CN218003625U - Semiconductor chip testing device - Google Patents
Semiconductor chip testing device Download PDFInfo
- Publication number
- CN218003625U CN218003625U CN202220506063.4U CN202220506063U CN218003625U CN 218003625 U CN218003625 U CN 218003625U CN 202220506063 U CN202220506063 U CN 202220506063U CN 218003625 U CN218003625 U CN 218003625U
- Authority
- CN
- China
- Prior art keywords
- box
- support
- equipment box
- semiconductor chip
- slip table
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The utility model discloses a testing arrangement for semiconductor chip, its motor setting just are located the carousel below at the top of equipment box, the output shaft and the carousel of motor are connected, the detection case has set gradually feed inlet, discharge gate along the direction of rotation of carousel, the detection case has set gradually medium temperature platform, high temperature platform from the top that the feed inlet extended to the discharge gate along circumference, collect the corner that the box is located equipment box circumference, a slip table setting is on the circumference outer wall of equipment box, and the one end of slip table extends to the top of collecting the box, and the edge department of a material slide rotation dish extends to the slip table top, is located equipment box top and is provided with a second support between support and slip table, the top of second support is on a parallel with the material slide and is provided with a box of blowing, the box of blowing is connected with a fan on the back of the body in one side of unloading slide. The utility model discloses can realize cooling down the heat dissipation to the chip after the test, guarantee the security that the chip was deposited.
Description
Technical Field
The utility model relates to a processingequipment technical field of chip especially relates to a testing arrangement for semiconductor chip.
Background
With the development of the internet, semiconductor chips are applied more and more in life, the yield of the semiconductor chips is also larger and larger, and various performances of the chips need to be tested in the production process of the semiconductor chips so as to meet performance indexes.
In order to ensure that the chip used in the high-temperature environment can normally operate, the chip needs to be subjected to high-temperature testing, but the chip subjected to the high-temperature testing has higher temperature, the chip subjected to the testing is directly collected together, and the accumulated heat can cause the chip to be damaged.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a testing arrangement for semiconductor chip, this testing arrangement for semiconductor chip can realize cooling the heat dissipation to the chip after the test, avoids the chip of high temperature to pile up the condition that causes the chip to damage together, has guaranteed the security that the chip was deposited.
In order to achieve the above purpose, the utility model adopts the technical scheme that: a test apparatus for a semiconductor chip, comprising: the device comprises an equipment box, a detection box, a rotary table and a collection box, wherein the detection box is fixed at the top of the equipment box, the rotary table is arranged between the equipment box and the detection box, a motor is arranged at the top of the equipment box and is positioned below the rotary table, an output shaft of the motor is connected with the rotary table, the detection box is sequentially provided with a feed port and a discharge port along the rotation direction of the rotary table, and the detection box is sequentially provided with a medium temperature table and a high temperature table from the feed port to the top of the discharge port along the circumferential direction;
the collecting box is located the corner of equipment box circumference, and a slip table sets up on the circumference outer wall of equipment box, and the one end of slip table extends to the top of collecting the box, and the edge department of a unloading slide rotation dish extends to the slip table top, is located the equipment box top and is provided with a second support between support and slip table, the top of second support is on a parallel with the unloading slide and is provided with a box of blowing, the box of blowing is connected with a fan in one side of the unloading slide back of the body.
The further improved scheme in the technical scheme is as follows:
1. in the scheme, a first support is arranged above the discharging sliding plate, an electric push rod is arranged on the top end of the first support and back to one side of the collecting box, a vertical downward air cylinder is arranged at the tail end of the electric push rod, and a push plate is fixedly connected to the tail end of a movable rod of the air cylinder
2. In the scheme, the air outlet end of the fan is connected with the blowing box through the air guide pipe.
3. In the scheme, the surface of one side, opposite to the blanking sliding plate, of the air blowing box is provided with the air outlet holes.
4. In the scheme, a plurality of supporting plates are arranged on the circumferential outer wall of the detection box at intervals.
5. In the scheme, four corners of the bottom of the equipment box are provided with universal wheels.
Because of above-mentioned technical scheme's application, compared with the prior art, the utility model have the following advantage:
1. the utility model discloses testing arrangement for semiconductor chip, its detection case extend to the top of discharge gate along circumference from the feed inlet and have set gradually medium temperature platform, high temperature platform, on the basis of realizing the high temperature test, can satisfy the test demand under the different condition, can also carry out the capability test to a plurality of chips simultaneously, have improved the suitability and the test efficiency of device; in addition, the top of its unloading slide is provided with a first support, the top of this first support and be provided with an electric putter in one side of collecting the box back to the body, electric putter's end is provided with a vertical decurrent cylinder, the terminal fixedly connected with push pedal of movable rod of this cylinder, shift the material through the cooperation between cylinder and the electric putter, can adapt to not unidimensional chip, and compare in the mode of shifting through picking up the chip, moreover, the steam generator is simple in structure, reliability, also effectively avoid snatching the inconsistent condition that causes the chip to damage of dynamics, the suitability of device is improved, reliability.
2. The utility model discloses testing arrangement for semiconductor chip, it is located the equipment box top and be provided with a second support between support and slip table, and the top of second support is on a parallel with the unloading slide and is provided with a box of blowing, and the box of blowing is connected with a fan in one side of unloading slide back of the body mutually, can realize cooling the heat dissipation to the chip after the test, avoids the chip of high temperature to pile up the condition that causes the chip to damage together, has guaranteed the security that the chip was deposited.
Drawings
FIG. 1 is a schematic view of the overall structure of the semiconductor chip testing apparatus of the present invention;
fig. 2 is an enlarged schematic view of the utility model at a in fig. 1;
FIG. 3 is a schematic view showing a partial structure of the testing apparatus for semiconductor chips according to the present invention;
fig. 4 is a schematic view of a partial structure of the testing apparatus for semiconductor chips according to the present invention.
In the drawings above: 1. an equipment box; 2. a detection box; 3. a turntable; 4. a collection box; 5. a motor; 6. a feed inlet; 7. a discharge port; 8. a medium temperature stage; 9. a high temperature stage; 10. a sliding table; 11. a blanking sliding plate; 12. a first bracket; 13. an electric push rod; 14. a cylinder; 15. pushing a plate; 16. a second bracket; 17. a blowing box; 18. a fan; 19. a support plate; 20. a universal wheel.
Detailed Description
In the description of this patent, it is noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The meaning of the above terms in this patent may be specifically understood by those of ordinary skill in the art.
The invention will be further described with reference to the following examples:
example 1: a test apparatus for a semiconductor chip, comprising: the device comprises an equipment box 1, a detection box 2, a rotary table 3 and a collection box 4, wherein the detection box 2 is fixed at the top of the equipment box 1, the rotary table 3 is arranged between the equipment box 1 and the detection box 2, a motor 5 is arranged at the top of the equipment box 1 and is positioned below the rotary table 3, an output shaft of the motor 5 is connected with the rotary table 3, the detection box 2 is sequentially provided with a feed inlet 6 and a discharge outlet 7 along the rotation direction of the rotary table 3, and the detection box 2 is sequentially provided with a medium temperature table 8 and a high temperature table 9 from the feed inlet 6 to the top of the discharge outlet 7 along the circumferential direction;
collect box 4 and be located the corner of 1 circumference of equipment box, a slip table 10 sets up on the circumference outer wall of equipment box 1, and the one end of slip table 10 extends to the top of collecting box 4, and a unloading slide 11 extends to slip table 10 top from the edge department of carousel 3, is located 1 top of equipment box and is provided with a second support 16 between support 12 and slip table 10, the top of second support 16 is on a parallel with unloading slide 11 and is provided with a box 17 that blows, box 17 that blows is connected with a fan 18 on the back of the body in one side of unloading slide 11.
A first support 12 is arranged above the blanking sliding plate 11, an electric push rod 13 is arranged at the top end of the first support 12 and on the side opposite to the collecting box 4, a vertically downward cylinder 14 is arranged at the tail end of the electric push rod 13, and a push plate 15 is fixedly connected to the tail end of a movable rod of the cylinder 14.
The air outlet end of the fan 18 is connected with the blowing box 17 through an air duct.
Four corners of the bottom of the equipment box 1 are provided with universal wheels 20.
Example 2: a test apparatus for a semiconductor chip, comprising: the device comprises an equipment box 1, a detection box 2, a rotary table 3 and a collection box 4, wherein the detection box 2 is fixed at the top of the equipment box 1, the rotary table 3 is arranged between the equipment box 1 and the detection box 2, a motor 5 is arranged at the top of the equipment box 1 and is positioned below the rotary table 3, an output shaft of the motor 5 is connected with the rotary table 3, the detection box 2 is sequentially provided with a feed inlet 6 and a discharge outlet 7 along the rotation direction of the rotary table 3, and the detection box 2 is sequentially provided with a medium temperature table 8 and a high temperature table 9 from the feed inlet 6 to the top of the discharge outlet 7 along the circumferential direction;
collect box 4 and be located the corner of 1 circumference of equipment box, a slip table 10 sets up on the circumference outer wall of equipment box 1, and the one end of slip table 10 extends to the top of collecting box 4, and a unloading slide 11 extends to slip table 10 top from the edge department of carousel 3, is located 1 tops of equipment box and is provided with a second support 16 between support 12 and slip table 10, the top of second support 16 is on a parallel with unloading slide 11 and is provided with a box 17 that blows, box 17 that blows is connected with a fan 18 on the back of the body in one side of unloading slide 11.
A first support 12 is arranged above the blanking sliding plate 11, an electric push rod 13 is arranged at the top end of the first support 12 and on the side opposite to the collecting box 4, a vertical downward cylinder 14 is arranged at the tail end of the electric push rod 13, and a push plate 15 is fixedly connected to the tail end of a movable rod of the cylinder 14.
The air outlet end of the fan 18 is connected with the blowing box 17 through an air duct.
The surface of one side of the blowing box 17 opposite to the blanking sliding plate 11 is provided with a plurality of air outlet holes.
The circumferential outer wall of the detection box 2 is provided with a plurality of supporting plates 19 at intervals.
When the testing device for the semiconductor chip is adopted, the working principle is as follows: put the chip that awaits measuring during the use at the carousel top of feed inlet, the demand according to the test selects to start respectively the medium temperature platform, the high temperature platform, carry out the temperature test to the chip, then the starter motor drives the carousel and rotates, thereby motor output shaft rotates and drives the carousel rotation, the chip on the carousel can be followed the direction of rotation of carousel and passed through the medium temperature platform in proper order, the high temperature platform, the chip through the temperature test at last rotates to the discharge gate, start electric putter and utilize the push pedal to promote the chip to the unloading slide this moment, the chip slides to the slip table on by the unloading slide, start the fan, send the air into in the box of blowing, blow the heat dissipation to the chip through the box below of blowing again, at last slide to collect in the box unified through the slip table.
The rotary table is arranged between an equipment box and a detection box, a motor is arranged at the top of the equipment box and is positioned below the rotary table, an output shaft of the motor is connected with the rotary table, the detection box is sequentially provided with a feed inlet and a discharge outlet along the rotating direction of the rotary table, and the detection box is sequentially provided with a medium temperature table and a high temperature table from the feed inlet to the top of the discharge outlet along the circumferential direction, so that the test requirements under different conditions can be met on the basis of realizing high temperature test, performance test can be simultaneously carried out on a plurality of chips, and the applicability and the test efficiency of the device are improved;
the automatic feeding device is characterized in that the edge of the self-rotating disc of the feeding sliding plate extends to the position above the sliding table, a first support is arranged above the feeding sliding plate, an electric push rod is arranged at the top end of the first support and on the back of one side of the collecting box, a vertically downward cylinder is arranged at the tail end of the electric push rod, and a push plate is fixedly connected to the tail end of a movable rod of the cylinder;
in addition, it is located the equipment box top and be provided with a second support between support and slip table, and the top of second support is on a parallel with the unloading slide and is provided with a box of blowing, and the box of blowing is connected with a fan in one side of unloading slide back to the back, can realize cooling the heat dissipation to the chip after the test, avoids carrying a large amount of thermal chips and piles up the condition that causes the chip to damage together, has guaranteed the security that the chip was deposited.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose of the embodiments is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, which cannot limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.
Claims (6)
1. A test apparatus for a semiconductor chip, characterized in that: the method comprises the following steps: the device comprises an equipment box (1), a detection box (2), a rotary table (3) and a collection box (4), wherein the detection box (2) is fixed at the top of the equipment box (1), the rotary table (3) is arranged between the equipment box (1) and the detection box (2), a motor (5) is arranged at the top of the equipment box (1) and is positioned below the rotary table (3), an output shaft of the motor (5) is connected with the rotary table (3), the detection box (2) is sequentially provided with a feed inlet (6) and a discharge outlet (7) along the rotation direction of the rotary table (3), and the detection box (2) is sequentially provided with a medium temperature table (8) and a high temperature table (9) from the feed inlet (6) to the top of the discharge outlet (7) along the circumferential direction;
collect box (4) and be located the corner of equipment box (1) circumference, a slip table (10) sets up on the circumference outer wall of equipment box (1), and the one end of slip table (10) extends to the top of collecting box (4), and a material slide (11) extend to slip table (10) top from the edge department of carousel (3), be located equipment box (1) top and be provided with a second support (16) between support (12) and slip table (10), the top of second support (16) is on a parallel with material slide (11) and is provided with a box (17) that blows, it is connected with a fan (18) to blow box (17) one side of being carried on the back in material slide (11).
2. The test apparatus for a semiconductor chip according to claim 1, wherein: the blanking device is characterized in that a first support (12) is arranged above the blanking sliding plate (11), an electric push rod (13) is arranged on the top end of the first support (12) and on the back of one side of the collecting box (4), a vertical downward air cylinder (14) is arranged at the tail end of the electric push rod (13), and a push plate (15) is fixedly connected to the tail end of a movable rod of the air cylinder (14).
3. The test apparatus for a semiconductor chip according to claim 1, wherein: the air outlet end of the fan (18) is connected with the blowing box (17) through an air duct.
4. The test apparatus for a semiconductor chip according to claim 1, wherein: and a plurality of air outlet holes are formed in the surface of one side, opposite to the blanking sliding plate (11), of the air blowing box (17).
5. The test apparatus for a semiconductor chip according to claim 1, wherein: the circumferential outer wall of the detection box (2) is provided with a plurality of supporting plates (19) at intervals.
6. The test apparatus for a semiconductor chip according to claim 1, wherein: four corners of the bottom of the equipment box (1) are provided with universal wheels (20).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220506063.4U CN218003625U (en) | 2022-03-09 | 2022-03-09 | Semiconductor chip testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220506063.4U CN218003625U (en) | 2022-03-09 | 2022-03-09 | Semiconductor chip testing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218003625U true CN218003625U (en) | 2022-12-09 |
Family
ID=84286384
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220506063.4U Active CN218003625U (en) | 2022-03-09 | 2022-03-09 | Semiconductor chip testing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218003625U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117347814A (en) * | 2023-11-22 | 2024-01-05 | 广东歌得智能装备有限公司 | High-temperature test structure of semiconductor device and gravity type normal temperature and high temperature tester |
-
2022
- 2022-03-09 CN CN202220506063.4U patent/CN218003625U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117347814A (en) * | 2023-11-22 | 2024-01-05 | 广东歌得智能装备有限公司 | High-temperature test structure of semiconductor device and gravity type normal temperature and high temperature tester |
| CN117347814B (en) * | 2023-11-22 | 2024-04-02 | 广东歌得智能装备有限公司 | High-temperature test structure of semiconductor device and gravity type normal temperature and high temperature tester |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN218003625U (en) | Semiconductor chip testing device | |
| CN105390709B (en) | A kind of battery core enters box hat automation equipment | |
| CN107694967B (en) | Automatic detecting and sorting equipment for voltage and internal resistance of lithium battery of automobile | |
| CN205177934U (en) | Box hat automation equipment is gone into to electricity core | |
| CN104795605B (en) | Paste fast bar paper barcode scanning test machine | |
| CN114023360B (en) | Semiconductor memory device with dustproof function | |
| CN116550571A (en) | Drying device after paper bag bonding molding | |
| CN217259059U (en) | Corrugated paper printing ink printing device | |
| CN214676283U (en) | Big data information processing equipment cooling device | |
| CN110918487A (en) | Detection system and detection method for formed connector | |
| CN215575524U (en) | Jacking device of chip detection equipment | |
| CN110459728A (en) | A kind of production line | |
| CN212962614U (en) | Mechanical tool drying device | |
| CN216150970U (en) | Cold heading machine with efficient cooling effect | |
| CN210905341U (en) | Pulse bag dust collector ware convenient to clearance | |
| CN112657574A (en) | Rice husking machine with rice husk separation double-channel structure | |
| CN211404463U (en) | Automatic insert machine for silicon wafers | |
| CN210680124U (en) | Effectual digital printing equipment dries | |
| CN112944868A (en) | Material drying equipment based on moisture exchange | |
| CN221082082U (en) | Forage grass processing packing apparatus | |
| CN214747024U (en) | Heat accumulating type agricultural product heat pump drying device | |
| CN215391293U (en) | Surface dust removal system for preparation of wind driven generator blade core material | |
| CN218183798U (en) | Three-phase high-voltage power supply for bag-type dust removal pre-charging | |
| CN217189471U (en) | Solid continuous desolventizing machine after extraction | |
| CN209971140U (en) | Ceramic plate punching tool for vertical probe card |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |