CN201112801Y - 160 wire ceramic four-side lead wire sheet type carrier aging testing socket - Google Patents
160 wire ceramic four-side lead wire sheet type carrier aging testing socket Download PDFInfo
- Publication number
- CN201112801Y CN201112801Y CN 200720109310 CN200720109310U CN201112801Y CN 201112801 Y CN201112801 Y CN 201112801Y CN 200720109310 CN200720109310 CN 200720109310 CN 200720109310 U CN200720109310 U CN 200720109310U CN 201112801 Y CN201112801 Y CN 201112801Y
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- socket
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- reliability
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- Expired - Fee Related
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- 238000012360 testing method Methods 0.000 title claims abstract description 18
- 230000032683 aging Effects 0.000 title abstract description 12
- 239000000919 ceramic Substances 0.000 title abstract description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 title 1
- 229920006351 engineering plastic Polymers 0.000 claims abstract description 4
- 235000014676 Phragmites communis Nutrition 0.000 claims description 8
- 238000005516 engineering process Methods 0.000 claims description 4
- 230000008676 import Effects 0.000 claims description 3
- 238000001746 injection moulding Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000011056 performance test Methods 0.000 abstract description 5
- 230000008901 benefit Effects 0.000 abstract description 4
- 238000013461 design Methods 0.000 abstract description 3
- 238000002474 experimental method Methods 0.000 abstract description 3
- 238000004377 microelectronic Methods 0.000 abstract description 3
- 229910000906 Bronze Inorganic materials 0.000 abstract description 2
- 238000005299 abrasion Methods 0.000 abstract description 2
- 239000010974 bronze Substances 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract description 2
- 238000002347 injection Methods 0.000 abstract 1
- 239000007924 injection Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 3
- 244000273256 Phragmites communis Species 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 241000196324 Embryophyta Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013590 bulk material Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The utility model relates to a microelectronic component aging test device, in particular to a socket that can conduct high-temperature aging experiments and tests for the reliability of 160-wire ceramic quad carrier components. The socket is characterized in that the socket is designed into three parts: a socket body, a contact piece and a pressing device according to the size requirements and structural design of 160-wire ceramic quad carrier; the socket body mainly comprises a base, a cover and a clasp; the socket body is made through high-temperature injection forming with imported high-temperature-resistant special engineering plastics, and is used for positioning and installing tested components; the contact piece is sheet-formed by beryllium-bronze material, which adopts the form of central symmetry and four-side arrangement (three roles on each side), corresponding to the outlet line of tested components; the number of contact pieces is large (160 wires) and the pitch is small; the pressing device of the socket comprises a socket body and a press piece; when the clasp turns downward and meshes with the base after being stressed, the press piece moves downward and the tested components is tightly pressed against the contact piece. The socket can conduct high-temperature aging experiments and performance tests after galvanization, has the advantages of small contact resistance, good consistency, high reliability, zero insertion-withdrawal force, surface abrasion resistance and convenient use, and greatly improves the reliability and service life of the socket.
Description
Technical field
The utility model relates to a kind of microelectronic component ageing tester, especially the socket that can carry out high-temperature circulation test and test to 160 lines potteries, four limits lead-in wire chip carrier component reliability.
Background technology
At present, in China reliability engineering field, what domestic aging test socket series of products bulk material adopted is non-high-temperature resistant unskilled labor engineering plastics, when measured device is tested, aging working temperature only is-25 ℃～+ 85 ℃, and the aging operating time is of short duration, and the socket contact surfaces is silver-plated, simple in structure, exist and measured device between a little less than big, the anti-environment of contact resistance, consistency is not high and mechanical endurance is long significant deficiency.In China microelectronic component reliability field, ceramic four limits lead-in wire chip carrier components and parts high-end technology product because of the isolated plant of no high temperature ageing reliability test, can not satisfy the test request to the device performance index, causes accident resulting from poor quality of projects easily.
Summary of the invention
For overcoming existing aging test socket in the deficiency aspect contact resistance, high temperature resistant and consistency and useful life, the utility model provides a kind of high temperature ageing testing experiment socket.This socket can not only expand the operating temperature range that wears out to-65 ℃～+ 150 ℃ from-25 ℃～+ 85 ℃, once aging stream time reaches more than the 1000h (150 ℃), connect-disconnect life is more than 5000 times, and tested device is being carried out in high-temperature circulation test and the performance test process, have that contact resistance is little, high conformity, reliability height, ZIF, surface abrasion resistance and advantage easy to use, the reliability and the useful life of having improved socket greatly.
The technical scheme that the utility model technical solution problem is adopted is: structural design and dimensional requirement according to 160 lines pottery, four limits lead-in wire chip carrier components and parts become three big part, i.e. socket, contact and hold down gags with jack design.Socket is made up of seat, lid and hook, selects the extraordinary high-temperature engineering plastics of high temperature resistant type of import for use, manufactures jack body through the high-temperature injection molding technology thereof, is used for the location and installation of tested device.Contact is with the beryllium-bronze material punch forming, and it is gold-plated to handle and electroplate hard gold layer technical face through 300 ℃ of quench hots, adopts and the corresponding mode of tested device lead-out wire, and is made up of center symmetry, four sides spread pattern; This utility model belongs to the structure of contact number many (160 lines), contact pitch little (pitch of contact only is 0.65mm) in the lead-in wire chip carrier series socket of ceramic four limits, on contact is arranged, adopt every three row's arrangement architecture first simultaneously.The hold down gag of socket is made up of socket and briquetting, when the stressed downward upset of hook is meshed with seat, make lid and be installed in the briquetting that covers and produce displacement, briquetting moves downward, tested device compresses contact, and the boss on the briquetting can make tested device stressed even in compressing the process of contact, wearing and tearing electrodeposited coating when this structure can be avoided contact and tested device contacts.Carry out high-temperature circulation test and performance test after the energising.This flip-shell structure is designed to the structure of ZIF formula, wearing and tearing electrodeposited coating in the time of can avoiding the contact plug, influence electrical contact performance, a little less than thoroughly having solved big, the anti-environment of contact resistance in high-temperature circulation test and performance test process, the consistency difference and mechanical endurance long technological difficulties, can also satisfy the requirements of the different lead-in wires of tested device.
The beneficial effects of the utility model are: this utility model can satisfy the general 160 lines pottery of the army and the people four limits lead-in wire chip carrier lead-in wire chip carrier components and parts high-temperature circulation test of similar ceramic four limits with other and performance test, filled up domestic blank, substitute import, for country has saved foreign exchange, for the user has saved cost, can obtain bigger economic benefit and social benefit.
Description of drawings
The utility model is described in further detail below in conjunction with accompanying drawing and example.
Fig. 1 is a contour structures of the present utility model vertical section structural map.
Fig. 2 is the utility model appearance structure vertical view.
78 big torsion spring 9 forward foot in a step reeds of 56 lids of 12 hook of Fig. 1,3 stage clips, 4 briquettings
Pin reed 11 rear foot reeds are 12 in 10
Embodiment
In Fig. 1, be forward foot in a step reed 9, middle pin reed 10, rear foot reed 11 by packing in the seat 12 of socket with corresponding, the axial symmetrical manner of tested device lead-out wire with contact; Briquetting 4 and axle 5 are packed in the lid 6 of socket; Again axle 1, hook 2 and stage clip 3 are packed among the lid 6 of socket; The lid 6 that will install at last, axle 7 and big torsion spring 8 are packed in the seat 12 of socket together.
In this scheme, socket is used for the location and installation of tested device, and socket also plays automatic compacting device simultaneously, and when the stressed downward upset of hook was meshed with seat, tested device compressed contact automatically; Contact by gold-plated reed by corresponding with tested device lead-out wire, automatically compress with the ZIF structure be installed on socket the seat in.
Claims (3)
1. one kind is applicable to 160 lines pottery, four limits lead-in wire chip carrier burn-in test socket, it is characterized in that: it is made up of socket, contact and three part unifications of positioner, socket is made up of seat, lid and hook, be used for compressing automatically of tested device, socket is selected the extraordinary high-temperature engineering plastics of the high temperature resistant type of import for use, form through the manufacturing of high-temperature injection molding technology thereof, contact corresponding with tested device lead-out wire and be installed on socket the seat in.
2. 160 lines pottery according to claim 1, four limits lead-in wire chip carrier burn-in test socket, it is characterized in that: socket and contact are a unified integral body, contact is vertically rearranged by 160 lines of symmetry, the gold-plated reed of 0.65mm pitch, is installed on respectively in 4 grooves of seat.
3. 160 lines pottery according to claim 1, four limits lead-in wire chip carrier burn-in test socket, it is characterized in that: the locking device socket and the briquetting of socket, this flip-shell structure is designed to compress automatically lock, ZIF structure to contact.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200720109310 CN201112801Y (en) | 2007-05-10 | 2007-05-10 | 160 wire ceramic four-side lead wire sheet type carrier aging testing socket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200720109310 CN201112801Y (en) | 2007-05-10 | 2007-05-10 | 160 wire ceramic four-side lead wire sheet type carrier aging testing socket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201112801Y true CN201112801Y (en) | 2008-09-10 |
Family
ID=39964549
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200720109310 Expired - Fee Related CN201112801Y (en) | 2007-05-10 | 2007-05-10 | 160 wire ceramic four-side lead wire sheet type carrier aging testing socket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201112801Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102646889A (en) * | 2012-04-01 | 2012-08-22 | 中国电子科技集团公司第四十研究所 | Ceramic quad flat package (CQFP) series aging test socket with pitch being no less than 0.8mm |
| CN104865422A (en) * | 2015-06-12 | 2015-08-26 | 中国电子科技集团公司第四十研究所 | Rotary hand wheel type ageing testing socket without insertion and extraction force |
-
2007
- 2007-05-10 CN CN 200720109310 patent/CN201112801Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102646889A (en) * | 2012-04-01 | 2012-08-22 | 中国电子科技集团公司第四十研究所 | Ceramic quad flat package (CQFP) series aging test socket with pitch being no less than 0.8mm |
| CN104865422A (en) * | 2015-06-12 | 2015-08-26 | 中国电子科技集团公司第四十研究所 | Rotary hand wheel type ageing testing socket without insertion and extraction force |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: ZHEJIANG CHANGXING ELETRONICS FACTORY CO., LTD. Free format text: FORMER OWNER: CAO HONGGUO Effective date: 20090710 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20090710 Address after: No. 86, Zhen Huai Road, Huai village, Zhejiang, Changxing County Province, 313119 Patentee after: Zhejiang Changxing Electronic Factory Co., Ltd. Address before: Room 108, Xinjie electronics factory, Changxing County, Zhejiang Province, 313119 Patentee before: Cao Hongguo |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080910 Termination date: 20100510 |