CN218003622U - Novel semiconductor component testing seat device - Google Patents
Novel semiconductor component testing seat device Download PDFInfo
- Publication number
- CN218003622U CN218003622U CN202221677116.5U CN202221677116U CN218003622U CN 218003622 U CN218003622 U CN 218003622U CN 202221677116 U CN202221677116 U CN 202221677116U CN 218003622 U CN218003622 U CN 218003622U
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- test
- test piece
- fixing base
- test strip
- thimble
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The utility model provides a novel semiconductor components and parts test seat device, including the test seat body, lead the mould, test piece fixing base. Four test strip fixing bases have been placed to the test socket body, every test strip fixing base is fixed with the test socket body through the staff, the test strip fixing base can rotate around the staff, there is a test strip on every test strip fixing base, there is the thimble post test strip below, the cover has the spring on the thimble post, make the thimble post have the ascending apical power of elasticity, when the suction nozzle absorbs the test strip that semiconductor device placed on the test strip fixing base, it is spacing through the guide die, the elasticity of thimble post below the test strip makes the apical power upwards, make semiconductor device have good contact with the test strip. The method has the advantages that the method improves the tight contact between the test piece and the pin, and the contact defect rate reaches 0.2 percent. The service life is prolonged by 300 percent.
Description
Technical Field
The utility model relates to a test of semiconductor device, the test of specially adapted DO219 product also is applicable to semiconductor Flat components and parts electrical test.
Background
The conventional test seat structure of a DO219 product is designed by extending the traditional semiconductor test structure, namely, a test base is additionally arranged on a metal support, a test piece fixing seat (PEEK material) is fixed on the base, the semiconductor component test method basically adopts a Kelvin method, namely four-point test, namely four beryllium copper test pieces are arranged on the test piece fixing seat, and pins of components are in contact with the test pieces through the elasticity of the test pieces to carry out the test.
The elasticity of the test piece is utilized to have three defects, namely, the thickness of the test piece cannot exceed 0.3mm, and the pin of a component is easily pressed and deformed due to too thick thickness, so that the defect of poor pin warping is caused; secondly, the service life of the test piece is shorter when the abrasion is too fast; thirdly, the contact failure ratio of the test piece and the material pin is higher by utilizing the elasticity of the test piece, and is about 0.4 percent.
Disclosure of Invention
For solving the problem that current semiconductor device test seat deposited, the utility model provides a novel semiconductor components and parts test seat device, including the test seat body, lead the mould, test piece fixing base. Four test piece fixing bases have been placed to the test seat body, every test piece fixing base is fixed with the test seat body through the staff, the test piece fixing base can rotate around the staff, there is a test piece on every test piece fixing base, there is the thimble post test piece below, the cover has the spring on the thimble post, make the thimble post have the ascending apical force of elasticity, when the suction nozzle absorbs the test piece that semiconductor device placed on the test piece fixing base, it is spacing through leading the mould, the ascending apical force of elasticity of thimble post below the test piece, make semiconductor device have good contact with the test piece.
The center of the test piece fixing seat is fixedly provided with a bearing, and the small shaft is connected through the bearing.
The upper end of the thimble column is provided with a step, a spring is sleeved below the step, and the spring is arranged on the spring seat.
The test piece is square, made of tungsten copper and 1mm in thickness.
The utility model has the advantages that 1, the matching of the bearing force of the pins is improved, the test piece is tightly contacted with the pins, and the contact defective rate reaches 0.2 percent. 2. The service life is prolonged, firstly, the thickness of the test piece is increased from 0.3mm to 1.0mm, and secondly, the material beryllium copper of the original test piece is changed into tungsten copper, so that the wear resistance of the test piece is improved; thirdly, the shape of the test piece is changed, so that the contact point between the test piece and the material pin is increased from 2 points to 8 points, and the service life is prolonged by 300%.
Drawings
FIG. 1 is an assembly view of the present invention;
FIG. 2 is a view of the structure of the test socket and the thimble stud;
description of reference numerals:
the method comprises the following steps of 1-testing seat body, 2-guide die, 3-small shaft, 4-testing piece fixing seat, 5-testing piece, 6-thimble column, 7-spring, 8-testing piece pressing piece, 9-spring seat, 10-bearing, 11-semiconductor device, 12-suction nozzle, 13-testing piece fixing seat rotation direction and 14-thimble column step.
Detailed Description
Referring to the attached drawings 1 and 2, the present invention comprises a testing base body 1, a guide mold 2, and a testing piece fixing base 4. Four test strip fixing bases 4 have been placed to test seat body 1, every test strip fixing base 4 is fixed with test seat body 1 through staff 3, test strip fixing base 4 can rotate around staff 3, there is a test strip 5 on every test strip fixing base 4, there is thimble post 6 test strip 5 below, the cover has spring 7 on the thimble post 6, make thimble post 6 have the ascending apical force of elasticity, when suction nozzle 12 absorbs test strip 5 that semiconductor device 11 placed on test strip fixing base 4, it is spacing through leading mould 2, the ascending apical force of elasticity of thimble post 6 test strip 5 below, make semiconductor device 11 have good contact with test strip 5.
The center of the test piece fixing seat 4 is fixed with a bearing 10, and the small shaft 3 is connected through the bearing 10.
The upper end of the thimble column 6 is provided with a step 14, the spring 7 is sleeved below the step 14, and the spring 7 is arranged on the spring seat 9.
The test piece 5 is square, made of tungsten copper and 1mm in thickness.
The guide die 2 is used for fixing the positions of the pins of the semiconductor device 11 and the test piece 5 in a range, so that the test piece 5 is fully and tightly contacted with the pins of the semiconductor device 11 and is also a limit block of the highest position for lifting the test piece 5; the four test strips 5 are respectively fixed on the four test strip fixing seats 4.
The test procedure was as follows:
the suction nozzle 12 adsorbs a semiconductor component 11 to move downwards, the component 11 is placed in a test guide die 2 on the uppermost layer of a test piece fixing seat 4, the test guide die 2 limits the component 11 in the middle of the guide die, pins of the component 11 are contacted with four test pieces 5 along with the downward pressing of the suction nozzle 12, in order to ensure that the pins of the component 11 are tightly and fully contacted with the test pieces 5, a suction nozzle pen 12 is pressed down by about 2mm, in the downward pressing process of the suction nozzle 12, an ejector pin column 6 is upwards pushed against the test pieces 5 from the lower part of the test pieces 5 under the action of a pressure spring force to ensure that the test pieces 5 are tightly contacted with the pins of the component 11, meanwhile, the test piece fixing seat 4 and the test pieces 5 rotate around a small shaft 3 of the fixing seat together, and because the small shaft 3 is fixed on a bearing 10, the rotation resistance is small, no force is basically exerted on the semiconductor pins, and the pins cannot deform and tilt; when the suction nozzle 12 is pressed to a set lower position, the tester sends current from one end of the semiconductor pin to the other end of the pin through the semiconductor device 11, and then returns to the tester to test the electrical parameters such as voltage, current, reverse recovery time and the like which can be borne by the chip.
After the electrical test is finished, the suction nozzle 12 adsorbs the semiconductor component 11 and lifts upwards, the thimble column 6 uses the elasticity of the compression spring 7 to push the test piece 5 to the original position of the test piece, and a complete test process of the component test is finished. In the test process, the test piece 5 rotates up and down around the test piece fixing seat 4, the test piece 5 descends to be the force of downward pressing of the suction nozzle 12, and the test piece 5 is lifted up to prop up the test piece to return to the upper position by the elastic force of the thimble rod 6.
Claims (4)
1. The utility model provides a novel semiconductor components and parts test seat device, including the test seat body, the guide die, the test piece fixing base, it is levied and lies in, four test piece fixing bases have been placed to the test seat body, every test piece fixing base is fixed with the test seat body through the staff, the test piece fixing base can rotate around the staff, there is a test piece on every test piece fixing base, there is the thimble post test piece below, the cover has the spring on the thimble post, make the thimble post have the ascending apical force of elasticity, when the suction nozzle absorbs the test piece that semiconductor device placed on the test piece fixing base, it is spacing through the guide die, the ascending apical force of elasticity of thimble post below the test piece, it has good contact to enable semiconductor device and test piece.
2. A novel semiconductor component test seat device as claimed in claim 1, wherein a bearing is fixed at the center of the test piece fixing seat, and the small shafts are connected through the bearing.
3. A novel semiconductor component test socket as claimed in claim 1 wherein the thimble posts have steps at their upper ends and springs are received under the steps and seated on spring seats.
4. A novel test socket for semiconductor components as claimed in claim 1, wherein the test piece is square and made of tungsten copper and has a thickness of 1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221677116.5U CN218003622U (en) | 2022-07-01 | 2022-07-01 | Novel semiconductor component testing seat device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221677116.5U CN218003622U (en) | 2022-07-01 | 2022-07-01 | Novel semiconductor component testing seat device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218003622U true CN218003622U (en) | 2022-12-09 |
Family
ID=84312901
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221677116.5U Active CN218003622U (en) | 2022-07-01 | 2022-07-01 | Novel semiconductor component testing seat device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218003622U (en) |
-
2022
- 2022-07-01 CN CN202221677116.5U patent/CN218003622U/en active Active
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