CN218008551U

CN218008551U - Lunch box

Info

Publication number: CN218008551U
Application number: CN202221779279.4U
Authority: CN
Inventors: 王素芬; 白云
Original assignee: Xiamen Paltier Electronic Technology Co ltd
Current assignee: Xiamen Paltier Electronic Technology Co ltd
Priority date: 2022-07-11
Filing date: 2022-07-11
Publication date: 2022-12-13
Anticipated expiration: 2032-07-11

Abstract

The utility model relates to the field of tableware, in particular to a lunch box, which comprises a box body, a support frame, a semiconductor refrigerating assembly, a PTC heating assembly and a fan, wherein the support frame is arranged inside the box body; the semiconductor refrigeration component and the PTC heating component are arranged in the box body, so that the heating and refrigeration functions of the lunch box are realized, and different use scenes can be applied; the support frame is used as a mounting plane of the semiconductor refrigeration assembly and the PTC heating assembly, the PTC heating assembly is designed on two sides of the support frame through the arrangement of the semiconductor refrigeration assembly and the fan in the length direction of the support frame, and enough heat dissipation channel space is reasonably arranged and reserved to guarantee the normal operation of each assembly.

Description

Lunch box

Technical Field

The utility model relates to a tableware field especially relates to a lunch-box.

Background

The lunch-box is often used for holding food etc. but general lunch-box can't heat and refrigerate to the content to the user demand under the different scenes of adaptation. In a chinese utility model patent with application No. CN201820286070.1, a temperature-controlled lunch box is disclosed, which realizes heat preservation and cold insulation by arranging a PTC heating sheet at the bottom of a box body and a semiconductor refrigerating sheet at the side of the box body; however, the design causes the electronic components to be too dispersed, and the difficulty in the design of maintenance, disassembly and assembly and ventilation and heat dissipation is higher.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical problem that will solve is: the lunch box has the advantages of compact structure, convenience in heat dissipation and capability of realizing heating and refrigeration.

In order to solve the technical problem, the utility model discloses a technical scheme be: the utility model provides a lunch box, includes box body, support frame, semiconductor refrigeration subassembly, PTC heating element and fan, the inside support frame that is equipped with of box body, be equipped with semiconductor refrigeration subassembly, PTC heating element and fan between support frame and the box body bottom, the length direction's of support frame both sides are located respectively to semiconductor refrigeration subassembly and fan, both sides on the support frame width direction are located to PTC heating element.

The energy guide sheet is locked on the support frame, and the semiconductor refrigeration assembly and the PTC heating assembly are both in contact with the energy guide sheet.

Furthermore, the semiconductor refrigeration assembly comprises a semiconductor, a radiator and an aluminum block, a groove is formed in the energy guide thin plate, and the aluminum block is arranged in the groove; the lower end face of the energy-conducting thin plate corresponding to the groove is abutted to the semiconductor, and the other end, far away from the energy-conducting thin plate, of the semiconductor is abutted to the radiator.

Furthermore, a first mounting groove communicated with the support frame is formed in the groove of the support frame corresponding to the energy-conducting thin plate, and the semiconductor is arranged in the first mounting groove.

Further, the radiator includes a plurality of fin side by side, the fin is equipped with the breach of stepping down along its length direction, the breach of stepping down is used for the bolt lock to pay.

Furthermore, the support frame is provided with second mounting grooves on two sides in the width direction, the PTC heating assembly comprises a PTC heating module, the PTC heating module is arranged in the second mounting grooves, and one end of the PTC heating module is abutted to the energy-guiding thin plate.

Furthermore, the fan, the support frame and the energy guide thin plate are provided with communicated locking holes, and the fan, the support frame and the energy guide thin plate are simultaneously locked.

Furthermore, the lower end face of the box body is provided with a pad foot, the bottom of the box body is provided with an air inlet hole corresponding to the fan, and one side of the box body, which is close to the semiconductor refrigeration assembly, is provided with an air outlet hole.

The beneficial effects of the utility model reside in that: the semiconductor refrigeration component and the PTC heating component are arranged in the box body, so that the heating and refrigeration functions of the lunch box are realized, and different use scenes can be applied; the support frame is used as a mounting plane of the semiconductor refrigeration assembly and the PTC heating assembly, the semiconductor refrigeration assembly and the fan are arranged in the length direction of the support frame, the PTC heating assembly is arranged on two sides of the support frame, enough heat dissipation channel space is reasonably arranged and reserved, and normal operation of the assemblies is guaranteed.

Drawings

FIG. 1 is an exploded view of a lunchbox in accordance with an embodiment of the present invention;

fig. 2 is an exploded view of the support frame, the semiconductor refrigeration assembly and the PTC heating assembly according to the embodiment of the present invention;

fig. 3 is a schematic structural view of the support frame, the semiconductor refrigeration assembly and the PTC heating assembly according to the embodiment of the present invention after being matched;

fig. 4 is a schematic structural diagram of the cartridge body according to the embodiment of the present invention.

Description of reference numerals:

1. a box body; 2. a support frame; 21. a first mounting groove; 22. a second mounting groove; 3. a semiconductor refrigeration assembly; 31. a semiconductor; 32. a heat sink; 321. a heat sink; 322. a abdication gap; 33. an aluminum block; 4. a PTC heating assembly; 5. a fan; 6. an energy conducting thin plate; 61. a groove; 7. a foot pad; 8. an air outlet; 9. and air inlet holes.

Detailed Description

In order to explain the technical content, the objects and the effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.

Referring to fig. 1 to 4, a lunch box includes a box body 1, a support frame 2, a semiconductor refrigeration component 3, a PTC heating component 4 and a fan 5, the support frame 2 is disposed inside the box body 1, the semiconductor refrigeration component 3, the PTC heating component 4 and the fan 5 are disposed between the support frame 2 and the bottom of the box body 1, the semiconductor refrigeration component 3 and the fan 5 are respectively disposed on two sides of the support frame 2 in the length direction, and the PTC heating component 4 is disposed on two sides of the support frame 2 in the width direction.

From the above description, the beneficial effects of the present invention are: the semiconductor refrigerating assembly 3 and the PTC heating assembly 4 are arranged in the box body 1, so that the heating and refrigerating functions of the lunch box are realized, and different use scenes can be applied; by support frame 2 as the mounting plane of semiconductor refrigeration subassembly 3 and PTC heating element 4, through the arrangement of semiconductor refrigeration subassembly 3 and fan 5 in support frame 2 length direction, PTC heating element 4 is in the design of support frame 2 both sides, and the normal operating of each subassembly is guaranteed in rational arrangement and reservation sufficient heat dissipation channel space.

Further, the energy-conducting thin plate 6 is further included, the energy-conducting thin plate 6 is locked on the support frame 2, and the semiconductor refrigeration component 3 and the PTC heating component 4 are both in contact with the energy-conducting thin plate 6.

As can be seen from the above description, by providing the energy guiding thin plate 6, the energy of the semiconductor refrigeration component 3 and the PTC heating component 4 is exchanged with the bowls placed in the box body 1 by the energy guiding thin plate 6, and the energy guiding thin plate 6 provides a large area of contact, thereby ensuring the efficiency of heat preservation and cold preservation.

Further, the semiconductor refrigeration component 3 comprises a semiconductor 31, a radiator 32 and an aluminum block 33, a groove 61 is formed in the energy-conducting thin plate 6, and the aluminum block 33 is arranged in the groove 61; the lower end face of the energy guiding sheet 6 corresponding to the groove 61 abuts against the semiconductor 31, and the other end of the semiconductor 31 away from the energy guiding sheet 6 abuts against the heat sink 32.

As can be seen from the above description, the aluminum block 33 is fixed by the groove 61 formed on the energy guiding thin plate 6, and the matching of the groove 61 and the aluminum block 33 can ensure that the upper end of the energy guiding thin plate 6 is a plane after assembly, so that the bowl can be conveniently placed in; the energy of the portion of the energy-conducting thin plate 6 directly contacting the semiconductor 31 is quickly transferred to the bowl placed in the case 1 by the aluminum block 33, and the heat dissipation of the semiconductor 31 is accelerated by the heat sink 32.

Furthermore, a first mounting groove 21 communicated with the support frame 2 is arranged at the position corresponding to the groove 61 of the energy-guiding thin plate 6, and the semiconductor 31 is arranged in the first mounting groove 21.

As can be seen from the above description, the contact between the semiconductor 31 and the energy guiding thin plate 6 is realized by the cooperation of the first mounting groove 21 provided on the supporting frame 2 and the groove 61 of the energy guiding thin plate 6. The setting of mounting groove type can reduce the space demand of support frame 2 and 1 bottom of box body simultaneously for 2 thicknesses of support frame can reduce the accommodation space in order to guarantee box body 1.

Further, the heat sink 32 includes a plurality of side by side heat dissipation fins 321, the heat dissipation fins 321 are provided with abdicating notches 322 along the length direction thereof, and the abdicating notches 322 are used for bolt locking.

As can be seen from the above description, the heat dissipation area is increased by the arrangement of the plurality of fins 321 arranged side by side; meanwhile, the heat sink 32 is conveniently locked and mounted by the relief notch 322 formed on the heat sink 321.

Further, the support frame 2 is provided with second mounting grooves 22 on both sides in the width direction thereof, the PTC heating assembly 4 includes a PTC heating module, the PTC heating module is provided in the second mounting grooves 22, and one end of the PTC heating module abuts against the energy guiding thin plate 6.

As can be seen from the above description, the installation and fixation of the PTC heating module are realized by the arrangement of the second installation grooves 22 on both sides of the support frame 2; meanwhile, the installation groove type arrangement can reduce the space requirement at the bottom of the support frame 2 and the box body 1, so that the thickness of the support frame 2 can be reduced to ensure the accommodating space of the box body 1.

Furthermore, the fan 5, the support frame 2 and the energy guiding thin plate 6 are provided with communicated locking holes, and the fan 5, the support frame 2 and the energy guiding thin plate 6 are simultaneously locked.

As can be seen from the above description, the fan 5, the support frame 2 and the energy-guiding thin plate 6 are provided with communicated locking holes, so that the three can be fixed at the same time when the locking holes are installed, and the assembly is accelerated.

Furthermore, the terminal surface is equipped with pad foot 7 under the box body 1, the bottom of box body 1 is equipped with fresh air inlet 9 corresponding to fan 5, box body 1 is close to semiconductor refrigeration subassembly 3 one side and is equipped with exhaust vent 8.

As can be seen from the above description, the design of the foot pad 7 on the lower end face of the box body 1 allows enough space at the bottom of the box body 1 to ensure the air flow; under the action of the fan 5, air enters through an air inlet hole 9 in the bottom of the box body 1, then is blown to the semiconductor refrigeration component 3, and then is discharged through an air outlet hole 8 in one side of the semiconductor refrigeration component 3.

Referring to fig. 1 to 4, a first embodiment of the present invention is:

the utility model discloses an use the scene and do: when heat preservation or cold preservation is needed to be carried out on food in the lunch box, in the lunch box with the heat preservation and cold preservation functions in the prior art, the PTC heating sheets are arranged at the bottom of the box body 1, and the semiconductor 31 refrigerating sheets are arranged on the side surfaces of the box body 1, so that the heat preservation and cold preservation are realized; however, the design causes the electronic components to be too dispersed, and the difficulty in maintenance, disassembly and ventilation and heat dissipation is higher.

As shown in fig. 1 to 4, the lunch box of this embodiment includes box body 1, support frame 2, semiconductor refrigeration component 3, PTC heating component 4, fan 5 and energy-conducting thin plate 6, the inside support frame 2 that is equipped with of box body 1, be equipped with semiconductor refrigeration component 3, PTC heating component 4 and fan 5 between support frame 2 and the box body 1 bottom, semiconductor refrigeration component 3 and fan 5 locate the length direction's of support frame 2 both sides respectively, PTC heating component 4 locates the both sides on the support frame 2 width direction.

As shown in fig. 1 to 3, the energy guiding sheet 6 is locked on the supporting frame 2, and both the semiconductor refrigeration assembly 3 and the PTC heating assembly 4 are in contact with the energy guiding sheet 6.

As shown in fig. 2, the semiconductor refrigeration assembly 3 includes a semiconductor 31, a heat sink 32 and an aluminum block 33, a groove 61 is formed on the energy-conducting thin plate 6, and the aluminum block 33 is disposed in the groove 61; a first mounting groove 21 communicated with the support frame 2 is formed in the position, corresponding to the groove 61 of the energy-conducting thin plate 6, of the support frame 2, and the semiconductor 31 is arranged in the first mounting groove 21; the lower end surface of the mounted energy guiding sheet 6 abuts against the semiconductor 31, and the other end of the semiconductor 31, which is away from the energy guiding sheet 6, abuts against the heat sink 32.

As shown in fig. 2 and 3, the heat sink 32 includes a plurality of side-by-side heat dissipation fins 321, the heat dissipation fins 321 are provided with relief notches 322 along the length direction thereof, and the relief notches 322 are used for bolt locking.

As shown in fig. 2 and 3, the support frame 2 is provided with second mounting grooves 22 on both sides in the width direction thereof, the PTC heating module 4 includes a PTC heating module which is provided in the second mounting grooves 22, and one end of the PTC heating module abuts against the energy guiding thin plate 6. Optionally, a hollow-out portion is arranged on the energy-conducting thin plate 6 corresponding to the second mounting groove 22, so that the PTC heating module directly contacts with the object in the box body 1; the side surface of the PTC heating module at this time is in contact with the energy conductive sheet 6 to transfer heat to the energy conductive sheet 6.

As shown in fig. 2, the fan 5, the support frame 2 and the energy guiding thin plate 6 are provided with locking holes communicated with each other, and the fan 5, the support frame 2 and the energy guiding thin plate 6 are simultaneously locked.

As shown in fig. 4, the lower end face of the box body 1 is provided with a pad 7, the bottom of the box body 1 is provided with an air inlet 9 corresponding to the fan 5, and one side of the box body 1 close to the semiconductor refrigeration component 3 is provided with an air outlet 8. Specifically, an inner container is further arranged in the box body 1, and the inner container is in contact with the energy guide thin plate 6 and the aluminum block 33.

The utility model discloses a theory of operation: when heating is needed, the bowl is placed on the energy-conducting thin plate 6, and the PTC heating assembly 4 heats the energy-conducting thin plate 6 and then conducts the energy-conducting thin plate to the bowl; when refrigeration is needed, the semiconductor refrigeration component 3 refrigerates the energy-conducting thin plate 6 and then conducts the energy-conducting thin plate to the bowl.

By arranging the PTC heating components 4 on the two sides of the support frame 2 in the width direction and arranging the semiconductor refrigeration components 3 and the fan 5 on the two sides of the support piece in the length direction, the heat generated by the semiconductor refrigeration components 3 can be quickly discharged from the fan 5 without obstruction.

In summary, the lunch box provided by the utility model realizes the heating and refrigerating functions of the lunch box by arranging the semiconductor refrigerating assembly and the PTC heating assembly in the box body, and can be applied to different use scenes; the support frame is used as a mounting plane of the semiconductor refrigeration assembly and the PTC heating assembly, the semiconductor refrigeration assembly and the fan are arranged in the length direction of the support frame, the PTC heating assembly is arranged on two sides of the support frame, enough heat dissipation channel space is reasonably arranged and reserved, and normal operation of the assemblies is guaranteed.

The above mentioned is only the embodiment of the present invention, and not the limitation of the patent scope of the present invention, all the equivalent transformations made by the contents of the specification and the drawings, or the direct or indirect application in the related technical field, are included in the patent protection scope of the present invention.

Claims

1. The utility model provides a lunch box, its characterized in that includes box body, support frame, semiconductor refrigeration subassembly, PTC heating element and fan, the inside support frame that is equipped with of box body, be equipped with semiconductor refrigeration subassembly, PTC heating element and fan between support frame and the box body bottom, the length direction's of support frame both sides are located respectively to semiconductor refrigeration subassembly and fan, the ascending both sides of support frame width direction are located to PTC heating element.

2. The lunch box according to claim 1, further comprising an energy-conducting sheet locked to the support frame, wherein the semiconductor refrigeration module and the PTC heating module are in contact with the energy-conducting sheet.

3. The lunch box according to claim 2, wherein the semiconductor refrigeration assembly comprises a semiconductor, a radiator and an aluminum block, a groove is formed in the energy-conducting thin plate, and the aluminum block is arranged in the groove; the lower end face of the energy-conducting thin plate corresponding to the groove is abutted to the semiconductor, and the other end, far away from the energy-conducting thin plate, of the semiconductor is abutted to the radiator.

4. The lunch box according to claim 3, wherein the support frame is provided with a first mounting groove communicated with the groove corresponding to the energy-guiding thin plate, and the semiconductor is arranged in the first mounting groove.

5. The lunch box of claim 3, wherein the heat sink comprises a plurality of side-by-side fins, and the fins have relief notches along their lengths, the relief notches being used for bolt locking.

6. The lunch box according to claim 2, wherein the support frame is provided with second mounting grooves on both sides in the width direction thereof, the PTC heating assembly comprises a PTC heating module, the PTC heating module is provided in the second mounting grooves, and one end of the PTC heating module abuts against the energy guiding thin plate.

7. The lunch box as claimed in claim 2, wherein the fan, the support frame and the energy-guiding sheet are provided with locking holes communicated with each other, and the fan, the support frame and the energy-guiding sheet are simultaneously locked.

8. The lunch box according to claim 1, wherein the bottom surface of the box body is provided with a foot pad, the bottom of the box body is provided with an air inlet corresponding to the fan, and the side of the box body close to the semiconductor refrigeration assembly is provided with an air outlet.