CN218473707U

CN218473707U - High power controller heat radiation structure

Info

Publication number: CN218473707U
Application number: CN202222532681.9U
Authority: CN
Inventors: 杨振国; 刘全; 王芳永
Original assignee: Jiangsu Easyland Automotive Science & Technology Co ltd
Current assignee: Jiangsu Easyland Automotive Science & Technology Co ltd
Priority date: 2022-09-23
Filing date: 2022-09-23
Publication date: 2023-02-10
Anticipated expiration: 2032-09-23

Abstract

The utility model discloses a high power controller heat radiation structure, the controller includes the base and installs in inboard high-pressure filter assembly of base and electronic components, be provided with the heat dissipation water course in the base, wherein, be provided with inside sunken heat dissipation water cavity on the surface of base, heat dissipation water cavity and heat dissipation water course intercommunication, and arrange corresponding high-pressure filter assembly's position, thereby with high-pressure filter assembly's whole back heat transfer, be provided with the water course board of a style of calligraphy on the base, water course board and heat dissipation water course intercommunication, a plurality of electronic components paste and lean on the setting of water course board. The high-power controller heat dissipation structure optimizes the arrangement of the heat dissipation water channels aiming at the defects of the existing controller heat dissipation structure, particularly increases the heat dissipation water cavity to enlarge the heat conduction surface, simplifies the structure of the water channel plate, meets the heat dissipation requirement of the silicon carbide part of the electronic component, reduces the processing cost, ensures the working performance of the component, and prolongs the service life of the controller, and is more effective and sufficient in overall heat dissipation.

Description

High power controller heat radiation structure

Technical Field

The utility model relates to a controller technical field especially relates to a high power controller heat radiation structure.

Background

With the development of social ecology, people seek higher quality of life. Energy conservation and emission reduction are taken as a life style advocated by people at present, and people are continuously required to pay more attention to innovation and use of new energy resources. New fuel cell energy, as a trend in current development, is constantly and autonomously innovated and changed to meet higher demanding lifestyles. Fuel-powered vehicles will be slowly diluted and the evolving hydrogen fuel cells and associated control unit components are constantly impacting our vision.

The heat dissipation technology of electronic components mainly comprises an air cooling technology and a liquid cooling technology at present. The air cooling technology comprises a natural convection air cooling technology and a forced convection air cooling technology, the natural convection air cooling technology is mainly used for electronic devices with small heating per unit volume, the forced convection air cooling technology is generally combined with a heat pipe technology for use, but the heat pipe has the problems of small effective heat transfer area, large heat resistance with a radiator, low single heat transfer efficiency, poor compactness and the like. At present, the cooling problem of electronic devices with larger heat generation per unit volume is generally solved by adopting a liquid cooling technology, and aiming at the high working environment temperature, compact space volume and large control power of the high-power density frequency conversion controller, the heat dissipation requirement of the high-power density frequency conversion controller is difficult to meet by adopting a common liquid cooling cold plate.

Fig. 4 and 5 show a heat dissipation structure of a conventional controller, in which an electronic component 1 ' and a high voltage filter assembly 2 ' are mounted on a base 3 ', a water channel plate 4 ' is disposed between the electronic component 1 ' and the base 3 ', a heat conduction pad 5 ' is disposed between the high voltage filter assembly 2 ' and the base 3 ', an inlet and outlet water channel 6 ' is disposed on the base 3 ', and a medium in the water channel flows to take away heat of the high voltage filter assembly 2 ' and the electronic component 1 ', thereby achieving integral heat dissipation. However, practical use has found the following problems: 1) Because the area of the high-voltage filter component 2 ' is close to the interface of the water inlet and outlet channel 6 ', only a narrower area is used for heat dissipation, and the rest of the lower area adopts the cavity 7 ' for heat conduction and dissipation, the heat dissipation effect is poor; 2) The heat is conducted in the area of the electronic component 1 ' through the water channel plate 4 ', so that the water channel plate 4 ' has a complex structure and higher processing cost.

SUMMERY OF THE UTILITY MODEL

Based on the problem, an object of the utility model is to provide a high power controller heat radiation structure optimizes the heat radiation structure of current controller, improves the radiating effect, lowers the radiating element cost, satisfies high power controller's heat dissipation requirement.

In order to achieve the purpose, the utility model adopts the following technical proposal:

the utility model provides a high power controller heat radiation structure, the controller includes the base and installs in inboard high pressure filter subassembly of base and electronic components, be provided with the heat dissipation water course in the base, wherein, be provided with inside sunken heat dissipation water cavity on the surface of base, heat dissipation water cavity and heat dissipation water course intercommunication, and arrange corresponding high pressure filter subassembly's position, thereby with the whole back heat transfer of high pressure filter subassembly, be provided with the water channel board of a style of calligraphy on the base, water channel board and heat dissipation water course intercommunication, a plurality of electronic components paste and lean on the water channel board and set up.

Particularly, other electronic components are arranged by being attached to the inner side wall of the base and exchange heat with the heat dissipation water cavity.

Particularly, a heat conducting pad with the size larger than the bottom area of the heat dissipation water cavity is arranged between the high-voltage filter assembly, the electronic component and the inner side wall of the base.

Particularly, more than one heat dissipation water cavity is arranged and distributed on the water inlet section and the water outlet section of the heat dissipation water channel.

Particularly, the outer wall of the base is provided with a cover plate for sealing the heat dissipation water cavity, and a sealing ring is arranged between the cover plate and the base.

Particularly, a water inlet and a water outlet which are communicated with the heat dissipation water channel are arranged on the base, and the water inlet and the water outlet are far away from the arrangement.

To sum up, the beneficial effects of the utility model are that, high power controller heat radiation structure has optimized arranging of heat dissipation water course to current controller heat radiation structure's defect, has especially increased the heat dissipation water cavity in order to enlarge the heat conduction face to simplify the structure of water channel board, when satisfying electronic components carborundum part heat dissipation requirement, reduced the processing cost, whole heat dissipation is more effective, abundant, has guaranteed components and parts working property, has improved controller life.

Drawings

Fig. 1 is a schematic view of a heat dissipation structure of a high power controller according to an embodiment of the present invention;

fig. 2 is an external view of a heat dissipation structure of a high power controller according to an embodiment of the present invention;

fig. 3 is a schematic cross-sectional view of a heat dissipation structure of a high power controller according to an embodiment of the present invention;

FIG. 4 is a diagram of a heat dissipation structure of a conventional controller;

fig. 5 is a schematic cross-sectional view of fig. 4.

Detailed Description

Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar parts throughout, or parts having the same or similar functions. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, unless otherwise expressly specified or limited, the terms "connected," "connected," and "fixed" are to be construed broadly and can include, for example, fixed or removable connections, mechanical or electrical connections, direct connections, indirect connections through an intermediary, communication between two elements, or an interaction between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the description of the present invention, unless otherwise expressly specified or limited, the first feature "on" or "under" the second feature may include both the first and second features being in direct contact, and may also include the first and second features being in contact, not in direct contact, but with another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The technical solution of the present invention is further explained by the following embodiments with reference to the accompanying drawings.

Referring to fig. 1 to 3, the preferred embodiment provides a heat dissipation structure of a high power controller, where the controller includes a base 3, and a high voltage filter assembly 2 and an electronic component 1 mounted inside the base 3, and a heat dissipation water channel 6 is disposed in the base 3.

Wherein, be provided with inside sunken heat dissipation water cavity 7 on the surface of base 3, heat dissipation water cavity 7 and heat dissipation water course 6 intercommunication to correspond the position of high pressure filter assembly 2 and arrange, thereby with the whole back heat transfer of high pressure filter assembly 2.

Be provided with the water course board 4 of a style of calligraphy on the base 3,

water course board

4 and 6 intercommunications of heat dissipation water course, a plurality of electronic components 1 paste and lean on water course board 4 to do the heat dissipation of reinforceing to electronic components 1's carborundum part. In addition, the electronic component 1 can also be arranged by being attached to the inner side wall of the base 3 like the high-voltage filter component 2, and exchanges heat with the heat dissipation water cavity 7 to achieve the purpose of heat dissipation.

Particularly, a heat conducting pad 5 with the size larger than the bottom area of the heat dissipation water cavity 7 is arranged between the inner side walls of the high-voltage filter assembly 2, the electronic component 1 and the base 3, so that the heat dissipation function of the high-voltage filter assembly 2 and the electronic component 1 is enhanced, and the heat dissipation is more sufficient.

The heat dissipation water cavity 7 is provided with more than one, preferably distributed on the water inlet section and the water outlet section of the heat dissipation water channel 6, the base 3 is provided with the water inlet 8 and the water outlet 9 communicated with the heat dissipation water channel 6, heat exchange is better performed through the temperature difference at the water inlet and the water outlet, and the water inlet 8 and the water outlet 9 are far away from arrangement as far as possible, so that the heat conduction area is increased.

The outer wall of the base 3 is provided with a cover plate for sealing the heat dissipation water cavity 7, and a sealing ring is arranged between the cover plate and the base 3.

In conclusion, the high-power controller heat dissipation structure optimizes the arrangement of the heat dissipation water channels aiming at the defects of the existing controller heat dissipation structure, particularly increases the heat dissipation water cavities to enlarge the heat conduction surface, simplifies the structure of the water channel plate, meets the heat dissipation requirements of the silicon carbide part of the electronic component, reduces the processing cost, ensures the working performance of the component, and prolongs the service life of the controller, and is more effective and sufficient in overall heat dissipation.

The above embodiments have been merely illustrative of the basic principles and features of the present invention, and the present invention is not limited by the above embodiments, and does not depart from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a high power controller heat radiation structure, the controller includes the base and installs in inboard high pressure filter subassembly and electronic components of base, be provided with the heat dissipation water course in the base, its characterized in that, be provided with inside sunken heat dissipation water cavity on the surface of base, heat dissipation water cavity with heat dissipation water course intercommunication, and correspond high pressure filter subassembly's position is arranged to with the whole back heat transfer of high pressure filter subassembly, be provided with the water channel board of a style of calligraphy on the base, the water channel board with heat dissipation water course intercommunication, a plurality of electronic components paste and lean on the water channel board sets up.

2. The heat dissipation structure of high power controller of claim 1, wherein: and electronic components are arranged by being attached to the inner side wall of the base and exchange heat with the heat dissipation water cavity.

3. The heat dissipation structure of high power controller of claim 2, wherein: and a heat conducting pad with the size larger than the bottom area of the heat dissipation water cavity is arranged among the high-voltage filtering assembly, the electronic component and the inner side wall of the base.

4. The heat dissipation structure of high power controller of claim 1, wherein: the heat dissipation water cavity is provided with more than one water inlet cavity, and the water inlet cavity and the water outlet cavity are distributed on the water inlet section and the water outlet section of the heat dissipation water channel.

5. The heat dissipation structure of high power controller of claim 1, wherein: the outer wall of the base is provided with a cover plate for sealing the heat dissipation water cavity, and a sealing ring is arranged between the cover plate and the base.

6. The heat dissipation structure of high power controller of claim 1, wherein: the base is provided with a water inlet and a water outlet which are communicated with the heat dissipation water channel, and the water inlet and the water outlet are far away from the arrangement.