CN201910526U - Socket for ageing test to CQFP device with 132 lines and 0.635 pitches - Google Patents
Socket for ageing test to CQFP device with 132 lines and 0.635 pitches Download PDFInfo
- Publication number
- CN201910526U CN201910526U CN2010202819471U CN201020281947U CN201910526U CN 201910526 U CN201910526 U CN 201910526U CN 2010202819471 U CN2010202819471 U CN 2010202819471U CN 201020281947 U CN201020281947 U CN 201020281947U CN 201910526 U CN201910526 U CN 201910526U
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- China
- Prior art keywords
- socket
- lines
- contact
- seat
- cqfp
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 238000012360 testing method Methods 0.000 title claims abstract description 21
- 230000032683 aging Effects 0.000 title claims abstract description 18
- 239000011295 pitch Substances 0.000 title abstract 3
- 238000004806 packaging method and process Methods 0.000 claims description 9
- 235000014676 Phragmites communis Nutrition 0.000 claims description 6
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 3
- 238000004377 microelectronic Methods 0.000 abstract description 4
- 239000000919 ceramic Substances 0.000 abstract description 3
- 238000013461 design Methods 0.000 abstract description 3
- 238000011056 performance test Methods 0.000 description 5
- 230000008901 benefit Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000012216 screening Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 230000008676 import Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000013590 bulk material Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
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- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The utility model relates to an aging test device for a micro-electronic component, in particular to socket performing high temperature ageing test to the reliability of a CQFP (Ceramic Quad Flat Pack) device with 132 lines and 0.635 pitches or other similar CQFP devices. According to the structure design and the size requirement of the CQFP device with 132 lines, the socket is designed into three main components including a socket body, a contact element and a positioning device, wherein the socket body comprises a seat, a cover and a hook; the socket and a pressing block play a role of a pressing device; when the hook downwardly overturns under a force to mesh with the seat, the cover drives the pressing block to downwardly move, and a device to be tested is in contact with the contact element; the contact element corresponds to a leading-out wire of the device to be tested, and comprises centrosymmetrical fine pitches arranged on four surfaces; and the inclined plane of the socket seat boy can serve as a positioning device, so that the device to be tested can be conveniently placed in and taken out.
Description
Technical field
The utility model relates to a kind of microelectronic component ageing tester, is the socket that can carry out high temperature ageing screening and performance test to 132 lines, 0.635 pitch pottery, four limits lead-in wire flat packaging component reliability; This utility model belongs to electronic information technology reliability field.
Background technology
At present, in China electronic devices and components reliability engineering field, what the bulk material of known domestic general aging test socket mostly adopted is the non-high-temperature resistant common plastics, when measured device is tested, aging working temperature only is-25 ℃～+ 85 ℃, operating time is short, the lead-in wire radical is few, the contact pitch is wide, simple in structure, exist and measured device between contact resistance is big, aging temperature is low, consistency difference and useful life are short significant deficiency, can not satisfy the quality screening of device and the test request of performance index, cause accident resulting from poor quality of projects easily.Domestic in the reliability engineering field particularly to being matched in the Shenzhou spacecraft, thrust-augmented rocket, satellite, nuclear-powered submarine, intercontinental missile and other defence and military, space flight, aviation, navigation, the multilead of major projects such as emphasis such as communication national defence sophisticated weapons equipment, the pitch microelectronic component, still the special test device that does not have high low temperature aging reliability test and test, the external import of a large amount of dependences of employed test jack, price is very expensive, country will spend a large sum of foreign exchange imported product every year, order cycle time is longer, the product of special requirement can't be ordered goods, and the part staple product also influences China's military electronic devices and components research and development manufacturing schedule because of embargo.
Summary of the invention
For overcoming existing aging test socket in contact resistance, aging working temperature and consistency and the deficiency of lead-in wire aspect radical, contact pitch and useful life, the utility model provides a kind of novel 132 lines, 0.635 pitch pottery, four limits lead-in wire flat packaging device aging test jack of carrying out high low temperature aging, test, screening and reliability test under integrated circuit, the online "on" position of microelectronic component that is exclusively used in.This socket can not only expand to-55 ℃～+ 150 ℃ from-25 ℃～+ 85 ℃ with the operating temperature range that wears out, once aging stream time reaches more than the 1500h (150 ℃), connect-disconnect life is more than 10000 times, and tested device is being carried out in high-temperature circulation test and the performance test process, have that the contact pitch is tiny, the lead-in wire radical is many, contact resistance is little, high conformity, reliability height, ZIF, surface abrasion resistance and advantage easy to use, the reliability and the useful life of having improved socket greatly.
The technical scheme that the utility model technical solution problem is adopted is: according to the structural design and the dimensional requirement of 132 lines pottery, four limits lead-in wire flat packaging components and parts, jack design is become three big parts, promptly form by socket, contact and three part unifications of positioner, socket is made up of seat (10), lid (4) and hook (2), be connected with torsion spring (7) with axle (1) (6) between each several part, select the high temperature resistant type engineering plastics for use, manufacture jack body through the high-temperature injection molding technology thereof, be used for the location and installation of tested device.Contact is with the beryllium-bronze material punch forming, gold-plated through 300 ℃ of quench hots processing and the hard gold layer of plating technical face, adopt and the corresponding mode of tested device lead-out wire, 132 lines that are evenly distributed by axial symmetry, the gold-plated reed of 0.635mm pitch vertically rearrange, and are installed on respectively in 4 grooves of seat (10).This utility model belongs to the structure of contact number many (132 lines), contact pitch little (pitch of contact only is 0.635mm) in the lead-in wire flat packaging components and parts series socket of ceramic four limits, on contact is arranged, adopt every three row's arrangement architecture simultaneously.The hold down gag of socket is made up of seat, lid, hook and briquetting, and briquetting adopts movable.This flip-shell structure is designed to compress automatically lock, ZIF structure to contact.The positioner of socket is positioned by the inclined-plane on the pedestal.When the stressed downward upset of hook is meshed with seat, make lid and be installed in the briquetting that covers and produce displacement, briquetting moves downward, tested device compresses contact, and the boss on the briquetting can make tested device stressed even in compressing the process of contact, wearing and tearing electrodeposited coating when this structure can be avoided contact and tested device contacts.Carry out high-temperature circulation test and performance test after the energising.This flip-shell structure is designed to the structure of ZIF formula, wearing and tearing electrodeposited coating in the time of can avoiding the contact plug, influence electrical contact performance, a little less than thoroughly having solved big, the anti-environment of contact resistance in high-temperature circulation test and performance test process, the consistency difference and mechanical endurance long technological difficulties, can also satisfy the requirement of the different lead-in wires of tested device (in 132 lines).
The beneficial effects of the utility model are: this utility model can satisfy general 132 lines of the army and the people lead-in wire flat packaging components and parts high-temperature circulation test of similar ceramic four limits with other and performance test, filled up domestic blank, substitute import, for country has saved foreign exchange, for the user has saved cost, can obtain bigger economic benefit and social benefit.
Description of drawings
The utility model is described in further detail below in conjunction with drawings and embodiments.
Fig. 1 is a contour structures of the present utility model vertical section structural map.
Fig. 2 is the utility model appearance structure vertical view.
Fig. 1: pin contact (reed), 12 rear foot contacts (reed) among 10 of 1,2 hooks, 3 stage clips, 4 lids, 5 briquettings, 6,7 torsion springs, 8,9 forward foot in a step contacts (reed), 11
Embodiment
In Fig. 1, be earlier that forward foot in a step contact (9), middle pin contact (11) and rear foot contact (12) insert in the seat (10) by corresponding structure with tested device lead-out wire with contact; Briquetting (5) and axle (6) are packed in the lid (4) of socket; Again axle (1), hook (2) and stage clip (3) are packed among the lid (4) of socket; The lid that will install (6), axle (8) and torsion spring (7) are packed in the seat (10) of socket together at last.
In this scheme, socket is used for contact to be fixed; Pedestal can be with the location and installation of tested device; Socket and briquetting play automatic compacting device simultaneously, and when the stressed downward upset of hook was meshed with seat, cover tape dynamic pressure piece was downward, makes tested device compress contact automatically; Movable briquetting can guarantee that tested device is stressed evenly; Contact by gold-plated reed by corresponding with tested device lead-out wire, automatically compress with the ZIF structure be installed on socket the seat in.
Claims (3)
1. line 0.635 pitch pottery four limits lead-in wire flat packaging device aging test jack, it is characterized in that: it is made up of socket, contact and three part unifications of positioner, socket is made up of seat (10), lid (4) and hook (2), be connected with torsion spring (7) with axle (1) (6) between each several part, 132 lines that contact (9), (11), (12) are evenly distributed by axial symmetry, the gold-plated reed of 0.635mm pitch vertically rearrange, and are installed on respectively in 4 grooves of seat (10).
2. the lead-in wire flat packaging device aging test jack of 132 lines, 0.635 pitch pottery according to claim 1, four limits, it is characterized in that: the hold down gag of socket is made up of seat (10), lid (4), hook (2) and briquetting (5), briquetting (5) adopts movable, and this flip-shell structure is designed to compress automatically lock, ZIF structure to contact.
3. the lead-in wire flat packaging device aging test jack of 132 lines, 0.635 pitch pottery according to claim 1, four limits, it is characterized in that: the positioner of socket is positioned by the inclined-plane on the pedestal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202819471U CN201910526U (en) | 2010-08-02 | 2010-08-02 | Socket for ageing test to CQFP device with 132 lines and 0.635 pitches |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202819471U CN201910526U (en) | 2010-08-02 | 2010-08-02 | Socket for ageing test to CQFP device with 132 lines and 0.635 pitches |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201910526U true CN201910526U (en) | 2011-07-27 |
Family
ID=44302726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202819471U Expired - Fee Related CN201910526U (en) | 2010-08-02 | 2010-08-02 | Socket for ageing test to CQFP device with 132 lines and 0.635 pitches |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201910526U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107132432A (en) * | 2016-02-29 | 2017-09-05 | 富泰华工业（深圳）有限公司 | Test device |
| CN116381282A (en) * | 2023-03-07 | 2023-07-04 | 浙江东瓷科技有限公司 | Aging test socket for small-intercept multi-lead packaging shell |
-
2010
- 2010-08-02 CN CN2010202819471U patent/CN201910526U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107132432A (en) * | 2016-02-29 | 2017-09-05 | 富泰华工业（深圳）有限公司 | Test device |
| CN107132432B (en) * | 2016-02-29 | 2021-02-12 | 富泰华工业（深圳）有限公司 | Testing device |
| CN116381282A (en) * | 2023-03-07 | 2023-07-04 | 浙江东瓷科技有限公司 | Aging test socket for small-intercept multi-lead packaging shell |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: ZHEJIANG CHANGXING ELECTRONIC FACTORY CO., LTD. Free format text: FORMER OWNER: CAO JINXUE Effective date: 20120416 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20120416 Address after: 313119 Electronic Industry Park, Changxing County, Zhejiang Province Patentee after: Zhejiang Changxing Electronic Factory Co., Ltd. Address before: 313119, Zhejiang, Changxing County province Huai Township Road, No. 86 vibration Patentee before: Cao Jinxue |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110727 Termination date: 20140802 |
|
| EXPY | Termination of patent right or utility model |