing upper surface left side, a guiding component is installed respectively on casing upper surface left side, right side, guiding component includes kuppe, bellows and radiator fan device, the kuppe is installed on casing upper surface left side, right side, each the kuppe all is connected with radiator fan device through a bellows, installs on the integrated kitchen shell radiator fan device, the casing downside is equipped with a plurality of cooling part.
As a preferred embodiment, the storage cavity is arranged inside the shell, the left side of the storage cavity is communicated with the filling port, and the filling port is movably provided with a sealing plug.
As a preferred embodiment, the mounting hole penetrates through the left side and the right side of the upper surface of the shell up and down, the air guide sleeve is connected to the shell through the mounting hole in a threaded mode, and a gap between the shell and the circuit board main body is communicated with the inside of the air guide sleeve.
As a preferred embodiment, a plurality of cooling unit sets up the casing lower surface, cooling unit includes contact piece, communicating pipe, contact piece upper surface left side, right side are equipped with a communicating pipe respectively, contact piece lower surface and the laminating of circuit board main part upper surface.
As a preferred embodiment, a heat absorption cavity is arranged inside the contact block, the heat absorption cavity is communicated with the inside of a storage cavity through two communicating pipes, and distilled water is filled in the storage cavity.
As a preferred embodiment, the lower surface of the contact block is designed to be smooth, the contact block is actually a thin copper sheet shell with an equilateral trapezoid shape, and the heat-conducting silicone grease is smeared between the lower surface of the contact block and the circuit board main body.
After the technical scheme is adopted, the beneficial effects of the utility model are that: through setting up radiator unit, replace traditional fin mode to dispel the heat, water conservancy diversion part and cooling part's design for whole radiator unit's radiating effect promotes greatly, can be fast with the heat absorption in the circuit board main part or utilize the air to derive integrated kitchen with the heat fast, reinforcing radiating effect, extension circuit board main part life.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
Fig. 1 is the overall structure schematic diagram of the high-efficient heat abstractor of integrated kitchen circuit board of the utility model.
Fig. 2 is the schematic diagram of the internal structure of the heat dissipation assembly of the high-efficiency heat dissipation device for integrated stove circuit board of the present invention.
Fig. 3 is an enlarged schematic view of the cooling component of the high-efficiency heat dissipation device for integrated stove circuit board of the present invention.
Fig. 4 is a schematic view of a flow guiding component of the high-efficiency heat dissipation device for the integrated stove circuit board of the present invention.
In the figure, 1-a circuit board main body, 2-a fixed assembly, 3-a heat dissipation assembly, 4-a filling port, 5-a flow guide component, 6-a shell, 7-a cooling component, 8-a heat absorption cavity, 9-a contact block, 10-a communicating pipe, 11-a flow guide cover, 12-a corrugated pipe and 13-a heat dissipation fan device.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1 to 4, the present invention provides a technical solution: the utility model provides a high-efficient heat abstractor of integrated kitchen circuit board, includes: circuit board main part 1, fixed subassembly 2 and radiator unit 3, 1 movable mounting of circuit board main part is inside fixed subassembly 2, radiator unit 3 installs at 2 upsides of fixed subassembly, radiator unit 3 includes casing 6, guide part 5 and cooling part 7, filler 4 sets up on 6 upper surfaces of casing left sides, a guide part 5 is installed respectively on 6 upper surfaces of casing left sides, right side, guide part 5 includes kuppe 11, bellows 12 and radiator fan device 13, kuppe 11 is installed on 6 upper surfaces of casing left sides, right side, each kuppe 11 all is connected with radiator fan device 13 through a bellows 12, install radiator fan device 13 on the integrated kitchen shell, 6 downside of casing is equipped with a plurality of cooling part 7.
The storage chamber sets up inside casing 6, and storage chamber left side and filling port 4 intercommunication, and filling port 4 movable mounting has the sealing plug, and the storage chamber is used for saving the coolant liquid.
As an embodiment of the present invention, please refer to fig. 1, fig. 1 and fig. 4, the mounting hole runs through the left side of the upper surface of the casing 6 from top to bottom, the right side, the air guide sleeve 11 is connected to the casing 6 through the mounting hole threads, the gap between the casing 6 and the circuit board main body 1 is communicated with the inside of the air guide sleeve 11, in practical use, when the temperature around the circuit board main body 1 is high, the heat dissipation fan device 13 in the air guide member 5 is started (the heat dissipation fan device 13 adopts a general fan in the market, the temperature control starting fan is the prior art, which is not described herein), the heat dissipation fan device 13 takes out the air in the air guide sleeve 11 through the corrugated tube 12 to the outside of the integrated cooker shell, the air pressure in the air guide sleeve 11 is reduced, because the air guide sleeve 11 is connected to the casing 6 through the mounting hole threads, and the gap between the casing 6 and the circuit board main body 1 is communicated with the inside of the air guide sleeve 11, the hot air in the gap between the casing 6 and the circuit board main body 1 enters the air guide sleeve 11 under the air pressure effect, and the gap between the casing 6 and the circuit board main body 1 is reduced, thereby the circuit board main body can cool down the circuit board main body 1.
As an embodiment of the present invention, please refer to fig. 1, fig. 2 and fig. 3, a plurality of cooling units 7 are disposed on the lower surface of the housing 6, the cooling unit 7 includes a contact block 9, a communicating pipe 10, the left side of the upper surface of the contact block 9, the right side is provided with a communicating pipe 10, the lower surface of the contact block 9 is attached to the upper surface of the circuit board main body 1, in practical use, when the temperature on the circuit board main body 1 is higher, because the lower surface of the contact block 9 is smooth, the lower surface of the contact block 9 is attached to the upper surface of the circuit board main body, and the heat-conducting silicone grease is coated between the lower surface of the contact block 9 and the circuit board main body 1, this enables the temperature on the circuit board main body 1 to be conducted to the contact block 9 quickly, and then because the heat absorption cavity 8 is disposed inside the contact block 9, the heat absorption cavity 8 is communicated with the inside of the storage cavity through two communicating pipes 10, and there is distilled water in the storage cavity, the distilled water distributed in the filling cavity 8 and the communicating pipe 10 can absorb the heat from the contact block 9, the heat on the communicating pipe 10, thereby greatly improving the heat dissipation effect of the whole heat dissipation assembly 3, and prolonging the service life of the circuit board main body 1.
The heat absorption cavity 8 is arranged inside the contact block 9, the heat absorption cavity 8 is communicated with the inside of the storage cavity through two communicating pipes 10, and distilled water is filled in the storage cavity and used for dissipating heat of the circuit board main body 1.
The lower surface of the contact block 9 is designed smoothly, the contact block 9 is actually an equilateral trapezoid thin copper sheet shell 6, and heat-conducting silicone grease is smeared between the lower surface of the contact block 9 and the circuit board main body 1 and used for rapidly leading heat on the circuit board main body 1 into the contact block 9.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. An efficient heat dissipation device for an integrated stove circuit board comprises: circuit board main part (1), fixed subassembly (2) and radiator unit (3), circuit board main part (1) movable mounting is inside fixed subassembly (2), radiator unit (3) are installed at fixed subassembly (2) upside, its characterized in that, radiator unit (3) include casing (6), water conservancy diversion part (5) and cooling part (7), casing (6) upper surface left side is equipped with filler (4), one water conservancy diversion part (5) is installed respectively on casing (6) upper surface left side, right side, water conservancy diversion part (5) are including kuppe (11), bellows (12) and radiator fan device (13), kuppe (11) are installed on casing (6) upper surface left side, right side, each kuppe (11) all are connected with radiator fan device (13) through a bellows (12), radiator fan device (13) are installed on integrated kitchen shell, casing (6) downside is equipped with a plurality of cooling part (7).
2. The efficient heat dissipation device for the integrated cooker circuit board as claimed in claim 1, wherein: the storage cavity is formed in the shell (6), the left side of the storage cavity is communicated with the filling port (4), and the filling port (4) is movably provided with a sealing plug.
3. The efficient heat dissipation device for the integrated cooker circuit board as claimed in claim 1, wherein: run through from top to bottom casing (6) upper surface left side, right side, kuppe (11) pass through mounting hole threaded connection on casing (6), inside and casing (6) of kuppe (11) and circuit board main part (1) between the clearance intercommunication.
4. The efficient heat dissipation device for the integrated cooker circuit board as claimed in claim 1, wherein: casing (6) lower surface is equipped with a plurality of cooling part (7), cooling part (7) are including contact piece (9), communicating pipe (10), contact piece (9) upper surface left side, right side are equipped with one communicating pipe (10) respectively, contact piece (9) lower surface and circuit board main part (1) upper surface laminating.
5. The efficient heat dissipation device for the integrated cooker circuit board as claimed in claim 2 or 4, wherein: the contact block (9) is internally provided with a heat absorption cavity (8), the heat absorption cavity (8) is communicated with the interior of the storage cavity through two communicating pipes (10), and distilled water is filled in the storage cavity.
6. The efficient heat dissipation device for the integrated cooker circuit board as recited in claim 4, wherein: the lower surface of the contact block (9) is designed smoothly, the contact block (9) is actually an equilateral trapezoid thin copper sheet shell (6), and heat-conducting silicone grease is smeared between the lower surface of the contact block (9) and the circuit board main body (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221640228.3U CN218033275U (en) | 2022-06-29 | 2022-06-29 | High-efficient heat abstractor of integrated kitchen circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221640228.3U CN218033275U (en) | 2022-06-29 | 2022-06-29 | High-efficient heat abstractor of integrated kitchen circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218033275U true CN218033275U (en) | 2022-12-13 |
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ID=84378537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221640228.3U Active CN218033275U (en) | 2022-06-29 | 2022-06-29 | High-efficient heat abstractor of integrated kitchen circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218033275U (en) |
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2022
- 2022-06-29 CN CN202221640228.3U patent/CN218033275U/en active Active
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